CN211518245U - Glue removing channel mold for fast recovery diode - Google Patents
Glue removing channel mold for fast recovery diode Download PDFInfo
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- CN211518245U CN211518245U CN201922217770.2U CN201922217770U CN211518245U CN 211518245 U CN211518245 U CN 211518245U CN 201922217770 U CN201922217770 U CN 201922217770U CN 211518245 U CN211518245 U CN 211518245U
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- die holder
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- injecting glue
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Abstract
The utility model discloses a be used for fast recovery diode to go to glue way mould, comprising a base plate, fixedly connected with die holder on the bottom plate, the middle part of die holder is equipped with the injecting glue main road, the equal fixedly connected with injecting glue lane in both sides of injecting glue main road, integration fixedly connected with extension board on the apron, the extension board location is pegged graft on the chase, be equipped with between extension board and the baffle and lead gluey passageway. The device inserts the apron earlier between the spacing post, and the location is accurate, make the firm installation of apron on the die holder, the dismouting is convenient, pour into the sizing material through the injecting glue main road and pass in proper order through the injecting glue branch and lead on gluey passageway to the diode, make through the mating reaction of baffle and extension board and carry out the butt to the sizing material of leading gluey passageway department, make the device get rid of the adhesion and glue the swift convenience of saying, be convenient for reduce the gluey way use quantity, practice thrift and water the material, labour saving and time saving is favorable to improving work efficiency.
Description
Technical Field
The utility model belongs to the technical field of the diode processing, concretely relates to be used for fast recovery diode to remove and glue way mould.
Background
After the diode body is manufactured, a process of injecting glue on the outer surface of the diode body is usually required. The glue injection process is to place the diode on a lower die, a main glue injection channel and a plurality of glue injection sub-channels are arranged on the lower die, when glue is injected, the diodes are respectively fixed in the glue injection sub-channels, and the epoxy resin flowing into the main glue injection sub-channels is attached to the surfaces of the diodes from the glue injection sub-channels.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a be used for fast recovery diode to remove gluey way mould to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a be used for fast recovery diode to go gluey way mould, includes the bottom plate, fixedly connected with die holder on the bottom plate, the middle part of die holder is equipped with the injecting glue main road, the equal fixedly connected with injecting glue lane in both sides of injecting glue main road, fixedly connected with baffle on the injecting glue lane, be equipped with the chase on the die holder, the joint is fixed with the apron on the die holder, integration fixedly connected with extension board on the apron, the extension board location is pegged graft on the chase, be equipped with the passageway of leading gluey between extension board and the baffle.
Preferably, the handle is fixedly connected to the side wall of the bottom plate, the limiting columns are fixedly connected to the bottom plate, and the cover plate is located between the inner sides of the limiting columns and is in sliding connection with the limiting columns.
The bottom plate is convenient to take through the handle in the setting, so that the die holder is convenient to operate and flexible to use, the cover plate is accurate to install and position through the limiting columns, and the stability of the connecting structure between the cover plate and the die holder is effectively improved.
Preferably, the left end and the right end of the cover plate are fixedly connected with the die holder through fixing bolts, and the die holder is provided with thread grooves matched and connected with the fixing bolts.
This setting has effectively improved connection structure's steadiness between apron and the die holder, dismouting convenient to use.
Preferably, the upper end and the lower end of the cover plate are fixedly connected with fixing blocks, fixing grooves are formed in the end portions of the fixing blocks, fixing columns are fixedly connected to the die grooves, and the fixing columns are connected with the fixing grooves in a matched mode.
When the cover plate is arranged, the fixing block is inserted into the fixing column, and the positioning block is inserted into the positioning column, so that the positioning accuracy and the stability are high, and the stability of the connecting structure between the cover plate and the die holder is further improved.
Preferably, the support plate is fixedly connected with a positioning block through a screw, the upper end and the lower end of the positioning block are both provided with a positioning groove, the die cavity is fixedly connected with a positioning column, and the positioning column is connected with the positioning groove in a matched manner.
The arrangement is convenient for the stable connection between the support plate and the partition plate, and the positioning is accurate.
Preferably, the mold slot is one centimeter higher than the main glue injection channel, the cover plate is attached to the mold base, and the support plate is clamped above the partition plate.
According to the arrangement, the glue can conveniently enter the die cavity through the glue injection main channel, the glue injection branch channel and the glue guide channel, the glue channel can be conveniently removed after the processing is finished, the use number of the glue channel can be conveniently reduced, and the pouring material can be saved.
Compared with the prior art, the utility model discloses a technological effect and advantage: the mould for removing the adhesive channel of the fast recovery diode comprises a cover plate, a positioning block, a fixing block, a positioning column, an adhesive guide channel, a baffle plate and a support plate, wherein the cover plate is inserted between limiting columns, the positioning block and the fixing block are respectively inserted into a corresponding positioning column and a corresponding fixing column through a positioning groove and a fixing groove, the positioning is accurate, the fixing bolt is screwed down, so that the cover plate is stably installed on a mould base, then a diode to be processed is placed into a mould groove, adhesive is injected into the diode through the adhesive main channel and sequentially passes through the adhesive sub-channel and the adhesive guide channel to the diode, after the adhesive is injected, when the diode is taken out, the adhesive on the adhesive guide channel is abutted through the cooperation of the baffle plate and the support plate, namely the diode can be separated from the adhesive channel which is adhered when the diode is taken out, meanwhile, the mould groove is one centimeter higher than the adhesive main channel, so that the adhesive main, the material is watered in the saving, and labour saving and time saving is favorable to improving work efficiency.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the die holder structure of the present invention;
fig. 3 is a schematic view of the connection structure of the support plate and the partition plate of the present invention.
In the figure: 1. a base plate; 101. a handle; 102. a limiting column; 2. a cover plate; 201. fixing the bolt; 202. a support plate; 203. positioning blocks; 204. positioning a groove; 205. a fixed block; 206. fixing grooves; 3. a die holder; 301. a thread groove; 302. a partition plate; 4. a die cavity; 401. a positioning column; 402. fixing a column; 5. a glue guide channel; 6. injecting glue to the main road; 601. and (5) injecting glue and dividing channels.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-3, a channel removing mold for a fast recovery diode comprises a base plate 1, wherein a mold base 3 is fixedly connected to the base plate 1, a main injection channel 6 is arranged in the middle of the mold base 3, two sides of the main injection channel 6 are both fixedly connected with sub-channels 601, the sub-channels 601 are fixedly connected with a partition plate 302, a mold groove 4 is arranged on the mold base 3, a cover plate 2 is fixedly clamped on the mold base 3, a support plate 202 is integrally and fixedly connected to the cover plate 2, the support plate 202 is positioned and inserted in the mold groove 4, and a channel 5 for guiding glue is arranged between the support plate 202 and the partition plate 302.
A handle 101 is fixedly connected to the side wall of the bottom plate 1, a limiting column 102 is fixedly connected to the bottom plate 1, and the cover plate 2 is located between the inner sides of the limiting columns 102 and is in sliding connection with the limiting columns 102; the bottom plate 1 is convenient to take through the handle 101, so that the die holder 3 is convenient to operate and flexible to use, the cover plate 2 is accurate to install and position through the limiting column 102, and the stability of the connecting structure between the cover plate 2 and the die holder 3 is effectively improved.
The left end and the right end of the cover plate 2 are fixedly connected with the die holder 3 through fixing bolts 201, and thread grooves 301 matched and connected with the fixing bolts 201 are formed in the die holder 3; effectively improved between apron 2 and the die holder 3 connection structure's steadiness, dismouting convenient to use.
The upper end and the lower end of the cover plate 2 are fixedly connected with fixing blocks 205, the end parts of the fixing blocks 205 are provided with fixing grooves 206, the die cavity 4 is fixedly connected with fixing columns 402, and the fixing columns 402 are matched and connected with the fixing grooves 206; when the cover plate 2 is installed, the fixing block 205 is inserted into the fixing column 402, and the positioning block 203 is inserted into the positioning column 401, so that the positioning accuracy and the positioning stability are high, and the stability of the connecting structure between the cover plate 2 and the die holder 3 is further improved.
A positioning block 203 is fixedly connected to the support plate 202 through screws, positioning grooves 204 are formed in the upper end and the lower end of the positioning block 203, a positioning column 401 is fixedly connected to the die cavity 4, and the positioning column 401 is connected with the positioning grooves 204 in a matched mode; the stable connection between the support plate 202 and the partition plate 302 is facilitated, and the positioning is accurate.
The die cavity 4 is 6 cm higher than the main glue injection channel, the cover plate 2 is attached to the die holder 3, and the support plate 202 is clamped above the partition plate 302; the glue stock is convenient to enter the die cavity 4 through the glue injection main channel 6, the glue injection branch channel 601 and the glue guide channel 5, the glue channel is convenient to remove after the processing is finished, the use number of the glue channel is convenient to reduce, and the pouring material is saved.
Specifically, when the device is used, the cover plate 2 is inserted between the limiting posts 102, meanwhile, the positioning block 203 and the fixing block 205 are respectively inserted into the corresponding positioning post 401 and the corresponding fixing post 402 through the positioning groove 204 and the fixing groove 206, the positioning is accurate, the fixing bolt 201 is screwed down, so that the cover plate 2 is stably installed on the die holder 3, then, the diode to be processed is placed into the die groove 4, glue is injected through the glue injection main channel 6 and sequentially passes through the glue injection branch channel 601 and the glue guide channel 5 to the diode, after the glue injection is completed, when the diode is taken out, the glue in the glue guide channel 5 is abutted through the matching action of the partition plate 302 and the support plate 202, namely, the diode can be separated from the adhesive glue channel when the diode is taken out, meanwhile, because the die groove 4 is higher than the glue injection main channel 6 by one centimeter, the glue injection main channel 6 is not easy to adhere to the diode, and the device is convenient and fast to remove the, the use amount of the rubber channels is convenient to reduce, the material is saved, and the time and the labor are saved, so that the working efficiency is improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. The utility model provides a be used for fast recovery diode to remove and glue way mould, includes bottom plate (1), its characterized in that: fixedly connected with die holder (3) on bottom plate (1), the middle part of die holder (3) is equipped with injecting glue main road (6), equal fixedly connected with injecting glue lane (601) in the both sides of injecting glue main road (6), fixedly connected with baffle (302) on injecting glue lane (601), be equipped with chase (4) on die holder (3), the joint is fixed with apron (2) on die holder (3), integration fixedly connected with extension board (202) on apron (2), extension board (202) location is pegged graft on chase (4), be equipped with between extension board (202) and baffle (302) and lead gluey passageway (5).
2. The photoresist stripping channel mold for the fast recovery diode according to claim 1, wherein: the side wall of the bottom plate (1) is fixedly connected with a handle (101), the bottom plate (1) is fixedly connected with limiting columns (102), and the cover plate (2) is located between the inner sides of the limiting columns (102) and is in sliding connection with the limiting columns (102).
3. The photoresist stripping channel mold for the fast recovery diode according to claim 1, wherein: the left end and the right end of the cover plate (2) are fixedly connected with the die holder (3) through fixing bolts (201), and thread grooves (301) which are connected with the fixing bolts (201) in a matched mode are formed in the die holder (3).
4. The photoresist stripping channel mold for the fast recovery diode according to claim 1, wherein: the upper end and the lower end of the cover plate (2) are fixedly connected with fixing blocks (205), fixing grooves (206) are formed in the end portions of the fixing blocks (205), fixing columns (402) are fixedly connected to the die cavity (4), and the fixing columns (402) are connected with the fixing grooves (206) in a matched mode.
5. The photoresist stripping channel mold for the fast recovery diode according to claim 1, wherein: the supporting plate (202) is fixedly connected with a positioning block (203) through screws, positioning grooves (204) are formed in the upper end and the lower end of the positioning block (203), a positioning column (401) is fixedly connected to the die cavity (4), and the positioning column (401) is connected with the positioning grooves (204) in a matched mode.
6. The photoresist stripping channel mold for the fast recovery diode according to claim 1, wherein: the die cavity (4) is higher than the glue injection main channel (6) by one centimeter, the cover plate (2) is attached to the die holder (3), and the support plate (202) is clamped above the partition plate (302).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922217770.2U CN211518245U (en) | 2019-12-12 | 2019-12-12 | Glue removing channel mold for fast recovery diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922217770.2U CN211518245U (en) | 2019-12-12 | 2019-12-12 | Glue removing channel mold for fast recovery diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211518245U true CN211518245U (en) | 2020-09-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922217770.2U Active CN211518245U (en) | 2019-12-12 | 2019-12-12 | Glue removing channel mold for fast recovery diode |
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| Country | Link |
|---|---|
| CN (1) | CN211518245U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114536670A (en) * | 2022-02-28 | 2022-05-27 | 江苏宝浦莱半导体有限公司 | Glue injection opening mold with foot side edge flash removal function |
-
2019
- 2019-12-12 CN CN201922217770.2U patent/CN211518245U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114536670A (en) * | 2022-02-28 | 2022-05-27 | 江苏宝浦莱半导体有限公司 | Glue injection opening mold with foot side edge flash removal function |
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