CN211471588U - Device for electroplating surface of metal wire - Google Patents
Device for electroplating surface of metal wire Download PDFInfo
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- CN211471588U CN211471588U CN201922285535.9U CN201922285535U CN211471588U CN 211471588 U CN211471588 U CN 211471588U CN 201922285535 U CN201922285535 U CN 201922285535U CN 211471588 U CN211471588 U CN 211471588U
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Abstract
A device for electroplating the surface of metal wire rod is composed of a plastic electroplating bath with electrode plates, a heating bath pot with electric heater, a temp controller connected to temp controller, a temp sensor connected to temp controller, a deionized water tank connected to upstream end of deionized water pump, a liquid adding tube connected to downstream end of deionized water pump, a liquid level sensor connected to deionized water pump, a sulfuric acid tank connected to sulfuric acid pressure pump, an acid adding tube connected to downstream end of sulfuric acid pressure pump, a pH sensor connected to sulfuric acid pressure pump, the PH sensor, the temperature sensor and the liquid level sensor all extend into the plastic plating bath, and a stirring rod is arranged in the plastic plating bath.
Description
Technical Field
The utility model relates to an electroplate technical field, in particular to a device that is used for metal wire surface to electroplate.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to prevent the oxidation (such as corrosion) of the metal, improve the wear resistance, the conductivity, the light reflection property, the corrosion resistance, the beauty and the like. The existing electroplating technology has a plurality of imperfect places in the electroplating process: the automatic stirring function is not provided, and metal ions in the electroplating solution are often unevenly distributed, so that the electroplating efficiency is low and the electroplating is uneven; the temperature control function is not available, the measurement can only be carried out manually, but the measurement can not be carried out manually at any moment, so that the temperature is unstable; the liquid level monitoring function is not provided, the liquid level is often unstable due to errors caused by manual visual inspection, and the requirement of the liquid level required by electroplating cannot be met; the electroplating solution pH value monitoring function is not available, manual timing sampling, inspection and troubleshooting can be performed only, manpower is wasted, working efficiency is reduced, and the electroplating solution often cannot meet the requirement of the optimal pH value. The above process parameters of electroplating are unstable, so that the electroplating efficiency is low, the electroplating quality of each batch of products is uneven, and the problems of uneven, rough and non-bright coating and the like are easy to occur. The existing electroplating device does not have the function of measuring the thickness of the coating, often depends on manual timing detection, wastes manpower, reduces the working efficiency, and even leads the thickness of the coating not to meet the requirement. Along with the acceleration of mechanization and automation process in the world, electroplating device is improving urgently, provides one kind and can also automatic control temperature, monitoring liquid level and PH value's electroplating device in the electroplating process automatic stirring, measurement cladding material thickness simultaneously for cladding material quality is better more stable, and production efficiency is higher, in order to satisfy the production needs better.
Disclosure of Invention
The utility model discloses a solve the problem that above prior art exists, provide one kind can be in the electroplating process automatic stirring, measure the electroplating device that cladding material thickness can also automatic control temperature, monitoring liquid level and pH value simultaneously for cladding material quality is better more stable, and production efficiency is higher, the technical scheme of the utility model as follows:
a device for electroplating the surface of a metal wire rod comprises a plastic electroplating bath, wherein a plate electrode is arranged in the plastic electroplating bath and is connected with an anode of a constant current power supply, the plastic electroplating bath is arranged in a heating bath pot, a leading-in wheel and a leading-out wheel of the metal wire rod are respectively arranged above the plastic electroplating bath, the leading-in wheel and the leading-out wheel are metal wheels, the leading-in wheel and the leading-out wheel are connected with a cathode of the constant current power supply, wire rod diameter measuring instruments are respectively arranged in front of the leading-in wheel and behind the leading-out wheel, a plurality of plastic guide wheels for guiding the metal wire rod are arranged at the bottom in the plastic electroplating bath, the plastic guide wheels are both positioned below the liquid level in the plastic electroplating bath, the heating bath pot is provided with an electric heater, the electric heater is connected with a temperature controller through a lead, and the, the temperature sensor stretches into the plastics plating bath, sets up a deionized water pump outside the heating bath, and the upper reaches end of deionized water pump leads to pipe connection deionized water jar, and the liquid feeding pipe is connected to the low reaches end of deionized water pump, the export of liquid feeding pipe is located the plastics plating bath, a level sensor is connected through the wire to the deionized water pump, level sensor stretches into the plastics plating bath, and the heating bath still is equipped with a sulphuric acid force (forcing) pump outward, and the upper reaches end of sulphuric acid force (forcing) pump passes through a pipe connection sulphuric acid jar, and the low reaches end of sulphuric acid force (forcing) pump is connected and is added the acid pipe, and the export of adding the acid pipe is located the plastics plating bath, a PH sensor is connected through the wire to the sulphuric acid force (forcing) pump, the PH sensor stretches into the plastics plating.
The plastic electroplating bath is rectangular, and electrode plates are respectively arranged on the inner walls of four sides of the rectangular electroplating bath.
The medium contained in the heating bath is water or oil.
The plastic electroplating bath and the plastic guide wheel are made of PP materials.
The electric heater is arranged at the bottom of the heating bath kettle.
The constant current power supply adopts a direct current stabilized power supply.
The wire diameter measuring instrument adopts a photoelectric detector.
The plastic guide wheel is arranged at the bottom of the inner cavity of the plastic electroplating bath through the supporting seat, and a space is reserved between the outer circumference of the plastic guide wheel and the plastic electroplating bath.
Adopt above-mentioned technical scheme: the plastic electroplating bath is provided with an electrode plate, the electrode plate is connected with an anode of a constant current power supply, the plastic electroplating bath is arranged in a heating bath pot, a leading-in wheel and a leading-out wheel of a metal wire are respectively arranged above the plastic electroplating bath, the leading-in wheel and the leading-out wheel are both metal wheels, the leading-in wheel and the leading-out wheel are connected with a cathode of the constant current power supply, wire diameter measuring instruments are respectively arranged in front of the leading-in wheel and behind the leading-out wheel, a plurality of plastic guide wheels for guiding the metal wire are arranged at the bottom in the plastic electroplating bath, the plastic guide wheels are both positioned below the liquid level in the plastic electroplating bath, the heating bath pot is provided with an electric heater, the electric heater is connected with a temperature controller through a lead, the temperature controller is connected with a temperature sensor through a lead, and the temperature sensor extends, set up a deionized water pump outside the heating bath, the upper reaches end of deionized water pump leads to pipe connection deionized water tank, and the liquid feeding pipe is connected to the lower reaches end of deionized water pump, the export of liquid feeding pipe is located the plastics plating bath, the deionized water pump passes through a wire and connects a level sensor, level sensor stretches into in the plastics plating bath, and the heating bath still is equipped with a sulphuric acid force (forcing) pump outside the pot, and the upper reaches end of sulphuric acid force (forcing) pump passes through a pipe connection sulphuric acid jar, and the acidification pipe is connected to the lower reaches end of sulphuric acid force (forcing) pump, and the export of acidification pipe is located the plastics plating bath, a PH sensor is connected through the wire to sulphuric acid force (forcing) pump, the PH sensor stretches into in the plastics plating bath, still be equipped with a stirring rod in the plastics plating bath, can make. The utility model can monitor the temperature of the electroplating solution in real time through the arranged temperature sensor, and if the temperature does not meet the requirement, the temperature controller is adjusted to enable the electric heater to heat the heating bath kettle, thereby controlling the temperature of the plastic electroplating bath; the liquid level sensor can monitor the liquid level of the electroplating solution in real time, and if the liquid level is low, deionized water can be timely supplemented into the plastic electroplating bath through the deionized water pump so as to meet the use requirement of the liquid level; the PH value of the electroplating solution can be monitored in real time through the arranged PH sensor, and if the PH value does not meet the requirement, the sulfuric acid solution can be supplemented in time through the sulfuric acid pressure pump to meet the use requirement of the PH of the electroplating solution; the diameter of the metal wire before and after electroplating can be measured by the arranged wire diameter measuring instrument, and the thickness of the coating can be obtained by calculation, so that the required coating thickness can be accurately controlled.
The plastic electroplating bath is rectangular, the inner walls of four sides of the rectangular electroplating bath are respectively provided with the electrode plates, and the uniform distribution of the electrode plates can ensure that the current density in the plastic electroplating bath is more uniform, so that the plating layer is more uniform.
The medium contained in the heating bath pot is water or oil, the plastic electroplating bath is uniformly heated by using oil bath or water bath heating energy, the temperature is easy to control, and the plastic electroplating bath can be kept at a constant temperature.
The plastic electroplating bath and the plastic guide wheel are made of PP materials which are non-conductive, acid-resistant, alkali-resistant and resistant to high temperature of about one hundred ℃.
The electric heater is arranged at the bottom of the heating bath kettle, so that the heating is more uniform.
The constant current power supply adopts a direct current stabilized power supply, and stable voltage and current are beneficial to electroplating.
The wire diameter measuring instrument adopts the photoelectric detector, so that the diameter can be detected without contacting the surface of the metal wire, and the damage to a plating layer is avoided.
The plastic guide wheel is arranged at the bottom of the inner cavity of the plastic electroplating bath through the supporting seat, and a space is reserved between the outer circumference of the plastic guide wheel and the plastic electroplating bath so as to prevent the metal wire from contacting the plastic electroplating bath and protect the coating.
The invention is further described with reference to the drawings and the specific embodiments.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of a plastic plating bath.
Detailed Description
The utility model discloses an embodiment of structure:
referring to fig. 1-2, a device for electroplating a metal wire surface comprises a plastic electroplating bath 18, wherein the plastic electroplating bath 18 is rectangular, an electrode plate 1 is respectively arranged on the inner walls of four sides of the rectangular electroplating bath, the electrode plates are uniformly distributed to enable the current density in the plastic electroplating bath 18 to be more uniform, so that the plating layer is more uniform, the electrode plate 1 is connected with the anode of a constant current power supply, the constant current power supply adopts a direct current stabilized power supply, and stable voltage and current are beneficial to electroplating. The plastic electroplating bath 18 is arranged in a heating bath pot 4, the medium contained in the heating bath pot 4 is water or oil, the plastic electroplating bath 18 is heated uniformly by using oil bath or water bath heating energy, the temperature is easy to control, and the plastic electroplating bath 18 can be kept at a constant temperature. The device is characterized in that a leading-in wheel 5 and a leading-out wheel 19 of a metal wire are respectively arranged above the plastic electroplating bath 18, the leading-in wheel 5 and the leading-out wheel 19 are both metal wheels, the leading-in wheel 5 and the leading-out wheel 19 are connected with a cathode of a constant current power supply, a wire diameter measuring instrument 3 is respectively arranged in front of the leading-in wheel 5 and behind the leading-out wheel 19, the wire diameter measuring instrument 3 adopts a photoelectric detector, so that the diameter can be detected without contacting the surface of the metal wire, the damage to a coating is avoided, a plurality of plastic guide wheels 2 for guiding the metal wire are arranged at the bottom in the plastic electroplating bath 18, the plastic guide wheels 2 are all positioned below the liquid level in the plastic electroplating bath 18, the plastic guide wheels 2 are arranged at the bottom of the inner cavity of the plastic electroplating bath 18 through supporting seats, and a space is reserved between the outer circumference of the, and (5) protecting the coating. The plastic electroplating bath 18 and the plastic guide wheel 2 are made of PP materials which are non-conductive, acid-resistant, alkali-resistant and high-temperature resistant at about one hundred ℃. The heating bath kettle 4 is provided with an electric heater 9, the electric heater 9 is arranged at the bottom of the heating bath kettle 4, so that the heating is more uniform, the electric heater 9 is connected with a temperature controller 8 through a lead, the temperature controller 8 is connected with a temperature sensor 7 through a lead, the temperature sensor 7 extends into a plastic electroplating bath 18, a deionized water pump 11 is arranged outside the heating bath kettle 4, the upstream end of the deionized water pump 11 is connected with a deionized water tank 12 through a water pipe, the downstream end of the deionized water pump 11 is connected with a liquid adding pipe 13, the outlet of the liquid adding pipe 13 is positioned in the plastic electroplating bath 18, the deionized water pump 11 is connected with a liquid level sensor 10 through a lead, the liquid level sensor 10 extends into the plastic electroplating bath 18, a sulfuric acid pressure pump 15 is also arranged outside the heating bath kettle 4, the upstream end of the sulfuric acid pressure pump 15 is connected with a sulfuric acid tank 16 through a pipeline, and the downstream end of the sulfuric, the outlet of the acidification pipe 17 is positioned in the plastic plating bath 18, the sulfuric acid pressure pump 15 is connected with a PH sensor 14 through a lead, the PH sensor 14 extends into the plastic plating bath 18, a stirring rod 6 is further arranged in the plastic plating bath 18, the stirring rod 6 is connected with a motor, and the stirring rod 6 can enable metal ions in the plating solution to be uniformly distributed, so that the plating efficiency is improved. The utility model can monitor the temperature of the electroplating solution in real time through the arranged temperature sensor 7, and if the temperature does not meet the requirement, the temperature controller 8 is adjusted to lead the electric heater 9 to heat the heating bath kettle 4, thereby controlling the temperature of the plastic electroplating bath 18; the liquid level sensor 10 can monitor the liquid level of the electroplating solution in real time, and if the liquid level is low, deionized water can be supplemented to the plastic electroplating bath 18 through the deionized water pump 11 in time to meet the use requirement of the liquid level; the PH value of the electroplating solution can be monitored in real time through the arranged PH sensor 14, and if the PH value does not meet the requirement, the sulfuric acid solution can be supplemented in time through the sulfuric acid pressure pump 15 to meet the use requirement of the PH of the electroplating solution; the diameter of the metal wire before and after electroplating can be measured by the arranged wire diameter measuring instrument 3, and the thickness of the coating can be obtained by calculation, so that the required coating thickness can be accurately controlled.
The utility model discloses an application procedure is, earlier runs through whole electroplating device with metal wire, by the leading-in metal wire of paying out machine structure, metal wire passes through wire rod diameter measurement appearance 3, leading-in wheel 5 in proper order, then enters into plastic plating bath 18, walks around plastic guide wheel 2, comes out from plastic plating bath 18 again, walks around leading-out wheel 19 and passes through wire rod diameter measurement appearance 3 again, gets into admission machine structure at last, so far metal wire has just run through whole electroplating device. Then pouring the electroplating solution into the plastic electroplating bath 18, starting the stirring rod 6, synchronously controlling the temperature, the liquid level and the pH value of the electroplating solution, adjusting the temperature of the electroplating solution through the temperature controller 8, heating the liquid in the pot by the heating bath pot 4, and heating the plastic electroplating bath 18 by the liquid in the pot so as to enable the electroplating solution to reach the specified temperature and keep the temperature at the specified temperature all the time in the electroplating process; setting the liquid level of the electroplating solution, introducing deionized water into the plastic electroplating bath 18 through a deionized water pump 11, and simultaneously enabling the liquid level of the electroplating solution to reach the designated liquid level through monitoring of a liquid level sensor 10; the plating solution is introduced into the plastic plating bath 18 by a sulfuric acid pressure pump 15 while being monitored by a pH sensor 14 to reach a prescribed pH. Then setting the voltage of the DC regulated power supply, starting electroplating, starting the wire diameter measuring instrument 3, measuring the diameters of the metal wire before and after electroplating, calculating to obtain the thickness of the coating, and adjusting each process parameter in electroplating according to the thickness of the coating to enable the coating to reach the required thickness of the coating.
Claims (8)
1. The utility model provides a device for metal wire surface is electroplated, includes plastics plating bath (18), be equipped with electrode plate (1) in plastics plating bath (18), electrode plate (1) connect the positive pole of constant current power, its characterized in that: the plastic electroplating bath (18) is arranged in a heating bath pot (4), a leading-in wheel (5) and a leading-out wheel (19) of metal wires are respectively arranged above the plastic electroplating bath (18), the leading-in wheel (5) and the leading-out wheel (19) are both metal wheels, the leading-in wheel (5) and the leading-out wheel (19) are connected with a cathode of a constant current power supply, wire diameter measuring instruments (3) are respectively arranged in front of the leading-in wheel (5) and behind the leading-out wheel (19), a plurality of plastic guide wheels (2) used for guiding the metal wires are installed at the bottom in the plastic electroplating bath (18), the plastic guide wheels (2) are all positioned below the liquid level in the plastic electroplating bath (18), an electric heater (9) is arranged on the heating bath pot (4), the electric heater (9) is connected with a temperature controller (8) through a lead, and the temperature controller (8) is connected with a temperature sensor (7) through a, the temperature sensor (7) stretches into the plastic electroplating bath (18), a deionized water pump (11) is arranged outside the heating bath pot (4), the upstream end of the deionized water pump (11) is connected with a deionized water tank (12) through a water pipe, the downstream end of the deionized water pump (11) is connected with a liquid adding pipe (13), the outlet of the liquid adding pipe (13) is positioned in the plastic electroplating bath (18), the deionized water pump (11) is connected with a liquid level sensor (10) through a wire, the liquid level sensor (10) stretches into the plastic electroplating bath (18), a sulfuric acid pressure pump (15) is further arranged outside the heating bath pot (4), the upstream end of the sulfuric acid pressure pump (15) is connected with a sulfuric acid tank (16) through a pipeline, the downstream end of the sulfuric acid pressure pump (15) is connected with an acid adding pipe (17), the outlet of the acid adding pipe (17) is positioned in the plastic electroplating bath (18), and the sulfuric acid pressure pump (15) is connected with a PH sensor (, the PH sensor (14) extends into the plastic electroplating bath (18), and a stirring rod (6) is also arranged in the plastic electroplating bath (18).
2. The apparatus for surface plating of metal wires according to claim 1, characterized in that: the plastic electroplating bath (18) is rectangular, and the inner walls of the four sides of the rectangular electroplating bath are respectively provided with an electrode plate (1).
3. The apparatus for surface plating of metal wires according to claim 1, characterized in that: the medium contained in the heating bath pot (4) is water or oil.
4. The apparatus for surface plating of metal wires according to claim 1, characterized in that: the plastic electroplating bath (18) and the plastic guide wheel (2) are made of PP materials.
5. The apparatus for surface plating of metal wires according to claim 1, characterized in that: the electric heater (9) is arranged at the bottom of the heating bath pot (4).
6. The apparatus for surface plating of metal wires according to claim 1, characterized in that: the constant current power supply adopts a direct current stabilized power supply.
7. The apparatus for surface plating of metal wires according to claim 1, characterized in that: the wire diameter measuring instrument (3) adopts a photoelectric detector.
8. The apparatus for surface plating of metal wires according to claim 1, characterized in that: the plastic guide wheel (2) is arranged at the bottom of the inner cavity of the plastic electroplating bath (18) through a supporting seat, and a space is reserved between the outer circumference of the plastic guide wheel (2) and the plastic electroplating bath (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922285535.9U CN211471588U (en) | 2019-12-18 | 2019-12-18 | Device for electroplating surface of metal wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922285535.9U CN211471588U (en) | 2019-12-18 | 2019-12-18 | Device for electroplating surface of metal wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211471588U true CN211471588U (en) | 2020-09-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922285535.9U Active CN211471588U (en) | 2019-12-18 | 2019-12-18 | Device for electroplating surface of metal wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211471588U (en) |
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2019
- 2019-12-18 CN CN201922285535.9U patent/CN211471588U/en active Active
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