CN211513126U - Miniature high-density array free-form surface electrode - Google Patents
Miniature high-density array free-form surface electrode Download PDFInfo
- Publication number
- CN211513126U CN211513126U CN201921122714.4U CN201921122714U CN211513126U CN 211513126 U CN211513126 U CN 211513126U CN 201921122714 U CN201921122714 U CN 201921122714U CN 211513126 U CN211513126 U CN 211513126U
- Authority
- CN
- China
- Prior art keywords
- electrode
- column
- substrate
- stimulation
- tail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electrotherapy Devices (AREA)
Abstract
A micro high-density array free-form surface electrode comprises a substrate and a plurality of electrode columns; the substrate comprises a welding surface and a stimulating surface; the electrode column comprises a column head and a column tail; the electrode column penetrates through the substrate, the column tail and the welding surface form a plane, and the column head protrudes out of the stimulation surface. The tail part of an electrode column of a common nerve stimulation electrode is usually arranged in a substrate, and then a lead is led out from the inside of the substrate to be connected with a stimulation chip. Compared with the prior art, the penetrating electrode structure adopted by the invention is more convenient to manufacture and suitable for mass manufacture, and the tail of the electrode column is exposed on the welding surface of the substrate, so that the pin of the stimulating chip can be directly connected with the electrode column, a lead is omitted, and the manufacturing process is simplified.
Description
Technical Field
The utility model belongs to the technical field of biomedical equipment, relate to a miniature high density array free-form surface electrode and manufacturing method thereof particularly.
Background
The implanted nerve stimulator has wide medical application, such as artificial cochlea, artificial vision recovery, deep brain electrical stimulation system, and the like. The microelectrode has attracted more and more attention as an important tool for revealing the working mechanism of the nervous system and treating the neurological diseases, and has become an important research direction at present. The application of the microelectrode is generally to implant the microelectrode into an animal or a patient, stimulate or inhibit nerve activity by loading an electric signal, or convert the nerve activity into the electric signal by using the microelectrode and record the electric signal for research. Due to the different targets of action, various micro-electrode arrays based on micro-fabrication technology have been developed. The high-density orderly-arranged three-dimensional microelectrode array can be implanted into nervous tissues, high-density selective stimulation and recording are realized, and the application prospect is good.
At present, neurostimulator's microelectrode adopts the MEMS technique preparation of flexible substrate more, passes through the wire with amazing chip again and is connected, and when preparation high density microelectrode array, along with the increase of stimulation point quantity, the quantity of connecting the stimulation point wire in the microelectrode array constantly rises, can lead to the wiring width grow, and the operation is implanted the opening and needs the increase, and the wound face is big.
Disclosure of Invention
The to-be-solved technical problem of the utility model is: in order to overcome the problems, a miniature high-density array free-form surface electrode and a manufacturing method thereof are provided.
The utility model provides a scheme that technical problem adopted is:
a micro high-density array free-form surface electrode comprises a substrate and a plurality of electrode columns; the substrate comprises a welding surface and a stimulating surface; the electrode column comprises a column head and a column tail; the electrode column penetrates through the substrate, the column tail and the welding surface form a plane, and the column head protrudes out of the stimulation surface. The tail part of an electrode column of a common nerve stimulation electrode is usually arranged in a substrate, and then a lead is led out from the inside of the substrate to be connected with a stimulation chip. The utility model discloses a run through formula electrode structure than current structure, it is more convenient in the preparation, be fit for big preparation in batches, the post tail of electrode post exposes the face of weld at the basement moreover for the pin of amazing chip can save the wire with electrode post lug connection, has simplified the preparation technology.
Preferably, the array density of the plurality of electrode columns is more than 45Pin/mm2. The high-density electrode column array has a better stimulation effect on application occasions with denser nerve cells, such as retinal nerve stimulation, and the high-density electrode column array enables a visual picture obtained by a patient to have higher resolution.
Preferably, the device also comprises a stimulation chip; the pins of the stimulating chip are connected with the column tails of the plurality of electrode columns one by one through flip chip welding. After the pin and the electrode post of amazing chip are directly connected through flip-chip bonding, implant the patient as whole with the two internal, when implanting the operation like this, the wound only need satisfy amazing chip and human external communication wire can, no longer receive the influence of wire quantity between chip and the electrode post, can effectively reduce the operation opening, reduce the operation degree of difficulty, reduce patient's misery.
Preferably, the stimulating surface of the substrate is the same as the curved surface formed by the column heads of the plurality of electrode columns, and the curved surface is the same as the curved surface of the human body part to be stimulated. The electrode column head is the same with the curved surface of the part to be stimulated, so that the electrode can be better attached to the part to be stimulated, and the stability of a stimulation signal is ensured.
Preferably, the material of the substrate may be ceramic, glass or other insulating material that can be sintered from the precursor material. The substrate needs to be implanted into a human body, so the selected material is insulated and has better biocompatibility, and the sinterable material is adopted, so that the substrate with the required shape can be conveniently manufactured in batches.
A manufacturing method of a miniature high-density array free-form surface electrode comprises the following steps:
s001, manufacturing a die with a corresponding curved groove according to the shape of the stimulation surface of the needed substrate;
s002, filling organic matters capable of transferring patterns in the mold and polishing the end face to be flat;
s003, manufacturing a corresponding mask plate according to the array pattern of the required electrode column;
s004, placing the mask plate above the mold filled with the organic matters, and carrying out exposure treatment downwards;
s005, removing the mask plate, immersing the die into a developing solution to wash off redundant organic matters, wherein the array formed by the residual organic matters is the array required by the electrode column;
s006, filling a substrate precursor material in an organic matter gap in the mold and polishing the substrate precursor material on the end face of the mold to expose an organic matter array;
s007, sintering the mold with the organic substance array and the substrate precursor material to obtain a substrate with fine holes, wherein the array of the fine holes is the same as the array of the required electrode columns;
s008, manufacturing a corresponding pressing tool according to a curved surface formed by the column heads of the required electrode columns;
s009, placing the electrode post blank in each pore of the substrate, placing the electrode post blanks from the welding surface, then pressurizing all the electrode post blanks by a pressing tool, and extruding all the electrode post blanks into the pores;
s010, removing the pressing tool after the electrode column blank penetrates through the substrate, and polishing the electrode column blank exposed out of the welding surface to obtain the substrate with the electrode column penetrating through;
and S011, connecting the pins of the stimulation chip and the column tails of the electrode columns one by one through flip-chip welding to obtain the miniature high-density array free-form surface electrode.
The micro high-density array free-form surface electrode with the substrate penetrated by the electrode column can be obtained through the steps, and the steps have low operation complexity even when a micro-volume object is manufactured, and can be manufactured in batches and repeatedly.
Preferably, the organic matter can be positive glue or negative glue; when the positive photoresist is selected, the mask plate should transmit light at the required array, and the rest part should not transmit light; when negative glue is selected, the mask should be opaque at the desired array, with the remainder transparent. And (3) obtaining a fine hole for extruding into the electrode column later through exposure treatment of the positive glue or the negative glue. And the diameter, the quantity, the density and the arrangement mode required by the fine holes can be obtained by using the corresponding mask plate, and the mask plate can be repeatedly used, so that the manufacturing efficiency is improved.
Preferably, the pressing tool is provided with independent micro planes which correspond to the tail parts of the electrode columns one by one, and the curved surface formed by fitting the independent micro planes is the same as the curved surface of the human body part to be stimulated. The surface of the pressing tool is fitted with the curved surface of the part to be stimulated, so that the length of the electrode column blank does not need to be adjusted according to the curved surface of the part to be stimulated during manufacturing, and the electrode column blanks with the same size and specification can be manufactured in batches; the pressing tool can be used repeatedly, so that the manufacturing efficiency is improved.
Preferably, the head of the electrode column blank is conical, and the diameter of the pore on the substrate is smaller than that of the tail of the electrode column blank; when the electrode column blank is pressed into the fine hole, the electrode column blank is heated and softened. Therefore, after the electrode column blank is extruded into the fine hole, the whole base body has better sealing performance, the electrode can work normally in the human body, and the influence of human body fluid on electronic components such as chips at the tail of the electrode column is avoided.
Preferably, the mold may be simultaneously provided with a plurality of corresponding curved grooves, and the pressing tool may be simultaneously provided with a plurality of curved surfaces which are formed by separate micro-planes and are the same as the curved surfaces of the human body parts to be stimulated. Make the utility model discloses a miniature high density array free-form surface electrode can make in batches, improves the preparation efficiency.
The utility model provides a miniature high density array free-form surface electrode and manufacturing method thereof, main advantage lies in: can improve the density of the stimulating electrode under the condition of ensuring that the width of the lead is certain, thereby improving the stimulating effect, and simultaneously can not increase the difficulty of the implantation operation and the pain of a patient. And adopt the utility model discloses a manufacturing approach has overcome the small difficult point that is difficult to manufacturing of miniature high density array free-form surface electrode, has still improved the production efficiency who needs to make the miniature high density array free-form surface electrode of different shapes to the position that treats stimulation to the difference, can make miniature high density array free-form surface electrode in batches, high-efficiently. And the manufactured micro high-density array free-form surface electrode has the advantage of good sealing performance.
Drawings
Fig. 1 is a schematic diagram of a structure of the present invention applied to retinal stimulation;
FIG. 2 is a schematic view of the mask plate used in the exposure process of the present invention;
FIG. 3 is a schematic view illustrating the pressing of all the electrode pillars into the pores of the substrate by the pressing tool;
FIG. 4 is a schematic view of a structure of the present invention with a base penetrating through the electrode column;
wherein: 1-substrate, 2-electrode column, 3-stimulating chip.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings.
Example 1, as shown in fig. 1, a miniature high density array free form surface electrode is applied to the eyeball of blind people suffering from retinal diseases (such as maculopathy). The micro high-density array free-form surface electrode comprises a substrate 1 and a plurality of electrode columns 2; the substrate 1 comprises a welding surface and a stimulating surface; the electrode column 2 comprises a column head and a column tail; the electrode column 2 penetrates through the substrate 1, the column tail and the welding surface form a plane, and the column head protrudes out of the stimulation surface. The micro high-density array free-form surface electrode also comprises a stimulation chip 3; the pins of the stimulating chip 3 are connected with the column tails of the electrode columns 2 one by one through flip chip welding. The stimulating surface of the substrate 1 is the same as the curved surface formed by the stigma of the plurality of electrode posts 2, and the curved surface is the same as the curved surface of the optic nerve distribution area to be stimulated.
The array density of the electrode column 2 is more than 45Pin/mm2When the area of the substrate 1 is 10mm2In the process, the number of the electrode columns 2 is not less than 450, so that the multichannel stimulation is provided under the condition that the size of the implant is small, the multichannel stimulation on optic nerves is realized, and the vision recovery resolution of the blind is improved. And because the pin of the stimulating chip 3 is directly connected with the tail of the electrode column 2 one by flip-chip bonding, a plurality of wires do not need to be arranged, and the whole device only needs to be provided withAnd a limited number of communication wires are connected with other equipment outside the eyeball. Not only reduces the volume and the number of parts of the implant, but also reduces the wound of the implantation operation, reduces the difficulty and reduces the pain of the patient.
Example 2, as shown in fig. 2-4, the designed micro high-density array free-form surface electrode array has a semicircular cross-sectional shape. Firstly, filling organic matter capable of being patterned in a mould (for example, adopting photoresist SU-8 with high aspect ratio photoetching characteristic and polishing a section, then placing a mask plate with electrode array hole sites above the mould and aligning the mask plate with the electrode array hole sites, wherein the electrode array has the characteristic of tiny precision, and the diameter of an electrode column blank can be set in the range of 10 micrometers-500 micrometers.
And then exposure processing is performed downward from the mask plate. SU-8 photoresist is a negative photoresist, the exposed portions undergo a photochemical reaction that renders it insoluble in a developer solution, and the unexposed portions can be developed in a solution developer solution. If the positive photoresist filling mold is selected, the same patterning process can be completed only by using the reversed mask.
And after exposure treatment, taking the mold off the photoetching machine, immersing the mold into a developing solution, and washing off redundant parts to expose the required electrode array. In this step, the organic microarray was successfully immobilized in the mold.
The mold containing the organic microarray is then filled with a ceramic precursor material, such as alumina, zirconia powder, or other material. And applying pressure to the mold filled with the ceramic precursor to compact the precursor material.
And polishing the end face of the mold after the precursor material is compacted to expose the organic matter microarray. And (3) putting the sample into a sintering furnace for sintering, introducing a certain amount of oxygen, and quickly gasifying the organic matters in a high-temperature high-concentration oxygen environment to finally obtain the substrate 1 with the micro-array pores.
The sintered substrate 1 is then removed from the mould. The electrode column blank is inserted into the fine hole of the substrate 1. The electrode column blank body is generally made of titanium metal, and other materials with good biocompatibility can be adopted. And applying pressure to the electrode column blank array by using a pressing tool designed according to the corresponding curved surface. Because the size of the tail end of the electrode column blank is slightly larger than that of the fine hole, the electrode column blank needs to be heated to be softened, and thus, after the electrode column blank is extruded into the fine hole, a better sealing effect can be achieved. And (3) extruding the electrode column blank into the pore by a pressing tool, and finally forming a curved surface characteristic similar to the substrate 1.
Then the pressing tool is removed, and the tail of the electrode column 2 exposed out of the end face of the substrate 1 is polished to obtain the substrate 1 with the penetrating electrode column 2.
And finally, connecting the pins of the stimulation chip 3 with the column tails of the electrode columns 2 one by one through flip-chip welding to obtain the miniature high-density array free-form surface electrode.
The method for processing the microelectrode array with the specific curved surface can be used for processing multiple units in large batch. Even if microelectrode arrays with different shapes need to be manufactured aiming at the parts to be stimulated, only the die and the pressing tool need to be adjusted, the electrode column blank with higher processing difficulty and the manufacturing method do not need to be changed, and the manufacturing efficiency is greatly improved.
Claims (5)
1. A micro high-density array free-form surface electrode is characterized by comprising a substrate (1) and a plurality of electrode columns (2); the substrate (1) comprises a welding surface and a stimulating surface; the electrode column (2) comprises a column head and a column tail; the electrode column (2) penetrates through the substrate (1), the column tail and the welding surface form a plane, and the column head protrudes out of the stimulation surface.
2. The miniature high-density array free-form surface electrode as claimed in claim 1, wherein the array density of the plurality of electrode columns (2) is greater than 45Pin/mm2。
3. The miniature high-density array free-form surface electrode according to claim 2, further comprising a stimulation chip (3); the pins of the stimulating chip (3) and the column tails of the electrode columns (2) are connected one by one through flip chip welding.
4. The miniature high-density array free-form surface electrode according to claim 3, wherein the stimulating surface of the substrate (1) is the same as the curved surface formed by the stigma of the plurality of electrode columns (2), and the curved surface is the same as the curved surface of the human body part to be stimulated.
5. The miniature high density array free form surface electrode of claim 4, wherein the material of the substrate (1) is ceramic, glass or other insulating material that can be sintered from a precursor material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921122714.4U CN211513126U (en) | 2019-07-17 | 2019-07-17 | Miniature high-density array free-form surface electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921122714.4U CN211513126U (en) | 2019-07-17 | 2019-07-17 | Miniature high-density array free-form surface electrode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211513126U true CN211513126U (en) | 2020-09-18 |
Family
ID=72439051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921122714.4U Active CN211513126U (en) | 2019-07-17 | 2019-07-17 | Miniature high-density array free-form surface electrode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211513126U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112237682A (en) * | 2019-07-17 | 2021-01-19 | 杭州暖芯迦电子科技有限公司 | Miniature high-density array free-form surface electrode and manufacturing method thereof |
-
2019
- 2019-07-17 CN CN201921122714.4U patent/CN211513126U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112237682A (en) * | 2019-07-17 | 2021-01-19 | 杭州暖芯迦电子科技有限公司 | Miniature high-density array free-form surface electrode and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105214214B (en) | A kind of nerve stimulator and preparation method thereof | |
| US7991475B1 (en) | High density micromachined electrode arrays useable for auditory nerve implants and related methods | |
| US8175710B2 (en) | Stimulator system with electrode array and the method of making the same | |
| Fofonoff et al. | Microelectrode array fabrication by electrical discharge machining and chemical etching | |
| US20060042830A1 (en) | Flexible multi-level cable | |
| EP2224999A2 (en) | Cochlear stimulation device comprising a flexible electrode array | |
| EP2849839A1 (en) | Charge steering high density electrode array | |
| CN211513126U (en) | Miniature high-density array free-form surface electrode | |
| CN106362279A (en) | Stimulating electrode structure and artificial retina implanting apparatus | |
| CN112631425B (en) | Microneedle array type brain-computer interface device and preparation method thereof | |
| CN102793592B (en) | Optic nerve implantable neural interface device with fan-shaped attaching function | |
| US20210236808A1 (en) | Apparatus and methods for making cochlear implant electrode arrays | |
| CN110709692A (en) | Apparatus and method for acquiring neural recordings | |
| CN112237682A (en) | Miniature high-density array free-form surface electrode and manufacturing method thereof | |
| KR101206462B1 (en) | Optical Stimulus Probe Structure with Optical transmittable Probe and Manufacturing method thereof | |
| EP3741427B1 (en) | Method for manufacturing a nerve stimulator | |
| CN101708353B (en) | Multi-site simulating electrode array for brain stimulation | |
| CN103239800A (en) | Flexible multi-channel deep brain stimulation three-dimension electrode based on micromachining technology | |
| CN107583191A (en) | A kind of nerve stimulator device | |
| CN101168435A (en) | Method for manufacturing three-dimensional nerve microelectrode | |
| CN207871274U (en) | A kind of Neural stimulation electrodes | |
| WO2023240688A1 (en) | Flexible electrode and manufacturing method therefor | |
| CN115893298A (en) | Bionic three-dimensional soft elastic cortex microelectrode and preparation method thereof | |
| JP5122244B2 (en) | Visual reproduction assist device | |
| CN210813497U (en) | Conical artificial cochlea implantation electrode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |