CN211445954U

CN211445954U - Electroplating pool movable bottom plate mounting structure convenient for bottom cleaning

Info

Publication number: CN211445954U
Application number: CN201922391828.5U
Authority: CN
Inventors: 区佩金; 梁艳华
Original assignee: Shenzhen Qipei Industrial Co ltd
Current assignee: Huizhou Shengze Technology Co.,Ltd.
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-09-08
Anticipated expiration: 2029-12-26

Abstract

The utility model relates to an electroplating pool movable bottom plate mounting structure convenient for bottom cleaning, belonging to the technical field of electroplating pools; fixing seats are fixed at the bottom of the electroplating pool in a bilateral symmetry mode, a groove is formed in the bottom end of the inner side of each fixing seat, a groove is formed in one side of the groove, a movable plate is arranged on the inner side of each fixing seat, a limiting groove is formed in the upper end of the outer side of each movable plate, a fixing block is fixed on the outer side of each movable plate, the fixing blocks are arranged in the grooves, rotating shafts are fixedly connected to the front side and the rear side of each fixing block and are arranged on the fixing seats in a screwed mode through bearings, a first hinging seat is fixed at the bottom of each movable plate, a; divide into two fly leafs through the bottom plate with the bottom, rotate downwards through driving the fly leaf to be convenient for clear up the electroplating bath inside, when need pour into the plating solution into in the electroplating bath, through the sealed setting of connecting plate with two fly leafs, thereby guaranteed the leakproofness of plating solution.

Description

Electroplating pool movable bottom plate mounting structure convenient for bottom cleaning

Technical Field

The utility model relates to an electroplating pool technical field, concretely relates to make things convenient for electroplating pool movable bottom plate mounting structure of bottom clearance.

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing the electrolysis principle, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by utilizing the electrolysis effect so as to play roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, enhancing attractiveness and the like; the outer layer of a plurality of coins is also electroplated, the electroplating principle is simple, namely, in a salt solution containing metal to be plated, a plated base metal is used as a cathode, cations to be plated in the plating solution are deposited on the surface of the base metal through electrolysis to form a plating layer, because the plating solution can seriously pollute the environment, particularly, the influence of acid, alkali gas mist, cyanide and chromium mist on the environment and the harm to human bodies are larger, the electroplating is needed to be carried out in a plating tank, therefore, an electroplated part needs to be operated in the special plating tank during electroplating, after long-time electroplating operation, the plating solution needs to be periodically or continuously filtered to remove various solid impurities and dregs in the solution, otherwise, the bonding force of the plating layer can be reduced, and the plating layer is rough, loose and porous, and when the plating solution is filtered, the bottom plate of the plating tank needs to be cleaned, however, the bottom plate of the existing electroplating tank is fixed, and is difficult to clean, so that the working strength of workers is increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to prior art's defect and not enough, provide a reasonable in design's electroplating bath movable bottom plate mounting structure who makes things convenient for bottom clearance, through divide into two fly leafs with the bottom plate of bottom, rotate downwards through driving the fly leaf to be convenient for clear up electroplating bath inside, when need pour into the plating solution into in the electroplating bath, through the connecting plate with two fly leafs seal up and set up, thereby guaranteed the leakproofness of plating solution.

In order to achieve the above purpose, the utility model adopts the following technical proposal: the device comprises an electroplating pool and support legs, wherein the periphery of the bottom of the electroplating pool is fixedly connected with the support legs; the electroplating bath device further comprises a support frame, a movable plate and a fixed seat, wherein the bottom of the electroplating bath is fixedly connected with the fixed seat in a bilateral symmetry manner, the bottom of the inner side of the fixed seat is provided with a groove, one side of the groove is provided with a groove, the inner side of the fixed seat is provided with the movable plate, the upper end of the outer side of the movable plate is provided with a limiting groove, the limiting groove is arranged in the groove, the outer side of the movable plate is fixedly connected with a fixed block, the fixed block is arranged in the groove, the front side and the rear side of the fixed block are both fixedly connected with a rotating shaft, the rotating shaft is screwed on the fixed seat through a bearing, the bearing is embedded and fixed on the inner wall of the groove, the bottom of the movable plate is fixedly connected with a first hinging seat, the bottom of the, the bottom plate in the support frame is arranged in the positioning groove, the front sliding plate and the rear sliding plate in the support frame are arranged in the sliding grooves, and the cover plate in the support frame is arranged on the upper side of the electroplating pool.

Further, the left side fixedly connected with supporting seat of electroplating bath, fixedly connected with electric putter on the supporting seat, electric putter's upper end fixedly connected with link, the link is "C" shape structure setting, two supports around in the link are connected fixedly with the apron that corresponds respectively.

Further, the telescopic link contain dead lever, movable rod, the articulated setting of articulated shaft and articulated seat No. one is passed through to the upper end of movable rod, the bottom of movable rod is inserted and is established in the dead lever, is provided with the several locating hole in the dead lever, the bottom bilateral symmetry of movable rod inlays and establishes and is fixed with the spring, the other end fixedly connected with boss of spring, the boss is inserted and is established in the locating hole.

Furthermore, a first sealing gasket is fixedly connected to the outer wall of the sliding plate.

Furthermore, the bottom of the bottom plate is fixedly connected with a second sealing gasket.

After the structure is adopted, the beneficial effects of the utility model are that: the utility model discloses in an electroplating pool movable bottom plate mounting structure who makes things convenient for bottom clearance, divide into two fly leafs through the bottom plate with the bottom, rotate downwards through driving the fly leaf to be convenient for clear up electroplating pool inside, when needing to pour into the plating solution into in the electroplating pool, through the sealed setting of two fly leafs of connecting plate, thereby guaranteed the leakproofness of plating solution.

Description of the drawings:

fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a left side view of fig. 1.

Fig. 3 is a cross-sectional view of the present invention.

Fig. 4 is an enlarged view of a portion a in fig. 3.

FIG. 5 is a top view of the electroplating tank of the present invention.

Fig. 6 is a schematic view illustrating the structural connection between the middle movable plate and the fixing base.

Fig. 7 is a schematic view of the connection of the middle support frame of the present invention.

Fig. 8 is a schematic structural view of the connecting frame of the present invention.

Description of reference numerals:

the electroplating device comprises an electroplating pool 1, a sliding groove 1-1, a support leg 2, a support frame 3, a bottom plate 4, a sliding plate 5, a movable plate 6, a limiting groove 6-1, a positioning groove 6-2, a cover plate 7, a fixed seat 8, a slotted groove 8-1, a groove 8-2, a fixed block 9, a rotating shaft 10, a first hinged seat 11, a telescopic rod 12, a supporting seat 13, an electric push rod 14, a connecting frame 15, a support 16, a fixed rod 17, a positioning hole 17-1, a movable rod 18, a spring 19, a boss 20, a first sealing gasket 21 and a second sealing gasket 22.

The specific implementation mode is as follows:

the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 to 8, the following technical solutions are adopted in the present embodiment: the electroplating device comprises an electroplating pool 1 and support legs 2, wherein the support legs 2 are welded and fixed on the periphery of the bottom of the electroplating pool 1; the electroplating bath further comprises a support frame 3, a movable plate 6 and a fixed seat 8, wherein the fixed seat 8 is symmetrically welded and fixed at the bottom of the electroplating bath 1 left and right, a slot 8-1 is formed at the bottom end of the inner side of the fixed seat 8, a groove 8-2 is formed in one side of the slot 8-1, the movable plate 6 is arranged on the inner side of the fixed seat 8, a limit groove 6-1 is formed in the upper end of the outer side of the movable plate 6, the limit groove 6-1 is arranged in the slot 8-1, a fixed block 9 is welded and fixed on the outer side of the movable plate 6, the fixed block 9 is arranged in the groove 8-2, a rotating shaft 10 is welded and fixed on the front side and the rear side of the fixed block 9, the rotating shaft 10 is screwed and arranged on the fixed seat 8 through a bearing, the bearing is embedded and fixed on the inner wall of, the telescopic rod 12 comprises a fixed rod 17 and a movable rod 18, the upper end of the movable rod 18 is hinged with a first hinge seat 11 through a hinge shaft, the bottom of the movable rod 18 is inserted in the fixed rod 17, a plurality of positioning holes 17-1 are arranged in the fixed rod 17, springs 19 are symmetrically embedded and fixed at the left and right of the bottom of the movable rod 18, a boss 20 is welded and fixed at the other end of the spring 19, the boss 20 is inserted in the positioning hole 17-1, the distance between the fixed rod 17 and the movable rod 18 is adjusted through the insertion and matching of the boss 20 and the positioning hole 17-1, so that the movable plate 6 in an disabled state can be supported, the positioning groove 6-2 is arranged at the upper end of the inner side of the movable plate 6, the inner walls at the front side and the rear side of the electroplating pool 1 are respectively provided with a sliding groove 1-1, the sliding groove, a bottom plate 4 in a support frame 3 is arranged in a positioning groove 6-2, a front sliding plate 5 and a rear sliding plate 5 in the support frame 3 are arranged in a sliding groove 1-1, a first sealing gasket 21 made of rubber materials is fixed on the outer wall of each sliding plate 5 by using sealing glue, a second sealing gasket 22 made of rubber materials is fixed on the bottom of the bottom plate 4 by using sealing glue, the sliding plates 5 and the sliding groove 1-1 are arranged in a sealing way through the first sealing gasket 21 and the second sealing gasket 22, the bottom plate 4 and the positioning groove 6-2 are arranged in a sealing way, so that the support frame 3 and an electroplating pool 1 are arranged in a sealing way, the sealing property of the electroplating pool 1 is ensured, the electroplating solution is prevented from leaking, a cover plate 7 in the support frame 3 is arranged on the upper side of the electroplating pool 1, a support base 13 is fixedly welded on the left side of the electroplating, the upper end welded fastening of electric putter 14 has link 15, link 15 is the setting of "C" shape structure, two front and back supports 16 in link 15 respectively with the apron 7 welded fastening that corresponds, drive link 15 through electric putter 14 and move to drive apron 7 and move, drive support frame 3 and move, when driving support frame 3 upward movement, break away from electroplating bath 1, be convenient for clear up, or drive support frame 3 downward movement, make support frame 3 and constant head tank 6-2, sliding tray 1-1 seal the setting, make electroplating bath 1 internal seal set up.

The working principle of the specific embodiment is as follows: when the device is used, two movable plates 6 are arranged at the bottom of the electroplating pool 1, and the movable plates 6 are rotatably connected with the fixed seat 8, so that after the boss 20 is manually pressed, the boss 20 is stressed to compress the spring 19, the boss 20 is separated from the positioning hole 17-1, the movable rod 18 can move up and down in the fixed rod 17, the movable rod 18 is hinged with the first hinged seat 11, when the boss 20 is driven to move to the corresponding positioning hole 17-1, the spring 19 is reset to drive the boss 20 to be inserted in the positioning hole 17-1, the movable plates 6 are driven to rotate around the rotating connection point between the movable plates 6 and the fixed seat 8, the movable plates 6 rotate towards the inner lower end, the movable plates 6 are obliquely arranged, the movable plates 6 are convenient to clean, because the bottom end of the inner side of the fixed seat 8 is provided with the open groove 8-1, the upper end of the outer side of the movable plates 6 is provided with, the fixed seat 8 has a limiting operation on the movable plate 6, after the movable plate 6 is cleaned, the movable plate 6 is pressed again to separate from the positioning hole 17-1, the boss 20 is moved into the corresponding positioning hole 17-1, when the movable plate 6 rotates, when the movable plate 6 is in contact with the fixed seat 8, the movable plate 6 can not rotate upwards any more, so that the movable plate 6 is arranged in a horizontal state, the whole use of the electroplating pool 1 is facilitated, the support frame 3 arranged in the electroplating pool 1 blocks the positioning groove 6-2 on the movable plate 6, simultaneously, the sealing performance between the left movable plate 6 and the right movable plate 6 is ensured, the electroplating solution in the electroplating pool 1 can not leak, the workpiece to be electroplated can be conveniently electroplated by a worker, and the support frame 3 is in contact with the electroplating solution, pushed by the electric push rod 14 on the outer side, and drives the connecting frame 15 to move, thereby driving the support frame 3 to move, reducing the manual operation and protecting the human health.

After adopting above-mentioned structure, this embodiment's beneficial effect is as follows:

1. the two movable plates 6 are additionally arranged at the bottom of the electroplating pool 1, and the two movable plates 6 can be manually rotated to be obliquely arranged according to requirements, so that the cleaning operation is facilitated;

2. the bottom end of the inner side of the fixed seat 8 is provided with the open slot 8-1, and the upper end of the outer side of the movable plate 6 is provided with the limit slot 6-1, so that the fixed seat 8 performs limit operation on the movable plate 6, the movable plate 6 is in a horizontal state, and the electroplating pool 1 can work conveniently;

3. through the support frame 3 that sets up in the electroplating pool 1, play sealed setting to fly leaf 6 to make the plating solution in the electroplating pool 1 at the during operation, avoid producing and leak.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A movable bottom plate mounting structure of an electroplating pool convenient for bottom cleaning comprises an electroplating pool (1) and supporting legs (2), wherein the periphery of the bottom of the electroplating pool (1) is fixedly connected with the supporting legs (2); the method is characterized in that: the electroplating bath device further comprises a support frame (3), a movable plate (6) and a fixed seat (8), the fixed seat (8) is fixedly connected with the bottom of the electroplating bath (1) in a bilateral symmetry mode, a slot (8-1) is formed in the bottom end of the inner side of the fixed seat (8), a groove (8-2) is formed in one side of the slot (8-1), the movable plate (6) is arranged on the inner side of the fixed seat (8), a limiting groove (6-1) is formed in the upper end of the outer side of the movable plate (6), the limiting groove (6-1) is arranged in the slot (8-1), a fixed block (9) is fixedly connected to the outer side of the movable plate (6), the fixed block (9) is arranged in the groove (8-2), rotating shafts (10) are fixedly connected to the front side and the rear side of the fixed block (9), the rotating shafts (10), the bottom of the movable plate (6) is fixedly connected with a hinge seat (11), the bottom of the hinge seat (11) is provided with a telescopic rod (12) in a hinged mode through a hinge shaft, the upper end of the inner side of the movable plate (6) is provided with a positioning groove (6-2), the inner walls of the front side and the rear side of the electroplating pool (1) are provided with sliding grooves (1-1), the sliding grooves (1-1) are communicated with the positioning groove (6-2), the support frame (3) is arranged in the electroplating pool (1), a bottom plate (4) in the support frame (3) is arranged in the positioning groove (6-2), a front sliding plate (5) and a rear sliding plate (5) in the support frame (3) are arranged in the sliding grooves (1-1), and a cover plate (7) in the support frame (3) is.

2. The movable bottom plate mounting structure of the electroplating pool convenient for bottom cleaning according to claim 1, characterized in that: the electroplating tank is characterized in that a supporting seat (13) is fixedly connected to the left side of the electroplating tank (1), an electric push rod (14) is fixedly connected to the supporting seat (13), a connecting frame (15) is fixedly connected to the upper end of the electric push rod (14), the connecting frame (15) is of a C-shaped structure, and a front support (16) and a rear support (16) in the connecting frame (15) are fixedly connected with corresponding cover plates (7) respectively.

3. The movable bottom plate mounting structure of the electroplating pool convenient for bottom cleaning according to claim 1, characterized in that: the telescopic rod (12) comprises a fixed rod (17) and a movable rod (18), the upper end of the movable rod (18) is hinged with a first hinged seat (11) through a hinged shaft, the bottom of the movable rod (18) is inserted into the fixed rod (17), a plurality of positioning holes (17-1) are formed in the fixed rod (17), springs (19) are symmetrically embedded in the left and right sides of the bottom of the movable rod (18), bosses (20) are fixedly connected to the other ends of the springs (19), and the bosses (20) are inserted into the positioning holes (17-1).

4. The movable bottom plate mounting structure of the electroplating pool convenient for bottom cleaning according to claim 1, characterized in that: the outer wall of the sliding plate (5) is fixedly connected with a first sealing gasket (21).

5. The movable bottom plate mounting structure of the electroplating pool convenient for bottom cleaning according to claim 1, characterized in that: the bottom of the bottom plate (4) is fixedly connected with a second sealing gasket (22).