CN211466613U

CN211466613U - Slicing device used in semiconductor production process

Info

Publication number: CN211466613U
Application number: CN201922430570.5U
Authority: CN
Inventors: 郁迎春
Original assignee: Taicheng Semiconductor Precision Suzhou Co ltd
Current assignee: Taicheng Semiconductor Precision Suzhou Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-09-11
Anticipated expiration: 2029-12-30

Abstract

The utility model relates to the technical field of slicing devices, in particular to a slicing device used in the production process of semiconductors, which comprises a slicing device body; a feed inlet is formed in the top end of the slicing device body; the conveying structure comprises a conveying roller, a conveying belt and a driving motor which is rotationally connected with the conveying roller; the semiconductor clamp that is used for the semiconductor raw materials to fix is installed to the top of conveyer belt, and the slicer that is used for the semiconductor section is installed to the one side that the feed pipe was kept away from to the semiconductor clamp, and slicer knife tackle spare is installed to the bottom of slicer. The utility model discloses a cooperation between feed inlet and the charge-in pipeline is used for the sliced unloading work of semiconductor to realize the conveying to the raw materials through transport structure, realize compressing tightly and the fixed work to the raw materials via semiconductor anchor clamps, realize the slicing work to the semiconductor through slicer and slicing knife subassembly after that, simple structure, it is easy and simple to handle, improved section efficiency and section quality greatly.

Description

Slicing device used in semiconductor production process

Technical Field

The utility model relates to a section technical field specifically is a section device of using in semiconductor production process.

Background

A semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors. All need cut into slices when present semiconductor product production, most slicing device structures are complicated, and slicing efficiency is not high, and flies upward everywhere when cutting into slices the dust, leads to the slicing device to be difficult to the clearance, for this, we provide a more practical slicing device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a section device of using in semiconductor production process to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a slicing device used in the semiconductor production process comprises a slicing device body; the top end of the slicing device body is provided with a feeding hole, the feeding hole is communicated with a feeding pipeline, and the bottom of the feeding pipeline is provided with a conveying structure for conveying semiconductors; the conveying structure comprises a conveying roller, a conveying belt and a driving motor which is rotationally connected with the conveying roller; a semiconductor clamp for fixing the semiconductor raw materials is installed above the conveying belt, a slicing machine for slicing the semiconductor is installed on one side, away from the feeding pipeline, of the semiconductor clamp, and a slicing knife assembly is installed at the bottom of the slicing machine;

install the dust absorption pipe on the section device body inner wall of slicer one side, be provided with the dust cage on the relative slicer one side of dust absorption pipe, the dust absorption pipe extends to the outside of section device body and communicates dust exhausting fan's income wind gap, and dust exhausting fan installs on the top of section device body, and dust exhausting fan's air outlet passes through dust absorption pipe and communicates dust exhausting device, and dust exhausting device installs the one side at dust exhausting fan.

Preferably, a protective barrier for protecting raw materials is arranged above the conveyor belt at one end, far away from the feeding pipeline, of the slicing machine.

Preferably, one end of the conveying belt, which is far away from the feeding pipeline, is provided with a material guide hopper with an inclined structure, so that the conveying belt can guide the sliced semiconductor raw materials, a material receiving box is arranged at the bottom of the material guide hopper, and the semiconductor raw materials can slide into the material receiving box under the action of the material guide hopper.

Preferably, dust collector's inside is provided with a plurality of filter screen, and the bottom of filter screen is provided with the deposit room, and the bottom of deposit room is provided with the blowdown fill, filters the impurity in the dust through the filter screen, and fine particle or dust subsides to the deposit room to by blowdown fill discharge.

Preferably, the driving motor is electrically connected with a transmission for adjusting the conveying speed of the raw material.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model is used for blanking of semiconductor slices through the matching between the feed inlet and the feed pipeline, realizes the transmission of raw materials through the transmission structure, realizes the compaction and fixing work of the raw materials through the semiconductor clamp, and then realizes the slicing work of the semiconductor through the slicing machine and the slicing knife component; the sliced sheet semiconductor is guided into a material receiving box under the action of a conveyor belt and a material guide hopper; and at the sliced in-process, collect the dust that the piece produced through the dust cage to through dust exhausting fan with its pump sending to dust collector, realize the dust removal work to the section device body, simple structure, it is easy and simple to handle, improved section efficiency and section quality greatly, the clearance and the maintenance of the slicer body of being convenient for prolong its life.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

In the figure: 1. a slicing device body; 2. a feed inlet; 3. a feed conduit; 4. a conveying roller; 5. a conveyor belt; 6. a transmission; 7. a semiconductor clamp; 8. slicing machine; 9. a dust collection pipe; 10. a slicing knife assembly; 11. a dust collection cover; 12. a dust removal fan; 13. a dust removal device; 14. a guard rail; 15. a material guide hopper; 16. a material receiving box; 17. a filter screen; 18. a settling chamber.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1, the present invention provides a technical solution: a slicing device used in the semiconductor production process comprises a slicing device body 1; a feed inlet 2 is formed in the top end of the slicing device body 1, the feed inlet 2 is communicated with a feed pipeline 3, and a conveying structure for conveying semiconductors is installed at the bottom of the feed pipeline 3; the conveying structure comprises a conveying roller 4, a conveying belt 5 and a driving motor which is rotationally connected with the conveying roller 3; a semiconductor clamp 7 for fixing semiconductor raw materials is arranged above the conveyor belt 5, a slicing machine 8 for slicing semiconductors is arranged on one side, away from the feeding pipeline 3, of the semiconductor clamp 7, and a slicing knife assembly 10 is arranged at the bottom of the slicing machine 8;

the inner wall of the slicing device body 1 on one side of the slicing machine 8 is provided with a dust suction pipe 9, one side, opposite to the slicing machine 8, of the dust suction pipe 9 is provided with a dust collection cover 11, the dust suction pipe 9 extends to an air inlet of the slicing device body 1, the outside of the slicing device body 1 is communicated with a dust removal fan 12, the dust removal fan 12 is installed at the top end of the slicing device body 1, an air outlet of the dust removal fan 12 is communicated with a dust removal device 13 through the dust suction pipe, and the dust removal device 13 is installed.

Further, a protective barrier 14 for protecting raw materials is arranged above the conveyor belt at the end of the slicing machine 8 far away from the feeding pipeline 3.

Furthermore, a material guide hopper 15 with an inclined structure is arranged at one end of the conveyor belt far away from the feeding pipeline 3, and a material receiving box 16 is arranged at the bottom of the material guide hopper 15.

Further, a plurality of filter screens 17 are arranged in the dust removing device 13, a settling chamber 18 is arranged at the bottom of each filter screen 17, and a sewage discharge hopper is arranged at the bottom of each settling chamber 18.

Further, the driving motor is electrically connected to a transmission 19.

The working principle is as follows: the utility model discloses before the use, whether operating personnel examine its inner structure earlier is intact, the inspection does not have the mistake back, switch on its power, then the semiconductor raw materials that will treat the section are put into from feed inlet 2, treat under charge-in pipeline 3's the guide effect, because on its self gravity landing to conveyer belt 5, then start driving motor, under the effect of conveyer roller 4, conveyer belt 5 drives and takes the section material to be the linear drive motion to 8 directions of slicer, when the material removes to slicing knife subassembly 10 below, through the rear end of 7 centre grippings of semiconductor anchor clamps and fixed material, then start slicer 8, carry out section work to the material through slicing knife subassembly 10.

Meanwhile, an operator starts the dust removal fan 12, collects dust generated by the slicing through the dust collection cover 11, pumps the dust into the dust removal device 12 through the dust collection pipe 9, and realizes dust removal through heavy filtering of the filter screen 17 and sedimentation of the sedimentation chamber 18. The sliced semiconductor raw materials slide down to a material receiving box 16 through a material guide hopper 15 under the action of a conveyor belt 5, and the slicing work of the semiconductor raw materials is finished.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A slicing apparatus for use in a semiconductor manufacturing process, comprising: comprises a slicing device body (1); the slicing device comprises a slicing device body (1), wherein a feed inlet (2) is formed in the top end of the slicing device body (1), the feed inlet (2) is communicated with a feed pipeline (3), and a conveying structure for conveying semiconductors is installed at the bottom of the feed pipeline (3); the conveying structure comprises a conveying roller (4), a conveying belt (5) and a driving motor which is rotationally connected with the conveying roller (4); a semiconductor clamp (7) for fixing a semiconductor raw material is installed above the conveyor belt (5), a slicing machine (8) for slicing a semiconductor is installed on one side, away from the feeding pipeline (3), of the semiconductor clamp (7), and a slicing knife assembly (10) is installed at the bottom of the slicing machine (8);

install dust absorption pipe (9) on the section device body (1) inner wall of slicer (8) one side, be provided with dust cage (11) on the relative slicer's (8) one side of dust absorption pipe (9), dust absorption pipe (9) extend to the outside intercommunication dust exhausting fan's (12) of section device body (1) the income wind gap, install the top at section device body (1) dust exhausting fan (12), and the air outlet of dust exhausting fan (12) passes through dust absorption pipe communicating pipe dust exhaust apparatus (13), one side at dust exhausting fan (12) is installed in dust exhausting fan (13).

2. A dicing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: and a protective barrier (14) for protecting raw materials is arranged above the conveyor belt at one end, far away from the feeding pipeline (3), of the slicing machine (8).

3. A dicing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: one end of the conveyor belt, which is far away from the feeding pipeline (3), is provided with a material guide hopper (15) with an inclined structure, and the bottom of the material guide hopper (15) is provided with a material receiving box (16).

4. A dicing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: a plurality of filter screens (17) are arranged in the dust removal device (13), a settling chamber (18) is arranged at the bottom of each filter screen (17), and a sewage discharge hopper is arranged at the bottom of each settling chamber (18).

5. A dicing apparatus for use in a semiconductor manufacturing process according to claim 1, wherein: the driving motor is electrically connected with a transmission (19).