CN211554562U - Backlight module, display device and electronic equipment - Google Patents
Backlight module, display device and electronic equipment Download PDFInfo
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- CN211554562U CN211554562U CN201921866241.9U CN201921866241U CN211554562U CN 211554562 U CN211554562 U CN 211554562U CN 201921866241 U CN201921866241 U CN 201921866241U CN 211554562 U CN211554562 U CN 211554562U
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Abstract
According to the embodiment of the utility model provides a backlight unit, display device and electronic equipment through use at least partly of fin cladding light screen and at least partly of framework in anti-backlight unit of organizing for the heat that backlight and circuit board produced in the anti-backlight unit of organizing can distribute fast via the fin, has reduced near the heat hoarding of backlight. In some embodiments, the effects including, but not limited to, reducing the taping glue structure, fixing the backlight module, improving the light-shielding performance of the taping structure, and improving the heat dissipation performance of the backlight module can be achieved.
Description
Technical Field
The utility model relates to a liquid crystal display technology field especially relates to a backlight module, display device and electronic equipment.
Background
In recent years, with the development of science and technology, various devices with display screens are increasingly popularized in daily life of people, the time for people to use the devices with the display screens is also increasingly long every day, and electronic devices with good heat dissipation performance can influence and improve the use experience of users to a great extent, so that the heat dissipation performance of the electronic devices is also a large field concerned by consumers, especially for mobile terminals such as smart phones, the holding posture needs to be kept during use, and the demand for the heat dissipation performance is higher. Because the backlight module of the display screen of various electronic devices can also generate more heat during operation, the backlight module is required to have a good heat dissipation structure in order to improve the heat dissipation effect of the backlight module.
A conventional front backlight module in the related art has a partial structure as shown in fig. 1, which includes an iron frame 11, a light emitting assembly 12, a light shielding plate 13, an optical film group 14, and so on. Because the light-emitting component works, the backlight source and the circuit board can generate more heat, and the heat emitted by the backlight source and the circuit board is difficult to dissipate because the heat-dissipating structure is not arranged near the light-emitting component in the positive group backlight module in the related technology, so that the backlight module generates heat more seriously.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a pair of backlight unit, display device and electronic equipment, the main technical problem who solves is: the heat dissipation performance of the positive backlight module is poor, so that the positive backlight module generates heat seriously.
In order to solve the above technical problem, an embodiment of the present invention provides a backlight module, which includes a frame, an optical film set, a light emitting module and a light shielding film, wherein the optical film set is disposed on a bottom surface of the frame, and a predetermined distance is left between a light incident end of the optical film set and one end of the frame for the light emitting module to be placed in; one end of a circuit board of the light-emitting component is fixed on the light guide plate in the optical film group, the other end of the circuit board is arranged on the side wall of the frame close to the light incident end of the optical film group, and a backlight source of the light-emitting component faces the bottom edge of the frame and is opposite to the light incident end of the optical film group; the heat radiating fins cover at least one part of the bottom surface and at least one part of the side surface of the frame and at least one part of the circuit board of the light-emitting component; the shading plate is arranged on the radiating fin of the circuit board wrapping the light-emitting component to shade the light-emitting component.
In an embodiment of the present invention, the integrated frame is divided into an outer frame and an inner frame, and the inner frame is fixed at a position where the bottom surface of the outer frame and the side surface of the outer frame close to the light emitting module meet each other.
In an embodiment of the present invention, the heat sink is integrally formed by covering at least a part of the bottom surface and at least a part of the side surface of the outer frame, and at least a part of the circuit board of the light emitting module.
In an embodiment of the present invention, a rectangular groove with a predetermined length and width is disposed on the heat sink, and the rectangular groove extends from one end of the heat sink close to the back group backlight source to the other end;
or, the heat sink is provided with a hole for the circuit board of the light-emitting component to extend out.
In an embodiment of the present invention, the heat dissipation sheet is a graphite sheet.
In an embodiment of the present invention, the optical film set at least includes a reflective film, a light guide plate, a diffusion film and a brightness enhancement film.
In an embodiment of the present invention, the inner frame is a rubber frame, and the outer frame is an iron frame.
In order to solve the above technical problem, an embodiment of the present invention further provides a liquid crystal display device, including the above backlight module.
In order to solve the above technical problem, an embodiment of the present invention further provides an electronic device, including the above liquid crystal display device.
The utility model has the advantages that:
according to the embodiment of the utility model provides a backlight unit, display device and electronic equipment through increase the fin in positive group backlight unit to utilize at least partly of fin cladding frame bottom surface and at least partly of side, and the partly of light-emitting component's circuit board, make the heat that light-emitting component's backlight and circuit board produced can distribute fast via the fin in positive group backlight unit, reduced near light-emitting component's heat and hoarded. In some embodiments, effects including, but not limited to, improving heat dissipation of the backlight module can be achieved.
Other features and corresponding advantages of the invention are set forth in the following part of the specification, and it is to be understood that at least some of the advantages become apparent from the description of the invention.
Drawings
FIG. 1 is a schematic structural diagram of a conventional front backlight module;
fig. 2 is a schematic structural view of a backlight module according to a first embodiment of the present invention;
fig. 3 is a schematic view of a heat sink structure according to a first embodiment of the present invention;
fig. 4 is a schematic view of a heat sink structure according to a first embodiment of the present invention;
fig. 5 is a schematic view illustrating a manufacturing method of a backlight module with a heat sink covered by a heat sink according to a first embodiment of the present invention;
fig. 6 is a schematic side view of a backlight module with a heat sink covered by a heat sink according to a first embodiment of the present invention;
fig. 7 is a schematic view of a heat sink structure according to a second embodiment of the present invention;
fig. 8 is a schematic view illustrating a manufacturing process of a backlight module with a heat sink covered according to a second embodiment of the present invention;
fig. 9 is a schematic side view of a backlight module with a heat sink covered according to a second embodiment of the present invention;
fig. 10 is a schematic view of the FPC board extending from the frame in various embodiments of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings. It is to be understood that the embodiments described herein are only some embodiments, and not all embodiments, of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The first embodiment is as follows:
in order to solve the problem of serious heat generation of the front group backlight module due to poor heat dissipation performance of the front group backlight module in the related art, the present embodiment provides a backlight module, as shown in fig. 2, which includes a frame 21, a light emitting assembly 22, a light shielding plate 23, a heat sink 27, and an optical film group 24.
The light emitting module 22 is fixed on the inner side of the bottom surface of the frame body, and is divided into two parts, namely an FPC board 25 and a backlight 26, preferably, the backlight is an LED light source. One end of the FPC board is fixed on the light guide plate in the optical film group 24, and the other end is placed on the side wall of the frame 21 near the light incident end of the optical film group and extends outward of the frame as shown in fig. 10. The backlight source is fixed on the FPC circuit board and faces the bottom surface of the frame.
The optical film set 24 is disposed on the bottom surface of the frame and is composed of a plurality of different optical films, for example, in some embodiments, the optical film set includes a reflective film, a light guide plate, a diffusion film and a brightness enhancement film in sequence from the bottom surface of the frame, and in some embodiments, the brightness enhancement film may be a single film or two films. The light incident end of the optical film group is opposite to the reverse group backlight source so as to allow the light emitted by the reverse group backlight source to enter. It should be noted that the above lists only a few common optical films, and the present invention is not limited to the listed optical films, and in fact, all fall within the scope of the present invention as long as the present invention belongs to the optical films.
The frame 21 is not fixed and can be made of any material suitable for the frame, and preferably, the frame is divided into an outer frame 28 and an inner frame 29, the inner frame is fixed at the position where the bottom surface of the outer frame and the side surface of the outer frame close to the light emitting assembly are jointed, the outer frame is made of an iron frame, and the inner frame is made of a rubber frame.
The heat radiation sheet 27 covers at least a part of the FPC board of the light emitting module 22, at least a part of the bottom surface and at least a part of the side surface of the frame 21, and preferably, the heat radiation sheet 27 covers the entire bottom surface of the outer frame 28, the side surface of the inner frame 29 which is flush with the side surface of the outer frame, and a part of the FPC board of the light emitting module 22 in the frame 21. The heat sink is a unitary structure with good thermal conductivity, and includes but is not limited to graphite sheets and various metal sheets, and preferably, the heat sink is a graphite sheet. Preferably, as shown in fig. 3, the hole is rectangular, and the length of the long side of the hole is not less than the width of the FPC board, or as shown in fig. 4, the hole is rectangular, and the length of the long side of the hole is not less than the width of the FPC board.
The heat sink covering the FPC board of the light emitting assembly 22 is further provided with a light shielding plate 23 above the heat sink, covering the FPC board and a part of the optical film set, for shielding the light emitted by the light emitting assembly.
An example of manufacturing the backlight module with the heat sink wrapped in the embodiment is provided below, as shown in fig. 5, the steps are divided into four steps:
(1) the graphite sheet is secured to the frame.
(2) The semi-finished product of the frame and the heat sink is placed in the jig groove, as shown in fig. 6, after the jig groove limits the heat sink, the heat sink stands along the side wall of the frame body.
(3) Fixing the reflecting film in the optical film group on the bottom surface of the frame, then obliquely inserting the semi-finished product formed by combining the light guide plate and the FPC circuit board into the holes of the vertical radiating fins, and then flatly placing the semi-finished product downwards and placing the semi-finished product on the reflecting film.
(4) The rolling pulley on the jig slides from one end of the frame close to the positive group backlight source to the other end, and the erected heat dissipation is pressed to the FPC circuit board.
In the backlight module provided by the embodiment, at least a part of the bottom surface of the frame, at least a part of the side surface of the frame and at least a part of the circuit board in the light-emitting assembly are wrapped by the heat radiating fins, so that heat generated by the backlight source and the circuit board in the light-emitting assembly can be quickly dissipated through the heat radiating fins, the problem of difficulty in heat dissipation of the backlight module in the related art is solved, and the heat dissipation performance of the backlight module is improved.
Example two
In order to solve the problem of serious heat generation of the front group backlight module due to poor heat dissipation performance of the front group backlight module in the related art, the present embodiment provides a backlight module, as shown in fig. 2, which includes a frame 21, a light emitting assembly 22, a light shielding plate 23, a heat sink 27, and an optical film group 24.
The light emitting module 22 is fixed on the inner side of the bottom surface of the frame body, and is divided into two parts, namely an FPC board 25 and a backlight 26, preferably, the backlight is an LED light source. One end of the FPC board is fixed on the light guide plate in the optical film group 24, and the other end is placed on the side wall of the frame 21 near the light incident end of the optical film group and extends outward of the frame as shown in fig. 10. The backlight source is fixed on the FPC circuit board and faces the bottom surface of the frame.
The optical film set 24 is disposed on the bottom surface of the frame and is composed of a plurality of different optical films, for example, in some embodiments, the optical film set includes a reflective film, a light guide plate, a diffusion film and a brightness enhancement film in sequence from the bottom surface of the frame, and in some embodiments, the brightness enhancement film may be a single film or two films. The light incident end of the optical film group is opposite to the reverse group backlight source so as to allow the light emitted by the reverse group backlight source to enter. It should be noted that the above lists only a few common optical films, and the present invention is not limited to the listed optical films, and in fact, all fall within the scope of the present invention as long as the present invention belongs to the optical films.
The frame 21 is not fixed and can be made of any material suitable for manufacturing the frame body, and preferably, the frame is divided into an outer frame body 27 and an inner frame body 28, the inner frame body is fixed at the position where the bottom surface of the outer frame body is jointed with the side surface of the outer frame body close to the light emitting assembly, the outer frame body is made of an iron frame, and the inner frame body is made of a rubber frame.
The heat radiation sheet 27 covers at least a part of the FPC board of the light emitting module 22, at least a part of the bottom surface and at least a part of the side surface of the frame 21, and preferably, the heat radiation sheet 24 covers the entire bottom surface of the outer frame 27, the side surface of the inner frame 28 which is flush with the side surface of the outer frame, and a part of the FPC board of the light emitting module 22 in the frame 21. The heat sink is a unitary structure with good thermal conductivity, and includes but is not limited to graphite sheets and various metal sheets, and preferably, the heat sink is a graphite sheet. As shown in fig. 7, a rectangular groove with a preset length and width for extending the FPC board of the light emitting assembly is provided on the heat sink, and the rectangular groove extends from one end of the heat sink close to the back group backlight source to the other end, and it should be understood that the length and width of the rectangular groove can be flexibly adjusted according to practical applications.
The heat sink covering the FPC board of the light emitting assembly 22 is further provided with a light shielding plate 23 above the heat sink, covering the FPC board and a part of the optical film set, for shielding the light emitted by the light emitting assembly.
An example of manufacturing the backlight module with the heat sink covered in the embodiment is provided below, as shown in fig. 8, the steps are divided into four steps:
(1) the graphite sheet is secured to the frame.
(2) The semi-finished product of the frame and the heat sink is placed in the jig groove, as shown in fig. 9, after the jig groove limits the heat sink, the heat sink stands along the side wall of the frame body.
(3) And fixing the reflecting film in the optical film group on the bottom surface of the frame, and then placing the semi-finished product formed by combining the light guide plate and the FPC circuit board on the reflecting film from top to bottom.
(4) The rolling pulley on the jig slides from one end of the frame close to the positive group backlight source to the other end, and the erected heat dissipation is pressed to the FPC circuit board.
In the backlight module provided by the embodiment, at least a part of the bottom surface of the frame, at least a part of the side surface of the frame and at least a part of the circuit board in the light-emitting assembly are wrapped by the heat radiating fins, so that heat generated by the backlight source and the circuit board in the light-emitting assembly can be quickly dissipated through the heat radiating fins, the problem of difficulty in heat dissipation of the backlight module in the related art is solved, and the heat dissipation performance of the backlight module is improved.
EXAMPLE III
In order to solve the problem that the heat dissipation performance of the front backlight module is poor and the front backlight module generates heat seriously in the related art, the embodiment provides a display device.
The display device in this embodiment includes the backlight module in the first embodiment, and further includes a liquid crystal display panel. The kind of the liquid crystal display panel is not limited, and includes, but is not limited to, a Twisted Nematic (TN) panel, a VA panel, an in-plane switching (IPS) panel, a continuous flame alignment (CPA) panel, and an advanced super-dimensional field switching (ADSDS) panel.
The display device provided by the embodiment solves the problem of difficulty in heat dissipation of the backlight module in the related art, and improves the heat dissipation performance of the display device.
Example four
In order to solve the problem that the heat dissipation performance of the front-group backlight module is poor and the front-group backlight module generates heat seriously in the related art, the embodiment provides an electronic device.
It should be understood that the terminal of the present embodiment may be implemented in various forms, for example. For example, the electronic device described in the present embodiment may include a mobile terminal such as a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and the like, and a fixed terminal such as a Digital TV, a desktop computer, and the like,
The electronic equipment provided by the embodiment solves the problem of difficulty in heat dissipation of the backlight module in the related art, and improves the heat dissipation performance of the electronic equipment.
The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (9)
1. A backlight module is characterized by comprising a frame, an optical film group, a light-emitting component, a radiating fin and a light shielding plate, wherein the optical film group is arranged on the bottom surface of the frame, and a preset distance is reserved between the light incident end of the optical film group and one end of the frame for the light-emitting component to be placed in; one end of a circuit board of the light-emitting component is fixed on the light guide plate in the optical film group, the other end of the circuit board is placed on the side wall of the frame close to the light incident end of the optical film group, and a backlight source of the light-emitting component faces to the bottom edge of the frame and is opposite to the light incident end of the optical film group; the heat radiating fin covers at least one part of the bottom surface and at least one part of the side surface of the frame and at least one part of the circuit board of the light-emitting component; the light shielding plate is arranged on a radiating fin of a circuit board wrapping the light-emitting component and shields the light-emitting component.
2. The backlight module as claimed in claim 1, wherein the frame is divided into an outer frame and an inner frame, and the inner frame is fixed at a position where a bottom surface of the outer frame meets a side surface of the outer frame adjacent to the light emitting device.
3. The backlight module of claim 2, wherein the heat sink enclosing at least a portion of the bottom surface and at least a portion of the side surfaces of the frame and at least a portion of the circuit board of the light emitting assembly is a unitary structure.
4. The backlight module as claimed in claim 3, wherein the heat sink has a rectangular groove of a predetermined length and width for the circuit board of the light emitting device to protrude from, the rectangular groove extending from one end of the heat sink adjacent to the back-set backlight source to the other end;
or, the heat sink is provided with a hole for the circuit board of the light-emitting component to extend out.
5. The backlight module of claim 4, wherein the heat sink is a graphite sheet.
6. The backlight module as claimed in claim 5, wherein the optical film group comprises at least a brightness enhancement film, a light guide plate, a reflective film and a diffusion film.
7. The backlight module as claimed in claim 6, wherein the inner frame is a rubber frame, and the outer frame is an iron frame.
8. A display device comprising a liquid crystal display panel, further comprising a backlight module according to any one of claims 1 to 7.
9. An electronic device characterized by comprising the liquid crystal display device according to claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921866241.9U CN211554562U (en) | 2019-10-29 | 2019-10-29 | Backlight module, display device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921866241.9U CN211554562U (en) | 2019-10-29 | 2019-10-29 | Backlight module, display device and electronic equipment |
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| Publication Number | Publication Date |
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| CN211554562U true CN211554562U (en) | 2020-09-22 |
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| CN201921866241.9U Active CN211554562U (en) | 2019-10-29 | 2019-10-29 | Backlight module, display device and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114035371A (en) * | 2021-10-12 | 2022-02-11 | 深圳市南极光电子科技股份有限公司 | Backlight module, preparation process thereof and display device |
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2019
- 2019-10-29 CN CN201921866241.9U patent/CN211554562U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114035371A (en) * | 2021-10-12 | 2022-02-11 | 深圳市南极光电子科技股份有限公司 | Backlight module, preparation process thereof and display device |
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