CN211470771U

CN211470771U - Mounting and fixing device for MEMS (micro-electromechanical system) microstructure

Info

Publication number: CN211470771U
Application number: CN201921897721.1U
Authority: CN
Inventors: 陈叶桐
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-11-06
Filing date: 2019-11-06
Publication date: 2020-09-11
Anticipated expiration: 2029-11-06

Abstract

The utility model belongs to the technical field of micro-mechanical electronic system, in particular to an installation fixing device for MEMS micro-structure. Including last mounting panel, lower mounting panel, base, electric heating plate and cushion, the MEMS microstructure bonds at the top of last mounting panel through glue, and the top surface machining of last mounting panel has V type slot, goes up the mounting panel and installs under on the mounting panel, all is equipped with relative recess at last mounting panel bottom and mounting panel top down, and the recess encloses into the cavity, installs electric heating plate and cushion in the cavity in proper order. The utility model discloses a make V type slot at last mounting panel top, can be with unnecessary glue discharge when bonding MEMS micro-structure, avoid because the damage of the MEMS micro-structure that the sticky installation probably arouses, the rethread sets up the electrical heating piece in the cavity that last mounting panel and lower mounting panel are constituteed, and the dismantlement to the MEMS micro-structure is realized to the method of accessible electricity heating colloidal sol.

Description

Mounting and fixing device for MEMS (micro-electromechanical system) microstructure

Technical Field

The utility model belongs to the technical field of micro-mechanical electronic system, in particular to an installation fixing device for MEMS micro-structure.

Background

MEMS micro-devices have many advantages such as low cost, small volume and light weight, and thus are widely used in many fields such as automobiles, aerospace, information communication, biochemistry, medical treatment, automatic control and national defense. Since the performance of the MEMS micro device is mainly determined by the dynamic performance of its internal microstructure, testing the dynamic characteristic parameters such as natural frequency and damping ratio of the microstructure has become an important content for developing MEMS products.

In the dynamic testing of MEMS microstructures, reliable mounting and fixing of the MEMS microstructures is required first. Since the MEMS micro device is usually obtained by fabricating a microstructure on a whole silicon wafer by using a bulk silicon process or a surface silicon process, and the silicon is a hard and brittle material, and the thickness of the silicon wafer is very thin, usually between 200 micrometers and 300 micrometers, the thickness of the processed MEMS microstructure is thinner, so that the MEMS microstructure is easily broken, and thus the conventional mechanical fixing method is not suitable for use; secondly, when the MEMS microstructure is adhered to the substrate, the glue coating amount on the substrate is not easy to control, the MEMS microstructure cannot be reliably adhered due to too little glue coating, and the MEMS microstructure is not only adhered due to too much glue coating, but also adhered to the movable structure part of the MEMS microstructure, which can cause irreversible damage to the MEMS microstructure.

SUMMERY OF THE UTILITY MODEL

To above technical problem, the utility model provides an installation fixing device for MEMS micro-structure through making V type slot at last mounting panel top, can be with unnecessary glue discharge when bonding MEMS micro-structure, avoids because the damage of the MEMS micro-structure that the sticky installation probably arouses, and the rethread sets up the electric heating piece in last mounting panel and the cavity that the lower mounting panel constitutes, and the dismantlement to the MEMS micro-structure is realized to the method of accessible electric heating colloidal sol, whole device simple structure, convenient to use.

The utility model discloses an go up mounting panel, lower mounting panel, base, electric heat piece and cushion, it installs on lower mounting panel to go up the mounting panel, lower mounting panel is installed on the base, and the MEMS micro-structure bonds at the top of last mounting panel through glue, the top surface of going up the mounting panel is equipped with V type slot, it all is equipped with the recess of relative setting with lower mounting panel top to go up mounting panel bottom, the recess encloses into the cavity, electric heat piece and cushion are installed in the cavity in proper order, the top of electric heat piece and the recess bottom butt of last mounting panel.

Further, the top of the upper mounting plate is provided with a mounting hole, the mounting hole is located below the MEMS microstructure, the mounting hole is not communicated with the cavity, a piston is mounted in the mounting hole, the outer wall of the piston and the mounting hole are in dynamic seal, and the piston freely moves in the mounting hole.

Furthermore, rubber is arranged at one end, close to the MEMS microstructure, of the piston.

Furthermore, the V-shaped grooves are divided into two groups, one group of grooves is along the horizontal direction of the top surface of the upper mounting plate, and the other group of grooves is along the vertical direction of the top surface of the upper mounting plate, so that redundant glue can flow out quickly.

Furthermore, the cavity is cylindrical, and processing is convenient.

The utility model has the advantages that:

1. by manufacturing the V-shaped groove on the top of the upper mounting plate, redundant glue can be discharged through the V-shaped groove when the MEMS microstructure is bonded, only the substrate of the MEMS microstructure can be bonded, but not the movable structure part of the MEMS microstructure, and the damage of the MEMS microstructure possibly caused by adhesive bonding installation is avoided.

2. Through the electric heating sheet arranged in the cavity formed by the upper mounting plate and the lower mounting plate, when the MEMS microstructure needs to be disassembled, glue can be dissolved by an electric heating method, and the MEMS microstructure is convenient to disassemble.

3. Through the setting of the mounting hole at the top of the upper mounting plate and the piston in the mounting hole, when the MEMS microstructure is dismounted, the air sealed at the lower end of the piston expands under the heating action of the electric heating sheet, so that the piston is driven to move upwards to push out the MEMS microstructure, and the piston can be effectively prevented from damaging the MEMS microstructure through the setting of rubber.

4. The device has simple structure and convenient use.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a plan view of the present invention.

Fig. 3 is a sectional view a-a of fig. 2.

Fig. 4 is a schematic view of the piston structure of the present invention.

In the drawings: 2. the device comprises an upper mounting plate, 201, V-shaped grooves, 202, mounting holes, 203, a piston, 3, a lower mounting plate, 4, a base, 5, electric heating sheets, 6, cushion blocks, 601 and a cavity.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

As shown in fig. 1 and 3, a mounting and fixing device for a MEMS microstructure includes an upper mounting plate 2, a lower mounting plate 3, a base 4, an electrical heating plate 5 and a spacer 6, where the upper mounting plate 2, the lower mounting plate 3 and the base 4 can be connected by bolts, a V-shaped groove 201 is formed on the top surface of the upper mounting plate 2, the MEMS microstructure is adhered to the top of the upper mounting plate 2 by glue and covers at least one V-shaped groove 201, opposite grooves are formed on the bottom of the upper mounting plate 2 and the top of the lower mounting plate 3, the grooves enclose a cavity 601, the cavity 601 is cylindrical and is convenient to process, the electrical heating plate 5 and the spacer 6 are sequentially installed in the cavity 601, where the top of the electrical heating plate 5 abuts against the bottom of the upper mounting plate 2, so that heat generated by the electrical heating plate 5 is directly transferred to the upper mounting plate 2, the heat energy is prevented from being dissipated through the air in the gap when the gap is reserved.

As shown in fig. 2 and 3, a mounting hole 202 is formed in the top of the upper mounting plate 2, the mounting hole 202 is a circular hole, the mounting hole 202 is located below the MEMS microstructure, the mounting hole 202 is not communicated with the cavity 601, a piston 203 is installed in the mounting hole 202, the outer wall of the piston 203 is in dynamic seal with the mounting hole 202, a sealed space is ensured below the piston 203, and when the electric heating plate 5 works, air in the sealed space below is thermally expanded to push the piston 203 to move, and finally the MEMS microstructure is pushed out. As shown in fig. 4, in order to ensure the sealing effect, the dynamic seal may adopt a dual-seal structure, and rubber is installed at one end of the piston 203 close to the MEMS microstructure, so as to ensure that the piston prevents the MEMS microstructure from being damaged when pushing the MEMS microstructure, and to ensure that the piston 203 generates sufficient thrust, the seal space may be filled with gas having a large thermal expansion coefficient.

As shown in fig. 1, the V-shaped grooves 201 are two groups, one group is along the horizontal direction of the top surface of the upper mounting plate 2, and the other group is along the vertical direction of the top surface of the upper mounting plate 2, so that the excessive glue can flow out quickly.

Claims

1. The utility model provides an installation fixing device for MEMS microstructure, includes mounting panel (2), lower mounting panel (3), base (4), it installs under on mounting panel (3) to go up mounting panel (2), install on base (4) mounting panel (3) down, the MEMS microstructure bonds at the top of last mounting panel (2) through glue, its characterized in that still includes electrical heating piece (5) and cushion (6), the top surface of going up mounting panel (2) is equipped with V type slot (201), it all is equipped with the recess of relative setting with mounting panel (3) top down to go up mounting panel (2) bottom, the recess encloses into cavity (601), electrical heating piece (5) and cushion (6) are installed in cavity (601) in proper order, the top of electrical heating piece (5) and the recess bottom butt of last mounting panel (2).

2. The mounting and fixing device for the MEMS microstructure according to claim 1, wherein a mounting hole (202) is formed in the top of the upper mounting plate (2), the mounting hole (202) is located below the MEMS microstructure, the mounting hole (202) is not communicated with the cavity (601), a piston (203) is mounted in the mounting hole (202), the outer wall of the piston (203) is in dynamic seal with the mounting hole (202), and the piston (203) freely moves in the mounting hole (202).

3. A mounting fixture for MEMS microstructures according to claim 2 wherein the piston (203) is mounted with rubber near one end of the MEMS microstructure.

4. A mounting fixture for MEMS microstructures according to claim 1, wherein the V-shaped grooves (201) are two groups, one group is along a horizontal direction of the top surface of the upper mounting plate (2), and the other group is along a vertical direction of the top surface of the upper mounting plate (2).

5. A mounting fixture for MEMS microstructures according to any of claims 1 to 4, wherein the cavity (601) is cylindrical.