CN211529941U - Partition shielding structure of electromagnetic shielding product - Google Patents
Partition shielding structure of electromagnetic shielding product Download PDFInfo
- Publication number
- CN211529941U CN211529941U CN201922371887.6U CN201922371887U CN211529941U CN 211529941 U CN211529941 U CN 211529941U CN 201922371887 U CN201922371887 U CN 201922371887U CN 211529941 U CN211529941 U CN 211529941U
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- electromagnetic
- electromagnetic shield
- bonding wire
- electromagnetic shielding
- shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to a shielding structure of electromagnetic shield product subregion, it includes base plate (1), base plate (1) is including electromagnetic shield region (11) and non-electromagnetic shield region (12), electromagnetic shield region (11) all are provided with ground connection pad (13) all around, electromagnetic shield region (11) top is provided with bonding wire (2), sensitive chip (4) top is provided with bonding wire (2), bonding wire (2) are connected between two ground connection pads (13) on electromagnetic shield region (11) adjacent both sides, bonding wire (2) all cover the top of electromagnetic shield region (11) and all around. The utility model relates to a shielding structure of electromagnetic shield product subregion, it can realize the shielding effect of better side through adjustment bonding wire angle.
Description
Technical Field
The utility model relates to a shielding structure of electromagnetic shield product subregion belongs to semiconductor packaging technology field.
Background
In the traditional packaged electronic product, the shielding of the partitioned area of the electromagnetic shielding product is realized by welding wires in a mode of being parallel to the long edge and the short edge of the shape, and the height of each welding wire is less than or equal to 1/2 wavelength to be shielded. In the wire welding mode, when the side shielding wire welding operation is carried out, the problem that the side shielding can not meet the requirement exists because the wire arc is longer. In addition, the workability of the ultra-low-arc bonding wire is poor.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that an electromagnetic shield product subregion shielding structure is provided to above-mentioned prior art, it can realize the shielding effect of better side through adjusting the bonding wire angle.
The utility model provides a technical scheme that above-mentioned problem adopted does: the utility model provides an electromagnetic shield product zoning shielded structure, it includes the base plate, the base plate includes electromagnetic shield region and non-electromagnetic shield region, all be provided with ground connection pad around the electromagnetic shield region, be provided with sensitive chip on the electromagnetic shield region, sensitive chip top is provided with the bonding wire, the bonding wire is connected between two ground connection pads on the adjacent both sides in electromagnetic shield region, the bonding wire is whole to be covered electromagnetic shield region's top and all around.
Preferably, if the electromagnetic shielding region is rectangular, the direction of the welding line is perpendicular to a diagonal line of the rectangular electromagnetic shielding region; if the electromagnetic shielding area is in a special shape, the direction of the welding line is perpendicular to the longest span line of the special-shaped electromagnetic shielding area.
Preferably, the welding wire has multiple layers, and the multiple layers of welding wires are welded at intervals at the same angle and different arc heights.
Preferably, the arc height spacing of the multilayer welding wires is more than one wire diameter.
Preferably, the minimum distance between the lowest wire arc of the multilayer bonding wire and the sensitive chip is not less than one wire diameter.
Preferably, the bonding wire is partially covered or completely covered with the non-conductive glue.
Compared with the prior art, the utility model has the advantages of:
1. the utility model can realize better shielding effect of full enclosure by covering multiple layers of welding wires with the same angle in the electromagnetic shielding area;
2. the utility model discloses can be according to conventional and unconventional shape, select the bonding wire of perpendicular and the biggest diagonal of shape to realize best originated wire arc stability.
Drawings
Fig. 1 is a schematic diagram of the partitioned shielding structure of the electromagnetic shielding product of the present invention.
Fig. 2 is a schematic view of a structure for enhancing the strength of a bonding wire.
Wherein:
Non-electromagnetic shielding region 12
Non-conductive glue 3
And a sensitive chip 4.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments.
As shown in fig. 1 and 2, the zoned shielding structure of the electromagnetic shielding product in this embodiment includes a substrate 1, where the substrate 1 includes an electromagnetic shielding region 11 and a non-electromagnetic shielding region 12, ground pads 13 are disposed around the electromagnetic shielding region 11, a sensitive chip 4 is disposed on the electromagnetic shielding region 11, a bonding wire 2 is disposed above the sensitive chip 4, the bonding wire 2 is connected between two ground pads 13 on two adjacent sides of the electromagnetic shielding region 11, and the bonding wire 2 completely covers the upper side and the periphery of the electromagnetic shielding region 11;
if the electromagnetic shielding region 11 is rectangular, the direction of the welding wire 2 is perpendicular to the diagonal line of the rectangular electromagnetic shielding region 11;
if the electromagnetic shielding region 11 is in a special shape, the direction of the welding line 2 is perpendicular to the longest span line of the special-shaped electromagnetic shielding region 11;
the bonding wires 2 are in multiple layers, the multiple layers of bonding wires 2 are welded at intervals by adopting the same angle and different arc heights, and the multiple layers of bonding wires 2 form an electromagnetic shielding wall to prevent the sensitive chip 4 from being interfered by electromagnetic waves;
the distance between the arc heights of the multilayer welding wires 2 is more than one wire diameter;
the minimum distance between the lowest wire arc of the multilayer bonding wire 2 and the sensitive chip 4 is not less than one time of the wire diameter;
the bonding wire 2 is partially or completely covered with the non-conductive glue 3, so that the supporting strength of the bonding wire can be enhanced;
the non-conductive glue 3 can be sprayed or spot-coated.
In addition to the above embodiments, the present invention also includes other embodiments, and all technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.
Claims (6)
1. The utility model provides a structure that electromagnetic shield product subregion was shielded which characterized in that: it includes base plate (1), base plate (1) includes electromagnetic shield region (11) and non-electromagnetic shield region (12), electromagnetic shield region (11) all is provided with ground connection pad (13) all around, be provided with sensitive chip (4) on electromagnetic shield region (11), sensitive chip (4) top is provided with bonding wire (2), bonding wire (2) are connected between two ground connection pad (13) on electromagnetic shield region (11) adjacent both sides, bonding wire (2) all cover electromagnetic shield region (11) the top and around.
2. The zoned shielding structure of an electromagnetic shielding product according to claim 1, wherein: if the electromagnetic shielding area (11) is rectangular, the direction of the welding line (2) is perpendicular to the diagonal line of the rectangular electromagnetic shielding area (11); if the electromagnetic shielding area (11) is in a special shape, the direction of the welding line (2) is perpendicular to the longest span line of the special-shaped electromagnetic shielding area (11).
3. The zoned shielding structure of an electromagnetic shielding product according to claim 1, wherein: the welding wire (2) has multiple layers, and the multiple layers of welding wires (2) are welded at intervals by adopting different arc heights at the same angle.
4. The zoned shielding structure of an electromagnetic shielding product according to claim 3, wherein: the arc height spacing of the multilayer welding lines (2) needs to be more than one time of the line diameter.
5. The zoned shielding structure of an electromagnetic shielding product according to claim 3, wherein: the minimum distance between the lowest wire arc of the multilayer bonding wire (2) and the sensitive chip (4) is not less than one wire diameter.
6. The zoned shielding structure of an electromagnetic shielding product according to claim 1, wherein: and the bonding wire (2) is partially or completely covered with a non-conductive adhesive (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922371887.6U CN211529941U (en) | 2019-12-26 | 2019-12-26 | Partition shielding structure of electromagnetic shielding product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922371887.6U CN211529941U (en) | 2019-12-26 | 2019-12-26 | Partition shielding structure of electromagnetic shielding product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211529941U true CN211529941U (en) | 2020-09-18 |
Family
ID=72466876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922371887.6U Active CN211529941U (en) | 2019-12-26 | 2019-12-26 | Partition shielding structure of electromagnetic shielding product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211529941U (en) |
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2019
- 2019-12-26 CN CN201922371887.6U patent/CN211529941U/en active Active
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