CN211428168U - Optical sensing device and electronic apparatus - Google Patents

Abstract

The application discloses an optical sensing device and an electronic device. The optical sensing device comprises an image sensing chip and a lens module. The image sensing chip comprises a plurality of pixel units, a light source and a light source, wherein the pixel units are used for receiving light beams, converting the received light beams into corresponding electric signals, and defining one side surface of the image sensing chip, which is used for sensing the light beams, as a photosensitive surface. The lens module includes: a plurality of first lenses disposed on the image sensing chip, the plurality of first lenses being spaced apart from each other and each facing a plurality of the pixel units, the plurality of first lenses being for converging light beams to the plurality of pixel units; and a light shielding part disposed on the image sensing chip, the light shielding part being located in an interval region between the plurality of first lenses, the light shielding part being configured to shield a light beam. The electronic equipment comprises the optical sensing device.

Description

Optical sensing device and electronic apparatus

Technical Field

The present disclosure relates to the field of optoelectronic technologies, and more particularly, to an optical sensing device with an ultra-thin size and an electronic apparatus having the optical sensing device.

Background

With the technical progress and the improvement of living standard of people, users demand more functions and fashionable appearance for electronic equipment such as mobile phones, tablet computers and cameras. At present, the development trend of electronic devices such as mobile phones and the like is to have higher screen occupation ratio and have functions of fingerprint detection and the like. In order to realize a full screen or a screen close to the full screen effect, the electronic equipment has a high screen occupation ratio, and a fingerprint detection technology under the screen is developed. Since the internal space of electronic devices such as mobile phones is limited, and the imaging device using conventional lenses to realize optical imaging occupies a large space due to its large size and volume, it is necessary to provide a device for imaging with a small volume.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application provides an optical sensing device and an electronic apparatus capable of solving or improving the problems of the prior art.

The application provides an optical sensing device, including:

the image sensing chip comprises a plurality of pixel units, wherein the pixel units are used for receiving light beams, converting the received light beams into corresponding electric signals and defining one side surface of the image sensing chip, which is used for sensing the light beams, as a photosensitive surface; and

a lens module, comprising:

a plurality of first lenses disposed on the image sensing chip, the plurality of first lenses being spaced apart from each other and each facing a plurality of the pixel units, the plurality of first lenses being for converging light beams to the plurality of pixel units; and

the shading part is arranged on the image sensing chip and is positioned in an interval area among the plurality of first lenses and used for shading light beams, wherein the highest point of the shading part back to the image sensing chip is higher than the highest point of the first lens back to the image sensing chip, or the highest point of the shading part back to the image sensing chip is flush with the highest point of the first lens back to the image sensing chip, or the highest point of the shading part back to the image sensing chip is lower than the highest point of the first lens back to the image sensing chip but is not lower than 10 micrometers.

In some embodiments, the highest height of the light shielding part relative to the light sensing surface is not lower than the highest height of the first lens relative to the light sensing surface; or the highest height of the shading part relative to the light sensing surface is lower than the highest height of the first lens relative to the light sensing surface, and the height difference between the highest height of the first lens relative to the light sensing surface and the highest height of the shading part relative to the light sensing surface is not more than 10 microns.

In some embodiments, the area of the plurality of pixel units capable of receiving the light beam through the first lens is defined as an effective photosensitive area, each effective photosensitive area is respectively opposite to one of the first lenses, and the light beam transmitted through the first lens is converged to the effective photosensitive area opposite to the first lens.

In some embodiments, the light shielding portion is configured to prevent a part or all of the light beam transmitted through one of the first lenses from being transmitted to the effective photosensitive area directly opposite to the adjacent or remaining first lens.

In some embodiments, the light shielding portion includes a retaining wall and a light shielding layer, the retaining wall is located between the image sensing chip and the light shielding layer, and the light shielding layer is used for shielding the light beam.

In some embodiments, the dam and the first lens are made of the same light-transmitting material.

In some embodiments, the light shielding portion includes a retaining wall and a light shielding layer, the light shielding layer is formed on the image sensing chip and has a plurality of openings exposing the photosensitive surface, the plurality of first lenses are formed above the light shielding layer, the first lenses are opposite to the openings and overlap with edge portions of the light shielding layer, the retaining wall is formed on the light shielding layer and located in an interval region between the first lenses, wherein the light shielding layer and the retaining wall are used for shielding light beams.

In some embodiments, for a light shielding portion located between two adjacent first lenses and between the two adjacent first lenses: the highest point of the shading part back to the image sensing chip is not lower than the highest point of the two adjacent first lenses back to the image sensing chip, or the highest point of the shading part back to the image sensing chip is lower than the highest point of the two adjacent first lenses back to the image sensing chip but is not lower than 10 micrometers, so that part or all of the light beam penetrating through one first lens cannot be transmitted to an effective photosensitive area opposite to the other first lens.

In some embodiments, the height from the retaining wall to the photosensitive surface is higher than the height from the first lens to the photosensitive surface.

In some embodiments, the maximum height of the light shielding portion relative to the light sensing surface is higher than the maximum height of the first lens relative to the light sensing surface by any value of 5 micrometers to 100 micrometers.

In some embodiments, the maximum height of the light shielding portion relative to the light sensing surface is higher than the maximum height of the first lens relative to the light sensing surface by any value of 5 to 10 micrometers.

In some embodiments, the pitch between adjacent first lenses is any value from 300 microns to 500 microns.

In some embodiments, the plurality of first lenses are arranged in an array, and the plurality of pixel units are arranged in an array.

In some embodiments, the lens module further includes a first substrate including an upper surface and a lower surface opposite to each other, one side of the upper surface being above the first substrate, one side of the lower surface being below the substrate, the image sensing chip being located below the first substrate; the plurality of first lenses and the shading part are arranged on the upper surface of the first substrate, and the image sensing chip and the lens module are fixed in a dispensing mode.

In some embodiments, the optical sensing device further includes a plurality of second lenses, the plurality of second lenses are located between the plurality of first lenses and the plurality of pixel units, and the plurality of second lenses are directly opposite to the plurality of pixel units one by one, and the plurality of second lenses are used for converging the light beams to the plurality of pixel units.

In some embodiments, the second lens is spaced apart from the first substrate by air, and the second lens has a refractive index greater than that of air.

In some embodiments, the optical sensing device further includes a filter layer disposed above the plurality of pixel units, the filter layer being configured to transmit the light beams of the target wavelength band and filter out light beams outside the target wavelength band, and the plurality of pixel units being configured to receive the light beams of the target wavelength band and convert the light beams of the target wavelength band into corresponding electrical signals.

In some embodiments, the optical sensing device further includes a filter layer disposed above the plurality of pixel units, the filter layer being configured to transmit a light beam of a target wavelength band and filter a light beam of a second predetermined wavelength band, and the light shielding portion being configured to filter a light beam of a first predetermined wavelength band, wherein the first predetermined wavelength band is completely different from or completely the same as or partially the same as the second predetermined wavelength band.

In some embodiments, the first predetermined wavelength band includes the second predetermined wavelength band when the first predetermined wavelength band is partially the same as the second predetermined wavelength band.

In some embodiments, the first predetermined wavelength band includes a visible light band and a near infrared light band, and the second predetermined wavelength band includes a near infrared light band.

In some embodiments, an area of an orthographic projection of an area of the effective photosensitive region on the first substrate is smaller than an area of an orthographic projection of the first lens on the first substrate.

In some embodiments, the plurality of second lenses are arranged in an array, the plurality of first lenses are the same in size, the plurality of second lenses are the same in size, and part or all of the plurality of first lenses respectively face the plurality of second lenses.

In some embodiments, the optical sensing device further comprises a support structure supported between the image sensing chip and the first substrate.

In some embodiments, the optical sensing device further includes a stiffener and a flexible printed circuit, the flexible printed circuit is provided with an opening, the image sensor chip is disposed in the opening of the flexible printed circuit and fixed to the stiffener, and the image sensor chip is electrically connected to the flexible printed circuit.

In some embodiments, the image sensing chip converts the received light beam into a corresponding electrical signal to obtain the biometric information of the external object, or the optical sensing device is used for sensing the biometric information of the external object.

In some embodiments, the plurality of first lenses are spherical lenses or aspherical lenses.

In some embodiments, the plurality of second lenses are spherical lenses or aspherical lenses.

In some embodiments, the filter layer is formed on each of an upper surface and a lower surface of the first substrate.

The present application further provides an electronic device, which includes a display screen and the optical sensing device described in any one of the above, wherein the display screen is used for displaying images, and the optical sensing device is disposed below the display screen and is used for transmitting the light beam returned by the external object to the display screen so as to perform sensing of the biometric information.

The lens module of the optical sensing device has the advantages that the lens module comprises a plurality of first lenses for converging light beams to the light sensing module, and the plurality of first lenses have smaller thickness and smaller focal length compared with the large lens in the prior art, so that the optical sensing device has compact and small size and can be used in electronic equipment with limited internal space.

Further, the lens module further includes a light shielding portion disposed in a spacing area between the plurality of first lenses, a highest point of the light shielding portion facing away from the image sensing chip is higher than a highest point of the first lens facing away from the image sensing chip, or the highest point of the light shielding portion facing away from the image sensing chip is flush with a highest point of the first lens facing away from the image sensing chip, or the highest point of the light shielding portion facing away from the image sensing chip is lower than the highest point of the first lens facing away from the image sensing chip but not lower than 10 micrometers, so as to avoid or reduce crosstalk of light beams and improve sensing accuracy.

The optical sensing device can be used as an ultra-thin camera, and in addition, the optical sensing device can also be applied below a display screen to realize optical information detection below the screen.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of an electronic device according to the present application.

Fig. 2 is a partially exploded view of an optical sensing device according to a first embodiment of the present application.

FIG. 3 is an enlarged view of a portion of the optical detection device shown in FIG. 2 along line II-II'.

Fig. 4 shows respective imaging diagrams of a large lens of the prior art and a first lens of the present application.

Fig. 5 is a schematic top view and a schematic partial cross-sectional view of an optical sensing device according to a first embodiment of the present application.

Fig. 6 is a partial cross-sectional view of an optical sensing device according to a second embodiment of the present application.

Fig. 7 is a partial cross-sectional view of an optical sensing device according to a third embodiment of the present application.

Fig. 8 is a schematic partial cross-sectional view of an optical sensing device according to a fourth embodiment of the present application.

Fig. 9 is a schematic partial cross-sectional view of an optical sensing device according to a fifth embodiment of the present application.

Fig. 10 is a schematic partial cross-sectional view of an optical sensing device according to a sixth embodiment of the present application.

Fig. 11 is a schematic partial cross-sectional view of an optical sensing device according to a seventh embodiment of the present application.

Detailed Description

In the detailed description of the embodiments herein, it will be understood that when a substrate, a sheet, a layer, or a pattern is referred to as being "on" or "under" another substrate, another sheet, another layer, or another pattern, it can be "directly" or "indirectly" on the other substrate, the other sheet, the other layer, or the other pattern, or one or more intervening layers may also be present. The thickness and size of each layer in the drawings of the specification may be exaggerated, omitted, or schematically represented for clarity. Further, the sizes of the elements in the drawings do not completely reflect actual sizes.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Further, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the subject technology can be practiced without one or more of the specific details, or with other structures, components, and so forth. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the focus of the application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of an electronic device according to the present application. The electronic device 1000 comprises an optical sensing device 1 and a display screen 2. The display screen 2 is used for displaying pictures. The optical sensing device 1 is located below the display screen 2, and is configured to receive a light beam returned by an external object through the display screen 2, and convert the received light beam into a corresponding electrical signal, so as to perform corresponding information sensing. The optical sensing device 1 is used for example to perform sensing of biometric information, such as but not limited to, texture information including fingerprint information, palm print information, and the like, and/or living body information including blood oxygen information, heartbeat information, pulse information, and the like. However, the present application is not limited thereto, and the optical sensing apparatus 1 may also be used for performing other information sensing, such as depth information sensing, proximity sensing, and the like. In the present application, the optical sensing device 1 is mainly used to perform the sensing of the biometric information. The display screen 2 is, for example, but not limited to, an OLED display screen or an LCD display screen. The display screen 2 may be used as an excitation light source for providing a light beam for detection, or an excitation light source may be additionally provided in the electronic device 1000 for providing a light beam for detection.

The electronic device 1000 may be any suitable type of electronic product, such as, but not limited to, consumer electronics, home electronics, vehicle-mounted electronics, financial terminal products, and the like. The consumer electronic products include, for example, mobile phones, tablet computers, notebook computers, desktop monitors, all-in-one computers, and the like. Household electronic products are, for example, smart door locks, televisions, refrigerators and the like. The vehicle-mounted electronic product is, for example, a vehicle-mounted navigator, a vehicle-mounted DVD, or the like. The financial terminal products are ATM machines, terminals for self-service business and the like.

It should be noted that in the present application, the optical sensing device 1 has a plurality of different embodiments, and for the sake of clarity, the optical sensing device 1 in the different embodiments is respectively labeled with different reference numerals 1a, 1b, 1c, 1d, 1e, 1f, 1g for distinction. Further, for convenience of description, the same reference numerals in different embodiments of the optical sensing apparatus 1 may refer to the same elements, and may also refer to similar elements that may be modified, replaced, expanded, or combined.

Referring to fig. 2 and fig. 3 together, fig. 2 is a partially exploded schematic view of an optical sensing device 1a according to a first embodiment of the present application. FIG. 3 is an enlarged view of a part of a cross section of the optical detection device 1a shown in FIG. 2 taken along line II-II'. The optical sensing device 1a includes a lens module 10 and a photosensitive module 20 located below the lens module 10. The lens module 10 is used for converging light beams to the photosensitive module 20. The photosensitive module 20 is used for converting the received light beam into a corresponding electrical signal.

The lens module 10 includes a plurality of first lenses 110 and a light shielding portion 111. The plurality of first lenses 110 and the light blocking part 111 are disposed on the photosensitive module 20. The plurality of first lenses 110 are spaced apart from each other. The first lenses 110 are used for converging light beams onto the photosensitive module 20. The light shielding portion 111 is disposed in a spacing region between the plurality of first lenses 110 and is higher in height than the first lenses 110. The light shielding portion 111 is used for shielding the light beam.

Optionally, the lens module 10 further includes a first substrate 12. The first substrate 12 includes an upper surface 121 and a lower surface 122 opposite to each other, one side of the upper surface 121 is above the first substrate 12, and one side of the lower surface 122 is below the first substrate 12. The lens module 20 is disposed under the first substrate 12 and faces the lower surface 122. The plurality of first lenses 110 and the light shielding portion 111 are disposed on the upper surface 121 of the first substrate 12. The highest height of the light shielding part 111 relative to the first surface 121 is higher than that of the first lens 110 relative to the first surface 121.

Optionally, the upper surface 121 or/and the lower surface 122 of the first substrate 12 are planar. Further optionally, the upper surface 121 and the lower surface 122 are planes parallel to each other.

Optionally, the first substrate 12 is a transparent substrate, such as, but not limited to, a transparent glass substrate, a transparent resin substrate.

However, alternatively, in some embodiments, the first substrate 12 may be omitted.

Optionally, when the first substrate 12 is omitted, the first connection layer 41 may also be omitted, the lens module 10 is manufactured by using the photosensitive module 20 as a carrier substrate, and the first lens 110 is formed on the photosensitive module 20 through an imprinting process, so that the thickness of the optical sensing device 1a is thinner because the first substrate 12 and the first connection layer 41 are saved.

Optionally, the plurality of first lenses 110 are arranged in a regular array. Further alternatively, the plurality of first lenses 110 are arranged in, for example, but not limited to, a rectangular array. However, alternatively, in some embodiments, the plurality of first lenses 110 may be arranged irregularly.

Alternatively, the light shielding portion 111 is only located between the partially adjacent first lenses 110, or the light shielding portion 111 is disposed between any adjacent first lenses 110.

Optionally, the light shielding portion 111 is higher than the first lens 110 by any value of 5 to 100 micrometers in height. Further optionally, the light shielding portion 111 is higher than the first lens 110 in height by any value of 5 to 10 micrometers. However, the present application is not limited thereto, and it is within the scope of the present application as long as the light shielding portion 111 is higher than the first lens 110 in height.

Optionally, the plurality of first lenses 110 are convex lenses. Further optionally, the plurality of first lenses 110 are spherical lenses or aspherical lenses.

Alternatively, the plurality of first lenses 110 are made of a transparent material. Such as, but not limited to, transparent acrylic, transparent glass, UV glue material, and the like.

Alternatively, the plurality of first lenses 110 are, for example, identical. However, alternatively, in some embodiments, the plurality of first lenses 110 may not be identical.

The photosensitive module 20 includes a plurality of pixel units 212. The plurality of pixel units 212 are configured to receive the light beams through the lens module 10 and convert the received light beams into corresponding electrical signals to obtain corresponding biometric information of the external object 1001 (see fig. 1). Such as, but not limited to, a user's finger, palm, etc. The pixel unit 212 includes, for example, but not limited to, a photodiode, etc.

Optionally, the plurality of pixel units 212 are arranged in a regular array. However, alternatively, in some embodiments, the plurality of pixel units 212 may be arranged irregularly.

Optionally, each of the first lenses 110 faces a plurality of the pixel units 212. However, alternatively, in some embodiments, the plurality of first lenses 110 may be directly opposite to the plurality of pixel units 212.

Compared with the case that each first lens 110 respectively faces only one pixel unit 212, each first lens 110 of the present embodiment respectively faces a plurality of pixel units 212, the light sensing area of the first lens 110 can be increased, and the sensing accuracy of the second lens is higher than that of the first lens.

An area of the plurality of pixel units 212 that can receive the light beams through the first lens 110 is defined as an effective photosensitive area 211. The effective photosensitive area 211 is capable of converting a light beam into a corresponding electrical signal.

Optionally, each effective photosensitive area 211 respectively faces one of the first lenses 110. The light beam transmitted through the first lens 110 is converged to the effective photosensitive area 211 opposite to the first lens 110. The effective photosensitive areas 211 opposite to the first lenses 110 are arranged at intervals. The effective photosensitive area 211 is smaller than the area of the orthographic projection of the first lens element 110 on the photosensitive surface 210.

Alternatively, the light beams can reach the plurality of pixel units 212 after being converged by the first lenses 110. That is, the effective photosensitive region 211 includes a region where a plurality of pixel units 212 are located.

The light shielding part 111 is higher than the first lens 110 in height, so that part or all of the light beam 101 transmitted through one first lens 110 is not transmitted to the adjacent or other effective photosensitive area 211 opposite to the first lens 110.

Alternatively, the plurality of pixel units 121 are integrated in the image sensing chip (Die) 21. Further alternatively, the thickness of the image sensing chip 21 may be about 100 μm.

A side surface of the image sensor chip 21 capable of sensing the light beam is defined as a photosensitive surface 210, and the lens module 10 is located on the photosensitive surface 210. The highest height from the light shielding layer 111 to the light sensing surface 210 is higher than the highest height from the first lens element 110 to the light sensing surface 210.

Optionally, a first connection layer 41 is disposed between the photosensitive module 20 and the lens module 10, and the first connection layer 14 is, for example and without limitation, daf (die attach film), solid glue, liquid glue, optical glue, or any other suitable adhesive. The first connection layer 41 fills and spreads over the opposite portions between the lens module 10 and the photosensitive module 20.

Optionally, the optical sensing device 1a further comprises a filter layer 13. The filter layer 13 is disposed above the plurality of pixel units 212.

In some embodiments, the filter layer 13 is used to transmit light beams in a target wavelength band and filter out light beams outside the target wavelength band, so as to reduce the interference of stray light on sensing accuracy. The light beam of the target wavelength band is, for example, visible light.

Alternatively, in some other embodiments, the filter layer 13 is configured to filter out light beams in a second predetermined wavelength band, and the light shielding portion 111 is configured to filter out light beams in a first predetermined wavelength band, wherein the first predetermined wavelength band is completely different from or completely the same as or partially the same as the second predetermined wavelength band.

When the first preset waveband is the same as the second preset waveband, the first preset waveband comprises the second preset waveband. For example, the first preset wavelength band includes a visible light wavelength band and a near infrared light wavelength band, and the second preset wavelength band includes a near infrared light wavelength band. The filter layer 13 is, for example, an infrared cut filter.

In some embodiments, the filter layer 13 is disposed on the photosensitive module 20, or/and the filter layer 13 is disposed on the lens module 10. Specifically, for example, the filter layer 13 is provided on the plurality of first lenses 110 and the light-shielding layer 111. Alternatively, the filter layer 13 is disposed on the upper surface 121 and/or the lower surface 122 of the first substrate 12. Alternatively, the filter layer 13 and the plurality of pixel units 212 are integrated in the image sensing chip 21.

In particular, when the filter layer 13 is formed on each of the upper surface 121 and the lower surface 122 of the first substrate 12, the upper surface 121 and the lower surface 122 of the first substrate 12 are substantially affected by the tension of the filter layer 13 and other factors, so that the problem of warping of the optical sensor device 1a due to being too thin can be reduced to some extent.

Alternatively, the filter layer 13 is formed on the photosensitive surface 210 of the image sensing chip 21, for example, by an evaporation process.

Optionally, the thickness of the filter layer 13 is 1 to 5 microns.

Optionally, the optical sensing device 1a further includes a second substrate 30 located below the photosensitive module 20. The second substrate 30 is used for supporting the photosensitive module 20 and electrically connecting with an external circuit, for example. The second substrate 30 is, for example, a flexible printed circuit board or a rigid printed circuit board.

Optionally, the optical sensing device 1a further includes a second connecting layer 42 located between the photosensitive module 20 and the second substrate 30, the second connecting layer 42 is used for connecting the photosensitive module 20 and the second substrate 30, and the second connecting layer 42 is located between the photosensitive module 20 and the second substrate 30 and fully covers the opposite portion between the photosensitive module 20 and the second substrate 30.

Referring to fig. 3 again, fig. 3 shows two adjacent first lenses 110, which have optical centers G1 and G2, respectively, and a distance LP between the optical centers G1 and G2 is a Pitch (Pitch). Optionally, the pitch may be any value from 300 microns to 500 microns, for example, but not limited to, the pitch may be 350 microns, 400 microns, 450 microns.

Optionally, the maximum width LR or diameter of the first lens 110 is, for example, but not limited to, 100 microns.

The first lens 110 includes a curved surface 1101, and the curved surface 1101 can converge the light beam 101 entering the first lens 110. Alternatively, in some embodiments, the first lens 110 may be a small lens (mini-lens), the small lens includes the curved surface 1101 and a lens bottom surface 1102 connected to the curved surface, the curved surface 1101 is a convex surface, and the lens bottom surface 1102 is located on the upper surface 121 of the first substrate 12. For example, and without limitation, the lenslet's sagittal height H1 may be 20 microns, the bottom lens surface 1102 may be circular with a diameter of 100 microns to 150 microns, and the curved surface 1101 may be spherical with a radius of 80 microns to 100 microns.

Optionally, the light shielding portion 111 includes a retaining wall 1111 and a light shielding layer 1112. The retaining wall 1111 is located in an interval region between the plurality of first lenses 110. The light-shielding layer 1112 is located above the retaining wall 1111 and covers the interval region between the first lenses 110. The light shielding layer 1112 is used for shielding the light beam 101. For example, the light shielding layer 1112 prevents the light beam 101 from passing through the space between the first lenses 110.

Alternatively, the retaining wall 1111 and the first lens 110 may be made of the same transparent material. Such as, but not limited to, transparent acrylic, transparent glass, UV glue material, and the like. The retaining wall 1111 and the first lens 110 may be formed at one time by an imprinting process. Therefore, the process production flow can be reduced, the production efficiency can be improved, and the product cost can be reduced.

Fig. 3 is an example only, and in an actual product, the retaining wall 1111 and the first lens 110 may be integrated. The retaining wall 1111 is not disconnected from the plurality of first lenses 110 and is integrally formed of the same material.

When the first substrate 12 and the first connection layer 41 are omitted, the image sensing chip 21 serves as a carrier substrate, and the plurality of first lenses 110 and the retaining walls 1111 of the lens module 10 are formed on the image sensing chip 21, for example, but not limited to, by an imprinting process. The optical sensing device 1a is manufactured at a low cost due to the imprinting process.

However, alternatively, in some embodiments, the retaining wall 1111 and the plurality of first lenses 101 may be made of different materials, and the retaining wall 1111 and the plurality of first lenses 101 may be formed separately from each other. This is not to be taken in any way limiting by the present application.

Optionally, the material of the light shielding layer 1112 is an opaque resin material or an opaque other material, and the light beam 101 cannot pass through the light shielding layer 1112. Alternatively, the light shielding layer 1112 may be formed by coating, spraying, evaporating, stamping, or other suitable processes, and may have a thickness of 1 to 5 μm.

Optionally, the height H2 of the retaining wall 1111 relative to the upper surface 121 is greater than the height H1 of the first lens 110 relative to the upper surface 121.

Taking two adjacent first lenses 110 and the light shielding portion 111 disposed between the two adjacent first lenses 110 as an example, the light shielding portion 111 is used to prevent a part or all of the light beam 101 transmitted through one of the first lenses 110 from reaching the effective photosensitive area 211 opposite to the other first lens 110.

Alternatively, in some embodiments, the light-shielding layer 1112 is omitted and the retaining wall 1111 is made of a non-light-transmissive material.

The retaining wall 1111 may have different structures or positions or numbers, all of which shall fall within the protection scope of the present application.

In the present application, the light shielding portion 111 is higher than the first lens 110 in height, so that part or all of the light beams transmitted through the first lens 110 are not transmitted to the adjacent or remaining effective photosensitive areas 211 opposite to the first lens 110. Therefore, mutual interference of light beams can be reduced or avoided, and sensing accuracy is improved. Further, since the light shielding portion 111 is higher than the first lens 110 in height, the light shielding portion 111 can bear all or most of the pressure when the lens module 10 is pressed from the top to the bottom, and the first lens 110 is not deformed or damaged by the pressure, and thus the optical imaging is not affected.

For example, but not limited to, when the filter layer 13 is formed on the lower surface 122 of the first substrate 12, when the lens module 10 and the photo-sensor module 20 are connected, or when the photo-sensor module 20 and the second substrate 30 are connected, pressure may be applied to the lens module 10, and since the shielding portion 111 is higher than the first lens 110, the first lens 110 is not damaged by the pressure.

However, alternatively, in some embodiments, the light shielding portion 111 may be flush with the first lens 110 or lower than the first lens 110. For example, the maximum height of the light shielding portion 111 with respect to the light sensing surface 210 is equal to or lower than the maximum height of the first lens 110 with respect to the light sensing surface 210.

Alternatively, when the light shielding portion 111 is entirely lower in height than the first lens 110, the first lens 110 cannot be higher than the light shielding portion 111 by 10 μm, for example. In this way, interference of the light beam after passing through each first lens 110 is small and the light flux is high, so that the sensing accuracy can be improved.

For example, the difference between the highest height of the first lens 110 relative to the photosensitive surface 210 and the highest height of the light shielding portion 111 relative to the photosensitive surface 210 is not greater than 10 microns.

For example, the highest point of the light shielding portion 111 facing away from the image sensing chip 21 is higher than the highest point of the first lens 110 facing away from the image sensing chip 21, or the highest point of the light shielding portion 111 facing away from the image sensing chip 21 is flush with the highest point of the first lens 110 facing away from the image sensing chip 21, or the highest point of the light shielding portion 111 facing away from the image sensing chip 21 is lower than the highest point of the first lens 110 facing away from the image sensing chip 21 but not lower than 10 micrometers.

Referring to fig. 4, fig. 4 shows respective imaging diagrams of a large lens 1002 of the prior art and the first lens 110 of the present application. The light incident surface of the large lens 1002 is a convex surface of a single lens. The first lens 110 of the optical sensing device 1a in the embodiment of the present application is a small lens (Mini-lens). The curved surfaces 1101 of the first lenses 110 of the optical sensor device 1a are simultaneously used as light incident surfaces. It should be noted that the lenses described in the present document are all referred to as convex lenses. The focal length of the lens may be determined based on the viewing angle of the electronic device 1000 and the size of the lens. For example, when the viewing angle is fixed, the focal length may increase in proportion to the size of the lens.

Taking fingerprint detection as an example, in order to acquire sufficient fingerprint characteristic information, the large lens 1002 and the small lens 110 need to perform convergent imaging on the light beam in the detection region VA. For example, but not limited to, the detection area VA may be a rectangular area with a diameter of 4 mm × 4 mm to 10 mm × 10 mm, or the detection area VA may be a circular area with a diameter greater than or equal to 4 mm and less than or equal to 10 mm, and of course, the detection area VA may have other configurations, which is not limited in this embodiment.

The diameter of the large lens 1002 of the prior art may be typically 1 mm or more, while the diameter of the first lens 110 in the present application may be 100 microns, which is only 1/10 times the diameter of the large lens 1002, the focal length of the first lens 110 being less than the focal length of the large lens 1002. In addition, in the optical sensing device 1a, each of the different first lenses 110 is used for collecting a part of the area on the detection area VA. For example, as shown in fig. 4, three different first lenses 110 are respectively used for convergent imaging of the light beam 101 transmitted through the sub-detection regions V1, V2, V3, the sub-detection regions V1, V2, V3 are partial regions of the detection region VA, and the sub-detection regions V1, V2, V3 may have overlapping or non-overlapping. In contrast, the large lens 1002 of the prior art needs to perform convergent imaging of the light beam 101 transmitted through the entire detection area VA. Under the condition of basically the same viewing angle, the distance between the optical center of the first lens 110 and the detection area VA is smaller than the distance between the optical center of the large lens 1002 and the detection area VA, and the distance between the optical center of the first lens 110 and the photosensitive surface 210 of the photosensitive module 20 is smaller than the distance between the optical center of the large lens 1002 and the photosensitive surface 210 of the image sensing chip 21.

Therefore, the distance between the detection area VA and the photosensitive surface 210 of the image sensor chip 21 in the prior art is greater than the distance between the detection area VA and the photosensitive surface 210 of the image sensor chip 21 when the optical sensing device 1a is used for fingerprint detection in the embodiment of the present application. Therefore, compared to the prior art, the optical sensing device 1a of the present application has a more compact and compact volume and size, and can be used in an electronic device 1000 with a more demanding requirement for the occupied internal space, such as a mobile phone, a tablet computer, a smart watch, and the like. The module thickness (thickness from the retaining wall 1111 to the second substrate 30 in fig. 3) of the optical sensing device 1a of the present application can be up to 0.5 mm, for example, 0.4 mm, 0.35 mm or less, and the optical sensing device 1a can be used as an ultra-thin camera or applied under the display screen 2 (see fig. 1) to realize the optical biometric feature detection under the screen.

Referring to fig. 5, fig. 5 is a schematic top view and a schematic partial cross-sectional view of the optical sensing device 1 a. Reference numeral PA in fig. 5 denotes a pixel area where a plurality of pixel units 212 (see fig. 3) of the image sensing chip 21 are located, and reference numeral BA denotes a peripheral area of the image sensing chip 21. The peripheral area BA is located around the pixel area PA. The optical sensing device 1a further includes a conducting wire 22, and the image sensing chip 21 is electrically connected to the second substrate 30 through the conducting wire 22. The second substrate 30 may be electrically connected to an external integrated circuit. The first connecting layer 41 of the optical sensing device 1a is located between the lens module 10 and the light sensing module 20, and substantially covers the opposite surface between the lens module 10 and the image sensing chip 21. The second connection layer 42 of the optical sensor device 1a connects the image sensing chip 21 and the second substrate 30.

Referring to fig. 6, fig. 6 is a partial cross-sectional view of an optical sensing device 1b according to a second embodiment of the present application. The optical sensing device 1b and the optical sensing device 1a have substantially the same structure, and the main difference is that: the first connection layer 41a of the optical sensing device 1b is located between the lens module 10 and the image sensing chip 21 and faces the edge portions of the lens module 10 and the image sensing chip 21. Air 1003 is provided between the lens module 10 and the image sensing chip 21. The first connection layer 41a is formed between the lens module 10 and the edge portion of the image sensing chip 21, for example, but not limited thereto, through a dispensing process.

Referring to fig. 7, fig. 7 is a partial cross-sectional view of an optical sensing device 1c according to a third embodiment of the present application. The optical sensing device 1c and the optical sensing device 1a have substantially the same structure, and the main difference is that: the first connection layer 41b of the optical sensor device 1c is connected to at least a portion of the outer side of the edge of the lens module 10, a portion of the peripheral area BA, the outer side of the edge of the partial image sensing chip 21, and the upper surface of the second substrate 30 (i.e., the surface of the second substrate 30 on the side adjacent to the image sensing chip 21). At this time, the lens module 10 and the image sensing chip 21 are directly opposite to and in direct contact with each other. The first connection layer 41b is made by, for example, but not limited to, a dispensing process.

Alternatively, a part of the edge of the lens module 10 extends beyond the edge of the image sensor chip 21, and the first connection layer 41b may connect at least a part of the outer side of the edge of the lens module 10, a part of the peripheral area BA, and the upper surface of the second substrate 30.

Referring to fig. 8, fig. 8 is a partial cross-sectional view of an optical sensing device 1d according to a fourth embodiment of the present application. The optical sensing device 1d and the optical sensing device 1b have substantially the same structure, and the main difference between them is that the photosensitive module 20 further includes a supporting structure 23 disposed between the image sensing chip 21 and the lens module 10. The supporting structure 23 is located above the plurality of pixel units 212 (see fig. 3) of the image sensing chip 21, and the supporting structure 23 is disposed opposite to the spacing region of the first lens 110. The supporting structure 23 may be made of a transparent or opaque material, the supporting structure 23 is used for maintaining a certain gap (gap) between the lens module 10 and the image sensing chip 21, and the supporting structure 23 can play a supporting role. The support structure 23 may also be used to maintain a separation distance between the lens module 10 and the image sensor chip 21 such that the lens module 10 is not significantly higher on one side and lower on the other side relative to the image sensor chip 21.

Referring to fig. 9, fig. 9 is a partial cross-sectional view of an optical sensing device 1e according to a fifth embodiment of the present application. The optical sensing device 1e and the optical sensing device 1a have substantially the same structure, and the main difference is that: the flexible circuit board 50 of the optical sensor device 1e has an opening 51, the photosensitive module 20 is disposed on the reinforcing plate 30c, and the lens module 10 and the photosensitive module 20 are located in the opening 51. Since the flexible circuit board 50 is not present between the photosensitive module 20 and the reinforcing plate 30c, the overall thickness (or height) of the optical sensing device 1e is small.

Optionally, the thickness of the flexible printed circuit 50 is 0.1 mm, and the thickness of the optical sensing device 1c may be reduced by 0.1 mm compared to the flexible printed circuit 50 without the opening 51. Optionally, the reinforcing plate 30c is a metal substrate, such as but not limited to: aluminum substrates, stainless steel substrates, and the like.

Referring to fig. 10, fig. 10 is a partial cross-sectional view of an optical sensing device 1f according to a sixth embodiment of the present application. For convenience of description, the optical sensing device 1f has substantially the same structure as the optical sensing devices 1a to 1e, and the main differences are: the lens module 10a of the optical sensor device 1f and the lens modules 10 of the optical sensor devices 1a to 1e have different structures.

The light-shielding portion 111a of the lens module 10a includes a light-shielding layer 1112a and a retaining wall 1111 a. The light-shielding layer 1112a is located between the retaining wall 1111a and the upper surface 121 of the first substrate 12. The light-shielding layer 1112a has an opening K exposing the upper surface 121, and the first lens 110 is formed above the opening K and overlaps with an edge portion of the light-shielding layer 1112 a. The retaining wall 1111a is formed right above the light shielding layer 1112a, and the retaining wall 1111a and the light shielding layer 1112a are both used for shielding light beams. The retaining wall 1111a prevents part or all of the light beam 101 transmitted through one of the first lenses 110 from being transmitted to the adjacent or other effective photosensitive area 211 opposite to the first lens 110.

In this embodiment, the retaining wall 1111a is made of a material that cannot transmit the light beam 101. The material of the light shielding layer 1112b is an opaque resin material or an opaque other material, and the light beam 101 cannot pass through the light shielding layer 1112 b.

Optionally, the light-shielding layer 1112a may be formed on the first substrate 12 through an evaporation process, and then an opening K corresponding to the arrangement position of the first lens 110 is formed through a photolithography process, where the opening K exposes the upper surface 121 of the first substrate 12. The first lens 110 and the retaining wall 1111a are formed by multiple photolithography processes.

It should be noted that the blocking of the light beam by the present application may be an absorption and/or reflection of the light beam. Optionally, blocking the light beam may include transmitting less than 10%, 5%, 1%, or equal to the light beam.

The light shielding portion 111a is higher than the first lens 110 in height. For example, the maximum height of the light shielding portion 111a relative to the photosensitive surface 210 is higher than the maximum height of the first lens 110 relative to the photosensitive surface 210.

However, alternatively, in some embodiments, the light shielding portion 111a may be flush with the first lens 110 or lower than the first lens 110. For example, the maximum height of the light shielding portion 111a relative to the light sensing surface 210 is equal to or lower than the maximum height of the first lens 110 relative to the light sensing surface 210.

Alternatively, when the light shielding portions 111a are all lower in height than the first lens 110, the first lens 110 is, for example, not higher than the light shielding portions 111a by 10 μm. In this way, interference of the light beam after passing through each first lens 110 is small and the light flux is high, so that the sensing accuracy can be improved.

For example, the difference between the highest height of the first lens 110 relative to the photosensitive surface 210 and the highest height of the light shielding portion 111a relative to the photosensitive surface 210 is not greater than 10 microns.

Referring to fig. 3 and fig. 11 together, fig. 11 is a partial cross-sectional view of an optical sensing device 1g according to a seventh embodiment of the present application. The optical sensor device 1g may have substantially the same structure as the optical sensor devices 1a to 1f of the above embodiments, and the main difference is that: the photosensitive module 20 of the optical sensing apparatus 1g further includes a plurality of second lenses 213. The plurality of second lenses 213 are disposed between the image sensing chip 21 and the lens module 10. The plurality of second lenses 213 are used to converge the light beams to the image sensing chip 21. An area of an orthographic projection of the second lens 213 on the first substrate 12 (see fig. 3) of the lens module 10 is smaller than an area of an orthographic projection of the first lens 110 on the first substrate 12. The focal length of the second lens 213 is smaller than the focal length of the first lens 110.

Alternatively, the plurality of second lenses 213 are arranged in a regular array, for example, in a rectangular array. However, alternatively, in some embodiments, the plurality of second lenses 213 may be arranged irregularly. Further alternatively, the plurality of second lenses 213 are the same and are all convex lenses.

Alternatively, the second mirror 213 is made of, for example, a transparent material. Such as, but not limited to, transparent acrylic, transparent glass, UV glue material, and the like.

Preferably, the second lens 213 is a micro lens (micro lens). The plurality of second lenses 213 are directly opposite to the plurality of pixel units 212 (see fig. 3) one by one. Each first lens 110 faces a plurality of the pixel units 212 and/or a plurality of the second lenses 213.

Optionally, each microlens 213 occupies an area no greater than that occupied by a single pixel cell 212.

However, alternatively, in some embodiments, the plurality of second lenses 213 may also be directly opposite to the plurality of first lenses 110, and respectively directly face the plurality of pixel units 212. Alternatively, the plurality of first lenses 110 are directly opposite to the plurality of pixel units 212, and the plurality of second lenses 213 are directly opposite to the plurality of first lenses 110. Various embodiments are within the scope of the present application as long as the area of the orthographic projection of the second lens 213 on the first substrate 12 is smaller than the area of the orthographic projection of the first lens 110 on the first substrate 12.

Optionally, the first connection layer 41a allows air 1003 to be provided between the lens module 10 and the image sensing chip 21. A space 1002 is provided between the second mirror 213 and the lens module 10. Since the refractive indices of the air 1001 and the second lens 213 are different, the light beam is refracted when entering the second lens 213 from the air 1003. The second lens 213 is a convex lens, the light beam 101 is refracted and then converged by the second lens 213, and more light beams 101 can be received by the pixel unit 212, so that the optical imaging quality is better.

However, as shown in fig. 5, the first connection layer 41 may be formed between the lens module 10 and the image sensor chip 21 instead of the first connection layer 41a, and the first connection layer 41 directly contacts and covers the plurality of second lenses 213, and there is no air between the lens module 10 and the image sensor chip 21.

Alternatively, as shown in fig. 7, the first connection layer 41b may be formed outside the edges of the lens module 10 and the image sensor chip 21 instead of the first connection layer 41 a.

It should be noted that part or all of the structures, functions, and methods of the embodiments of the present application can be applied to other or modified embodiments, and are not limited to the embodiments described in correspondence thereto, and all embodiments obtained thereby belong to the scope of the present application. In addition, in the embodiment of the present application, the light beam may be visible light or invisible light, and the invisible light may be near infrared light, for example. The terms "overlap", "overlap" and "overlapping" as may appear in the description of the present application should be understood to have the same meaning and to be interchangeable.

It should be noted that, part or all of the embodiments of the present application, and part or all of the modifications, substitutions, alterations, splits, combinations, extensions, etc. of the embodiments are all considered to be covered by the inventive concept of the present application, and belong to the protection scope of the present application, without inventive efforts.

Any reference in this specification to "one embodiment," "an embodiment," "example embodiment," etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Further, when a particular feature or structure is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to effect such feature or structure in connection with other ones of the embodiments.

The orientations or positional relationships indicated by "length", "width", "upper", "lower", "left", "right", "front", "rear", "back", "front", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which may appear in the specification of the present application, are based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the embodiments of the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Like reference numbers and letters refer to like items in the figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance. In the description of the present application, "plurality" or "a plurality" means at least two or two unless specifically defined otherwise. In the description of the present application, it should also be noted that, unless explicitly stated or limited otherwise, "disposed," "mounted," and "connected" are to be understood in a broad sense, e.g., they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. The terms used in the following claims should not be construed to limit the application to the specific embodiments disclosed in the specification. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (29)

1. An optical sensing device, comprising:

the image sensing chip comprises a plurality of pixel units, wherein the pixel units are used for receiving light beams, converting the received light beams into corresponding electric signals and defining one side surface of the image sensing chip, which is used for sensing the light beams, as a photosensitive surface; and

a lens module, comprising:

a plurality of first lenses disposed on the image sensing chip, the plurality of first lenses being spaced apart from each other and each facing a plurality of the pixel units, the plurality of first lenses being for converging light beams to the plurality of pixel units; and

the shading part is arranged on the image sensing chip and is positioned in an interval area among the plurality of first lenses and used for shading light beams, wherein the highest point of the shading part back to the image sensing chip is higher than the highest point of the first lens back to the image sensing chip, or the highest point of the shading part back to the image sensing chip is flush with the highest point of the first lens back to the image sensing chip, or the highest point of the shading part back to the image sensing chip is lower than the highest point of the first lens back to the image sensing chip but is not lower than 10 micrometers.

2. The optical sensor apparatus of claim 1, wherein a maximum height of the light shielding portion with respect to the photosensitive surface is not lower than a maximum height of the first lens with respect to the photosensitive surface; or the highest height of the shading part relative to the light sensing surface is lower than the highest height of the first lens relative to the light sensing surface, and the height difference between the highest height of the first lens relative to the light sensing surface and the highest height of the shading part relative to the light sensing surface is not more than 10 microns.

3. The optical sensing device as claimed in claim 1, wherein the areas of the plurality of pixel units capable of receiving the light beams through the first lenses are defined as effective photosensitive areas, each effective photosensitive area respectively faces one of the first lenses, and the light beams passing through the first lenses converge to the effective photosensitive area facing the first lens.

4. The optical sensor apparatus of claim 3, wherein the light shielding portion is configured to prevent a part or all of the light beam transmitted through one of the first lenses from being transmitted to the adjacent or remaining effective photosensitive area directly opposite to the first lens.

5. The optical sensor device as claimed in claim 1, wherein the light-shielding portion comprises a retaining wall and a light-shielding layer, the retaining wall is located between the image sensor chip and the light-shielding layer, and the light-shielding layer is used for shielding the light beam.

6. The optical sensor device as claimed in claim 5, wherein the dam and the first lens are made of the same light-transmissive material.

7. The optical sensor device as claimed in claim 1, wherein the light-shielding portion includes a dam and a light-shielding layer, the light-shielding layer is formed on the image sensor chip and has a plurality of openings exposing the light-sensing surface, the plurality of first lenses are formed over the light-shielding layer, the first lenses are opposite to the openings and overlap with edge portions of the light-shielding layer, the dam is formed on the light-shielding layer and is located in a spacing region between the first lenses, wherein the light-shielding layer and the dam are for blocking light beams.

8. The optical sensor device according to claim 3, wherein for the light shielding portions located between two adjacent first lenses and between the two adjacent first lenses: the highest point of the shading part back to the image sensing chip is not lower than the highest point of the two adjacent first lenses back to the image sensing chip, or the highest point of the shading part back to the image sensing chip is lower than the highest point of the two adjacent first lenses back to the image sensing chip but is not lower than 10 micrometers, so that part or all of the light beam penetrating through one first lens cannot be transmitted to an effective photosensitive area opposite to the other first lens.

9. The optical sensor apparatus according to claim 5 or 7, wherein a height from the dam to the photosensitive surface is higher than a height from the first lens to the photosensitive surface.

10. The optical sensor apparatus of claim 2, wherein a maximum height of the light shielding portion with respect to the light sensing surface is higher than a maximum height of the first lens with respect to the light sensing surface by any value of 5 to 100 μm.

11. The optical sensor apparatus of claim 10, wherein a maximum height of the light shielding portion with respect to the light sensing surface is higher than a maximum height of the first lens with respect to the light sensing surface by any value of 5 to 10 μm.

12. The optical sensing device as claimed in claim 5 or 7, wherein the pitch between adjacent first lenses is any value from 300 microns to 500 microns.

13. The optical sensing device as claimed in claim 1, wherein the plurality of first lenses are arranged in an array, and the plurality of pixel units are arranged in an array.

14. The optical sensing device as claimed in claim 3, wherein the lens module further comprises a first substrate, the first substrate comprising an upper surface and a lower surface opposite to each other, one side of the upper surface being above the first substrate, one side of the lower surface being below the substrate, the image sensor chip being located below the first substrate; the plurality of first lenses and the shading part are arranged on the upper surface of the first substrate, and the image sensing chip and the lens module are fixed in a dispensing mode.

15. The optical sensing device as claimed in claim 14, further comprising a plurality of second lenses disposed between the plurality of first lenses and the plurality of pixel units, and facing the plurality of pixel units, the plurality of second lenses being for converging light beams to the plurality of pixel units.

16. The optical sensing device as defined in claim 15, wherein the second lens is spaced apart from the first substrate by air, the second lens having a refractive index greater than that of air.

17. The optical sensing device as claimed in claim 1 or 14, further comprising a filter layer disposed above the plurality of pixel units, the filter layer being configured to transmit the light beams of the target wavelength band and filter out light beams outside the target wavelength band, the plurality of pixel units being configured to receive the light beams of the target wavelength band and convert the light beams of the target wavelength band into corresponding electrical signals.

18. The optical sensing device as claimed in claim 14, further comprising a filter layer disposed above the plurality of pixel units, wherein the filter layer is configured to transmit the light beam of the target wavelength band and filter out the light beam of a second predetermined wavelength band, and the light shielding portion is configured to filter out the light beam of a first predetermined wavelength band, wherein the first predetermined wavelength band is completely different from or completely the same as or partially the same as the second predetermined wavelength band.

19. The optical sensing device of claim 18, wherein the first predetermined wavelength band includes the second predetermined wavelength band when the first predetermined wavelength band is partially the same as the second predetermined wavelength band.

20. The optical sensing device of claim 19, wherein the first predetermined wavelength band comprises a visible light band and a near infrared light band, and the second predetermined wavelength band comprises a near infrared light band.

21. The optical sensor apparatus of claim 14, wherein an area of an orthographic projection of an area of the effective photosensitive region on the first substrate is smaller than an area of an orthographic projection of the first lens on the first substrate.

22. The optical sensing device as claimed in claim 15, wherein the plurality of second lenses are arranged in an array, the plurality of first lenses are the same size, the plurality of second lenses are the same size, and some or all of the plurality of first lenses respectively face the plurality of second lenses.

23. The optical sensing device of claim 14 or 15, further comprising a support structure supported between the image sensing chip and the first substrate.

24. The optical sensor apparatus as claimed in claim 1, wherein the optical sensor apparatus further comprises a stiffener and a flexible printed circuit, the flexible printed circuit has an opening, the image sensor chip is disposed in the opening of the flexible printed circuit and fixed to the stiffener, and the image sensor chip is electrically connected to the flexible printed circuit.

25. The optical sensing apparatus of claim 1, wherein the image sensor chip converts the received light beam into a corresponding electrical signal to obtain the biometric information of the external object, or the optical sensing apparatus is used for sensing the biometric information of the external object.

26. The optical sensing device as claimed in claim 1, wherein the plurality of first lenses are spherical lenses or aspherical lenses.

27. The optical sensing device as claimed in claim 15, wherein the plurality of second lenses are spherical lenses or aspherical lenses.

28. The optical sensing device as claimed in claim 18, wherein the filter layer is formed on each of the upper and lower surfaces of the first substrate.

29. An electronic device, characterized in that: the electronic device comprises a display screen and the optical sensing device of any one of claims 1 to 28, wherein the display screen is used for displaying pictures, and the optical sensing device is arranged below the display screen and used for receiving light beams returned by an external object through the display screen so as to perform biometric information sensing.

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