CN211509508U

CN211509508U - Ultra-thin power supply

Info

Publication number: CN211509508U
Application number: CN201922267204.2U
Authority: CN
Inventors: 蒋宇; 向忠
Original assignee: Guangzhou Nengzhiwei Electronics Co ltd
Current assignee: Guangzhou Nengzhiwei Electronics Co ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-09-15
Anticipated expiration: 2029-12-17

Abstract

The utility model relates to the technical field of power, and an ultra-thin power is disclosed, including the power body, the top and the equal fixed mounting in bottom of power body have the articulamentum, two the equal fixed mounting in inside of articulamentum has first heat-conducting plate, two the equal fixed mounting in the back of the body one side of the back of the body of first heat-conducting plate has the second heat-conducting plate, first heat-conducting plate has the constant temperature net with relative one side fixed mounting of second heat-conducting plate, the refrigerant hole has been seted up, two to the inside of constant temperature net the equal fixed mounting in inside of first heat-conducting plate has the casing, two the equal fixed mounting in inside of casing has temperature sensor, top the equal fixed mounting in the outside of articulamentum has the casing with. This ultra-thin power possesses advantages such as constant temperature heat dissipation, has solved the power and when charging or supplying power, if be in the higher environment of temperature, the life and the duration of power then can receive huge influence to influence power work efficiency's problem.

Description

Ultra-thin power supply

Technical Field

The utility model relates to a power technical field specifically is an ultra-thin power.

Background

The power supply is a device for converting energy in other forms into electric energy, the electric power is derived from a 'magnetic electricity generation' principle, renewable energy sources such as water power, wind power, sea tide, dam water pressure difference and solar energy are used for burning coal, oil residue and the like to generate power sources, common power sources are dry batteries and household 110V-220V alternating current power supplies, high-quality power supplies generally have FCC (fluid catalytic cracking), US UL (UL) and great domestic great wall and other multinational certification marks, the certification is professional standards established by a certification authority for the power supplies according to technical specifications in the industry, including production processes, electromagnetic interference, safety protection and the like, and the certification marks can be used on the surfaces of packages and products after the products meeting certain indexes pass the declaration certification, so that the power supplies have certain authority.

As is well known, the endurance and the service life of a power supply are related to the working temperature of the power supply, and when the power supply is charged or powered, if the power supply is in a high-temperature environment, the service life and the endurance of the power supply are greatly influenced, so that the working efficiency of the power supply is influenced, and the ultrathin power supply is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides an ultra-thin power possesses advantages such as constant temperature heat dissipation, has solved the power when charging or supplying power, if be in the higher environment of temperature, the life and the duration of power then can receive huge influence to influence power work efficiency's problem.

(II) technical scheme

For realizing the radiating purpose of above-mentioned constant temperature, the utility model provides a following technical scheme: an ultrathin power supply comprises a power supply body, wherein connecting layers are fixedly arranged at the top and the bottom of the power supply body, a first heat-conducting plate is fixedly arranged inside each of the two connecting layers, a second heat-conducting plate is fixedly arranged on one opposite side of the two first heat-conducting plates, a constant temperature net is fixedly arranged on one opposite side of the first heat-conducting plates and the second heat-conducting plate, a refrigerant hole is formed inside the constant temperature net, a shell is fixedly arranged inside each of the two first heat-conducting plates, a temperature sensor is fixedly arranged inside each of the two shells, a shell fixedly connected with the connecting layer at the bottom is fixedly arranged on the outer side of the connecting layer at the top, a semiconductor refrigerating sheet is fixedly arranged inside each of the two shells, heat dissipation holes are formed inside the shell, heat dissipation holes are formed in the right side of the shell, and mounting plates are fixedly arranged on the front and the back of the two constant temperature, the left side fixed mounting of casing has the end cover, the inside fixed mounting of end cover has the collar, the inside fixed mounting of collar has the wiring end.

Preferably, two opposite sides of the first heat-conducting plates are adhered to the top and the bottom of the power supply body, and the length and the width of the two first heat-conducting plates are respectively the same as those of the power supply body.

Preferably, the two second heat-conducting plates are respectively positioned inside the two connecting layers, and the connecting layers are fixedly connected with the second heat-conducting plates.

Preferably, the radiating holes are uniformly distributed and are positioned on the opposite sides of the two semiconductor refrigerating pieces.

Preferably, the heat dissipation holes are distributed equidistantly, the right sides of the heat dissipation holes are in an open shape, and the first heat conduction plate and the second heat conduction plate are copper plates.

Preferably, the wiring terminal is respectively and electrically connected with the power supply body, the two first heat-conducting plates and the two temperature sensors, and the two temperature sensors are both contacted with the power supply body.

(III) advantageous effects

Compared with the prior art, the utility model provides an ultra-thin power possesses following beneficial effect:

1. this ultra-thin power, be connected through the CPU with wiring end and equipment, temperature sensor carries out real time monitoring to the temperature of power body, when the temperature of power body is too high, temperature sensor conveying signal of telecommunication to the CPU of equipment, the work of the CPU control semiconductor refrigeration piece of equipment, semiconductor refrigeration piece work cooling second heat-conducting plate, the leading-in first heat-conducting plate of second heat-conducting plate with the temperature, the inside refrigerant of thermostatic network can be balanced to the temperature simultaneously, make the temperature of first heat-conducting plate all with, and the power body cools down, thereby make the power body be in normal temperature at the during operation, avoid the temperature to cause the influence to the life-span and the duration of power body, thereby reached the radiating purpose of constant temperature.

2. This ultra-thin power, when semiconductor refrigeration piece during operation, the one end that the semiconductor refrigeration piece is close to the louvre is the face of heating, and the heat passes through the louvre and discharges, avoids influencing the work of semiconductor refrigeration piece, and the heat dissipation that the hole helps the power body right-hand member is arranged in the temperature, and first heat-conducting plate and second heat-conducting plate are the copper, and the copper has good heat conductivility, shortens the time of thermal transition, more effectual cooling to power body operational environment sooner.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the constant temperature net structure of the present invention;

fig. 3 is a right side view of the structure of the present invention.

In the figure: the heat dissipation device comprises a power supply body 1, a connecting layer 2, a machine shell 3, heat dissipation holes 4, semiconductor refrigeration sheets 5, a second heat conduction plate 6, a constant temperature network 7, refrigerant holes 8, a shell 9, a temperature sensor 10, temperature exhaust holes 11, end covers 12, wiring ends 13, a mounting ring 14, a first heat conduction plate 15 and a mounting plate 16.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an ultrathin power supply comprises a power supply body 1, wherein connecting layers 2 are fixedly arranged at the top and the bottom of the power supply body 1, first heat-conducting plates 15 are fixedly arranged in the two connecting layers 2, the opposite sides of the two first heat-conducting plates 15 are adhered to the top and the bottom of the power supply body 1, the length and the width of the two first heat-conducting plates 15 are respectively equal to those of the power supply body 1, second heat-conducting plates 6 are fixedly arranged at the opposite sides of the two first heat-conducting plates 15, a constant temperature net 7 is fixedly arranged at the opposite sides of the first heat-conducting plates 15 and the second heat-conducting plates 6, refrigerant holes 8 are formed in the constant temperature net 7, shells 9 are fixedly arranged in the two first heat-conducting plates 15, temperature sensors 10 are fixedly arranged in the two shells 9, the type of the temperature sensors 10 can be DS18B20, a casing 3 fixedly connected with the bottom connecting layer 2 is fixedly arranged at the outer side of the top connecting layer 2, the two second heat conduction plates 6 are respectively positioned inside the two connection layers 2, the connection layers 2 are fixedly connected with the second heat conduction plates 6, semiconductor refrigeration sheets 5 are fixedly arranged inside the two machine cases 3, heat dissipation holes 4 are formed inside the machine cases 3, the heat dissipation holes 4 are uniformly distributed and are positioned on the opposite sides of the two semiconductor refrigeration sheets 5, heat exhaust holes 11 are formed in the right sides of the machine cases 3, the heat exhaust holes 11 are distributed equidistantly, the right sides of the heat exhaust holes 11 are in an open shape, the first heat conduction plates 15 and the second heat conduction plates 6 are both copper plates, mounting plates 16 are fixedly arranged on the front sides and the back sides of the two constant temperature networks 7, an end cover 12 is fixedly arranged on the left side of the machine case 3, a mounting ring 14 is fixedly arranged inside the end cover 12, a wiring terminal 13 is fixedly arranged inside the mounting ring 14, the wiring terminal 13 is respectively and electrically connected with the power supply body 1, the two, and two temperature sensors 10 are both contacted with the power supply body 1, the wiring terminal 13 is connected with the CPU of the equipment, the temperature sensors 10 monitor the temperature of the power supply body 1 in real time, when the temperature of the power supply body 1 is overhigh, the temperature sensors 10 transmit electric signals to the CPU of the equipment, the CPU of the equipment controls the semiconductor refrigerating sheet 5 to work, the semiconductor refrigerating sheet 5 works to cool the second heat conducting plate 6, the second heat conducting plate 6 guides the temperature into the first heat conducting plate 15, meanwhile, the refrigerant in the constant temperature net 7 can balance the temperature, the temperature of the first heat conducting plate 15 is uniform, and the power supply body 1 is cooled, so that the power supply body 1 is at normal temperature during working, the temperature is prevented from influencing the service life and the endurance capacity of the power supply body 1, and the purpose of constant temperature heat dissipation is achieved, when the semiconductor refrigerating sheet 5 works, one end of the semiconductor refrigerating sheet 5 close to the equipment 4 is a heating surface, the heat passes through louvre 4 and discharges, avoids influencing the work of semiconductor refrigeration piece 5, and row warm hole 11 helps the heat dissipation of power supply body 1 right-hand member, and first heat-conducting plate 15 and second heat-conducting plate 6 are the copper, and the copper has good heat conductivility, shortens the time of thermal transition, more effectual cooling to power supply body 1 operational environment sooner.

When the temperature-controlled constant-temperature radiating power supply is used, the wiring end 13 is connected with a CPU of the equipment, the temperature sensor 10 monitors the temperature of the power supply body 1 in real time, when the temperature of the power supply body 1 is too high, the temperature sensor 10 transmits an electric signal to the CPU of the equipment, the CPU of the equipment controls the semiconductor refrigerating sheet 5 to work, the semiconductor refrigerating sheet 5 works to cool the second heat conducting plate 6, the second heat conducting plate 6 guides the temperature into the first heat conducting plate 15, meanwhile, the refrigerant in the constant-temperature network 7 can balance the temperature, the temperature of the first heat conducting plate 15 is enabled to be equal, and the power supply body 1 is cooled, so that the power supply body 1 is at normal temperature during working, the influence of the temperature on the service life and the cruising ability of the power supply body 1 is avoided, and the.

In summary, in the ultra-thin power supply, the terminal 13 is connected with the CPU of the device, the temperature sensor 10 monitors the temperature of the power supply body 1 in real time, when the temperature of the power supply body 1 is too high, the temperature sensor 10 transmits an electrical signal to the CPU of the device, the CPU of the device controls the semiconductor chilling plate 5 to operate, the semiconductor chilling plate 5 operates to cool the second heat conducting plate 6, the second heat conducting plate 6 guides the temperature to the first heat conducting plate 15, and the refrigerant in the constant temperature network 7 can balance the temperature, so that the temperature of the first heat conducting plate 15 is uniform, and the power supply body 1 is cooled, so that the power supply body 1 is at a normal temperature during operation, the influence of the temperature on the service life and the endurance of the power supply body 1 is avoided, and the purpose of constant temperature heat dissipation is achieved, when the semiconductor chilling plate 5 operates, one end of the semiconductor chilling plate 5 close to the device 4 is a, the heat passes through louvre 4 and discharges, avoid influencing the work of semiconductor refrigeration piece 5, heat dissipation that the hole 11 helps the 1 right-hand member of power supply body is arranged, first heat-conducting plate 15 and second heat-conducting plate 6 are the copper, the copper has good heat conductivility, shorten the time of thermal transition, more fast more effectual cooling to the 1 operational environment of power supply body, the power has been solved and when charging or supplying power, if be in the higher environment of temperature, the life and the duration of power then can receive huge influence, thereby influence power work efficiency's problem.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An ultra-thin power supply, includes power body (1), its characterized in that: the power supply comprises a power supply body (1), wherein connecting layers (2) are fixedly arranged at the top and the bottom of the power supply body (1), first heat-conducting plates (15) are fixedly arranged in the two connecting layers (2), second heat-conducting plates (6) are fixedly arranged on the opposite sides of the two first heat-conducting plates (15), a constant temperature net (7) is fixedly arranged on the opposite sides of the first heat-conducting plates (15) and the second heat-conducting plates (6), refrigerant holes (8) are formed in the constant temperature net (7), shells (9) are fixedly arranged in the two first heat-conducting plates (15), temperature sensors (10) are fixedly arranged in the two shells (9), casings (3) fixedly connected with the bottom connecting layers (2) are fixedly arranged on the outer sides of the top connecting layers (2), and semiconductor refrigerating sheets (5) are fixedly arranged in the two casings (3), louvre (4) have been seted up to the inside of casing (3), heat dissipation hole (11), two have been seted up on the right side of casing (3) the equal fixed mounting in front and the back of constant temperature net (7) has mounting panel (16), the left side fixed mounting of casing (3) has end cover (12), the inside fixed mounting of end cover (12) has mounting ring (14), the inside fixed mounting of mounting ring (14) has wiring end (13).

2. The ultra-thin power supply of claim 1, wherein: two the relative one side of first heat-conducting plate (15) all pastes with the top and the bottom of power supply body (1), and the length and the width of two first heat-conducting plates (15) are the same with the length and the width of power supply body (1) respectively.

3. The ultra-thin power supply of claim 1, wherein: the two second heat-conducting plates (6) are respectively positioned inside the two connecting layers (2), and the connecting layers (2) are fixedly connected with the second heat-conducting plates (6).

4. The ultra-thin power supply of claim 1, wherein: the radiating holes (4) are uniformly distributed, and the radiating holes (4) are positioned on the back side of the two semiconductor refrigerating pieces (5).

5. The ultra-thin power supply of claim 1, wherein: the heat-dissipating holes (11) are distributed equidistantly, the right sides of the heat-dissipating holes (11) are open, and the first heat-conducting plate (15) and the second heat-conducting plate (6) are copper plates.

6. The ultra-thin power supply of claim 1, wherein: the wiring end (13) is respectively electrically connected with the power supply body (1), the two first heat-conducting plates (15) and the two temperature sensors (10), and the two temperature sensors (10) are in contact with the power supply body (1).