CN211457554U

CN211457554U - Heating device for be used for producing PCB board

Info

Publication number: CN211457554U
Application number: CN201921896553.4U
Authority: CN
Inventors: 何建芬
Original assignee: Nippon (boluo) Electronics Co ltd
Current assignee: Nippon (boluo) Electronics Co ltd
Priority date: 2019-11-06
Filing date: 2019-11-06
Publication date: 2020-09-08
Anticipated expiration: 2029-11-06

Abstract

The utility model discloses a heating device for producing PCB board, which belongs to the technical field of PCB board processing, and comprises a heating groove and a heat pump, wherein the heat pump is provided with an air inlet pipe and an air outlet pipe, the heating groove is internally provided with two heat conduction coil pipes, the middle parts of the two heat conduction coil pipes are communicated through a connecting pipe, one ends of the two heat conduction coil pipes, which are far away from the connecting pipe, are respectively communicated with the air inlet pipe and the air outlet pipe, the heat pump can be used for excavating the energy stored in the environment medium, the temperature is improved for utilization, the work consumed by the whole heat pump device is only 1/3 or lower of the heat supply, the heat is guided by the heat conduction coil pipes, the temperature of the electroplating mixed liquid is increased, thereby the heating effect is achieved, the electric energy consumption cost of the electroplating process is reduced, and all heating pipe devices in an electroplating cylinder can be cancelled, avoiding the fire risk and ensuring more environment-friendly and safer working procedures.

Description

Heating device for be used for producing PCB board

Technical Field

The utility model relates to a PCB board processing technology field, more specifically say, relate to a heating device for be used for producing PCB board.

Background

At present, PCB manufacturers in China are numerous, electroplating procedures in PCB manufacturing need a large amount of liquid medicine and pure water to be mixed to realize electroplating, wherein the most key parameters also comprise temperature parameters of mixed liquid, the temperature of the liquid medicine in the electroplating process is required to be more than 80 ℃, generally more than 40 ℃, and the heating pipe heating mode is adopted in the industry at present.

Heating by adopting the heating pipes requires a plurality of heating pipes to ensure the heating speed, and a fire disaster is easy to occur in the heating process; the long-term heating and temperature rise can cause waste of energy.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

To the problem that exists among the prior art, the utility model aims to provide a heating device for producing PCB board, it can avoid the heating in-process to take place the conflagration, reduces the waste to the energy.

2. Technical scheme

In order to solve the above problems, the utility model adopts the following technical proposal.

The utility model provides a heating device for be used for producing PCB board, includes heating tank and heat pump, be provided with intake pipe and outlet duct on the heat pump, the inside of heating tank is provided with two heat conduction coil pipes, two the connecting pipe intercommunication is passed through at heat conduction coil pipe's middle part, two the one end that the connecting pipe was kept away from to the heat conduction coil pipe corresponds respectively with intake pipe and outlet duct intercommunication.

Further, intake pipe and outlet duct all extend to the top in heating tank, all be provided with the valve on intake pipe and the outlet duct.

Further, an aeration rod extending into the heating groove is arranged in the heating groove.

Further, two the left and right sides of heat conduction coil pipe all overlaps along the horizontal direction and is equipped with two horizontal fixation hoops, two be provided with two vertical fixation hoops along vertical direction between the heat conduction coil pipe.

Further, the inside of heating groove is vertical to be provided with the inlet tube, the one end of inlet tube extends along the interior diapire level of heating groove, the bottom fixed mounting of inlet tube has two raceway, the raceway extends to the other end of heating groove.

Furthermore, the other ends of the two water pipes are communicated with one end of a water collecting pipe, the other end of the water collecting pipe is communicated with a water discharging pipe, and the other end of the water discharging pipe extends to the water inlet pipe and extends downwards to form a heating groove.

Further, be provided with temperature sensor on the inner wall of heating tank, temperature sensor is connected with the display panel electricity, display panel sets up in the heating tank outside.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages of:

the scheme has the advantages that the heat pump is used for excavating the energy stored in the environment medium, the temperature is increased to be utilized, the heat pump consumes a part of energy, the work consumed by the whole heat pump device is only 1/3 or lower of the heat supply amount, the heat is conducted by the heat conducting coil pipe, the temperature of the electroplating mixed liquid rises, the heating effect is achieved, the electric energy consumption cost of the electroplating process can be reduced, all heating pipe devices in the electroplating cylinder can be cancelled, the fire risk is avoided, and the process is more environment-friendly and safer.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a top view of the heating tank of the present invention;

fig. 3 is a side sectional view of two heat conducting coils according to the present invention.

The reference numbers in the figures illustrate:

1. a heating tank; 2. a heat pump; 3. an air inlet pipe; 4. an air outlet pipe; 5. a heat conducting coil; 6. a valve; 7. an aeration rod; 8. a horizontal fixing hoop; 9. a vertical fixing hoop; 10. a water inlet pipe; 11. a water delivery pipe; 12. a water collection pipe; 13. a drain pipe; 14. a temperature sensor; 15. a display panel; 16. and (4) connecting the pipes.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1-3, a heating device for producing a PCB comprises a heating tank 1 and a heat pump 2, wherein the heat pump 2 is an air-source heat pump, an air inlet pipe 3 and an air outlet pipe 4 are arranged on the heat pump 2, two heat conducting coils 5 are arranged inside the heating tank 1, the heat conducting coils 5 are preferably made of a material which is beneficial to heat conduction, the middle parts of the two heat conducting coils 5 are communicated through a connecting pipe 16, and one ends of the two heat conducting coils 5, which are far away from the connecting pipe, are respectively and correspondingly communicated with the air inlet pipe 3 and the air outlet pipe 4.

Specifically, intake pipe 3 and outlet duct 4 all extend to the top of heating tank 1, all are provided with valve 6 on intake pipe 3 and the outlet duct 4, can control air input and air output, the operation of being convenient for.

Specifically, the inside of the heating tank 1 is provided with the aeration rod 7 extending to the inside thereof, so that the temperature of the mixed liquid inside the heating tank 1 can be more uniform.

Concrete, two heat conduction coil pipe 5's the left and right sides all overlaps along the horizontal direction and is equipped with two horizontal fixing hoops 8, is provided with two vertical fixing hoops 9 along vertical direction between two heat conduction coil pipe 5, utilizes horizontal fixing hoop 8 and two vertical heat conduction coil pipe 5 of vertical fixing hoop 9 combined action fixed, and is more stable, also can be connected vertical fixing hoop 9 and heating tank 1 through the bolt, does not do not describe here any more.

Specifically, the vertical inlet tube 10 that is provided with in heating tank 1's inside, the one end of inlet tube 10 extends along heating tank 1's interior diapire level, the bottom fixed mounting of inlet tube 10 has two raceway 11, raceway 11 extends to heating tank 1's the other end, can be through inlet tube 10 to the leading-in hot water in heating tank 1's inside, utilize hot water to make progress a heating to the mixed liquid, the inside hot water heating mode of inlet tube 10 is as the auxiliary heating mode, make the effect of heating better.

Specifically, the other ends of the two water pipes 11 are communicated with one end of the water collecting pipe 12, the other end of the water collecting pipe 12 is communicated with the water discharging pipe 13, the other end of the water discharging pipe 13 extends towards the water inlet pipe 10 and downwards extends out of the heating groove 1, the inner diameters of the two water pipes 11 can be set to be larger than the inner diameter of the water inlet pipe 10, at the moment, the flow rate of hot water in the water pipes 11 can be reduced, and the heating effect is better.

Specifically, be provided with temperature sensor 14 on the inner wall of heating tank 1, temperature sensor 14 is connected with display panel 15 electricity, and display panel 15 sets up in the heating tank 1 outside, can have more audio-visual observation, the operation of being convenient for through temperature sensor 14 to the temperature of mixing liquid in the heating tank 1.

The working principle is as follows: when the device is used, the heat pump 2 excavates the energy stored in the environment medium, the temperature is increased to be utilized, the energy is guided to the heating tank 1 through the heat conduction coil pipe 5 to achieve the effect of heating the mixed liquid, hot water can be guided into the heating tank 1 through the water inlet pipe 10, and the mixed liquid is further heated through the hot water, so that the heating effect is better.

The above description is only the preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. A heating device for producing a PCB board comprises a heating tank (1) and a heat pump (2), and is characterized in that: be provided with intake pipe (3) and outlet duct (4) on heat pump (2), the inside of heating bath (1) is provided with two heat conduction coil pipe (5), two connecting pipe (16) intercommunication is passed through at the middle part of heat conduction coil pipe (5), two the one end that the connecting pipe was kept away from in heat conduction coil pipe (5) corresponds respectively and communicates with intake pipe (3) and outlet duct (4).

2. A heating apparatus for producing a PCB board according to claim 1, wherein: intake pipe (3) and outlet duct (4) all extend to the top of heating tank (1), all be provided with valve (6) on intake pipe (3) and outlet duct (4).

3. A heating apparatus for producing a PCB board according to claim 1, wherein: and an aeration rod (7) extending into the heating tank (1) is arranged in the heating tank.

4. A heating apparatus for producing a PCB board according to claim 1, wherein: two the both sides are all overlapped along the horizontal direction and are equipped with two horizontal fixation hoops (8) about heat conduction coil pipe (5), two be provided with two vertical fixation hoops (9) along vertical direction between heat conduction coil pipe (5).

5. A heating apparatus for producing a PCB board according to claim 1, wherein: the inside of heating groove (1) is vertical to be provided with inlet tube (10), the one end of inlet tube (10) extends along the interior diapire level of heating groove (1), the bottom fixed mounting of inlet tube (10) has two raceway (11), raceway (11) extend to the other end of heating groove (1).

6. A heating apparatus for producing PCB board as claimed in claim 5, wherein: the other ends of the two water conveying pipes (11) are communicated with one end of a water collecting pipe (12), the other end of the water collecting pipe (12) is communicated with a water discharging pipe (13), and the other end of the water discharging pipe (13) extends to the water inlet pipe (10) and extends downwards to form the heating groove (1).

7. A heating apparatus for producing a PCB board according to claim 1, wherein: be provided with temperature sensor (14) on the inner wall of heating groove (1), temperature sensor (14) are connected with display panel (15) electricity, display panel (15) set up in the heating groove (1) outside.