CN211529073U - High-heat-dissipation storage device for cloud computing host - Google Patents

Abstract

The application discloses high heat dissipation storage device for cloud computing host computer, this high heat dissipation storage device include storage box and radiator unit, the storage box includes the box, open at the top of box has the radiating groove, the mounting hole has been seted up to the lateral part of box, radiator unit includes absorber plate, heat-conducting plate and heating panel, the absorber plate the heat-conducting plate with the heating panel from interior to exterior set gradually in the mounting hole of box. This application makes things convenient for the upper end heat dissipation of cloud computing host computer through having seted up the radiating groove at the top of box, installs radiator unit through the lateral part at the box, has increaseed radiating area, and then has avoided the drawback because the heat gathering is brought in the inside of box.

Description

High-heat-dissipation storage device for cloud computing host

Technical Field

The application relates to the technical field of storage equipment, in particular to a high-heat-dissipation storage device for a cloud computing host.

Background

At present, for data storage, data is generally stored on some media and effective access can be guaranteed by adopting a reasonable, safe and effective mode according to different application environments, and the storage can generally comprise two aspects of meanings: on the one hand it is a physical medium where data resides temporarily or for a long time; on the other hand, it is a way or act to ensure the complete and safe storage of data. Storage is to combine these two aspects and provide a data storage solution to customers.

However, in the prior art, most of storage devices for cloud computing hosts have poor heat dissipation effects, heat inside the storage tank is easy to collect, and objects inside the storage tank are easy to damage.

SUMMERY OF THE UTILITY MODEL

In order to overcome the problems in the prior art, the main object of the present application is to provide a high heat dissipation storage device for a cloud computing host, which has a good heat dissipation effect and can avoid the disadvantages caused by the heat accumulated inside a box.

In order to achieve the above purpose, the following technical solutions are specifically adopted in the present application:

the application discloses high heat dissipation storage device for cloud computing host computer, this high heat dissipation storage device includes:

the storage box comprises a box body, the top of the box body is provided with a heat dissipation groove, and the side part of the box body is provided with a mounting hole;

the heat dissipation assembly comprises a heat absorption plate, a heat conduction plate and a heat dissipation plate, and the heat absorption plate, the heat conduction plate and the heat dissipation plate are sequentially arranged in the mounting hole of the box body from inside to outside.

Preferably, the heat absorbing plate, the heat conducting plate and the heat dissipating plate are arranged in the mounting hole in a clamping manner or an adhesion manner.

Preferably, the high heat dissipation storage device further comprises a dust screen, and the dust screen is arranged in the heat dissipation groove.

Preferably, the high heat dissipation storage device further comprises a herringbone plate, and the herringbone plate is arranged at the top of the box body.

Preferably, a box door is further opened at the side part of the box body, the high-heat-dissipation storage device further comprises a door body and a protection component, the door body is arranged on the box door, and the protection component is arranged on the outer wall of the box body and/or the door body.

Preferably, the protection component comprises a reinforcing layer, a waterproof layer, a fireproof layer, an antirust layer and a buffer layer, wherein the reinforcing layer, the waterproof layer, the fireproof layer, the antirust layer and the buffer layer are sequentially arranged on the outer wall of the box body and/or the door body from inside to outside.

Preferably, the high heat dissipation storage device further comprises an object bearing assembly, and the object bearing assembly is arranged at the bottom inside the box body.

Preferably, it includes the buffer board and puts the thing board to hold the thing subassembly, the buffer board set up in diapire in the box, put the thing board set up in the upper surface of buffer board.

Preferably, the high heat dissipation storage device further comprises a support assembly, wherein the support assembly comprises support legs and a non-slip mat, the support legs are arranged at the bottom of the box body, and the non-slip mat is arranged at the bottom of the support legs.

Preferably, a box door is further opened at the side part of the box body, the high-heat-dissipation storage device further comprises a door body and a sealing ring, the door body is arranged on the box door, and the sealing ring is arranged on the periphery of the door body.

The high-heat-dissipation storage device comprises a storage box and a heat dissipation assembly, wherein the storage box comprises a box body, the top of the box body is provided with a heat dissipation groove, the side part of the box body is provided with a mounting hole, the heat dissipation assembly comprises a heat absorption plate, a heat conduction plate and a heat dissipation plate, and the heat absorption plate, the heat conduction plate and the heat dissipation plate are sequentially arranged in the mounting hole of the box body from inside to outside; compared with the prior art, the radiating groove is seted up through the top at the box in this application, makes things convenient for the upper end heat dissipation of cloud computing host computer, installs radiator unit through the lateral part at the box, has increaseed radiating area, and then has avoided the drawback because the heat gathering is brought in the inside of box.

Drawings

Fig. 1 is a sectional view of a case according to an embodiment of the present application.

Fig. 2 is a schematic diagram of a storage box according to an embodiment of the present application.

FIG. 3 is a cross-sectional view of the housing at another angle in accordance with an embodiment of the present application.

Fig. 4 is a sectional view of a door body according to an embodiment of the present application.

The attached drawings are as follows:

1-a storage box;

11-a box body;

111-heat sink;

112-mounting holes;

12-a door body;

2-a heat dissipation assembly;

21-a heat absorbing plate;

22-a thermally conductive plate;

23-a heat sink;

3, dust screen;

4-herringbone plates;

5-a support rod;

6-a protective component;

61-a reinforcement layer;

62-waterproof layer;

63-a fire barrier layer;

64-an anti-rust layer;

65-a buffer layer;

7-an object bearing component;

71-a buffer plate;

72-a storage plate;

8-a support assembly;

81-supporting legs;

82-a non-slip mat;

9-sealing ring;

10-buckling.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the present application, unless explicitly stated or limited otherwise, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, integrally connected, or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the description of the present application, it should be understood that the terms "upper" and "lower" used in the description of the embodiments of the present application are used in a descriptive sense only and not for purposes of limitation. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.

Referring to fig. 1 and 2, an embodiment of the present application discloses a high heat dissipation storage device for a cloud computing host, where the high heat dissipation storage device includes a storage box 1 and a heat dissipation assembly 2, the storage box 1 includes a box body 11 and a door body 12, a heat dissipation groove 111 is formed at the top of the box body 11, a mounting hole 112 and a door (not shown in the drawings) are formed at a side portion of the box body 11, the heat dissipation assembly 2 is disposed in the mounting hole 112 of the box body 11, and the door body 12 is disposed on the door.

Specifically, the two opposite sides of the box 11 are respectively provided with a mounting hole 112, and the side of the box 11 provided with the box door is adjacent to the side of the box 11 provided with the mounting hole 112. The door body 12 is rotatably connected with the box body 11 through a hinge, two sets of heat dissipation assemblies 2 are arranged, and the two sets of heat dissipation assemblies 2 are respectively arranged in the two mounting holes 112. Each set of heat dissipation assembly 2 comprises a heat absorption plate 21, a heat conduction plate 22 and a heat dissipation plate 23, and the heat absorption plate 21, the heat conduction plate 22 and the heat dissipation plate 23 are sequentially arranged in the mounting hole 112 from inside to outside in a bonding mode.

In the present embodiment, the heat absorbing plate 21, the heat conducting plate 22 and the heat dissipating plate 23 are disposed in the mounting hole 112 in this order from inside to outside by means of adhesion. It is understood that in other embodiments, the heat absorbing plate 21, the heat conducting plate 22 and the heat dissipating plate 23 may be disposed in the mounting hole 112 in sequence from inside to outside through a snap-fit manner or other connection manners.

This application has seted up radiating groove 111 through the top at box 11, make things convenient for the upper end heat dissipation of cloud computing host computer, both sides relative through at box 11 are provided with mounting hole 112 respectively, and from interior to exterior has set gradually absorber plate 21 in every mounting hole 112, heat-conducting plate 22 and heating panel 23, absorb the heat at both ends about the cloud computing host computer respectively through absorber plate 21, then give heating panel 23 through heat-conducting plate 22 conduction, give box 11's the outside through heating panel 23 dissipation, the heat radiating area of whole box 11 has been increaseed, avoided because the heat gathering is in box 11's inside and the damage that leads to the fact the article in the box 11.

Referring to fig. 1 and 3, the high heat dissipation storage device further includes a dust screen 3, a chevron plate 4 and a support rod 5, the dust screen 3 is disposed in the heat dissipation groove 111, the support rod 5 is disposed on the top of the box body 11, the chevron plate 4 is disposed on the top of the support rod 5, and the chevron plate 4 is supported by the support rod 5. This application avoids dust impurity to pile up at the top of box 11 through the setting of chevron plate 4, avoids the object to fall simultaneously and smashes bad box 11, and when dust impurity fell into the upper surface of chevron plate 4, dust impurity can be along the inclined plane landing of chevron plate 4. Through the setting of dust screen 3, prevent that the dust from falling into in the box 11, simultaneously, this dust screen 3 still has radiating effect, has further accelerated the radiating rate of the interior article of box 11.

Referring to fig. 1 and 4, the high heat dissipation storage device further includes a protection component 6, where the protection component 6 is disposed on the outer walls of the box body 11 and the door body 12, and the protection component 6 is disposed to prevent the box body 11 from being affected by the external severe environment.

Specifically, the protection assembly 6 comprises a reinforcing layer 61, a waterproof layer 62, a fireproof layer 63, an antirust layer 64 and a buffer layer 65, wherein the reinforcing layer 61, the waterproof layer 62, the fireproof layer 63, the antirust layer 64 and the buffer layer 65 are sequentially arranged on the outer walls of the box body 11 and the door body 12 from inside to outside in an adhesion mode.

In the prior art, most of storage boxes do not have a protection function, so that the storage boxes are easily damaged due to the influence of the external severe environment, and the service life of storage is shortened.

This application is through having set gradually enhancement layer 61, waterproof layer 62, flame retardant coating 63, antirust coat 64 and buffer 65 from interior to exterior on the outer wall of box 11 and door body 12, avoids external adverse circumstances to bring the influence to box 11, has improved the life of storage box. For example, when the storage box 1 collides with other objects, the impact force of the other objects to the storage box 1 can be reduced by the arrangement of the buffer layer 65, and the degree of the damage to the storage box is reduced.

As shown in fig. 1, the high heat dissipation storage device further includes an object holding assembly 7, the object holding assembly 7 includes a buffer plate 71 and an object placing plate 72, the buffer plate 71 is disposed on the bottom wall of the box 11, the object placing plate 72 is disposed on the upper surface of the buffer plate 71, and the object placing plate 72 is slidably connected to the inner wall of the box 11. The object placed in the box body 11 is supported by the object support plate 72, and the object supported by the object support plate 72 is protected by the buffer plate 71.

In order to support the box body 11, the high heat dissipation storage device further comprises a supporting assembly 8, and the supporting assembly 8 is arranged at the bottom of the box body 11 and is used for supporting the box body 11. Specifically, the support assembly 8 includes support legs 81 and non-slip pads 82, the support legs 81 are disposed at the bottom of the box body 11, and the non-slip pads 82 are disposed at the bottom of the support legs 81. Through the setting of slipmat 82 for supporting leg 81 is placed more firm, avoids taking place the phenomenon of skidding, simultaneously, makes box 11 place more firm.

In order to seal the joint of the door body 12 and the box body 11 when the door body 12 is closed, the high-heat-dissipation storage device further comprises a sealing ring 9 and a buckle 10, wherein the sealing ring 9 is arranged on the periphery of the door body 12, and the buckle 10 is arranged on the door body 12 and the box body 11. When the door is closed, the door body 12 and the cabinet 11 are engaged by the buckle 10, and at this time, the door body 12 presses the gasket 9, so that the door body 12 is tightly sealed with the cabinet 11 by the gasket 9.

In specific implementation, the buckle 10 is opened first, the door body 12 is opened through the hinge, an object to be placed is placed on the object placing plate 72, and then the door body 12 is closed again.

The above description is only for the preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A high heat dissipation storage device for a cloud computing host, comprising:

the storage box comprises a box body, the top of the box body is provided with a heat dissipation groove, and the side part of the box body is provided with a mounting hole;

the heat dissipation assembly comprises a heat absorption plate, a heat conduction plate and a heat dissipation plate, and the heat absorption plate, the heat conduction plate and the heat dissipation plate are sequentially arranged in the mounting hole of the box body from inside to outside.

2. The high thermal dissipation storage device of claim 1, wherein the heat absorbing plate, the heat conducting plate and the heat dissipating plate are disposed in the mounting hole by clamping or bonding.

3. The high heat dissipation storage device of claim 2, further comprising a dust screen disposed in the heat sink.

4. The high thermal storage device of claim 3, further comprising a chevron plate disposed on top of the tank.

5. The high-heat-dissipation storage device according to claim 1, wherein a door is further opened at a side portion of the box body, the high-heat-dissipation storage device further comprises a door body and a protection assembly, the door body is disposed on the door, and the protection assembly is disposed on an outer wall of the box body and/or the door body.

6. The high heat dissipation storage device of claim 5, wherein the protection assembly comprises a reinforcing layer, a waterproof layer, a fireproof layer, an antirust layer and a buffer layer, and the reinforcing layer, the waterproof layer, the fireproof layer, the antirust layer and the buffer layer are sequentially arranged on the outer wall of the box body and/or the door body from inside to outside.

7. The high heat dissipation storage device of claim 1, further comprising an object bearing assembly disposed at a bottom within the tank.

8. The high heat dissipation storage device of claim 7, wherein the object bearing assembly comprises a buffer plate and an object placing plate, the buffer plate is disposed on the bottom wall in the box body, and the object placing plate is disposed on the upper surface of the buffer plate.

9. The high heat dissipation storage device of claim 1, further comprising a support assembly, wherein the support assembly comprises support legs and a non-slip mat, the support legs are disposed at the bottom of the box body, and the non-slip mat is disposed at the bottom of the support legs.

10. The high-heat-dissipation storage device as claimed in claim 1, wherein a door is further opened at a side of the box body, the high-heat-dissipation storage device further comprises a door body and a sealing ring, the door body is disposed on the door, and the sealing ring is disposed around the door body.

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