CN211490006U - Semiconductor diode pin bonding wire device - Google Patents
Semiconductor diode pin bonding wire device Download PDFInfo
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- CN211490006U CN211490006U CN201922488135.8U CN201922488135U CN211490006U CN 211490006 U CN211490006 U CN 211490006U CN 201922488135 U CN201922488135 U CN 201922488135U CN 211490006 U CN211490006 U CN 211490006U
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Abstract
The utility model discloses a semiconductor diode pin bonding wire device, including the side extension board, slide rail plate, the bonding wire device, the slide, the threaded rod, circuit board clamping device, slip table and mesa, the bilateral symmetry of mesa top surface is equipped with the side extension board, be provided with slide rail plate between the both sides extension board top, slide rail plate top surface is provided with the slide, slide central thread is connected with the threaded rod, the threaded rod passes the spout that slide rail plate center set up and is connected with the revolving stage in its bottom rotation, the revolving stage bottom is provided with the bonding wire device, the both sides of relative face side extension board bottom are provided with the extension board, be provided with the slip table between the both sides extension board, the slip. The utility model provides a pair of semiconductor diode pin bonding wire device is through the slide sliding connection of design on the slide rail board, can realize carrying out the operation that the optional position removed to the bonding wire device, thereby avoided operating personnel to hold welder for a long time and cause the arm shake to influence the quality of bonding wire.
Description
Technical Field
The utility model relates to a pin bonding wire field particularly, relates to a semiconductor diode pin bonding wire device.
Background
A semiconductor diode refers to a two-terminal electronic device that utilizes semiconductor characteristics. The most common semiconductor diodes are PN junction diodes and metal semiconductor contact diodes. They have in common the asymmetry of the current-voltage characteristic, i.e. the current exhibits a good conductivity in one direction and a high resistance in the opposite direction. Can be used for rectification, wave detection, voltage stabilization, constant current, variable capacitance, switching, luminescence, photoelectric conversion and the like. The tunnel diode of ultrahigh frequency amplification or ultrahigh speed switch can be made by using the tunnel effect of carriers in the highly doped PN junction.
Most of the existing semiconductor welding operation is to weld pins one by holding a welding gun by an operator, but the problem of hand pain of the operator who welds for a long time can occur, and then the welding precision and the quality are reduced.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor diode pin bonding wire device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor diode pin bonding wire device, includes side extension board, slide rail board, bonding wire device, slide, threaded rod, circuit board clamping device, slip table and mesa, the bilateral symmetry of mesa top surface is equipped with the side extension board, both sides be provided with between the side extension board top the slide rail board, slide rail board top surface is provided with the slide, slide central thread is connected with the threaded rod, the threaded rod passes the spout that slide rail board center set up is rotated in its bottom and is connected with the revolving stage, the revolving stage bottom is provided with bonding wire device, opposite face the both sides of side extension board bottom are provided with the extension board, both sides be provided with between the extension board the slip table, the slip table top surface is provided with circuit board clamping device.
Furthermore, circuit board clamping device includes grip block and lower grip block, go up the grip block with threaded connection has the centre gripping threaded rod down between the grip block, it is provided with spacing gasket to go up the grip block top surface, spacing gasket rotate connect in fixed position on the centre gripping threaded rod.
Furthermore, the bottom surface of the sliding table is provided with sliding teeth, and the sliding table is connected in sliding tooth grooves formed in the top surface of the table top in a sliding mode through the sliding teeth.
Furthermore, the clamping ends of the upper clamping plate and the lower clamping plate arranged on the circuit board clamping device are provided with anti-slip gaskets.
Further, the welding wire device comprises a welding gun fixing seat arranged at the top end, a connecting rod is hinged to one side of the welding gun fixing seat, a first tightening screw is arranged at the position where the welding gun fixing seat is hinged to the connecting rod, a welding gun is hinged to the other end of the connecting rod, and a second tightening screw is arranged at the position where the connecting rod is hinged to the welding gun.
Furthermore, the extension board outside is provided with the spacing groove, the equal threaded connection in slip table both sides has the third to screw up the spiral, the third screw up set up in spacing inslot portion and in the spacing groove outside sets up and revolves the cap.
Furthermore, a supporting seat is arranged between the sliding tables on the two sides.
Furthermore, through holes are formed in the side supporting plates on the two sides of the bottom end of the side supporting plate on the two sides, and the height of each through hole is higher than that of the top of the circuit board clamping device.
Furthermore, the two sides of the sliding plate are provided with sliding arms which are clamped on the two sides of the sliding rail plate.
Furthermore, a second rotating handle and a first rotating handle are respectively arranged at the top ends of the threaded rod and the clamping threaded rod.
Compared with the prior art, the utility model discloses following beneficial effect has:
(1) the utility model provides a pair of semiconductor diode pin bonding wire device is through the slide sliding connection of design on the slide rail board, can realize carrying out the operation that the optional position removed to the bonding wire device, thereby avoided operating personnel to hold welder for a long time and cause the arm shake to influence the quality of bonding wire.
(2) The utility model provides a pair of semiconductor diode pin bonding wire device can treat the welded circuit board through the circuit board clamping device of design and effectively fix, avoids it to take place the skew because of the collision at the bonding wire in-process, and then influences the bonding wire quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor diode pin bonding apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a circuit board clamping device of a semiconductor diode pin bonding apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a wire bonding apparatus of a semiconductor diode pin wire bonding apparatus according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a sliding table structure of a semiconductor diode pin bonding apparatus according to an embodiment of the present invention.
Reference numerals:
1. a side support plate; 2. a slide rail plate; 3. a wire bonding device; 4. a slide plate; 5. a chute; 6. a threaded rod; 7. A welding gun fixing seat; 8. a first tightening screw; 9. a second tightening screw; 10. a connecting rod; 11. a welding gun; 12. a supporting seat; 13. perforating; 14. a circuit board clamping device; 15. a sliding table; 16. sliding the teeth; 17. a sliding gullet; 18. a first rotating handle; 19. clamping the threaded rod; 20. a limiting gasket; 21. an upper clamping plate; 22. a lower clamping plate; 23. a third tightening screw; 24. a support plate; 25. a table top; 26. a limiting groove; 27. anti-slip gaskets; 28. a slide arm; 29. a turntable; 30. and a second rotating handle.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, a wire bonding apparatus for semiconductor diode pins according to an embodiment of the present invention includes a side support plate 1, a slide rail plate 2, a wire bonding apparatus 3, a slide plate 4, a threaded rod 6, a circuit board clamping apparatus 14, a slide table 15 and a table 25, the side support plates 1 are symmetrically arranged on two sides of the top surface of the table top 25, the slide rail plate 2 is arranged between the top ends of the side support plates 1 on the two sides, the top surface of the sliding rail plate 2 is provided with the sliding plate 4, the threaded rod 6 is connected with the central thread of the sliding plate 4, the threaded rod 6 passes through a sliding groove 5 arranged at the center of the sliding rail plate 2 and is rotatably connected with a rotary table 29 at the bottom end thereof, the bottom end of the rotary table 29 is provided with the wire welding device 3, the two sides of the bottom end of the side support plate 1 opposite to the bottom end of the rotary table are provided with support plates 24, the sliding table 15 is arranged between the support plates 24 at the two sides, and the top surface of the sliding table 15 is provided with the circuit board clamping device 14.
Through the above technical scheme of the utility model, circuit board clamping device 14 includes grip block 21 and lower grip block 22, go up grip block 21 with threaded connection has centre gripping threaded rod 19 between the grip block 22 down, it is provided with spacing gasket 20 to go up grip block 21 top surface, spacing gasket 20 rotate connect in fixed position on the centre gripping threaded rod 19 for the position of fixed line board.
Through the above technical scheme of the utility model, slip table 15 bottom surface is provided with sliding tooth 16, slip table 15 passes through 16 sliding connection in the slip tooth's socket 17 that the mesa 25 top surface set up, be convenient for slip table 15 in slide wantonly on the mesa 25.
Through the above technical scheme of the utility model, set up on the circuit board clamping device 14 go up the grip block 21 with grip block 22 exposed core all is provided with anti-skidding gasket 27 down, makes more firm and can not harm the circuit board of centre gripping.
Through the above technical scheme of the utility model, welding wire device 3 includes welder fixing base 7 that the top set up, 7 one sides of welder fixing base articulate there is connecting rod 10, welder fixing base 7 with the articulated department of connecting rod 10 is provided with first screw up spiral 8, the connecting rod 10 other end articulates there is welder 11, connecting rod 10 with the articulated department of welder 11 is provided with the second and screws up spiral 9, makes welder 11 ability all-round rotation.
Through the above technical scheme of the utility model, the extension board 24 outside is provided with spacing groove 26, the equal threaded connection in slip table 15 both sides has third screw up spiral 23, the third screw up the spiral set up in spacing groove 26 inside and in the spacing groove 26 outside sets up the cap soon.
Through the above technical scheme of the utility model, both sides be provided with supporting seat 12 between the slip table 15 for the circuit board of treating the bonding wire is supported.
Through the above technical scheme of the utility model, both sides side extension board 1 is provided with perforation 13 between the extension board 24 that its bottom both sides set up, perforation 13 highly is higher than circuit board clamping device 14's top, the longer circuit board of centre gripping size of being convenient for.
Through the above technical scheme of the utility model, slide 4 both sides be provided with slide arm 28 joint in the both sides of slide rail board 2 are avoided slide 4 to control the both ends volume of sliding different when sliding on slide rail board 2.
Through the above technical scheme of the utility model, threaded rod 6 is provided with the second respectively with the 19 tops of centre gripping threaded rod and revolves 30 and first 18 of revolving.
When the device is specifically applied, a circuit board is placed on the top surface of the supporting seat 12 to control the sliding tables 15 on the two sides to slide to the two sides of the circuit board, the first rotating handle 18 is rotated to clamp the circuit board with the circuit board clamping devices 14 on the two sides through the upper clamping plate and the lower clamping plate, the third screwing screw 23 is screwed to fix the sliding tables 15, then the position of the sliding plate 4 on the sliding rail plate 2 is adjusted, the second rotating handle 30 is rotated to lower the welding wire device 3 to the height to be welded, and then the welding wire operation can be carried out.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A semiconductor diode pin wire welding device comprises side support plates (1), a sliding rail plate (2), a wire welding device (3), a sliding plate (4), a threaded rod (6), a circuit board clamping device (14), a sliding table (15) and a table top (25), and is characterized in that the side support plates (1) are symmetrically arranged on two sides of the top surface of the table top (25), the sliding rail plate (2) is arranged between the top ends of the side support plates (1), the sliding plate (4) is arranged on the top surface of the sliding rail plate (2), the threaded rod (6) is in central threaded connection with the sliding plate (4), the threaded rod (6) penetrates through a sliding groove (5) arranged in the center of the sliding rail plate (2) and is rotatably connected with a rotary table (29) at the bottom end of the sliding rail plate, the wire welding device (3) is arranged at the bottom end of the rotary table (29), and support plates (, the sliding table (15) is arranged between the support plates (24) on the two sides, and the circuit board clamping device (14) is arranged on the top surface of the sliding table (15).
2. The wire bonding device for the pins of the semiconductor diode as claimed in claim 1, wherein the circuit board clamping device (14) comprises an upper clamping plate (21) and a lower clamping plate (22), a clamping threaded rod (19) is connected between the upper clamping plate (21) and the lower clamping plate (22) in a threaded manner, a limiting gasket (20) is arranged on the top surface of the upper clamping plate (21), and the limiting gasket (20) is rotatably connected to a fixed position on the clamping threaded rod (19).
3. The semiconductor diode pin bonding device according to claim 1, wherein the sliding teeth (16) are arranged on the bottom surface of the sliding table (15), and the sliding table (15) is slidably connected into the sliding tooth grooves (17) arranged on the top surface of the table top (25) through the sliding teeth (16).
4. The wire bonding device for the pins of the semiconductor diode according to claim 2, wherein the clamping ends of the upper clamping plate (21) and the lower clamping plate (22) arranged on the circuit board clamping device (14) are provided with anti-slip gaskets (27).
5. The semiconductor diode pin wire welding device according to claim 1, characterized in that the wire welding device (3) comprises a welding gun fixing seat (7) arranged at the top end, a connecting rod (10) is hinged to one side of the welding gun fixing seat (7), a first tightening screw (8) is arranged at the hinge of the welding gun fixing seat (7) and the connecting rod (10), a welding gun (11) is hinged to the other end of the connecting rod (10), and a second tightening screw (9) is arranged at the hinge of the connecting rod (10) and the welding gun (11).
6. The wire bonding device for the pins of the semiconductor diode according to claim 1, wherein a limiting groove (26) is formed outside the supporting plate (24), third tightening screws (23) are connected to both sides of the sliding table (15) through threads, the third tightening screws are arranged inside the limiting groove (26), and a screw cap is arranged outside the limiting groove (26).
7. The semiconductor diode pin bonding apparatus according to claim 1, wherein a support base (12) is disposed between the sliding platforms (15) on two sides.
8. The wire bonding device for the pins of the semiconductor diode according to claim 1, wherein the side support plates (1) on both sides are provided with through holes (13) between support plates (24) arranged on both sides of the bottom end of the side support plates, and the through holes (13) are higher than the top of the circuit board clamping device (14).
9. The semiconductor diode pin bonding apparatus according to claim 1, wherein sliding arms (28) are arranged on two sides of the sliding plate (4) and are clamped on two sides of the sliding rail plate (2).
10. The wire bonding device for the pins of the semiconductor diode as claimed in claim 1, wherein the threaded rod (6) and the clamping threaded rod (19) are respectively provided with a second knob (30) and a first knob (18) at the top ends thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922488135.8U CN211490006U (en) | 2019-12-30 | 2019-12-30 | Semiconductor diode pin bonding wire device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922488135.8U CN211490006U (en) | 2019-12-30 | 2019-12-30 | Semiconductor diode pin bonding wire device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211490006U true CN211490006U (en) | 2020-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922488135.8U Active CN211490006U (en) | 2019-12-30 | 2019-12-30 | Semiconductor diode pin bonding wire device |
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| Country | Link |
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| CN (1) | CN211490006U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112222560A (en) * | 2020-09-29 | 2021-01-15 | 北京如利本辉科技有限公司 | Diode welding production line |
-
2019
- 2019-12-30 CN CN201922488135.8U patent/CN211490006U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112222560A (en) * | 2020-09-29 | 2021-01-15 | 北京如利本辉科技有限公司 | Diode welding production line |
| CN112222560B (en) * | 2020-09-29 | 2021-12-21 | 江苏贺颖智能科技有限公司 | Diode welding production line |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 518000 505, 5th floor, No.1, Guanghui science and Technology Park, Minqing Road, Fukang community, Longhua street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Quanye Electronic Co.,Ltd. Address before: Room 407, 4th floor, science and technology building, Guanghui science and Technology Park, Songhe community, Longhua office, Longhua New District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Quanye Electronic Co.,Ltd. |