CN211457168U - Splicing structure of mobile phone motherboard - Google Patents
Splicing structure of mobile phone motherboard Download PDFInfo
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- CN211457168U CN211457168U CN202020540655.9U CN202020540655U CN211457168U CN 211457168 U CN211457168 U CN 211457168U CN 202020540655 U CN202020540655 U CN 202020540655U CN 211457168 U CN211457168 U CN 211457168U
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Abstract
The utility model discloses a mosaic structure of mobile phone motherboard, including cell-phone casing and mobile phone motherboard body, the inside wall of cell-phone casing is equipped with first chucking mechanism, the top fixed mounting of mobile phone motherboard body has the cardboard, the cardboard extends to in the chucking mechanism and offsets tightly rather than the lateral wall, fixed mounting has the installation piece in the mobile phone casing, first mounting groove has been seted up on the installation piece, the draw-in groove has been seted up to the inside wall of first mounting groove, be equipped with slide mechanism on the mobile phone motherboard body, sliding connection has L shape pole in the slide mechanism, L shape pole extends to in the first mounting groove and offsets tightly rather than the inside wall, second mounting groove and spout have been seted up on the L shape pole. The utility model has the advantages of reasonable design, it can realize quick concatenation and the dismantlement between mobile phone motherboard and the cell-phone casing, easy operation, and it is fixed to need not the screw, and the condition of screw loss takes place when having avoided the mobile phone motherboard to maintain.
Description
Technical Field
The utility model relates to a mobile phone motherboard technical field especially relates to a mosaic structure of mobile phone motherboard.
Background
With the development of economy, a mobile phone becomes an indispensable tool for people's life, a mobile phone motherboard is one of the most basic and important components of the mobile phone, the mobile phone motherboard is generally a rectangular circuit board, and a main circuit system forming the mobile phone is installed on the mobile phone motherboard.
Among the prior art, the connection between current mobile phone motherboard and the cell-phone casing is usually fixed through the screw, and it is comparatively troublesome when dismantling mobile phone motherboard from the cell-phone casing and maintain mobile phone motherboard, and fixed screw is less, causes the condition of screw loss to take place easily when mobile phone motherboard maintains, for this we have designed a mosaic structure of mobile phone motherboard to solve above problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving among the prior art current mobile phone motherboard and being connected between the cell-phone casing and be fixed through the screw usually, it is comparatively troublesome when maintaining the mobile phone motherboard to dismantle the mobile phone motherboard from the cell-phone casing, fixed screw is less, cause the problem of screw loss easily when the mobile phone motherboard maintains, and the mosaic structure of a mobile phone motherboard who proposes, it can realize quick concatenation and the dismantlement between mobile phone motherboard and the cell-phone casing, and easy operation, and it is fixed to need not the screw, the condition of screw loss when having avoided maintaining the mobile phone motherboard takes place.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a splicing structure of a mobile phone mainboard comprises a mobile phone shell and a mobile phone mainboard body, wherein a first clamping mechanism is arranged on the inner side wall of the mobile phone shell, a clamping plate is fixedly arranged at the top of the mobile phone mainboard body, the clamping plate extends into the clamping mechanism and is tightly abutted against the side wall of the clamping mechanism, an installation block is fixedly arranged in the mobile phone shell, a first installation groove is formed in the installation block, a clamping groove is formed in the inner side wall of the first installation groove, a sliding mechanism is arranged on the mobile phone mainboard body, an L-shaped rod is connected in the sliding mechanism in a sliding mode, the L-shaped rod extends into the first installation groove and is tightly abutted against the inner side wall of the first installation groove, a second installation groove and a sliding groove are formed in the L-shaped rod, a second clamping mechanism is arranged in the second installation groove, the second clamping mechanism extends into the clamping, the pulling mechanism extends into the second mounting groove and is fixedly connected with the side wall of the second clamping mechanism.
Preferably, first chucking mechanism includes the first installing frame of fixed mounting on the cell-phone casing, sliding connection has the baffle in the first installing frame, a plurality of first springs of fixedly connected with between the lateral wall of baffle and the inside wall of first installing frame, the cardboard extends to in the first installing frame and offsets tightly with the lateral wall of baffle.
Preferably, slide mechanism includes the second installing frame of fixed mounting on the mobile phone motherboard body, L shape pole sliding connection is in the second installing frame, fixedly connected with second spring between the inside wall of L shape pole and second installing frame.
Preferably, the second clamping mechanism comprises a trapezoidal clamping block which is slidably connected in the second mounting groove, the trapezoidal clamping block extends into the clamping groove and is tightly abutted to the inner side wall of the trapezoidal clamping block, and a third spring is fixedly connected between the side wall of the trapezoidal clamping block and the inner side wall of the second mounting groove.
Preferably, the pulling mechanism comprises a pull rod which is slidably connected in the sliding groove, a pull rope is fixedly connected to the side wall of the pull rod, and the pull rope extends into the second mounting groove and is fixedly connected with the side wall of the trapezoid clamping block.
Preferably, the third spring is an elastic spring.
Compared with the prior art, the utility model, its beneficial effect does:
1. through first chucking mechanism, the establishment of second chucking mechanism and pulling mechanism, when needs splice mobile phone case and mobile phone motherboard body, extend the cardboard to first installing frame in, and press, then pulling L shape pole, make the tip of L shape pole can get into in the first mounting groove, press L shape pole, L shape pole gets into in the first mounting groove, trapezoidal fixture block gets into in the draw-in groove under the effect of third spring elasticity and offsets tightly rather than the inside wall, the concatenation of mobile phone case and mobile phone motherboard body is accomplished, the installation is simple, and easily dismantle.
2. Through the cooperation between each mechanism, make fixing on the cell-phone casing that mobile phone motherboard body can be stable, it is fixed to need not the screw, and the condition of screw loss takes place when having avoided the mobile phone motherboard to maintain.
To sum up, the utility model has the advantages of reasonable design, it can realize quick concatenation and the dismantlement between mobile phone motherboard and the cell-phone casing, easy operation, and it is fixed to need not the screw, and the condition of screw loss takes place when having avoided the mobile phone motherboard to maintain.
Drawings
Fig. 1 is a schematic structural diagram of a splicing structure of a mobile phone motherboard according to the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1;
fig. 3 is an enlarged view of the structure at B in fig. 1.
In the figure: 1 cell-phone casing, 2 mobile phone motherboard bodies, 3 first installing frames, 4 baffles, 5 first springs, 6 cardboard, 7 installation pieces, 8 first mounting grooves, 9 draw-in grooves, 10 second installing frames, 11L shape pole, 12 second mounting grooves, 13 trapezoidal fixture blocks, 14 third springs, 15 second springs, 16 spout, 17 pull rods, 18 stay cords.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, a splicing structure of a mobile phone motherboard comprises a mobile phone shell 1 and a mobile phone motherboard body 2, a first clamping mechanism is arranged on the inner side wall of the mobile phone shell 1, a clamping plate 6 is fixedly installed at the top of the mobile phone motherboard body 2, the clamping plate 6 extends into the clamping mechanism and is abutted against the side wall of the clamping mechanism, an installation block 7 is fixedly installed in the mobile phone shell 1, a first installation groove 8 is formed in the installation block 7, a clamping groove 9 is formed in the inner side wall of the first installation groove 8, the first clamping mechanism comprises a first installation frame 3 fixedly installed on the mobile phone shell 1, a baffle 4 is slidably connected in the first installation frame 3, a plurality of first springs 5 are fixedly connected between the side wall of the baffle 4 and the inner side wall of the first installation frame 3, and the clamping plate 6 extends into the first installation frame 3 and is abutted;
the mobile phone mainboard body 2 is provided with a sliding mechanism, an L-shaped rod 11 is connected in the sliding mechanism in a sliding manner, the L-shaped rod 11 extends into the first mounting groove 8 and is abutted against the inner side wall of the first mounting groove, the sliding mechanism comprises a second mounting frame 10 fixedly mounted on the mobile phone mainboard body 2, the L-shaped rod 11 is connected in the second mounting frame 10 in a sliding manner, and a second spring 15 is fixedly connected between the L-shaped rod 11 and the inner side wall of the second mounting frame 10;
a second mounting groove 12 and a sliding groove 16 are formed in the L-shaped rod 11, a second clamping mechanism is arranged in the second mounting groove 12, the second clamping mechanism extends into the clamping groove 9 and is abutted against the inner side wall of the clamping groove 9, the second clamping mechanism comprises a trapezoidal clamping block 13 which is connected in the second mounting groove 12 in a sliding mode, the trapezoidal clamping block 13 extends into the clamping groove 9 and is abutted against the inner side wall of the clamping groove 9, a third spring 14 is fixedly connected between the side wall of the trapezoidal clamping block 13 and the inner side wall of the second mounting groove 12, and the third spring 14 is an elastic spring;
a pulling mechanism is arranged in the sliding groove 16, the pulling mechanism extends into the second mounting groove 12 and is fixedly connected with the side wall of the second clamping mechanism, the pulling mechanism comprises a pull rod 17 which is slidably connected in the sliding groove 16, a pull rope 18 is fixedly connected with the side wall of the pull rod 17, the pull rope 18 extends into the second mounting groove 12 and is fixedly connected with the side wall of the trapezoidal clamping block 13, through the arrangement of the first clamping mechanism, the second clamping mechanism and the pulling mechanism, when the mobile phone shell 1 and the mobile phone mainboard body 2 need to be spliced, the clamping plate 6 extends into the first mounting frame 3 and is pressed, then the L-shaped rod 11 is pulled, the end part of the L-shaped rod 11 can enter the first mounting groove 8, the L-shaped rod 11 is pressed, the L-shaped rod 11 enters the first mounting groove 8, the trapezoidal clamping block 13 enters the clamping groove 9 under the action of the elastic force of the third spring 14 and is abutted against the inner side wall of the trapezoidal clamping block 13, the splicing of, the installation is simple to easily dismantle, through the cooperation between each mechanism, make fixing on cell-phone casing 1 that mobile phone motherboard body 2 can be stable, it is fixed to need not the screw, has avoided the condition emergence that the screw lost when mobile phone motherboard maintains.
The utility model discloses its functional principle is explained to following mode of operation of accessible:
in the utility model, when the splicing operation of the mobile phone shell 1 and the mobile phone mainboard body 2 is needed, the operator extends the clamping plate 6 into the first mounting frame 3 and presses the clamping plate to make the clamping plate 6 push the baffle 4 to slide into the first mounting frame 3, then pulls the L-shaped rod 11 to make the end part of the L-shaped rod 11 enter the first mounting groove 8, presses the L-shaped rod 11, the L-shaped rod 11 enters the first mounting groove 8, the trapezoidal clamping block 13 enters the clamping groove 9 under the action of the elasticity of the third spring 14 and is abutted against the inner side wall of the clamping groove, and the splicing of the mobile phone shell 1 and the mobile phone mainboard body 2 is completed;
when needs are dismantled mobile phone motherboard body 2 from cell-phone casing 1 and are repaired, operator pulling pull rod 17, pull rod 17 passes through in trapezoidal fixture block 13 of stay cord 18 pulling slides in second mounting groove 12, and trapezoidal fixture block 13 breaks away from blockking of draw-in groove 9, then pulling L shape pole 11, makes L shape pole 11 follow roll-off in the first mounting groove 8, can take off mobile phone motherboard body 2 from cell-phone casing 1 and maintain it.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. A splicing structure of a mobile phone mainboard comprises a mobile phone shell (1) and a mobile phone mainboard body (2), and is characterized in that a first clamping mechanism is arranged on the inner side wall of the mobile phone shell (1), a clamping plate (6) is fixedly arranged at the top of the mobile phone mainboard body (2), the clamping plate (6) extends into the clamping mechanism and is tightly abutted to the side wall of the clamping mechanism, a mounting block (7) is fixedly arranged in the mobile phone shell (1), a first mounting groove (8) is formed in the mounting block (7), a clamping groove (9) is formed in the inner side wall of the first mounting groove (8), a sliding mechanism is arranged on the mobile phone mainboard body (2), an L-shaped rod (11) is connected in the sliding mechanism in a sliding manner, the L-shaped rod (11) extends into the first mounting groove (8) and is tightly abutted to the inner side wall of the L-shaped rod (11), a second mounting groove (12) and a sliding groove (16, be equipped with second chucking mechanism in second mounting groove (12), second chucking mechanism extends to in draw-in groove (9) and offsets tightly rather than the inside wall, be equipped with pulling mechanism in spout (16), pulling mechanism extend to in second mounting groove (12) and with second chucking mechanism's lateral wall fixed connection.
2. The splicing structure of mobile phone motherboard according to claim 1, wherein the first clamping mechanism comprises a first mounting frame (3) fixedly mounted on the mobile phone housing (1), a baffle (4) is slidably connected in the first mounting frame (3), a plurality of first springs (5) are fixedly connected between the side wall of the baffle (4) and the inner side wall of the first mounting frame (3), and the clamping plate (6) extends into the first mounting frame (3) and abuts against the side wall of the baffle (4).
3. The splicing structure of mobile phone motherboard according to claim 1, wherein the sliding mechanism comprises a second mounting frame (10) fixedly mounted on the mobile phone motherboard body (2), the L-shaped rod (11) is slidably connected in the second mounting frame (10), and a second spring (15) is fixedly connected between the L-shaped rod (11) and the inner side wall of the second mounting frame (10).
4. The splicing structure of a mobile phone motherboard according to claim 1, wherein the second clamping mechanism comprises a trapezoidal clamping block (13) slidably connected in the second mounting groove (12), the trapezoidal clamping block (13) extends into the clamping groove (9) and abuts against the inner side wall thereof, and a third spring (14) is fixedly connected between the side wall of the trapezoidal clamping block (13) and the inner side wall of the second mounting groove (12).
5. The splicing structure of mobile phone motherboard according to claim 4, wherein said pulling mechanism comprises a pull rod (17) slidably connected in the sliding slot (16), a pull rope (18) is fixedly connected to the side wall of said pull rod (17), said pull rope (18) extends into the second mounting groove (12) and is fixedly connected to the side wall of the trapezoidal fixture block (13).
6. The splicing structure of mobile phone motherboard according to claim 4, wherein said third spring (14) is a spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020540655.9U CN211457168U (en) | 2020-04-14 | 2020-04-14 | Splicing structure of mobile phone motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020540655.9U CN211457168U (en) | 2020-04-14 | 2020-04-14 | Splicing structure of mobile phone motherboard |
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| CN211457168U true CN211457168U (en) | 2020-09-08 |
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| CN202020540655.9U Active CN211457168U (en) | 2020-04-14 | 2020-04-14 | Splicing structure of mobile phone motherboard |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114614225A (en) * | 2020-12-09 | 2022-06-10 | 张家港市长江五金锁业有限公司 | Attenuator with shock-absorbing function |
-
2020
- 2020-04-14 CN CN202020540655.9U patent/CN211457168U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114614225A (en) * | 2020-12-09 | 2022-06-10 | 张家港市长江五金锁业有限公司 | Attenuator with shock-absorbing function |
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