CN211537163U - Pipeline semiconductor refrigeration defogging dehumidifier - Google Patents
Pipeline semiconductor refrigeration defogging dehumidifier Download PDFInfo
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- CN211537163U CN211537163U CN201921928336.9U CN201921928336U CN211537163U CN 211537163 U CN211537163 U CN 211537163U CN 201921928336 U CN201921928336 U CN 201921928336U CN 211537163 U CN211537163 U CN 211537163U
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Abstract
The utility model relates to a pipeline semiconductor refrigeration defogging dehumidifier, include: the device comprises a pipe frame, at least one semiconductor refrigerating sheet and a plurality of spiral condensing parts, wherein the pipe frame is of a hollow box body structure with two open ends, one open end is an inlet end containing fog airflow, and the other open end is an outlet end of the fog-removing airflow; the semiconductor refrigerating sheet is communicated with the refrigerating circuit, and the cold end of the semiconductor refrigerating sheet is tightly attached to the outer wall of the tube frame; the spiral condensing parts are arranged inside the tube frame; the spiral condensing part includes: the cold guide plate is tightly attached to the inner wall of the tube frame; the cold guide rod is connected with the cold guide plate; the spiral fin is arranged on the cold guide rod. The defogging dehumidifier has the advantages of simple and compact structure, convenient processing and excellent dehumidification and defogging effects.
Description
Technical Field
The utility model relates to a dehumidification technical field, in particular to pipeline semiconductor refrigeration defogging dehumidifier.
Background
The demister is widely applied to acid mist recovery places for wet desulphurization demisting and acid making, reduces the emission of fog drops and the recovery of valuable liquid, and improves the atmospheric environment. In some scientific research experiment systems, moderate air humidity is also generally needed to meet the humidity requirement of the experiment, and the dehumidification and defogging of high-humidity air have practical application requirements.
Mechanical defogging/dehumidification, filtration defogging/dehumidification, temperature reduction defogging/dehumidification, low-temperature refrigerant defogging/dehumidification and the like are basic forms which are widely applied. Mechanical defogging develops to have silk screen defroster, baffling board defroster, shutter defroster now, and the advantage of this type of mechanical type defroster is no moving part, and the fault rate is low, and the shortcoming is that the dehumidification effect is slightly poor. The low-temperature refrigerant overcomes the defect of poor dehumidification effect of mechanical demisting, has good dehumidification effect, needs refrigerant phase change equipment, and brings the defects of complex system and high equipment cost.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pipeline semiconductor refrigeration defogging dehumidifier has solved current low temperature refrigerant defogging device structure complicacy, and technical problem with high costs has realized simple structure compactness, processing convenience, the good technological effect of dehumidification defogging effect.
The utility model provides a pipeline semiconductor refrigeration defogging dehumidifier, include: a tube frame, at least one semiconductor refrigerating sheet and a plurality of spiral condensing parts, wherein,
the tube frame is of a hollow box body structure with two open ends, wherein one open end is an inlet end containing mist airflow, and the other open end is an outlet end containing mist airflow;
the semiconductor refrigerating sheet is communicated with the refrigerating circuit, and the cold end of the semiconductor refrigerating sheet is tightly attached to the outer wall of the tube frame;
a plurality of the spiral condensing parts are arranged inside the tube frame; the spiral condensing part includes: the cooling guide plate is tightly attached to the inner wall of the tube frame; the cold guide rod is connected with the cold guide plate; the spiral fin is arranged on the cold guide rod.
Preferably, the number of the semiconductor refrigeration pieces is 3,
the left end of the pipe frame is the inlet end, and the right end of the pipe frame is the outlet end;
and 3 semiconductor refrigerating sheets are respectively and tightly attached to the outer walls of the front panel, the rear panel and the top plate of the tube frame.
Preferably, the device also comprises a water collecting tank,
a bottom plate of the pipe frame is provided with a plurality of converging holes;
the water collecting groove is arranged below the confluence hole.
Preferably, the spiral condensing units are vertically arranged side by side and are fixed in the tube frame in a matrix arrangement.
Preferably, the distance between adjacent spiral condensing parts is equal to the diameter of the spiral fin.
Preferably, the thickness of the helical fin is not more than 1 mm.
Preferably, the cold guide plate and the cold guide rod are made of red copper.
Preferably, the method further comprises the following steps: a temperature and humidity sensor, a controller and a control switch,
the temperature and humidity sensor is arranged at the outlet end of the pipe frame to detect the temperature and humidity information of the demisting airflow;
the controller is electrically connected with the temperature and humidity sensor and the control switch;
the control switch is connected to the refrigeration circuit;
and after receiving the temperature and humidity information, the controller sends an instruction to the control switch to enable the refrigeration circuit to be switched on or off.
Preferably, the semiconductor refrigeration device further comprises a radiating fin and a fan, wherein the radiating fin is arranged at the hot end of the semiconductor refrigeration piece in a clinging manner; the fan is arranged on the heat radiating fin.
Preferably, the heat-insulating pipe further comprises a heat-insulating layer, flanges are arranged at the inlet end and the outlet end of the pipe frame, and the heat-insulating layer is arranged between the flanges and the inlet end and the outlet end respectively.
The utility model provides a pipeline semiconductor refrigeration defogging dehumidifier has following technological effect or advantage at least:
by arranging the defogging dehumidifier consisting of the tube frame, at least one semiconductor refrigerating sheet and a plurality of spiral condensing parts, after the semiconductor refrigerating sheet is connected with a power supply, under the action of Peltier effect and Thomson effect, a hot end and a cold end are generated on the semiconductor refrigerating sheet, and the cold end of the semiconductor refrigerating sheet is a defogging and dehumidifying cold source; the cold energy generated by the semiconductor refrigerating sheet is conducted to the spiral fin through the wall surface of the pipe frame, the cold guide plate of the spiral condensing part and the cold guide rod, so that the temperature of the surface of the spiral fin is lower than the dew point temperature of the airflow, and when mist-containing airflow flows into the spiral fin, airflow fog drops and water molecules are condensed and separated out on the surface of the spiral fin, thereby reducing the air humidity; the technical problems of complex structure and high cost of the existing low-temperature refrigerant defogging device are solved, and the technical effects of simple and compact structure, convenient processing and good dehumidification and defogging effects are realized.
Drawings
FIG. 1 is a schematic diagram of a ducted semiconductor refrigeration defogging dehumidifier according to an embodiment of the present application;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a schematic diagram of the spiral condensing element of FIG. 1;
fig. 4 is a cross-sectional view taken along line B-B of fig. 3.
(the parts represented by each reference number in the figure are 1 water collecting tank, 2 tube frames, 3 spiral condensing parts, 4 semiconductor refrigerating sheets, 5 radiating fins, 6 hot end fans, 7 temperature and humidity sensing controllers, 8 control switches, 9 heat insulating layers, 31 spiral fins, 32 cold guide rods and 33 cold guide plates in sequence)
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
Referring to fig. 1 and 2, the utility model provides a pipeline semiconductor refrigeration defogging dehumidifier, include: a tube frame 2, at least one semiconductor refrigerating sheet 4 and a plurality of spiral condensing units 3, wherein,
the pipe frame 2 is arranged into a hollow box structure with two open ends, wherein one open end is an inlet end containing mist airflow, and the other open end is an outlet end containing mist airflow. The semiconductor refrigerating plate 4 is communicated with the refrigerating circuit, and the cold end of the semiconductor refrigerating plate 4 is tightly attached to the outer wall of the tube frame 2.
A plurality of spiral condensing parts 3 are arranged inside the tube frame 2; referring to fig. 3 and 4, the spiral condensing part 3 includes: the cold guide plate 33, the cold guide rod 32 and the spiral fin 31, wherein the cold guide plate 33 is tightly attached to the inner wall of the tube frame 2; the cold guide rod 32 is connected with the cold guide plate 33; the spiral fin 31 is provided on the cold lead bar 32.
As a preferred embodiment, the number of the semiconductor refrigeration pieces 4 is 3, the left end of the tube frame 2 is an inlet end, and the right end is an outlet end; the 3 semiconductor refrigeration pieces 4 are respectively clung to the outer walls of the front panel, the rear panel and the top plate of the tube frame 2.
By arranging the defogging dehumidifier consisting of the tube frame 2, at least one semiconductor refrigerating sheet 4 and a plurality of spiral condensing parts 3, after the semiconductor refrigerating sheet 4 is powered on, under the action of Peltier effect and Thomson effect, a hot end and a cold end are generated on the semiconductor refrigerating sheet 4, and the cold end of the semiconductor refrigerating sheet 4 is a defogging and dehumidifying cold source; the cold energy generated by the semiconductor refrigeration sheet 4 is conducted to the spiral fin 31 through the wall surface of the tube frame 2, the cold guide plate 33 of the spiral condensation part 3 and the cold guide rod 32, so that the temperature of the surface of the spiral fin 31 is lower than the dew point temperature of the airflow, and when the mist-containing airflow flows into the spiral fin 31, airflow mist drops and water molecules are condensed and separated on the surface of the spiral fin 31, thereby reducing the air humidity.
Further, the device also comprises a water collecting tank 1, and a bottom plate of the pipe frame 2 is provided with a plurality of converging holes; the water collecting tank 1 is arranged below the converging hole so as to collect the condensed water on the bottom plate of the pipe frame 2.
Further, a plurality of spiral condensing units 3 are vertically arranged side by side and are fixed in the pipe frame 2 in a matrix arrangement. The spacing between adjacent spiral condensing elements 3 is equal to the diameter of the spiral fins 31. As a preferred embodiment, the thickness of the helical fin 31 is not more than 1 mm. The material of the cold conducting plate 33 and the cold conducting rod 32 is red copper.
Further, the method also comprises the following steps: the temperature and humidity sensor is arranged at the outlet end of the pipe frame 2 to detect the temperature and humidity information of the demisting airflow; the controller 7 is electrically connected with the temperature and humidity sensor and the control switch 8; the control switch 8 is connected to the refrigeration circuit; after receiving the temperature and humidity information, the controller 7 sends an instruction to the control switch 8 to control the refrigeration circuit to be switched on or off if the temperature and humidity exceed or are lower than a set value.
Further, the cooling device also comprises a cooling fin 5 and a fan 6, wherein the cooling fin 5 is tightly attached to the hot end of the semiconductor refrigerating fin 4; the fan 6 is disposed on the heat sink 5. The heat at the hot end of the semiconductor refrigerating plate 4 is rapidly taken away by the heat radiating plate 5 and the fan 6.
Further, referring to fig. 1, the heat insulating layer 9 is further included, flanges are disposed at the inlet end and the outlet end of the tube frame 2, and the heat insulating layer 9 is disposed between the flanges and the inlet end and the outlet end, respectively.
The working principle and the structural features of the demister of the present application will be further explained as follows:
the condensation demisting and dehumidifying process is that after the semiconductor refrigerating sheet 4 is powered on, under the action of Peltier effect and Thomson effect, the semiconductor refrigerating sheet 4 produces hot end and cold end, and the cold end of the semiconductor refrigerating sheet 4 is the cold source for demisting and dehumidifying. The cold energy generated by the semiconductor refrigerating sheet 4 is conducted to the spiral fin 31 through the wall surface of the tube frame 2, the cold guide plate 33 of the spiral condensing part 3 and the cold guide rod 32, so that the temperature of the surface of the spiral fin 31 is lower than the dew point temperature of the airflow, and when mist-containing airflow flows into the spiral fin 31, airflow fog drops and water molecules are condensed and separated on the surface of the fin, thereby reducing the air humidity.
After the fog-containing (high-humidity) airflow enters the demisting dehumidifier along the inlet end, when the fog-containing airflow flows into the spiral condensing part 3, liquid drops can impact the spiral fins 31 and the cold guide rod 32 in a head-on manner, and the liquid drops are captured and separated out due to collision and interception effects in the impact process.
The liquid that precipitates in condensation and mechanical defogging dehumidification process forms the liquid film on helical fin 31 surface and cold guide rod 32 surface, and the liquid film bodiness along with the continuation of process converges under the action of gravity to the water catch bowl when the liquid film reaches certain thickness.
This defogging dehumidifier can be according to the use occasion, decides 2 lengths of pipe frame and the quantity of semiconductor refrigeration piece 4 of a pipeline formula semiconductor refrigeration dehumidification defroster, and then decides the line number and the row number of spiral condensing element 3.
In the defogging process, the relative humidity of the airflow is monitored and controlled through the temperature and humidity sensor and the controller 7, the controller 7 sets a reasonable temperature and humidity set value, and when the monitoring value of the temperature and humidity sensor at the outlet end deviates from the set value, the controller 7 cuts off or turns on the power supply of the semiconductor refrigerating sheet 4 through the control switch 8 which is connected with the controller 7.
This defogging dehumidifier integrates two kinds of defogging functions of mechanical type defogging and semiconductor refrigeration condensation defogging, forms a high-efficient defogging device, and simple structure is compact, and processing is simple, through the flange of entrance point and exit end, but convenient and fast's installation is used on the pipeline, has very strong practicality.
The above-mentioned embodiments further describe the objects, technical solutions and advantages of the present invention in detail, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a pipeline semiconductor refrigeration defogging dehumidifier which characterized in that includes: a tube frame, at least one semiconductor refrigerating sheet and a plurality of spiral condensing parts, wherein,
the tube frame is of a hollow box body structure with two open ends, wherein one open end is an inlet end containing mist airflow, and the other open end is an outlet end containing mist airflow;
the semiconductor refrigerating sheet is communicated with the refrigerating circuit, and the cold end of the semiconductor refrigerating sheet is tightly attached to the outer wall of the tube frame;
a plurality of the spiral condensing parts are arranged inside the tube frame; the spiral condensing part includes: the cooling guide plate is tightly attached to the inner wall of the tube frame; the cold guide rod is connected with the cold guide plate; the spiral fin is arranged on the cold guide rod.
2. The ducted semiconductor refrigeration mist dehumidifier recited in claim 1, wherein said semiconductor refrigeration sheets are 3 in number,
the left end of the pipe frame is the inlet end, and the right end of the pipe frame is the outlet end;
and 3 semiconductor refrigerating sheets are respectively and tightly attached to the outer walls of the front panel, the rear panel and the top plate of the tube frame.
3. The ducted semiconductor refrigeration mist dehumidifier recited in claim 2, further comprising a sump,
a bottom plate of the pipe frame is provided with a plurality of converging holes;
the water collecting groove is arranged below the confluence hole.
4. The ducted semiconductor refrigeration mist and moisture eliminator as claimed in claim 1, wherein a plurality of said spiral condensing elements are vertically arranged side-by-side and fixed in a matrix arrangement within said tube frame.
5. The ducted semiconductor refrigerated mist dehumidifier recited in claim 4, wherein the spacing between adjacent said spiral condensing elements is equal to the diameter of said spiral fins.
6. The ducted semiconductor refrigerated mist dehumidifier recited in claim 4, wherein said spiral fins are no more than 1mm thick.
7. The ducted semiconductor refrigeration defogging dehumidifier recited in claim 1 wherein said cold conducting plate and said cold conducting rod are made of red copper.
8. The ducted semiconductor refrigerated mist eliminator as set forth in claim 1 further comprising: a temperature and humidity sensor, a controller and a control switch,
the temperature and humidity sensor is arranged at the outlet end of the pipe frame to detect the temperature and humidity information of the demisting airflow;
the controller is electrically connected with the temperature and humidity sensor and the control switch;
the control switch is connected to the refrigeration circuit;
and after receiving the temperature and humidity information, the controller sends an instruction to the control switch to enable the refrigeration circuit to be switched on or off.
9. The pipeline semiconductor refrigerating defogging dehumidifier recited in claim 1, further comprising a heat sink and a fan, wherein said heat sink is closely attached to the hot end of said semiconductor refrigerating sheet; the fan is arranged on the heat radiating fin.
10. The ducted semiconductor refrigeration demister as claimed in claim 1, further comprising a thermal insulation layer, wherein the inlet end and the outlet end of the tube frame are provided with flanges, and the thermal insulation layer is provided between the flanges and the inlet end and the outlet end, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921928336.9U CN211537163U (en) | 2019-11-08 | 2019-11-08 | Pipeline semiconductor refrigeration defogging dehumidifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921928336.9U CN211537163U (en) | 2019-11-08 | 2019-11-08 | Pipeline semiconductor refrigeration defogging dehumidifier |
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| Publication Number | Publication Date |
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| CN211537163U true CN211537163U (en) | 2020-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921928336.9U Active CN211537163U (en) | 2019-11-08 | 2019-11-08 | Pipeline semiconductor refrigeration defogging dehumidifier |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113731130A (en) * | 2021-10-09 | 2021-12-03 | 清远市鑫辉化工有限公司 | Air drying structure for fluidized bed |
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2019
- 2019-11-08 CN CN201921928336.9U patent/CN211537163U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113731130A (en) * | 2021-10-09 | 2021-12-03 | 清远市鑫辉化工有限公司 | Air drying structure for fluidized bed |
| CN113731130B (en) * | 2021-10-09 | 2024-02-27 | 清远市鑫辉化工有限公司 | Air drying structure for fluidized bed |
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