CN211478547U - Wafer test fixture - Google Patents
Wafer test fixture Download PDFInfo
- Publication number
- CN211478547U CN211478547U CN201922125417.1U CN201922125417U CN211478547U CN 211478547 U CN211478547 U CN 211478547U CN 201922125417 U CN201922125417 U CN 201922125417U CN 211478547 U CN211478547 U CN 211478547U
- Authority
- CN
- China
- Prior art keywords
- wafer
- chip
- suction nozzle
- test fixture
- location cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a wafer test fixture, including chip test seat, its characterized in that: the utility model discloses a chip test seat's top fixed mounting has the location cylinder, the location cylinder has four, four in essence altogether the location cylinder is rectangular array form and distributes in the top of chip test seat, the inboard sliding connection of location cylinder has the piston rod, the terminal fixedly connected with guide bar mounting panel of piston rod, one side fixedly connected with test head direction slide bar of guide bar mounting panel, the chip suction nozzle version has been placed on the top of chip test seat, be provided with around the chip suction nozzle version and lead the corresponding positioning groove of slide bar with the test head, the utility model discloses when having solved and using wafer test fixture, wafer test fixture is difficult to stable clamp and gets the wafer, and the integrality of wafer fragile wafer is got to direct clamp, has influenced the problem of wafer test fixture's result of use.
Description
Technical Field
The utility model belongs to the technical field of wafer test fixture, concretely relates to wafer test fixture.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The wafer test fixture is used for clamping a wafer and fixing a tool for testing during wafer testing.
However, the wafer test fixture in the current market still has certain defects in the use process, for example, when the wafer test fixture is used, the wafer test fixture is difficult to stably clamp the wafer, the wafer is easily damaged by directly clamping the wafer, and the use effect of the wafer test fixture is affected.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer test fixture to when solving the use wafer test fixture that proposes in the above-mentioned background art, wafer test fixture is difficult to stable clamp and gets the wafer, and the problem of the integrality of wafer fragile wafer is got to direct clamp.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wafer test fixture, includes chip test seat, its characterized in that: the top fixed mounting of chip test seat has the location cylinder, the location cylinder has four, four in essence altogether the location cylinder is rectangular array form and distributes in the top of chip test seat, the inboard sliding connection of location cylinder has the piston rod, the terminal fixedly connected with guide bar mounting panel of piston rod, one side fixedly connected with test head direction slide bar of guide bar mounting panel, the chip suction nozzle version has been placed on the top of chip test seat, be provided with around the chip suction nozzle version with the corresponding positioning groove of test head direction slide bar.
Preferably, the bottom end of the chip suction nozzle plate is connected with a vacuum pump connecting pipe.
Preferably, the top end of the chip suction nozzle plate adsorbs the wafer through a negative pressure suction nozzle.
Preferably, the piston rods of the guide rod mounting plates are arranged towards one side far away from the chip suction nozzle plate.
Preferably, the chip suction nozzle plate is of a hollow plate-shaped structure.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses chip suction nozzle version top is placed to the wafer that the user will await measuring, the vacuum pump connection pipe of the bottom of chip suction nozzle version is connected to the wafer and adsorbs the pump, chip suction nozzle version top is through negative pressure suction nozzle absorption wafer, and simultaneously, the power of switch-on location cylinder, the location cylinder drives the piston rod and removes, the piston rod promotes in the positioning groove in the test head direction slide bar inserts the chip suction nozzle version outside through the guide bar mounting panel, be convenient for stably press from both sides dress wafer, when using wafer test fixture has been solved, wafer test fixture is difficult to stable clamp and gets the wafer, the integrality of wafer fragile wafer is got to direct clamp, the problem of wafer test fixture's result of use has been.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a front view of the present invention.
In the figure: the method comprises the following steps of 1-testing a head guide sliding rod, 2-positioning grooves, 3-chip testing seats, 4-guide rod mounting plates, 5-piston rods, 6-positioning cylinders, 7-chip suction nozzle plates and 8-wafers.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a wafer test fixture, includes chip test seat 3, its characterized in that: chip test seat 3's top fixed mounting has location cylinder 6, location cylinder 6 has four in essence altogether, four location cylinders 6 are rectangular array form and distribute in chip test seat 3's top, the inboard sliding connection of location cylinder 6 has piston rod 5, the terminal fixedly connected with guide bar mounting panel 4 of piston rod 5, one side fixedly connected with test head direction slide bar 1 of guide bar mounting panel 4, chip suction nozzle version 7 has been placed on chip test seat 3's top, be provided with all around chip suction nozzle version 7 with the corresponding positioning groove 2 of test head direction slide bar 1.
The bottom end of the chip suction nozzle plate 7 is connected with a vacuum pump connecting pipe.
The top end of the chip suction nozzle plate 7 sucks the wafer 8 through a negative pressure suction nozzle.
The piston rods 5 of the guide rod mounting plates 4 are all arranged towards one side far away from the chip suction nozzle plate 7.
The chip suction nozzle plate 7 is a hollow plate-shaped structure.
The utility model discloses a theory of operation and use flow: the utility model discloses when using, the user places 7 tops of chip suction nozzle version with the wafer 8 that awaits measuring, the vacuum pump connection pipe of the bottom of chip suction nozzle version 7 is connected to the wafer and adsorbs the pump, negative pressure suction nozzle adsorbs wafer 8 is passed through on 7 tops of chip suction nozzle version, and simultaneously, put through the power of location cylinder 6, location cylinder 6 drives piston rod 5 and removes, piston rod 5 promotes in the positioning groove 2 in the chip suction nozzle version 7 outsides is inserted to test head direction slide bar 1 through guide bar mounting panel 4, be convenient for stable the dress wafer of pressing from both sides.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a wafer test fixture, includes chip test seat (3), its characterized in that: the top fixed mounting of chip test seat (3) has location cylinder (6), location cylinder (6) are four, four in essence altogether location cylinder (6) are the rectangle array form and distribute in the top of chip test seat (3), the inboard sliding connection of location cylinder (6) has piston rod (5), the terminal fixedly connected with guide bar mounting panel (4) of piston rod (5), one side fixedly connected with test head direction slide bar (1) of guide bar mounting panel (4), chip suction nozzle version (7) have been placed on the top of chip test seat (3), be provided with around chip suction nozzle version (7) with test head direction slide bar (1) corresponding positioning groove (2).
2. The wafer test fixture of claim 1, wherein: the bottom end of the chip suction nozzle plate (7) is connected with a vacuum pump connecting pipe.
3. The wafer test fixture of claim 2, wherein: and the top end of the chip suction nozzle plate (7) adsorbs the wafer (8) through a negative pressure suction nozzle.
4. The wafer test fixture of claim 3, wherein: and piston rods (5) of the guide rod mounting plates (4) are arranged towards one side far away from the chip suction nozzle plate (7).
5. The wafer test fixture of claim 4, wherein: the chip suction nozzle plate (7) is of a hollow plate-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922125417.1U CN211478547U (en) | 2019-12-02 | 2019-12-02 | Wafer test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922125417.1U CN211478547U (en) | 2019-12-02 | 2019-12-02 | Wafer test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211478547U true CN211478547U (en) | 2020-09-11 |
Family
ID=72361398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922125417.1U Expired - Fee Related CN211478547U (en) | 2019-12-02 | 2019-12-02 | Wafer test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211478547U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567713A (en) * | 2021-07-22 | 2021-10-29 | 昆山沃得福自动化设备有限公司 | Chip test carrier |
-
2019
- 2019-12-02 CN CN201922125417.1U patent/CN211478547U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567713A (en) * | 2021-07-22 | 2021-10-29 | 昆山沃得福自动化设备有限公司 | Chip test carrier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200911 Termination date: 20211202 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |