CN211465954U

CN211465954U - Cleaning device

Info

Publication number: CN211465954U
Application number: CN201922478209.XU
Authority: CN
Inventors: 杨兆明; 颜凯; 中原司
Original assignee: Zhejiang Xinhui Equipment Technology Co ltd
Current assignee: Zhejiang Xinhui Equipment Technology Co ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-09-11
Anticipated expiration: 2029-12-31

Abstract

The utility model relates to the technical field of silicon wafer grinding and cleaning, and discloses a cleaning device, which comprises two first cleaning mechanisms and a second cleaning mechanism, wherein the two first cleaning mechanisms are arranged on a frame at intervals and slidably, the first cleaning mechanisms can move along a horizontal first direction relative to the frame, each first cleaning mechanism comprises a first driving component and a first cleaning head, and the first driving component can drive the first cleaning head to clean a silicon wafer; the second cleaning mechanism is arranged on the rack in a sliding mode and located between the two first cleaning mechanisms, the second cleaning mechanism can move along the horizontal first direction relative to the rack, the second cleaning mechanism comprises a second driving assembly and a second cleaning head, and the second cleaning mechanism can drive the second cleaning head to clean the suckers. The cleaning device can clean the silicon wafer to ensure the cleanliness of the silicon wafer, clean the sucker to ensure the cleanliness of the sucker, and effectively avoid the influence of dust adhered on the sucker on the grinding precision of the next silicon wafer.

Description

Cleaning device

Technical Field

The utility model relates to a silicon chip grinds and washs technical field, especially relates to a belt cleaning device.

Background

With the development of electronic science and technology, the usage amount of silicon wafers is larger and larger, and the application fields are more and more. The silicon wafer needs to be ground during the processing. Generally, a manipulator (the mode of grabbing the silicon wafer by the manipulator mainly comprises a vacuum adsorption mode and a clamping mode) is adopted to take the silicon wafer out of the wafer box, the silicon wafer is moved to a grinding disc, vacuum adsorption is adopted for fixing, and then grinding is carried out.

In order to improve the grinding efficiency, the grinding equipment is generally provided with two ceramic suckers and two grinding assemblies, the two ceramic suckers adsorb and fix two silicon wafers simultaneously, and the two grinding assemblies grind the two silicon wafers simultaneously.

After grinding, the silicon wafer needs to be cleaned in order to ensure the cleanliness of the silicon wafer. Meanwhile, in order to ensure the next grinding precision, the ceramic adsorption disc also needs to be cleaned, so that the influence of dust adhered to the ceramic adsorption disc on the next silicon wafer placement precision is avoided.

Therefore, a cleaning device is needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a belt cleaning device, it can wash silicon chip and sucking disc to guarantee the cleanliness of silicon chip and sucking disc.

To achieve the purpose, the utility model adopts the following technical proposal:

there is provided a cleaning device including:

a machine frame, a plurality of guide rails and a plurality of guide rails,

the two first cleaning mechanisms are arranged on the rack at intervals in a sliding mode and can move along a horizontal first direction relative to the rack, each first cleaning mechanism comprises a first driving assembly and a first cleaning head, and the first driving assemblies can drive the first cleaning heads to clean the silicon wafers;

the second cleaning mechanism is arranged on the rack in a sliding mode and located between the two first cleaning mechanisms, the second cleaning mechanism can move along the horizontal first direction relative to the rack, the second cleaning mechanism comprises a second driving assembly and a second cleaning head, and the second cleaning mechanism can drive the second cleaning head to clean the suckers.

As a preferred scheme of a cleaning device, the first driving assembly includes a first mounting bracket and a first driving piece, the first driving piece is disposed on the first mounting bracket, the first cleaning head is rotatably disposed on the first mounting bracket, an output end of the first driving piece is in transmission connection with the first cleaning head, and the first driving piece can drive the first cleaning head to operate so as to clean the silicon wafer.

As a preferable scheme of the cleaning device, the first driving assembly further comprises a first synchronizing wheel, a third synchronizing wheel, a first connecting shaft and a first synchronizing belt;

the output end of the first driving piece is provided with the first synchronizing wheel, the first cleaning head is provided with the first connecting shaft, the first connecting shaft is rotatably connected with the first mounting frame through a bearing, the first connecting shaft is provided with the third synchronizing wheel, and the first synchronizing wheel and the third synchronizing wheel are in transmission connection through the first synchronizing belt.

As a preferable mode of the cleaning device, the first driving assembly further includes a first tension wheel rotatably disposed on the first mounting bracket, and the first tension wheel abuts against the first timing belt.

As a preferable scheme of the cleaning device, the first cleaning mechanism further comprises a first translation mechanism and a first lifting mechanism, and the first lifting mechanism is slidably arranged on the rack;

first translation mechanism set up in first elevating system's output drives first elevating system and can orders about first translation mechanism removes along vertical direction, first mounting bracket set up in first translation mechanism's output, first translation mechanism can drive first mounting bracket removes along horizontal second direction.

As a preferred scheme of belt cleaning device, the second drive assembly includes second mounting bracket and second driving piece, the second driving piece set up in on the second mounting bracket, the second cleaning head set up with rotating on the second mounting bracket, the output of second driving piece with the transmission of second cleaning head is connected, the second driving piece can drive the operation of second cleaning head to wash the sucking disc.

As a preferred scheme of the cleaning device, the second driving assembly further comprises a second synchronizing wheel, a fourth synchronizing wheel, a second connecting shaft and a second synchronous belt;

the output of second driving piece is provided with the second synchronizing wheel, be provided with on the second cleaning head the second connecting axle, the second connecting axle pass through the bearing with the second mounting bracket rotates to be connected, be provided with the fourth synchronizing wheel on the second connecting axle, the second synchronizing wheel with the fourth synchronizing wheel passes through the second synchronous belt drive is connected.

As a preferable aspect of the cleaning apparatus, the second driving assembly further includes a second tensioning wheel, the second tensioning wheel is rotatably disposed on the second mounting bracket, and the second tensioning wheel abuts against the second timing belt.

As a preferable scheme of the cleaning device, the second cleaning mechanism further includes a second translation mechanism and a second lifting mechanism, and the second lifting mechanism is slidably disposed on the rack;

the second translation mechanism is arranged at the output end of the second lifting mechanism, drives the second lifting mechanism to drive the second translation mechanism to move along the vertical direction, the second mounting frame is arranged at the output end of the second translation mechanism, and the second translation mechanism can drive the second mounting frame to move along the horizontal second direction.

As a preferable mode of the cleaning apparatus, the horizontal first direction and the horizontal second direction are arranged perpendicular to each other.

The utility model has the advantages that:

the first cleaning mechanism is used for cleaning the silicon wafer, the second cleaning mechanism can be used for cleaning the sucker after the silicon wafer is cleaned, the cleaning device can be used for cleaning the silicon wafer to ensure the cleanliness of the silicon wafer, the cleanliness of the sucker can be ensured, and the influence of dust adhered to the sucker on the grinding precision of the next silicon wafer can be effectively avoided. The second cleaning mechanism is arranged between the two first cleaning mechanisms and can clean the two suckers by moving left and right. The silicon wafer on the first sucking disc is ground while the silicon wafer on the second sucking disc and the sucking discs are cleaned, the silicon wafer on the sucking disc on the left side is ground while the silicon wafer on the sucking disc on the right side is cleaned, and the silicon wafer on the right side starts to be ground while the silicon wafer on the left side is ground and needs to be cleaned; the two suckers can ensure that one is grinding the silicon wafer at any time, so that the working time of the grinding device is prolonged, and the effective grinding aging of the grinding device is increased. Moreover, the cleaning device is simple in structure, convenient to operate and high in cleaning efficiency.

Drawings

Fig. 1 is a first schematic structural diagram of a first cleaning mechanism provided by the present invention;

fig. 2 is a schematic structural diagram of a first cleaning mechanism provided by the present invention;

fig. 3 is a partial schematic structural view of a first cleaning mechanism provided by the present invention;

FIG. 4 is a partial cross-sectional view of a first cleaning mechanism provided by the present invention;

fig. 5 is a first schematic structural diagram of a second cleaning mechanism provided by the present invention;

fig. 6 is a schematic structural diagram of a second cleaning mechanism provided by the present invention;

fig. 7 is a partial schematic structural view of a second cleaning mechanism provided by the present invention;

fig. 8 is a partial cross-sectional view of a second washer mechanism provided by the present invention.

In the figure:

1. a first cleaning mechanism; 11. a first drive assembly; 11. a first mounting bracket; 112. a first driving member; 113. a first synchronizing wheel; 114. a third synchronizing wheel; 115. a first connecting shaft; 116. a first synchronization belt; 117. a first tensioning wheel;

12. a first cleaning head; 13. a first translation mechanism; 131. a third servo motor; 132. a first slide rail; 14. a first lifting mechanism; 141. a first servo motor; 142. a third slide rail; 15. a rodless cylinder;

2. a second cleaning mechanism; 21. a second drive assembly; 211. a second mounting bracket; 212. a second driving member; 213. a second synchronizing wheel; 214. a fourth synchronizing wheel; 215. a second connecting shaft; 216. a second synchronous belt; 217. a second tensioning wheel;

22. a second cleaning head; 23. a second translation mechanism; 231. a fourth servo motor; 232. a second slide rail;

24. a second lifting mechanism; 241. a second servo motor; 242. a fourth slide rail; 251. driving a servo motor; 252. a second guide rail.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description of the present invention and simplification of description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either mechanically or electrically. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

As shown in fig. 1 to 8, the present embodiment discloses a cleaning apparatus including a frame, two first cleaning mechanisms 1 and one second cleaning mechanism 2.

The two first cleaning mechanisms 1 are arranged on the rack at intervals in a sliding mode, the first cleaning mechanisms 1 can move along a horizontal first direction relative to the rack, each first cleaning mechanism 1 comprises a first driving assembly 11 and a first cleaning head 12, and the first driving assemblies 11 can drive the first cleaning heads 12 to clean the silicon wafers. The second cleaning mechanism 2 is slidably arranged on the rack and located between the two first cleaning mechanisms 1, the second cleaning mechanism 2 can move along a horizontal first direction relative to the rack, the second cleaning mechanism 2 comprises a second driving assembly 21 and a second cleaning head 22, and the second cleaning mechanism 2 can drive the second cleaning head 22 to clean the suckers.

The silicon wafer of the first cleaning mechanism 1 is cleaned, after the silicon wafer is cleaned, the sucking disc can be cleaned by the second cleaning mechanism 2, the cleaning device can clean the silicon wafer to guarantee the cleanliness of the silicon wafer, the cleanliness of the sucking disc can be guaranteed, and the influence of dust adhered to the sucking disc on the grinding precision of the next silicon wafer can be effectively avoided. The second cleaning mechanism 2 is arranged between the two first cleaning mechanisms 1, and can clean the two suckers by moving left and right. The two first cleaning mechanisms 1 are used for cleaning the silicon wafer on the sucking disc on the left side and the sucking disc on the right side while the silicon wafer on the left side is ground, and grinding the silicon wafer on the right side is started while the silicon wafer on the left side is ground and needs to be cleaned; the two suckers can ensure that one is grinding the silicon wafer at any time, so that the working time of the grinding device is prolonged, and the effective grinding aging of the grinding device is increased. Moreover, the cleaning device is simple in structure, convenient to operate and high in cleaning efficiency.

The first cleaning head 12 comprises a first frame and a first brush, the first brush is arranged on the first frame, the first frame rotates to enable the first brush to clean the surface of the silicon wafer, and dust generated by grinding is cleaned to complete cleaning of the silicon wafer. Specifically, as shown in fig. 3 and 4, the first driving assembly 11 includes a first mounting frame 111 and a first driving member 112, the first driving member 112 is disposed on the first mounting frame 111, the first cleaning head 12 is rotatably disposed on the first mounting frame 111, an output end of the first driving member 112 is in transmission connection with the first cleaning head 12, and the first driving member 112 can drive the first cleaning head 12 to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer.

More specifically, the first driving assembly 11 further includes a first synchronizing wheel 113, a third synchronizing wheel 114, a first connecting shaft 115, and a first synchronizing belt 116. The output end of the first driving member 112 is provided with a first synchronous wheel 113, a first connecting shaft 115 is arranged on a first frame of the first cleaning head 12, two ends of the first connecting shaft 115 are rotatably connected with the first mounting frame 111 through bearings, a third synchronous wheel 114 is arranged on the first connecting shaft 115, and the first synchronous wheel 113 and the third synchronous wheel 114 are in transmission connection through a first synchronous belt 116. Preferably, the first synchronizing wheel 113 and the third synchronizing wheel 114 in this embodiment are both toothed pulleys, and the first synchronizing belt 116 is a toothed belt, so that the transmission efficiency is ensured by preventing slippage between the first synchronizing wheel 113 and the first synchronizing belt 116 and between the third synchronizing wheel 114 and the first synchronizing belt 116. Optionally, the first driving assembly 11 further includes a first tensioning wheel 117, the first tensioning wheel 117 is rotatably disposed on the first mounting bracket 111, and the first tensioning wheel 117 abuts against the outer surface of the first synchronous belt 116. The first tension roller 117 is provided so that no slip occurs between the first synchronizing roller 113 and the first synchronizing belt 116 and between the second synchronizing roller 213 and the first synchronizing belt 116, thereby ensuring the efficiency of the transmission. The first driving member 112 drives the first synchronous wheel 113 to rotate, the first synchronous wheel 113 drives the third synchronous wheel 114 to rotate through the first synchronous belt 116, and further drives the first connecting shaft 115 to rotate, so as to drive the first cleaning head 12 to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer.

As shown in fig. 1 and 2, the first cleaning mechanism 1 further includes a first translation mechanism 13 and a first lifting mechanism 14, and the first lifting mechanism 14 is slidably disposed on the frame. The first translation mechanism 13 is disposed at an output end of the first lifting mechanism 14, and drives the first lifting mechanism 14 to drive the first translation mechanism 13 to move along a vertical direction, the first mounting bracket 111 is disposed at an output end of the first translation mechanism 13, and the first translation mechanism 13 can drive the first mounting bracket 111 to move along a horizontal second direction. The horizontal first direction and the horizontal second direction are arranged perpendicular to each other.

Specifically, a rodless cylinder 15 is arranged on the frame along a horizontal first direction, and an output end of the rodless cylinder 15 can move along the horizontal first direction. The first lifting mechanism 14 includes a first support frame, a first servo motor 141, a first lead screw, and a first nut. The first support frame is arranged at the output end of the rodless cylinder 15, a first guide rail is arranged on the rack, and a first guide block in sliding fit with the first guide rail is arranged on the first support frame. The rodless cylinder 15 is capable of driving the first support frame to move in a horizontal first direction on the first guide rail. The first servo motor 141 is disposed on the first support frame, the first lead screw is rotatably disposed on the first support frame along a vertical direction, and an output shaft of the first servo motor 141 is in transmission connection with the first lead screw, specifically, may be in transmission connection through a coupler or a gear assembly. The first nut is screwed on the first lead screw.

The first translation mechanism 13 includes a third support frame, a third servo motor 131, a third lead screw, and a third nut. The first nut is arranged on the third support frame, the first support frame is provided with a first slide rail 132 along a vertical mode, and the third support frame is provided with a first slide block matched with the first slide rail 132. The first servo motor 141 can drive the first lead screw to rotate so as to drive the third support frame to move up and down along the first slide rail 132.

The third servo motor 131 is disposed on the third support frame, the third screw rod is rotatably disposed on the third support frame, and the third nut is screwed on the third screw rod. A third slide rail 142 is arranged on the third support frame along the horizontal second direction, a third slide block in sliding fit with the third slide rail 142 is arranged on the first mounting frame 111, and a third nut is arranged on the first mounting frame 111. The third servo motor 131 can drive the third lead screw to rotate so as to drive the first mounting frame 111 to move along the horizontal second direction.

The rodless cylinder 15 can drive the first support frame to move along a horizontal first direction; the first servo motor 141 can drive the third support frame to move up and down along the first slide rail 132; the third servo motor 131 can drive the first mounting bracket 111 to move in the horizontal second direction. The three parts are matched to drive the first cleaning head 12 of the first cleaning mechanism 1 to move towards any direction in space so as to clean the silicon wafer and move away after cleaning the silicon wafer, and therefore subsequent processing and cleaning are facilitated.

As shown in fig. 7 and 8, the second cleaning head 22 includes a second frame, a bearing frame and a second brush, the second brush is disposed on the second frame, the second frame and the bearing frame are slidably connected through a sliding shaft, and a spring is disposed between the second frame and the bearing frame, and the spring is sleeved on the sliding shaft. The second frame rotates to enable the second brush to clean the surface of the sucker, and dust generated by grinding is cleaned, so that the sucker is cleaned. The second driving assembly 21 includes a second mounting bracket 211 and a second driving member 212, the second driving member 212 is disposed on the second mounting bracket 211, the second cleaning head 22 is rotatably disposed on the second mounting bracket 211, an output end of the second driving member 212 is in transmission connection with the second cleaning head 22, and the second driving member 212 can drive the second cleaning head 22 to operate to clean the suction cup.

More specifically, the second driving assembly 21 further includes a second synchronizing wheel 213, a fourth synchronizing wheel 214, a second connecting shaft 215, and a second synchronizing belt 216. The output end of the second driving member 212 is provided with a second synchronizing wheel 213, the bearing frame of the second cleaning head 22 is provided with a second connecting shaft 215, two ends of the second connecting shaft 215 are rotatably connected with the second mounting frame 211 through bearings, the second connecting shaft 215 is provided with a fourth synchronizing wheel 214, and the second synchronizing wheel 213 and the fourth synchronizing wheel 214 are in transmission connection through a second synchronizing belt 216. Preferably, in the present embodiment, the second synchronizing wheel 213 and the fourth synchronizing wheel 214 are both toothed pulleys, and the second timing belt 216 is a toothed belt, so that the transmission efficiency is ensured by preventing slippage between the second synchronizing wheel 213 and the second timing belt 216 and between the fourth synchronizing wheel 214 and the second timing belt 216. Optionally, the second driving assembly 21 further includes a second tension pulley 217, the second tension pulley 217 is rotatably disposed on the second mounting bracket 211, and the second tension pulley 217 abuts against an outer surface of the second timing belt 216. The second tension pulley 217 is arranged between the second synchronous pulley 213 and the second synchronous belt 216 and between the fourth synchronous pulley 214 and the second synchronous belt 216, so that the transmission efficiency is ensured. The first driving member 112 drives the first synchronous wheel 113 to rotate, the first synchronous wheel 113 drives the third synchronous wheel 114 to rotate through the first synchronous belt 116, and further drives the first connecting shaft 115 to rotate, so as to drive the first cleaning head 12 to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer.

As shown in fig. 5 and 6, the second cleaning mechanism 2 further includes a second translation mechanism 23 and a second lifting mechanism 24, and the second lifting mechanism 24 is slidably disposed on the frame. The second translation mechanism 23 is disposed at an output end of the second lifting mechanism 24, and drives the second lifting mechanism 24 to drive the second translation mechanism 23 to move along a vertical direction, the second mounting bracket 211 is disposed at an output end of the second translation mechanism 23, and the second translation mechanism 23 can drive the second mounting bracket 211 to move along a horizontal second direction.

Specifically, a driving servo motor 251 is arranged on the frame along the horizontal first direction, and the driving servo motor 251 can drive the second lifting mechanism 24 to move along the horizontal first direction. The second lifting mechanism 24 includes a second support frame, a second servo motor 241, a second lead screw, and a second nut. A second guide rail 252 is arranged on the rack (the second guide rail 252 may be arranged in a collinear manner with the first guide rail, or may be arranged in a parallel manner), a second guide block in sliding fit with the second guide rail 252 is arranged on the second support frame, a driving lead screw is arranged on an output shaft of the driving servo motor 251, a driving nut is arranged on the second support frame, and the driving lead screw is driven by the driving servo motor 251 to rotate so as to drive the second support frame to move along the horizontal first direction on the second guide rail 252. The second servo motor 241 is arranged on the second support frame, the second lead screw is rotatably arranged on the second support frame along the vertical direction, and an output shaft of the second servo motor 241 is in transmission connection with the second lead screw, specifically, can be in transmission connection through a coupler or a gear assembly. The second nut is screwed on the second lead screw.

The second translation mechanism 23 includes a fourth support frame, a fourth servo motor 231, a fourth lead screw, and a fourth nut. The second nut sets up on the fourth support frame, and the second support frame is provided with second slide rail 232 along vertical mode, is provided with the second slider with second slide rail 232 matched with on the fourth support frame. The second servo motor 241 can drive the second lead screw to rotate so as to drive the fourth support frame to move up and down along the second slide rail 232.

The fourth servo motor 231 is arranged on the fourth support frame, the fourth lead screw is rotatably arranged on the fourth support frame, and the fourth nut is screwed on the fourth lead screw. A fourth slide rail 242 is arranged on the fourth support frame along the horizontal second direction, a fourth slide block in sliding fit with the fourth slide rail 242 is arranged on the second mounting frame 211, and a fourth nut is arranged on the second mounting frame 211. The fourth servo motor 231 can drive the fourth lead screw to rotate so as to drive the second mounting frame 211 to move along the horizontal second direction.

The driving servo motor 251 can drive the second support frame to move along a horizontal first direction; the second servo motor 241 can drive the fourth support frame to move up and down along the second slide rail 232; the fourth servo motor 231 can drive the second mounting bracket 211 to move in the horizontal second direction. The three parts are matched to drive the second cleaning head 22 of the second cleaning mechanism 2 to move in any direction in space so as to clean the sucker and remove the sucker for subsequent processing and cleaning.

After the manipulator finishes feeding the left sucker and the right sucker successively, the left sucker finishes grinding first, and the grinding device moves away. The rodless cylinder 15 drives the first support frame to move along a horizontal first direction, the first servo motor 141 drives the third support frame to move along the first slide rail 132, and the third servo motor 131 drives the first mounting frame 111 to move along a horizontal second direction. The three cooperate to drive the first cleaning head 12 of the first cleaning mechanism 1 corresponding to the left suction cup to move to the upper side of the silicon wafer on the left suction cup, then the first driving member 112 drives the first synchronous wheel 113 to rotate, the first synchronous wheel 113 drives the third synchronous wheel 114 to rotate through the first synchronous belt 116, and then the first cleaning head 12 is driven to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer on the left suction cup.

After the silicon wafer on the left suction cup is cleaned, the rodless cylinder 15, the first servo motor 141 and the third servo motor 131 are matched to move the first cleaning head 12 corresponding to the left suction cup away, so as to give way for the second cleaning mechanism 2. And then the mechanical arm vacuum adsorbs the silicon wafer, and after the silicon wafer is vacuumed, the silicon wafer on the sucking disc on the left side is removed.

Then, the driving servo motor 251 drives the second support frame to move along the horizontal first direction, the second servo motor 241 drives the fourth support frame to move along the second slide rail 232, and the fourth servo motor 231 drives the second mounting frame 211 to move along the horizontal second direction. The three cooperate to drive the second cleaning head 22 of the second cleaning mechanism 2 to move above the left suction cup, then the second driving member 212 drives the second synchronizing wheel 213 to rotate, the second synchronizing wheel 213 drives the third synchronizing wheel 214 to rotate through the second synchronizing belt 216, and further drives the second cleaning head 22 to rotate, so that the second brush of the second cleaning head 22 cleans the left suction cup.

The silicon wafer on the left sucker and the silicon wafer on the right sucker are ground in the cleaning process of the left sucker; after the left suction cup is cleaned, the servo motor 251, the second servo motor 241 and the fourth servo motor 231 are driven to cooperate with each other to move the second cleaning head 22 away and yield. The manipulator grabs the unground silicon wafer and places the unground silicon wafer on the left sucker, and the left grinding device grinds the silicon wafer.

When the left sucker is cleaned, the silicon wafer on the right sucker is ground, the right grinding device moves away and gives way, the rodless cylinder 15 drives the first support frame to move along the horizontal first direction, the first servo motor 141 drives the third support frame to move along the first slide rail 132, and the third servo motor 131 drives the first mounting frame 111 to move along the horizontal second direction. The three cooperate to drive the first cleaning head 12 of the first cleaning mechanism 1 corresponding to the right suction cup to move to the upper side of the silicon wafer on the right suction cup, then the first driving member 112 drives the first synchronous wheel 113 to rotate, the first synchronous wheel 113 drives the third synchronous wheel 114 to rotate through the first synchronous belt 116, and then the first cleaning head 12 is driven to rotate, so that the first brush of the first cleaning head 12 cleans the silicon wafer on the right suction cup.

After the silicon wafer on the right suction cup is cleaned, the rodless cylinder 15, the first servo motor 141 and the third servo motor 131 are matched to move the first cleaning head 12 corresponding to the right suction cup away, so as to give way for the second cleaning mechanism 2. And then the mechanical arm adsorbs the silicon wafer in vacuum, and after the silicon wafer is vacuumed, the silicon wafer on the sucking disc on the right side is removed.

Then, the driving servo motor 251 drives the second support frame to move along the horizontal first direction, the second servo motor 241 drives the fourth support frame to move along the second slide rail 232, and the fourth servo motor 231 drives the second mounting frame 211 to move along the horizontal second direction. The three cooperate to drive the second cleaning head 22 of the second cleaning mechanism 2 to move above the right suction cup, then the second driving member 212 drives the second synchronizing wheel 213 to rotate, the second synchronizing wheel 213 drives the third synchronizing wheel 214 to rotate through the second synchronizing belt 216, and further drives the second cleaning head 22 to rotate, so that the second brush of the second cleaning head 22 cleans the right suction cup.

After the right chuck is cleaned, the wafer on the left chuck is substantially polished and then the wafer on the left chuck and the left chuck are cleaned. This is always done in sequence.

The two suckers can ensure that one is grinding the silicon wafer at any time, so that the working time of the grinding device is prolonged, and the effective grinding aging of the grinding device is increased. Moreover, the cleaning device is simple in structure, convenient to operate and high in cleaning efficiency.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A cleaning device, comprising:

a machine frame, a plurality of guide rails and a plurality of guide rails,

the two first cleaning mechanisms (1) are arranged on the rack in a spaced and sliding mode, the first cleaning mechanisms (1) can move along a horizontal first direction relative to the rack, each first cleaning mechanism (1) comprises a first driving assembly (11) and a first cleaning head (12), and the first driving assemblies (11) can drive the first cleaning heads (12) to clean the silicon wafers;

the second cleaning mechanism (2) is arranged on the rack in a sliding mode and located between the two first cleaning mechanisms (1), the second cleaning mechanism (2) can move along the horizontal first direction relative to the rack, the second cleaning mechanism (2) comprises a second driving assembly (21) and a second cleaning head (22), and the second cleaning mechanism (2) can drive the second cleaning head (22) to clean the suckers.

2. The cleaning device according to claim 1, wherein the first driving assembly (11) comprises a first mounting frame (111) and a first driving member (112), the first driving member (112) is disposed on the first mounting frame (111), the first cleaning head (12) is rotatably disposed on the first mounting frame (111), an output end of the first driving member (112) is in transmission connection with the first cleaning head (12), and the first driving member (112) can drive the first cleaning head (12) to operate so as to clean the silicon wafer.

3. The washing device according to claim 2, characterized in that the first drive assembly (11) further comprises a first synchronizing wheel (113), a third synchronizing wheel (114), a first connecting shaft (115) and a first synchronizing belt (116);

the output end of the first driving piece (112) is provided with a first synchronous wheel (113), the first cleaning head (12) is provided with a first connecting shaft (115), the first connecting shaft (115) is rotatably connected with the first mounting frame (111) through a bearing, the first connecting shaft (115) is provided with a third synchronous wheel (114), and the first synchronous wheel (113) and the third synchronous wheel (114) are in transmission connection through a first synchronous belt (116).

4. A cleaning device according to claim 3, characterized in that said first driving assembly (11) further comprises a first tensioning wheel (117), said first tensioning wheel (117) being rotatably arranged on said first mounting frame (111), said first tensioning wheel (117) being pressed against said first synchronization belt (116).

5. The washing device according to claim 2, characterized in that said first washing means (1) further comprise a first translation means (13) and a first lifting means (14), said first lifting means (14) being slidingly arranged on said frame;

first translation mechanism (13) set up in the output of first elevating system (14), drive first elevating system (14) and can order about first translation mechanism (13) remove along vertical direction, first mounting bracket (111) set up in the output of first translation mechanism (13), first translation mechanism (13) can drive first mounting bracket (111) remove along horizontal second direction.

6. The cleaning device according to claim 1, characterized in that the second driving assembly (21) comprises a second mounting frame (211) and a second driving member (212), the second driving member (212) is arranged on the second mounting frame (211), the second cleaning head (22) is rotatably arranged on the second mounting frame (211), an output end of the second driving member (212) is in transmission connection with the second cleaning head (22), and the second driving member (212) can drive the second cleaning head (22) to operate so as to clean the suction cup.

7. The cleaning device according to claim 6, characterized in that the second driving assembly (21) further comprises a second synchronizing wheel (213), a fourth synchronizing wheel (214), a second connecting shaft (215) and a second timing belt (216);

the output of second driving piece (212) is provided with second synchronizing wheel (213), be provided with on second cleaning head (22) second connecting axle (215), second connecting axle (215) pass through the bearing with second mounting bracket (211) rotate and are connected, be provided with fourth synchronizing wheel (214) on second connecting axle (215), second synchronizing wheel (213) with fourth synchronizing wheel (214) pass through second hold-in range (216) transmission is connected.

8. The cleaning device according to claim 7, characterized in that the second driving assembly (21) further comprises a second tensioning wheel (217), the second tensioning wheel (217) being rotatably arranged on the second mounting frame (211), the second tensioning wheel (217) being pressed against the second timing belt (216).

9. A washing device according to claim 6, characterized in that the second washing means (2) further comprise a second translation means (23) and a second lifting means (24), the second lifting means (24) being slidingly arranged on the frame;

the second translation mechanism (23) is arranged at the output end of the second lifting mechanism (24), the second lifting mechanism (24) is driven to drive the second translation mechanism (23) to move along the vertical direction, the second mounting frame (211) is arranged at the output end of the second translation mechanism (23), and the second translation mechanism (23) can drive the second mounting frame (211) to move along the horizontal second direction.

10. The cleaning apparatus defined in claim 9, wherein the horizontal first direction and the horizontal second direction are disposed perpendicular to one another.