CN211457188U

CN211457188U - Smart mobile phone motherboard location structure

Info

Publication number: CN211457188U
Application number: CN202020569900.9U
Authority: CN
Inventors: 江科
Original assignee: Luzhou Xinruidi Technology Co ltd
Current assignee: Luzhou Xinruidi Technology Co ltd
Priority date: 2020-04-17
Filing date: 2020-04-17
Publication date: 2020-09-08
Anticipated expiration: 2030-04-17

Abstract

The utility model discloses a smart mobile phone motherboard location structure, including the cell-phone shell, the bottom is equipped with the mounting groove in the cell-phone shell, be equipped with the connecting rod in the mounting groove, be equipped with first damper on the connecting rod, the inner wall of cell-phone shell is equipped with four first sliding chutes, four all be equipped with stop gear in the first sliding chute, the lateral wall of cell-phone shell is equipped with four second sliding chutes, four all be equipped with second damper in the second sliding chute, first damper includes two movable blocks of sliding connection on the connecting rod, two first damping spring of fixedly connected with between the movable block, two the up end of movable block all rotates and is connected with the dwang. The utility model has the advantages of reasonable design, not only can be with the quick installation of mobile phone motherboard in the cell-phone shell, can also carry out the shock attenuation to mobile phone motherboard, avoid mobile phone motherboard to cause the damage because of vibrations.

Description

Smart mobile phone motherboard location structure

Technical Field

The utility model relates to a mobile phone motherboard fixes a position technical field, especially relates to a smart mobile phone motherboard location structure.

Background

The mobile phones are classified into smart phones and non-smart phones, the performance of the smart phones is generally better than that of the non-smart phones, but the performance of the non-smart phones is more stable than that of the smart phones, and most of the non-smart phones and the smart phones use a CPU of the british ARM company architecture. The smart phone has the advantages of higher dominant frequency, high running speed, quicker program task processing and more convenience in daily life.

When an existing mobile phone mainboard is installed, most of the existing mobile phone mainboards are fixedly connected by nuts, a screwdriver used for rotating screws is easy to collide with or scrape electronic components inside, so that the electronic components are easy to damage, and the mobile phone mainboard is easy to be damaged by vibration when a mobile phone falls; therefore, a positioning structure of a main board of a smart phone is designed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem that prior art exists, and the smart mobile phone mainboard location structure who provides.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a smart mobile phone motherboard location structure, includes the cell-phone shell, the bottom is equipped with the mounting groove in the cell-phone shell, be equipped with the connecting rod in the mounting groove, be equipped with first damper on the connecting rod, the inner wall of cell-phone shell is equipped with four first sliding tray, four all be equipped with stop gear in the first sliding tray, the lateral wall of cell-phone shell is equipped with four second sliding tray, four all be equipped with second damper in the second sliding tray.

Preferably, the first damping mechanism comprises two moving blocks which are connected to the connecting rod in a sliding mode, a first damping spring is fixedly connected between the two moving blocks, the upper end faces of the two moving blocks are connected with rotating rods in a rotating mode, the upper ends of the two rotating rods are connected with a same supporting plate in a rotating mode, two T-shaped rods are fixedly connected to the bottom of the supporting plate, two damping pipes are fixedly connected to the inner bottom of the mounting groove, the two T-shaped rods penetrate through the corresponding damping pipes and are connected with the corresponding damping pipes in a sliding mode, the two T-shaped rods are connected with the inner walls of the two damping pipes through second damping springs, and a mobile phone main board is arranged on the supporting.

Preferably, the limiting mechanism comprises a limiting rod which is connected in the first sliding groove in a sliding manner, and the limiting rod is connected with the first sliding groove through a spring.

Preferably, the second damping mechanism comprises a third damping spring fixedly connected in the second sliding groove, and the other end of the third damping spring is fixedly connected with a rectangular plate.

Preferably, the upper end face of the limiting rod is an arc-shaped face.

Preferably, one end of the rectangular plate is fixedly connected with a rubber pad.

Compared with the prior art, the utility model, its beneficial effect does:

the mobile phone mainboard can be subjected to all-around shock absorption through the combined action of the first shock absorption mechanism and the second shock absorption mechanism, so that the damage of the mobile phone mainboard caused by shock is avoided; through stop gear's effect, installation mobile phone motherboard that can be quick avoids the shell screwdriver to cause the damage to the part of mobile phone motherboard.

To sum up, not only can install the mobile phone motherboard in the cell-phone shell fast, can also carry out the shock attenuation to the mobile phone motherboard, avoid the mobile phone motherboard to cause the damage because of vibrations.

Drawings

Fig. 1 is the utility model provides a structure schematic diagram of smart mobile phone motherboard location structure.

Fig. 2 is the utility model provides a side view of smart mobile phone motherboard location structure.

In the figure: 1 cell-phone shell, 2 first sliding tray, 3 gag lever posts, 4 springs, 5 mobile phone mainboards, 6 second sliding tray, 7 rectangular plate, 8 third damping spring, 9 mounting grooves, 10 connecting rods, 11 shock attenuation pipes, 12 movable blocks, 13 first damping spring, 14 second damping spring, 15T type pole, 16 backup pads, 17 dwang.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-2, an intelligent mobile phone motherboard positioning structure comprises a mobile phone shell 1, wherein an installation groove 9 is arranged at the bottom in the mobile phone shell 1, a connecting rod 10 is arranged in the installation groove 9, a first damping mechanism is arranged on the connecting rod 10, the first damping mechanism comprises two moving blocks 12 connected to the connecting rod 10 in a sliding manner, a first damping spring 13 is fixedly connected between the two moving blocks 12, the upper end surfaces of the two moving blocks 12 are respectively and rotatably connected with a rotating rod 17, the upper ends of the two rotating rods 17 are respectively and rotatably connected with a same supporting plate 16, the bottom of the supporting plate 16 is fixedly connected with two T-shaped rods 15, two damping tubes 11 are fixedly connected to the inner bottom of the installation groove 9, the two T-shaped rods 15 penetrate through and are connected with the corresponding damping tubes 11 in a sliding manner, the two T-shaped rods 15 are connected with the inner walls of, when the mobile phone falls down, the mobile phone main board 5 drives the supporting plate 16 to move downwards, the supporting plate 16 moves downwards to drive the T-shaped rod 15 to move downwards, the T-shaped rod 15 moves downwards to extrude air in the shock absorption tube 11, and under the action of air resistance and the elastic force of the second shock absorption spring 14, the descending amplitude of the T-shaped rod 15 is reduced, so that the downward moving amplitude of the supporting plate 16 is reduced; the support plate 16 moves downwards to drive the two moving blocks 12 to move relatively, under the action of the elastic force of the first damping spring 13, the amplitude of the relative movement of the two moving blocks 12 is reduced, and further the downward movement amplitude of the support plate 16 is reduced, so that the mobile phone main board 5 can be damped up and down, and the mobile phone main board is prevented from being damaged due to vibration.

Inner wall of cell-phone shell 1 is equipped with four first sliding tray 2, all be equipped with stop gear in four first sliding tray 2, stop gear includes the gag lever post 3 of sliding connection in first sliding tray 2, the up end of gag lever post 3 is the arcwall face, be connected through spring 4 between gag lever post 3 and the first sliding tray 2, when installation mobile phone motherboard 5, with mobile phone motherboard 5 just to 16 downstream in backup pad, when mobile phone motherboard 5 offsets with gag lever post 3, under the effect of arcwall face, remove in gag lever post 3 looks first sliding tray 2, when mobile phone motherboard 5 breaks away from gag lever post 3, under spring 4's elastic force effect, gag lever post 3 resets, so can carry on spacingly to mobile phone motherboard 5, make it difficult for breaking away from cell-phone shell 1.

The lateral wall of cell-phone shell 1 is equipped with four second sliding tray 6, all be equipped with second damper in four second sliding tray 6, second damper includes third damping spring 8 of fixed connection in second sliding tray 6, third damping spring 8's other end fixedly connected with rectangular plate 7, the one end fixedly connected with rubber pad of rectangular plate 7, when moving about mobile phone motherboard 5, mobile phone motherboard 5 drives rectangular plate 7 and removes, under third damping spring 8's spring action, can control the shock attenuation to mobile phone motherboard 5, cooperate first damper's effect, avoid mobile phone motherboard 5 to cause the damage because of vibrations.

The utility model discloses its functional principle is explained to following mode of operation of accessible:

the utility model discloses in, when needs installation mobile phone motherboard 5, just to 16 downshifts in backup pad with mobile phone motherboard 5, when mobile phone motherboard 5 offsets with gag lever post 3, under the effect of arcwall face, remove in gag lever post 3 first sliding tray 2 mutually, when mobile phone motherboard 5 breaks away from gag lever post 3, under spring 4's elastic force effect, gag lever post 3 resets, so can carry out spacingly to mobile phone motherboard 5, make it be difficult for breaking away from cell-phone shell 1, need not to carry out the screw installation, avoid causing the damage to the part on mobile phone motherboard 5.

When the mobile phone drops, the mobile phone main board 5 drives the supporting plate 16 to move downwards, the supporting plate 16 moves downwards to drive the T-shaped rod 15 to move downwards, the T-shaped rod 15 moves downwards to extrude air in the shock absorption tube 11, and the descending amplitude of the T-shaped rod 15 is reduced under the action of air resistance and the elastic force of the second shock absorption spring 14, so that the downward movement amplitude of the supporting plate 16 is reduced; backup pad 16 moves down and drives two movable block 12 relative movement, under the spring action of first damping spring 13, make the range of a movable block 12 relative movement reduce even, and then make backup pad 16 decurrent amplitude of movement reduce, so can carry out shock attenuation from top to bottom to mobile phone motherboard 5, when moving about mobile phone motherboard 5, mobile phone motherboard 5 drives rectangular plate 7 and removes, under the spring action of third damping spring 8, can control the shock attenuation to mobile phone motherboard 5, the effect of the first damper of cooperation, avoid mobile phone motherboard 5 to cause the damage because of vibrations.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides an intelligent mobile phone mainboard location structure, includes cell-phone shell (1), its characterized in that, the bottom is equipped with mounting groove (9) in cell-phone shell (1), be equipped with connecting rod (10) in mounting groove (9), be equipped with first damper on connecting rod (10), the inner wall of cell-phone shell (1) is equipped with four first sliding tray (2), four all be equipped with stop gear in first sliding tray (2), the lateral wall of cell-phone shell (1) is equipped with four second sliding tray (6), four all be equipped with second damper in second sliding tray (6).

2. The smart phone motherboard positioning structure according to claim 1, wherein the first damping mechanism comprises two moving blocks (12) slidably connected to the connecting rod (10), a first damping spring (13) is fixedly connected between the two moving blocks (12), a rotating rod (17) is rotatably connected to each of the upper end surfaces of the two moving blocks (12), a same supporting plate (16) is rotatably connected to each of the upper ends of the two rotating rods (17), two T-shaped rods (15) are fixedly connected to the bottom of the supporting plate (16), two damping tubes (11) are fixedly connected to the inner bottom of the mounting groove (9), the two T-shaped rods (15) penetrate through and are slidably connected to the corresponding damping tubes (11), and the two T-shaped rods (15) are connected to the inner walls of the two damping tubes (11) through second damping springs (14), and a mobile phone mainboard (5) is arranged on the supporting plate (16).

3. The main board positioning structure of the smart phone according to claim 1, wherein the limiting mechanism comprises a limiting rod (3) slidably connected in the first sliding groove (2), and the limiting rod (3) is connected with the first sliding groove (2) through a spring (4).

4. The main board positioning structure of the smart phone according to claim 1, wherein the second damping mechanism comprises a third damping spring (8) fixedly connected in the second sliding groove (6), and a rectangular plate (7) is fixedly connected to the other end of the third damping spring (8).

5. The smart phone motherboard positioning structure according to claim 3, wherein the upper end surface of the limiting rod (3) is an arc surface.

6. The positioning structure of the mainboard of the smart phone according to claim 4, wherein a rubber pad is fixedly connected to one end of the rectangular plate (7).