CN211554958U - Optical fingerprint unlocking module, display screen and electronic equipment - Google Patents
Optical fingerprint unlocking module, display screen and electronic equipment Download PDFInfo
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- CN211554958U CN211554958U CN202020162547.2U CN202020162547U CN211554958U CN 211554958 U CN211554958 U CN 211554958U CN 202020162547 U CN202020162547 U CN 202020162547U CN 211554958 U CN211554958 U CN 211554958U
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Abstract
The utility model discloses an optics fingerprint unblock module, including the circuit base plate, optics fingerprint chip, strengthening layer and light shield layer, optics fingerprint chip all sets up the upper surface at the circuit base plate with the strengthening layer, the strengthening layer be equipped with the first through-hole of optics fingerprint chip complex, optics fingerprint chip is located first through-hole and exposes from first through-hole, optics fingerprint chip top is located to the light shield layer, the light shield layer is equipped with the second through-hole that matches with optics fingerprint chip, the second through-hole is less than optics fingerprint chip and makes the light shield layer shelter from the cutting way that is located optics fingerprint chip periphery. The utility model discloses a set up the light shield layer and shelter from with being located the peripheral cutting street of optics fingerprint chip, prevent that the cutting street from taking place the reflection of light when meetting the highlight, avoid influencing optics fingerprint chip's resolution ratio, improve fingerprint identification accuracy and reaction rate. The utility model discloses a display screen and electronic equipment.
Description
Technical Field
The utility model relates to a fingerprint identification technical field especially relates to an optics fingerprint unblock module, display screen and electronic equipment.
Background
With the rapid development of the mobile internet era, information interaction between mobile terminal users is also multiplied.
The biometric identification technology in the interactive unlocking scheme of the mobile smart phone is becoming an emerging interactive technology under the introduction of the era and is gradually accepted by the public. The fingerprint identification unlocking technology is a very convenient and fast unlocking scheme. With the continuous innovation of the mobile phone technology, the emergence of a full-screen mobile phone is a serious test for the current capacitive fingerprint identification technology, and the capacitive fingerprint cannot realize a technology of penetrating a screen due to the characteristics of the capacitive fingerprint, so that an optical fingerprint unlocking technology appears.
However, due to the existing 5G scheme and the requirement for product lightness and thinness, the optical fingerprint chip in the existing optical fingerprint unlocking technology is no longer shielded by a lens, and the optical fingerprint chip is directly exposed under a light source and can reflect light when a cutting path (i.e. the periphery of the optical fingerprint chip) meets strong light, so that the resolution of the product is affected, and the fingerprint identification accuracy and the reaction speed are reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the shortcoming and the not enough that exist among the prior art, the utility model aims to provide an optics fingerprint unblock module, display screen and electronic equipment to optics fingerprint chip can take place the reflection of light in the cutting track among the solution prior art, thereby influences the resolution ratio of product, leads to the problem that fingerprint identification accuracy and reaction rate reduce.
The purpose of the utility model is realized through the following technical scheme:
the utility model provides an optics fingerprint unblock module, including circuit base plate, optics fingerprint chip, strengthening layer and light shield layer, optics fingerprint chip with the strengthening layer all sets up the upper surface of circuit base plate, the strengthening layer be equipped with the first through-hole of optics fingerprint chip complex, optics fingerprint chip is located in the first through-hole and follow first through-hole department exposes, the light shield layer is located optics fingerprint chip top, the light shield layer be equipped with the second through-hole that optics fingerprint chip matees, the second through-hole is less than optics fingerprint chip makes the light shield layer shelters from and is located the peripheral cutting way of optics fingerprint chip.
Furthermore, the light shielding layer shields the optical fingerprint chip, and the width of the periphery of the optical fingerprint chip is 0.1-0.2 mm.
Further, the thickness of the strengthening layer is larger than or equal to that of the optical fingerprint chip.
Further, the light shield layer sets up the upper surface on reinforcement layer, optics fingerprint unblock module still includes the blotter, the blotter sets up the upper surface of light shield layer, the blotter be equipped with optics fingerprint chip complex third through-hole, optics fingerprint chip not by the part that the light shield layer sheltered from is followed the third through-hole exposes.
Further, the light shield layer sets up the upper surface of optics fingerprint chip is located the periphery of optics fingerprint chip, optics fingerprint unblock module still includes the blotter, the blotter sets up the upper surface on reinforcement layer, the blotter be equipped with optics fingerprint chip complex third through-hole, optics fingerprint chip not by the part that the light shield layer sheltered from is followed the third through-hole exposes.
Further, optics fingerprint unblock module still includes the reinforcement piece, the reinforcement piece sets up the lower surface at circuit substrate.
Further, the reinforcing sheet is made of steel.
Furthermore, be equipped with first installation department on the circuit substrate, be equipped with on the light shield layer with the second installation department that first installation department corresponds, first installation department with all be equipped with the mounting hole on the second installation department.
The utility model also provides a display screen, the lower surface of display screen is equipped with as above optics fingerprint unblock module.
The utility model also provides an electronic equipment, electronic equipment includes as above the display screen.
The utility model has the advantages that: optics fingerprint unblock module includes the circuit base plate, optics fingerprint chip, strengthening layer and light shield layer, optics fingerprint chip all sets up the upper surface at the circuit base plate with the strengthening layer, the strengthening layer be equipped with the first through-hole of optics fingerprint chip complex, optics fingerprint chip is located first through-hole and exposes from first through-hole department, optics fingerprint chip top is located to the light shield layer, the light shield layer is equipped with the second through-hole that matches with optics fingerprint chip, the second through-hole is less than optics fingerprint chip and makes the light shield layer shelter from the cutting way that is located optics fingerprint chip periphery. The utility model discloses a set up the light shield layer and shelter from with being located the peripheral cutting street of optics fingerprint chip, prevent that the cutting street from taking place the reflection of light when meetting the highlight, avoid influencing optics fingerprint chip's resolution ratio, improve fingerprint identification accuracy and reaction rate.
Drawings
Fig. 1 is a schematic view of a split structure of an optical fingerprint unlocking module according to a first embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of an optical fingerprint unlocking module according to a first embodiment of the present invention;
fig. 3 is a schematic cross-sectional structure view of an optical fingerprint unlocking module in the second embodiment of the present invention.
In the figure: the optical fingerprint unlocking module 10, the circuit substrate 11, the first mounting portion 111, the flexible circuit board 112, the connector 113, the optical fingerprint chip 12, the cutting street 121, the reinforcing layer 13, the first through hole 131, the light shielding layer 14, the second through hole 141, the second mounting portion 142, the cushion pad 15, the third through hole 151, the reinforcing sheet 16, and the third mounting portion 161.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the objectives of the present invention, the following detailed description will be made in conjunction with the accompanying drawings and preferred embodiments for the specific embodiments, structures, features and effects of the optical fingerprint unlocking module, the display screen and the electronic device according to the present invention as follows:
[ example one ]
Fig. 1 is the utility model provides an in the split structure sketch map of optical fingerprint unblock module, fig. 2 is the utility model provides an in the cross-sectional structure sketch map of optical fingerprint unblock module.
As shown in fig. 1 to 2, a first embodiment of the present invention provides an optical fingerprint unlocking module 10, which includes a circuit substrate 11, an optical fingerprint chip 12, a reinforcing layer 13, and a light shielding layer 14;
the optical fingerprint chip 12 and the strengthening layer 13 are both arranged on the upper surface of the circuit substrate 11, the strengthening layer 13 is provided with a first through hole 131 matched with the optical fingerprint chip 12, the first through hole 131 is larger than the optical fingerprint chip 12, the optical fingerprint chip 12 is positioned in the first through hole 131 and is exposed from the first through hole 131, namely, the upper surface of the optical fingerprint chip 12 can be seen from the upper side of the first through hole 131. Wherein, optics fingerprint chip 12 and strengthening layer 13 all have the metal wiring through laminating sticky joint on the upper surface of circuit substrate 11 on the circuit substrate 11, optics fingerprint chip 12 welds and sets up on circuit substrate 11 and through gold thread and the metal wiring electric connection on circuit substrate 11. Still be equipped with flexible circuit board 112 and connector 113 on the circuit base plate 11, flexible circuit board 112 and the metal circuit electric connection on the circuit base plate 11, connector 113 is connected with the cell-phone treater to be used for the signal transmission who senses with optics fingerprint chip 12 to the treater and handle.
The light shield layer 14 is arranged above the optical fingerprint chip 12, the light shield layer 14 is provided with a second through hole 141 matched with the optical fingerprint chip 12, and the second through hole 141 is smaller than the optical fingerprint chip 12 and enables the light shield layer 14 to shield the cutting channel 121 positioned on the periphery of the optical fingerprint chip 12. The shape of the second through hole 141 may be the same as the shape of the optical fingerprint chip 12, for example, the second through hole 141 is rectangular, but the second through hole 141 needs to be smaller than the optical fingerprint chip 12, and of course, the shape of the second through hole 141 may be different from the shape of the optical fingerprint chip 12, and only the light shielding layer 14 needs to be able to shield the scribe line 121 located at the periphery of the optical fingerprint chip 12. The light-shielding layer 14 is made of opaque material, preferably black material, such as black light-shielding tape.
Further, the width d of the light shielding layer 14 shielding the periphery of the optical fingerprint chip 12 is 0.1-0.2mm, that is, the width d of the overlapping portion of the light shielding layer 14 and the projection area of the optical fingerprint chip 12 on the circuit substrate 11 is 0.1-0.2mm, the shape of the overlapping portion area is a rectangular frame, and the width d is preferably 0.15 mm.
In this embodiment, light shield layer 14 sets up the upper surface at reinforcing layer 13, and optics fingerprint unblock module 10 still includes blotter 15, and blotter 15 sets up the upper surface at light shield layer 14, and blotter 15 is equipped with the third through-hole 151 with optics fingerprint chip 12 complex, and the part that optics fingerprint chip 12 is not sheltered from by light shield layer 14 exposes from third through-hole 151. Wherein, blotter 15 can be for soaking the cotton-padded rubber, avoids damaging optics fingerprint unblock module 10 when the dress. The thickness of the strengthening layer 13 is greater than or equal to the thickness of the optical fingerprint chip 12, and preferably, the thickness of the strengthening layer 13 is greater than the thickness of the optical fingerprint chip 12 by 0.02 mm.
In this embodiment, the optical fingerprint unlocking module 10 further includes a reinforcing sheet 16, and the reinforcing sheet 16 is disposed on the lower surface of the circuit substrate 11. The reinforcing sheet 16 is made of steel. The reinforcing sheet 16 may be electrically connected to the circuit substrate 11 through a conductive adhesive to increase the strength of the circuit substrate 11, and at the same time, prevent the circuit substrate 11 from generating static electricity and shielding other signals from interfering with the optical fingerprint chip 12.
In this embodiment, the circuit board 11 is provided with a first mounting portion 111, the light shielding layer 14 is provided with a second mounting portion 142 corresponding to the first mounting portion 111, and the first mounting portion 111 and the second mounting portion 142 are provided with mounting holes. The number of the first mounting portions 111 on the circuit board 11 is two, one of the first mounting portions 111 corresponds to the second mounting portion 142, the reinforcing sheet 16 is provided with a third mounting portion 161, the third mounting portion 161 is also provided with a mounting hole, and the third mounting portion 161 corresponds to the other first mounting portion 111 on the circuit board 11.
[ example two ]
Fig. 3 is a schematic cross-sectional structure view of an optical fingerprint unlocking module in the second embodiment of the present invention. As shown in fig. 3, the optical fingerprint unlocking module 10 provided in the second embodiment of the present invention is substantially the same as the optical fingerprint unlocking module 10 in the first embodiment (fig. 1 and fig. 2), except that, in this embodiment, the light shielding layer 14 is disposed on the upper surface of the optical fingerprint chip 12 and is located at the periphery of the optical fingerprint chip 12, that is, the light shielding layer 14 is also disposed in the first through hole 131 of the reinforcing layer 13, and the light shielding layer 14 is smaller than the first through hole 131 and larger than the optical fingerprint chip 12.
Optical fingerprint unblock module 10 still includes blotter 15, and blotter 15 sets up at the upper surface of strengthening layer 13, and blotter 15 is equipped with the third through-hole 151 with optics fingerprint chip 12 complex, and optics fingerprint chip 12 does not expose from third through-hole 151 by the part that light shield layer 14 sheltered from.
Compared with the first embodiment, in the present embodiment, the light shielding layer 14 is directly attached to the periphery of the optical fingerprint chip 12, so that the overall thickness of the optical fingerprint unlocking module 10 can be reduced, and the development trend of thinning and lightening of the mobile phone is facilitated.
It should be understood by those skilled in the art that the rest of the structure and the operation principle of the present embodiment are the same as those of the first embodiment, and are not described herein again.
The utility model also provides a display screen, the lower surface of display screen is equipped with as above optical fingerprint unblock module 10, optical fingerprint unblock module 10 passes through the lower surface of installation department (first installation department 111, second installation department 142, third installation department 161) installation at the display screen. The display screen is an OLED organic light-emitting screen, which is a screen made of organic electroluminescent diodes, and since the display screen has self-luminescence and does not need to be additionally provided with a backlight, for more detailed description of the OLED organic light-emitting screen, reference is made to the prior art, and details are not repeated here.
When actually carrying out the fingerprint unblock, press the top at the organic luminescent screen of OLED with the finger, the fingerprint of finger contacts with the upper surface of the organic luminescent screen of OLED, after the organic luminescent screen of OLED lights, the self-luminous source layer upwards launches the incident light, the incident light hits the epidermis position back emergence reflection of finger, the optics fingerprint unblock module 10 of lower surface is reachd behind the organic luminescent screen of OLED to the reverberation, optics fingerprint unblock module 10 gathers the collection that realizes the fingerprint pattern behind the reverberation.
The utility model also provides an electronic equipment, electronic equipment includes as above the display screen. The electronic device may be an electronic device terminal such as a tablet computer, a palm computer, a notebook computer, or a mobile phone, and is not limited specifically herein.
To sum up, the utility model discloses a set up light shield layer 14 and shelter from with being located the peripheral cutting street 121 of optics fingerprint chip 12, prevent that cutting street 121 from taking place the reflection of light when meetting the highlight, avoid influencing the resolution ratio of optics fingerprint chip 12, improve fingerprint identification accuracy and reaction rate.
In this document, the terms upper, lower, left, right, front, rear and the like are used for defining the positions of the structures in the drawings and the positions of the structures relative to each other, and are only used for the clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims. It is also to be understood that the terms "first" and "second," etc., are used herein for descriptive purposes only and are not to be construed as limiting in number or order.
The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description in any form, and although the present invention has been disclosed with the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make some changes or modifications within the technical scope of the present invention without departing from the technical scope of the present invention, and the technical contents of the above disclosure can be utilized to make equivalent embodiments, but the technical contents of the present invention are not broken away from, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention all still belong to the protection scope of the technical solution of the present invention.
Claims (10)
1. An optical fingerprint unlocking module is characterized by comprising a circuit substrate (11), an optical fingerprint chip (12), a reinforcing layer (13) and a light shielding layer (14), the optical fingerprint chip (12) and the reinforcing layer (13) are both arranged on the upper surface of the circuit substrate (11), the strengthening layer (13) is provided with a first through hole (131) matched with the optical fingerprint chip (12), the optical fingerprint chip (12) is positioned in the first through hole (131) and exposed from the first through hole (131), the light shielding layer (14) is arranged above the optical fingerprint chip (12), the light shielding layer (14) is provided with a second through hole (141) matched with the optical fingerprint chip (12), the second through hole (141) is smaller than the optical fingerprint chip (12) and enables the light shielding layer (14) to shield a cutting channel (121) located on the periphery of the optical fingerprint chip (12).
2. The optical fingerprint unlocking module as claimed in claim 1, wherein the light shielding layer (14) shields the optical fingerprint chip (12) from the peripheral edge with a width of 0.1-0.2 mm.
3. The optical fingerprint unlocking module of claim 1, wherein the thickness of the strengthening layer (13) is greater than or equal to the thickness of the optical fingerprint chip (12).
4. The optical fingerprint unlocking module as claimed in claim 1, wherein the light shielding layer (14) is disposed on an upper surface of the reinforcing layer (13), the optical fingerprint unlocking module (10) further comprises a buffer pad (15), the buffer pad (15) is disposed on the upper surface of the light shielding layer (14), the buffer pad (15) is provided with a third through hole (151) matched with the optical fingerprint chip (12), and a portion of the optical fingerprint chip (12) which is not shielded by the light shielding layer (14) is exposed from the third through hole (151).
5. The optical fingerprint unlocking module as claimed in claim 1, wherein the light shielding layer (14) is disposed on an upper surface of the optical fingerprint chip (12) and located at a periphery of the optical fingerprint chip (12), the optical fingerprint unlocking module (10) further comprises a buffer pad (15), the buffer pad (15) is disposed on an upper surface of the reinforcing layer (13), the buffer pad (15) is provided with a third through hole (151) matched with the optical fingerprint chip (12), and a portion of the optical fingerprint chip (12) which is not shielded by the light shielding layer (14) is exposed from the third through hole (151).
6. The optical fingerprint unlocking module set of claim 1, wherein the optical fingerprint unlocking module set (10) further comprises a reinforcing sheet (16), and the reinforcing sheet (16) is arranged on the lower surface of the circuit substrate (11).
7. The optical fingerprint unlocking module set of claim 6, wherein the reinforcing sheet (16) is made of steel.
8. The optical fingerprint unlocking module set according to claim 1, wherein a first installation portion (111) is disposed on the circuit substrate (11), a second installation portion (142) corresponding to the first installation portion (111) is disposed on the light shielding layer (14), and installation holes are disposed on the first installation portion (111) and the second installation portion (142).
9. A display screen, characterized in that the lower surface of the display screen is provided with an optical fingerprint unlocking module (10) according to any one of claims 1-8.
10. An electronic device characterized in that it comprises a display screen as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020162547.2U CN211554958U (en) | 2020-02-11 | 2020-02-11 | Optical fingerprint unlocking module, display screen and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020162547.2U CN211554958U (en) | 2020-02-11 | 2020-02-11 | Optical fingerprint unlocking module, display screen and electronic equipment |
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| CN211554958U true CN211554958U (en) | 2020-09-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864339A (en) * | 2021-01-26 | 2021-05-28 | 京东方科技集团股份有限公司 | Display device and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864339A (en) * | 2021-01-26 | 2021-05-28 | 京东方科技集团股份有限公司 | Display device and manufacturing method thereof |
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Effective date of registration: 20201203 Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshanqiu titanium biometric technology Co., Ltd Address before: 215300 No. 3 Rainbow Road, Kunshan hi tech Industrial Development Zone, Jiangsu, Suzhou Patentee before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |