CN211426303U - Circuit board structure, light source module and optical detection device - Google Patents

Abstract

The utility model discloses a circuit board structure, it includes circuit board and the chip of electricity connection on the circuit board, the circuit board is used for providing the signal of telecommunication for the chip. The circuit board comprises a first edge positioned on one side of the circuit board, the chip comprises a second edge positioned on one side of the circuit board, and the second edge of the chip and the first edge of the circuit board are aligned with each other; or at least a portion of the second edge of the chip extends beyond the first edge of the circuit board. The utility model also provides a light source module and optical detection device.

Description

Circuit board structure, light source module and optical detection device

Technical Field

The utility model relates to the field of photoelectric technology, especially, relate to a circuit board structure, and use light source module and the optical detection device of this circuit board structure.

Background

With the technical progress and the improvement of living standard of people, users demand more functions and fashionable appearance for electronic products such as mobile phones, tablet computers, cameras and the like. At present, the development trend of electronic products such as mobile phones and the like is to have a higher screen occupation ratio and have fingerprint detection or other biological characteristic detection functions. In order to realize a full screen or a nearly full screen effect, an electronic product has a high screen occupation ratio, and a biological characteristic detection technology under the screen is developed. For liquid crystal display screens and other non-self-luminous displays, an active light-emitting detection light source needs to be arranged below a protective cover plate of the screen so as to transmit detection light beams through the protective cover plate to perform biological feature detection under the screen. However, the light source structure in the prior art makes the light emitting surface of the detection light source far away from the protective cover plate, and the loss of the emitted detection light beam in the transmission process is large, which results in low light utilization rate of the detection light source.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a can improve circuit board structure, light source module and optical detection device of prior art problem.

An aspect of the utility model provides a circuit board structure, it includes circuit board and the chip of electricity connection on the circuit board, the circuit board is used for providing the signal of telecommunication for the chip, the circuit board is including the first edge that is located self one of them side, the chip is including the second edge that is located self one of them side, the second edge of chip aligns each other with the first edge of circuit board, perhaps at least part at the second edge of chip surpasss the first edge of circuit board.

In some embodiments, the chip is a light emitting chip including a light emitting face for emitting a light beam, the second edge being one of the edges of the light emitting face.

In some embodiments, the circuit board comprises a first surface for connecting the chip, the light emitting face being perpendicular to the first surface; or the light emitting surface is obliquely arranged at a preset angle relative to the first surface.

In some embodiments, the light emitting chip may be one or more of an LED, VCSEL, OLED, MICRO-LED, MINI-LED.

In some embodiments, the light beam emitted by the light emitting chip is infrared light or near infrared light, and the wavelength range is 700 nm to 2500 nm.

In some embodiments, the circuit board is a flexible circuit board.

In some embodiments, the circuit board includes a first portion and a second portion connected to each other, the first portion includes the first edge and a third edge opposite to the first edge, the second portion extends outward from the second portion on a side where the third edge is located, and the chip is electrically connected to the first portion.

In some embodiments, the chip further comprises a driving circuit, the driving circuit is disposed on the second portion, the driving circuit is connected to the chip circuit through traces disposed on the first portion and the second portion, and the driving circuit is configured to drive the chip to operate.

In some embodiments, the first portion is an elongated sheet having a length direction and a width direction, the first edge is parallel to the length direction of the first portion, and the second portion extends from the third edge along the width direction of the first portion.

In some embodiments, a plurality of the chips are included, the plurality of the chips being spaced along the first edge.

In some embodiments, the spacing between each two adjacent chips is equal; or

At least two different pitches are arranged between the adjacent chips of the plurality of pairs.

In some embodiments, the circuit board structure is included, wherein the chip is a light emitting chip for emitting a light beam toward a side where the first edge of the circuit board is located.

In some embodiments, the chip is a light emitting chip, the light emitting chip includes a light emitting surface for emitting a light beam, the circuit board includes a first surface for connecting the light emitting chip, the light emitting surface is perpendicular to the first surface, the light emitting surface and the first edge are aligned with each other, or the light emitting surface exceeds the first edge.

An aspect of the utility model provides a light source module, it includes any one in the above-mentioned circuit board structure, wherein, the chip is luminous chip for the transmission detecting beam, detecting beam is used for the biological characteristic to detect.

An aspect of the utility model provides an optical detection device, it has biological feature detection function under the screen, include:

the protective layer comprises an upper surface and a lower surface which are oppositely arranged, and the upper surface is provided with a detection area which can be directly touched by an external object during detection;

the display module is positioned below the lower surface and used for displaying pictures through the protective layer;

the light source module is located below the lower surface, the light source module is used for transmitting a detection light beam to an external object located above the protective layer through the protective layer, the first edge is an edge of the circuit board, which is closest to the lower surface of the protective layer, the light emitting chip comprises a light emitting surface used for emitting the light beam, and the second edge is one edge of the light emitting surface.

In some embodiments, the light emitting chip emits the detection light beam to an external object above the protection layer through the light emitting surface, the light emitting surface faces the protection layer, and the optical detection device further includes a detection module configured to receive the detection light beam returned by the external object to obtain biometric information of the external object.

The beneficial effects of the utility model reside in that, the light emitting area edge of luminous chip aligns each other with the nearest top edge of circuit board distance protective layer lower surface, makes the light emitting area of luminous chip can be close to furthest the lower surface emission measuring beam of protective layer, in order to reduce the energy loss of measuring beam in the projection process.

Drawings

Fig. 1 is a schematic front plan view illustrating an optical detection device applied to an electronic device according to an embodiment of the present invention;

FIG. 2 is a schematic partial cross-sectional view of the optical detection device of FIG. 1 taken along line II-II;

FIG. 3 is a schematic diagram of the optical path of the detection beam of FIG. 2 as it is transmitted from an external object;

FIG. 4 is a schematic diagram of a circuit board structure of the optical inspection device shown in FIG. 2;

FIG. 5 is a schematic view of another viewing angle of the circuit board structure of FIG. 4;

FIG. 6 is a schematic diagram of one embodiment of an arrangement of light emitting chips on the circuit board structure shown in FIG. 4;

FIG. 7 is a schematic diagram of another embodiment of the arrangement of light emitting chips on the circuit board structure shown in FIG. 4

FIG. 8 is a schematic diagram of another embodiment of an arrangement of light emitting chips on the circuit board structure shown in FIG. 4;

fig. 9 is a schematic structural diagram of a circuit board structure according to another embodiment of the present invention.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

In the detailed description of the embodiments of the invention, it will be understood that when a substrate, a sheet, a layer, or a pattern is referred to as being "on" or "under" another substrate, another sheet, another layer, or another pattern, it can be "directly" or "indirectly" on the other substrate, the other sheet, the other layer, or the other pattern, or one or more intervening layers may also be present. The thickness and size of each layer in the drawings of the specification may be exaggerated, omitted, or schematically represented for clarity. Further, the sizes of the elements in the drawings do not completely reflect actual sizes.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and settings of the specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or reference letters in the various examples, which are repeated for purposes of simplicity and clarity and do not in themselves dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present disclosure provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other structures, components, and so forth. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring aspects of the invention.

Referring to fig. 1 to fig. 2, fig. 1 is a schematic front plan view illustrating an optical detection device 10 applied to an electronic apparatus 1 according to a first embodiment of the present invention. FIG. 2 is a schematic partial cross-sectional view of the optical detection device 10 of FIG. 1 taken along line II-II. The optical inspection device 10 has a length direction along the Y-axis, a width direction along the X-axis, and a thickness direction along the Z-axis. The optical detection device 10 has a central axis 113 parallel to the longitudinal direction Y, and the optical detection device 10 is substantially axisymmetric with respect to the central axis 113. Optionally, the line II-II is a central axis 113 of the optical detection apparatus 10 or a parallel line located on the central axis 113. The electronic device 1 has a shape corresponding to the optical detection apparatus 10, and accordingly has a length direction along the Y-axis, a width direction along the X-axis, and a thickness direction along the Z-axis. The electronic device 1 comprises a top part 13 and a bottom part 14 which are oppositely arranged along the length direction Y of the electronic device. The electronic device 1 is, for example, a mobile phone, and may include an earphone 130, a front camera 132, and a sound sensor 140. The earpiece 130 and the front camera 132 are disposed at a position of the electronic device 1 near the top 13. The sound sensor 140, for example: a microphone arranged at a position of the electronic device 1 near the bottom 14.

The optical detection device 10 includes a display device 12. The display device 12 includes a protection layer 100, a display module 104 and a fixing frame 105 sequentially arranged from top to bottom.

The protective layer 100 includes a non-transparent region 210 and a transparent region 220 that are contiguous. The non-transparent area 210 is located around the transparent area 220. The periphery of the transparent area 220 refers to an area other than the edge of one or more sides of the transparent area 220. The transparent region 220 is capable of transmitting visible light and invisible light. The non-transparent region 210 is capable of blocking visible light and transmitting non-visible light such that elements inside the display device 12 are not visible to a user in the non-transparent region 210. The protective layer 100 includes an upper surface 101 and a lower surface 102 disposed opposite each other. The upper surface 101 includes an upper surface of the transparent region 220 and an upper surface of the non-transparent region 210. The lower surface 102 includes a lower surface of the transparent region 220 and a lower surface of the non-transparent region 210.

Illustratively, the main body of the protective layer 100 may be made of a transparent material, such as, but not limited to, transparent glass, a transparent polymer material, or any other transparent material. The protective layer 100 may have a single-layer structure or a multi-layer structure. The protective layer 100 is a substantially thin plate having a predetermined length, width and thickness. The protective layer 100 has a length axis corresponding to the Y-axis, a width axis corresponding to the X-axis, and a thickness axis corresponding to the Z-axis.

Optionally, in some embodiments, the protective layer 100 may include a transparent substrate 103 and an optical film layer 107. The transparent substrate 103 is capable of transmitting visible light and non-visible light, and is a main body portion of the protective layer 100. The optical film layer 107 is disposed on the lower surface 102 of the non-transparent region 210 of the protection layer 100, and the non-transparent region 210 of the protection layer 100 realizes the function of blocking visible light and transmitting invisible light through the optical film layer 107. The non-transparent region 210 of the protection layer 100 includes the optical film layer 107 and a portion of the transparent substrate 103 facing the optical film layer 107. The transparent region of the protective layer 100 includes a portion of the transparent substrate 103 where the optical film layer 107 is not disposed.

The transparent substrate 103 is, for example, but not limited to, glass, plastic, resin, or any other transparent material. The optical film layer 107 is, for example, but not limited to, an infrared ink capable of transmitting near infrared light and blocking visible light.

Optionally, in some embodiments, the optical film layer 107 may be omitted or integrated in the transparent substrate 103.

It is understood that the protective layer 100 may include a plastic film, a toughened film, or other films that are attached by a user during actual use, and the upper surface 101 of the protective layer 100 is a surface that the external object 1000 directly contacts during biometric detection. The upper surface 101 may be an outermost surface of the optical detection device 10, or the upper surface 101 may be an outermost surface of an electronic apparatus 1 comprising the optical detection device 10. In the present application, for example and without limitation, the external object 1000 may be a finger and the biometric detection may be fingerprint detection or fingerprint feature detection.

The display module 104 is located below the lower surface 102 of the protection layer 100, and can emit visible light through the protection layer 100 to realize a display function, such as but not limited to displaying images or characters. The protection layer 100 is used for protecting the display module 104 from the external environment.

Optionally, in some embodiments, the display module 104 is a passive light emitting display module, such as but not limited to a liquid crystal display module or an electronic paper display module. The display module 104 includes, for example, a display panel 105 and a backlight unit 106, the display panel 105 is located below the protective layer 100, and the backlight unit 106 is located below the display panel 105. The backlight unit 106 is used for providing visible light to the display panel 105. The backlight unit 106 includes a reflective sheet (not shown), a light guide plate (not shown), and an optical film set (not shown) stacked in this order from top to bottom. The backlight unit 106 may further include a backlight (not shown) disposed adjacent to one side of the light guide plate. The backlight is used for emitting visible light, and the visible light enters the light guide plate from the side of the light guide plate adjacent to the backlight, is transmitted by the light guide plate, and then is emitted to the display panel 105 through the optical film set. The reflector plate is used for reflecting the visible light emitted from the bottom surface of the light guide plate back to the inside of the light guide plate so as to improve the utilization rate of the visible light. The optical film set is used to diffuse and/or brighten the visible light emitted from the light guide plate and provide the visible light to the display panel 105. The optical film set may include one or more diffusion sheets (diffusion sheets) and/or brightness enhancement sheets (brightness enhancement films)

The display panel 105 is located below the protection layer 100 and substantially opposite to the transparent region 220, the display panel 105 realizes a function of displaying a picture by modulating the throughput of visible light, and the visible light modulated by the display panel 105 is emitted from the transparent region 210 and is seen by a user through picture contents displayed by the display module 104.

The display panel 105 is, for example but not limited to, a liquid crystal display panel, and may include an array substrate (not shown), a liquid crystal layer (not shown), and a color filter substrate (not shown) sequentially stacked from bottom to top. Accordingly, the optical inspection device 10 is, for example, but not limited to, a liquid crystal optical inspection device or a liquid crystal display. In the present application, the optical detection device 10 is a hard display screen, which cannot be bent, unlike a flexible display screen that can be bent.

The optical detection device 10 further includes a light source module 16 and a detection module 19. The light source module 16 is located below the lower surface 102 of the protection layer 100, and is configured to emit a detection light beam 11 to the external object 1000. The detection module 19 is located below the lower surface 102 of the protection layer 100, and is configured to receive the detection beam 11 returned by the external object 1000 and convert the detection beam into an electrical signal. Since the detection beam 11 returned through the external object 1000 carries the biometric information of the external object 1000, the biometric information of the external object 1000 can be obtained by analyzing the electrical signal converted from the detection beam 11 returned through the external object 1000, and thus can be used for biometric detection and identification of the external object 1000. The biometric information may be any one or more of, but not limited to, skin texture information such as fingerprints and palm prints, living body information such as blood oxygen, heartbeat, and pulse, depth information, or three-dimensional image information. In the present application, the biometric information is taken as fingerprint information, and the detection beam 11 is taken as near-infrared light for example.

Alternatively, in some embodiments, the detection beam 11 is, for example, but not limited to, near infrared light having a wavelength ranging from 750 nm to 2000 nm, or near infrared light having a wavelength ranging from 800 nm to 2000 nm, or other invisible light that can be used for biometric detection and identification.

Optionally, in some embodiments, the manner of returning the detection beam 11 through the external object 1000 includes, but is not limited to, the detection beam 11 entering the inside of the external object 1000 located above the protection layer 100 and then being transmitted out of the surface of the external object 1000 and returning; alternatively, the detection beam 11 propagates by total reflection in the protective layer 100, and returns by diffuse reflection at a position where the external object 1000 is in contact with the protective layer 100; alternatively, the detection beam 11 is transmitted through the protective layer 100 and then reflected by the external object 1000 to return. The upper surface 101 of the protection layer 100 has a detection area VA for the external object 1000 to directly touch during detection, and the detection beam 11 returned by the external object 1000 passes through the protection layer 100 from the detection area VA and can return to the detection module 19.

It is understood that the detection module 19 has a preset Field Of View (FOV) range, and the portion Of the detection beam 11 returning through the external object 1000 within the FOV range can be received by the detection module 19 and converted into an electrical signal for detection. The detection area VA includes or is an area where the upper surface 101 of the protection layer 100 is located within the field angle range of the detection module 19.

Optionally, in some embodiments, the detection module 19 includes a lens module (not shown) and an image sensor (not shown), and the detection beam 11 returned by the external object 1000 passes through the lens module and is converted into an electrical signal by the image sensor. The lens module has an optical center, and the angle of view with the optical center as a vertex is, for example, but not limited to: 100 to 140 degrees or 120 to 130 degrees. Optionally, the thickness of the detection module 19 is 1 to 2mm, or 2 to 3mm, or 3 to 4 mm.

Optionally, in some embodiments, the detection module 19 includes an ultrathin lens array and an image sensor, and the field angle range is the field angle range of the ultrathin lens array. The detection beam 11 reaches the image sensor via the ultra-thin lens array and is converted by the image sensor into an electrical signal corresponding to image information. In this case, the thickness of the detecting module 19 may be 0.2 to 1mm, for example, but not limited to, the thickness of the detecting module is 0.4 mm.

It should be noted that, when not particularly limited, the angle of view of the detection module 19 described in the present application may be an angle of view of an XZ plane, an angle of view of a YZ plane, or any other possible angle of view of a plane or direction. It is understood that the angles of view of the detection module 19 in different planes form the field angle range of stereo in space, and the field angle range of the detection module 19 may be at least part of a cone, or any other possible stereo shape. The area covered by the field angle range of the detection module 19 on different planes is the field area of the detection module 19 on the plane, and an object on the plane located in the field area can be received by the detection module 19 because the reflected light is in the field angle range, so that the object can be effectively detected. Therefore, the detection area VA where the upper surface 101 of the protection layer 100 is used for the external object 1000 to contact during detection should include or be at least a part of the field area covered by the field angle range of the detection module 19 on the upper surface 101 of the protection layer 100.

Optionally, in some embodiments, the detection module 19 is located below the backlight unit 106, and the detection module 19 is configured to receive the detection light beam 11 with the biometric information of the external object 1000 through the protection layer 11, the display panel 105, and the backlight unit 106 of the optical detection apparatus 10, and convert the detection light beam 11 into a corresponding electrical signal to obtain the biometric information of the external object 1000. The detection module 19 is located below the transparent region 210 of the protection layer 100, and the transparent region 210 of the protection layer 100 is transparent to the detection beam 11. The array substrate, the liquid crystal layer, and the color film substrate of the display panel 105 can transmit the detection beam 11, and the reflector, the light guide plate, and the optical film set of the backlight unit 106 can also transmit the detection beam 11.

Optionally, in some embodiments, the detection module 19 is disposed inside the display panel 105. For example: the detection module 19 may be a photosensitive element (not shown) disposed in a display pixel (not shown) of the display panel 105, and the detection light beam 11 returned by the external object 1000 passes through the protective layer 100 and a portion of the display panel 105 and is received by the photosensitive element and converted into a corresponding electrical signal, so as to implement the biometric detection of the external object 1000.

It is understood that, in other or modified embodiments, the detection module 19 may also be disposed at another suitable position of the optical detection apparatus 10 where the detection beam 11 returned via the external object can be received, which is not limited in the present application.

Referring to fig. 2 and 3, for example, the external object 100 is a finger, and the fingerprint of the finger has concave-convex patterns (e.g., raised valleys and depressed ridges), when the finger contacts the upper surface 101 of the protective layer 100, the ridges of the fingerprint are attached to the upper surface 101 of the protective layer 100, and the valleys are spaced from the upper surface 101 of the protective layer 100 by air. The detection light beam 11 emitted by the light source module 16 enters the inside of the finger to propagate through the protection layer 100, a part of the detection light beam 11 can be transmitted out from the ridge and the valley which are in contact with the detection area VA, the ridge is in direct contact with the upper surface 101 of the protection layer 100, and the detection light beam 11 can be directly refracted from the ridge and penetrate through the upper surface 101 of the protection layer 100 to enter the protection layer 100. Air is spaced between the valleys and the upper surface 101 of the protective layer 100, and the detection beam 11 needs to be refracted from the valleys into the air before being refracted through the air and into the protective layer 100 through the upper surface 101 of the protective layer 100. Since the detection beam 11 causes energy loss every time it is refracted and passes through the air, the detection beam 11 that is returned by transmitting the finger from the ridge and valley of the fingerprint respectively has intensity distribution corresponding to the ridge and valley lines, and thus has fingerprint characteristic information of the finger. Alternatively, the fingerprint feature information may be a fingerprint image formed by the detection beam 11 on the image sensor through the lens module.

Optionally, in some embodiments, the light source module 16 is located below the non-transparent region 210. The light source module 16 is configured to emit a detection light beam 11 through the protection layer 100 to an inside of an external object 1000 located above the protection layer 100. The area where the detection beam 11 passes through the protection layer 100 and exits from the upper surface 101 of the protection layer 100 is defined as an irradiation area PA, and the detection beam 11 exits from the irradiation area and enters the external object 100, wherein a part of the detection beam 11 is transmitted from the surface of the external object 1000 in contact with the detection area VA and returns to the detection module 19. The detection area VA and the irradiation area PA may not overlap each other. It is understood that, in other or modified embodiments, the irradiation region PA may also partially overlap with the detection region VA, and the ratio of the area of the overlapped portion to the total area of the detection region VA is less than or equal to one third.

Referring to fig. 4 and 5, the light source module 16 includes a circuit board structure 160, where the circuit board structure 160 includes a circuit board 161 and a chip 162 electrically connected to the circuit board 161, and the circuit board 161 is used for providing an electrical signal for the chip 162. The circuit board 161 includes a first edge 1610 on one side thereof, and the chip 162 includes a second edge 1620 on one side thereof. Optionally, in some embodiments, the second edge 1620 of the chip 162 and the first edge 1610 of the circuit board 161 are aligned with each other. The first edge 1610 is located on a side of the circuit board 161 facing the protection layer 100, and the first edge 1610 is a top edge of the circuit board 161 closest to the lower surface 102 of the protection layer 100 because the light source module 16 is entirely located below the lower surface 102 of the protection layer 100.

Optionally, in some embodiments, the chip 162 is a light emitting chip for emitting the detection beam 11. The light emitting chip 162 includes a light emitting surface 1626 for emitting the detection light beam 11, and the second edge 1620 is one of the light emitting surfaces 1626. Since the second edge 1620 of the light emitting surface 1626 and the first edge 1610 of the circuit board 161 are aligned with each other, the light emitting surface 1626 of the light emitting chip 162 is located at a position closest to the lower surface 102 of the protection layer 100, like the first edge 1610 of the circuit board 161, of the light source module 16.

It is understood that the light emitting chip 162 refers to an integral package structure including a semiconductor light emitting die (die) and a package for packaging the semiconductor light emitting die, and the related structural features of the light emitting chip 162 described in this application, such as: second edge 1620, light emitting face 1626, etc., refer to structural features on the overall package structure. In many cases in the field, the light emitting chip 162 may also be referred to as a lamp bead or a lamp.

A predetermined safety distance S needs to be reserved between the top edge of the circuit board 161 closest to the protective layer 100 and the lower surface 102 of the protective layer 100 to prevent the top edge of the circuit board 161 from scratching the optical film layer 107 disposed on the lower surface 102 of the non-transparent region 210 of the protective layer 100. Generally speaking, in the existing circuit board structure provided with a light emitting chip, a section of preset space is usually reserved between the position of the light emitting chip disposed on the circuit board and each edge of the circuit board, so that the distance between the light emitting surface of the light emitting chip and the lower surface 102 of the protection layer 100 is the space between the light emitting surface and the top edge of the circuit board plus the safety distance S between the top edge of the circuit board and the lower surface of the protection layer. And in the circuit board structure 160 of this application, because the light emitting surface 1626 edge of light emitting chip 162 with the circuit board 161 aligns each other apart from the nearest top edge of protection layer 100 lower surface 102, the distance between light emitting surface 1626 of light emitting chip 162 and protection layer 100 lower surface 102 is only for safe distance S between the top edge of circuit board 161 and protection layer 100 lower surface 102, thereby makes light emitting surface 1626 of light emitting chip 162 can be close to furthest under the prerequisite that satisfies above-mentioned safe distance S the lower surface 102 of protection layer 100, in order to reduce the energy loss of detecting beam 11 in the projection process.

Alternatively, the circuit board 161 may be, but is not limited to, one or more of a flexible circuit board, a rigid circuit board, and a rigid-flex board. In some embodiments, the circuit board 161 includes a first portion 1611 and a second portion 1612 coupled together. The first portion 1611 is an elongated rectangular thin plate having long sides and short sides substantially perpendicular to each other, and the long sides are parallel to the longitudinal direction of the first portion 1611 itself. The first portion 1611 includes the first edge 1610 and a third edge 1613 disposed opposite the first edge 1610, the third edge 1613 being substantially parallel to the first edge 1610. The first edge 1610 and the third edge 1613 are a pair of long sides of the first portion 1611 along its length.

The second portion 1612 extends outwardly from the second portion 1612 on a side where the third edge 1613 is located. The second portion 1612 is an elongated rectangular thin plate having long sides and short sides substantially perpendicular to each other, and the long sides are parallel to the longitudinal direction of the second portion 1612 itself. Optionally, in some embodiments, the long side of the second portion 1612 is substantially perpendicular to the third edge 1613 of the first portion 1611. That is, the length direction of the second section 1612 itself is substantially perpendicular to the length direction of the first section 1611 itself, and the second section 1612 extends from the third edge 1613 of the first section 1611 in the width direction of the first section 1611. Optionally, in other or modified embodiments, the long side of the second portion 1612 may not be perpendicular to the third edge 1613 of the first portion 1611; alternatively, the circuit board 161 may include a plurality of discrete second portions 1612 extending in different directions from the third edge 1613 of the first portion 1611. The long sides of the second portions 1612 form different included angles with the third edge 1613 of the first portion 1611.

Optionally, in some embodiments, the circuit board structure 160 further includes a driving circuit 163, and the driving circuit 163 is configured to drive the chip 162 to operate. The driving circuit 163 is disposed on the second portion 1612 of the circuit board 161, and is electrically connected to the chip 162 disposed on the first portion 1611 through conductive traces (not shown) formed on the first portion 1611 and the second portion 1612. The driving circuit 163 includes, but is not limited to, a driving chip (not shown) and passive components (not shown), such as a capacitor, a resistor, etc.

Alternatively, in other embodiments, the driving circuit 163 may not be disposed on the circuit board 161 of the present application, but disposed on the optical detection apparatus 10 or another circuit board of the electronic device 1. The light emitting chip 162 is connected to a driving circuit 163 disposed outside through a circuit board 161 of the present application.

Optionally, in some embodiments, the circuit board structure 160 further includes an interface module 164 for interfacing with the outside to interact electrical signals, such as: control signals and power signals, etc. The interface module 164 may be disposed, for example, at an end of the second portion 1612 of the circuit board 161 facing away from the first portion 1611.

The circuit board 161 includes a first surface 1614 and a second surface 1615 which are oppositely arranged along the thickness direction, the first surface 1614 includes a first surface 1614 of the first portion 1611 and a first surface 1614 of the second portion 1612, and the second surface 1615 includes a second surface 1615 of the first portion 1611 and a second surface 1615 of the second portion 1612. Optionally, in some embodiments, the light emitting chip 162 is electrically connected to the first surface 1614 of the first portion 1611, and the reinforcing plate 165 is disposed on the second surface 1615 of the first portion 1611. The driving circuit 163 is disposed on the first surface 1614 of the second portion 1612, and a reinforcing plate 165 is disposed at a position where the second surface 1615 of the second portion 1612 faces the driving circuit 163. The interface module 164 is disposed on the first surface 1614 of the second portion 1612, and a reinforcing plate 165 is disposed at a position where the second surface 1615 of the second portion 1612 faces the interface module 164. The stiffener 165 is made of a hard material with high rigidity, such as, but not limited to, metal, polymer, etc.

Optionally, the light emitting chip 162 includes or is one or more of an LED (light emitting diode), an LD (laser diode), a VCSEL (vertical cavity surface emitting laser), a Mini-LED, a Micro-LED, an OLED (organic light emitting diode), a QLED (quantum dot light emitting diode), or a light emitting array including one or more of an LED, an LD, a VCSEL, a Mini-LED, a Micro-LED, an OLED, and a QLED.

Alternatively, the circuit board structure 160 may include a plurality of the light emitting chips 162, and the plurality of the light emitting chips 162 are spaced along the first edge 1610 of the first portion 1611 of the circuit board 161. As shown in fig. 6, in some embodiments, the distance L0 between each two adjacent light emitting chips 162 is equal, and the value of the distance L0 ranges from 0.5mm to 2 mm.

Optionally, in other embodiments, there are at least two different pitches between pairs of adjacent light emitting chips 162. For example, as shown in fig. 7, the plurality of light emitting chips 162 may be divided into a first light emitting chip group 1621 and a second light emitting chip group 1622, the first light emitting chip group 1621 including three first light emitting chips 162a, and the second light emitting chip group 1622 including three second light emitting chips 162 b. The first light emitting chip set 1621 and the second light emitting chip set 1622 are disposed near two opposite ends of the first portion 1611 along a length direction thereof, respectively. Every two adjacent first light emitting chips 162a have an equal first interval L1 therebetween, every two adjacent second light emitting chips 162b have an equal second interval L2 therebetween, and the closest first light emitting chip 162a and second light emitting chip 162b have a third interval L3 therebetween. The first interval L1 and the second interval L2 may be equal or unequal. The first interval L1 and the second interval L2 range from 0.5mm to 2mm, and the first interval L1 and the second interval L2 range from 0.6mm, 1mm, 1.2mm, 1.65mm, 1.8mm, or 2mm, for example. The third pitch L3 is greater than the first and second pitches L1 and L2. The third distance L3 ranges from 10mm to 25mm, and the third distance L3 is, for example, 10mm, 12mm, 16mm, 20mm, or 25 mm.

Still alternatively, as shown in fig. 8, the plurality of light emitting chips 162 may be divided into a third light emitting chip group 1623, a fourth light emitting chip group 1624 and a fifth light emitting chip group 1625, the third light emitting chip group 1623 includes two third light emitting chips 162c, the fourth light emitting chip group 1624 includes two fourth light emitting chips 162d, and the fifth light emitting chip group 1625 includes two fifth light emitting chips 162 e. The third light emitting chip set 1623 and the fourth light emitting chip set 1624 are respectively disposed near two opposite ends of the first portion 1611 along a length direction thereof, and the fifth light emitting chip set 1625 is disposed between the third light emitting chip set 1623 and the fourth light emitting chip set 1624. The adjacent third light emitting chips 162c have a fourth interval L4 therebetween, the adjacent fourth light emitting chips have a fifth interval L5 therebetween, and the adjacent fifth light emitting chips have a sixth interval L6 therebetween. The fourth interval L4, the fifth interval L5 and the sixth interval L6 may be equal or not. The value range of the fourth interval L4, the fifth interval L5 and the sixth interval L6 is 0.5mm to 2mm, and the value range of the fourth interval L4, the fifth interval L5 and the sixth interval L6 is, for example, 0.6mm, 1mm, 1.2mm, 1.65mm, 1.8mm or 2 mm. A seventh distance L7 is provided between the third and fifth light emitting chips that are closest to each other, and an eighth distance L8 is provided between the fourth and fifth light emitting chips that are closest to each other. The seventh interval L7 and the eighth interval L8 may be equal or unequal. The seventh and eighth spacings L7, L8 are each greater than the fourth spacing L4, fifth spacing L5, or sixth spacing L6. The value of the seventh interval L7 and the eighth interval L8 ranges from 8mm to 12mm, for example, 8mm, 10mm, or 12 mm.

Referring to fig. 1, fig. 2, fig. 4 and fig. 5, the optical detection apparatus 1 further includes a fixing frame 15, and the fixing frame 15 is used for supporting the display module 104. The fixing frame 15 includes a bottom 152 and a sidewall 150, the bottom 152 is located below the display module 104 to support the display module 104, the sidewall 150 extends from the peripheral edge of the bottom 152 and surrounds the display module 104, and one side edge of the sidewall 150 facing away from the bottom 152 is connected to the protection layer 100. The side wall 150 has an inner surface 154 facing the display module 104, and the circuit board 161 may be fixedly connected or detachably connected to the inner surface 154 of the side wall 150 by glue, double-sided tape, adhesive, bolt, bracket, clip, slot, welding, etc., so as to dispose the light emitting chip 162 below the lower surface 102 of the protective layer 100 in the non-transparent region 210. It is understood that, since the light emitting chip 162 and/or the driving circuit 163 are disposed on the first surface 1614 of the circuit board 161, the circuit board 161 is connected to the inner surface 154 of the sidewall 150 through the second surface 1615.

Optionally, in some embodiments, the circuit board 161 is disposed on the inner surface 154 of the sidewall 150 that is connected to the optical detection apparatus 10 and the bottom 14 of the electronic device 1. Correspondingly, the light source module 16 is disposed below the protective layer 100 in the non-transparent region 210 of the bottom 14 of the electronic device 1 and the optical detection device 10. The first edge 1610 of the first portion 1611 is the top edge of the circuit board 161 closest to the protective layer 100, and the first edge 1610 is parallel to the lower surface 102 of the protective layer 100 and is also parallel to the width axis X of the optical detection apparatus 10 and the electronic device 1. Thus, the plurality of light emitting chips 162 are also arranged along the width axis X of the optical detection device 10 and the electronic apparatus 1.

Optionally, in some embodiments, the light emitting surface 1626 of the light emitting chip 162 is perpendicular to the first surface 1614, and the inner surface 154 of the sidewall 150 is perpendicular to the lower surface 102 of the protection layer 100, so that the light emitting surface 1626 of the light emitting chip 162 is parallel to the lower surface 102 of the protection layer 100. Because the second edge 1620 of the light emitting surface 1626 and the first edge 1610 of the circuit board 161 serving as the top edge are aligned with each other, the distance between the light emitting surface 1626 and the lower surface 102 of the protection layer 100 is equal to the safety distance S reserved between the top edge of the circuit board 161 and the lower surface 102 of the protection layer 100, and the value range of the safety distance S is 0.1mm to 0.3 mm.

Optionally, in other embodiments, the light emitting surface 1626 of the light emitting chip 162 may also be disposed obliquely with respect to the first surface 1614 of the circuit board 161, and an included angle smaller than 90 degrees is formed between the light emitting surface 1626 and the first surface 1614.

Optionally, in some embodiments, the bottom 152 of the fixed frame 15 has a first opening 1521. The first opening 1521 is located below the transparent area 220 of the protection layer 100 and substantially opposite to the detection area VA. The detection module 19 is located at least partially below the bottom 152 of the fixed frame 15. Optionally, the detection module 19 is at least partially fixed in the first opening 1521, or the detection module 19 is entirely located below the first opening 1521. The detection beam 11 returning through the external object sequentially passes through the protection layer 100, the display module 104, and the first opening 1521 to reach the detection module 19. Of course, in other embodiments, the detecting module 19 may be offset from the first opening 1521. For example, but not limited to, in some variations or alternative embodiments of the optical inspection device 10 that employ a periscopic imaging configuration.

Optionally, in some embodiments, the bottom 152 of the fixed frame 15 further has a second opening 1522. The second opening 1522 is located below the non-transparent region 210 of the protection layer 100 and corresponds to the circuit board structure 160 disposed on the sidewall 150. The second portion 1612 of the circuit board 161 passes through the second opening 1522 and enters the bottom portion 152, and the end of the second portion 1612, which faces away from the first portion 1611, is electrically connected to the detection module 19 through the interface module 164, so that signals can be exchanged between the detection module 19 and the light emitting chip 152, and the detection process is performed cooperatively.

Optionally, in some embodiments, the electronic device 1 is a mobile phone, and the optical detection device 10 is an off-screen fingerprint detection device for providing an off-screen fingerprint detection function for the mobile phone. The fixed frame 15 is a middle frame of the mobile phone.

Fig. 9 is a schematic structural diagram of an embodiment of a circuit board structure 160 provided in the present application. The circuit board structure 160a shown in fig. 8 and the circuit board structure 160 in fig. 4, 5 and 6 have substantially the same structure. For convenience of description, the element numbers of the circuit board structure 160a and the circuit board structure 160 are the same, and those skilled in the art will understand that, although some elements may not be described in the embodiment, the same numbers may indicate the same elements, and may also indicate similar elements that may be modified, replaced, expanded, or combined. The circuit board structure 160a and the circuit board structure 160 differ mainly in that: at least a portion of the second edge 1620 of the chip 162 on one side thereof extends beyond the first edge 1610 of the circuit board 161 on one side thereof. Alternatively, in some embodiments, the second edge 1620 of the chip 162 may extend entirely beyond the first edge 1610 of the circuit board 161 so as to be located outside of the circuit board 161. Optionally, in some other embodiments, the second edge 1620 of the chip 162 may partially extend beyond the first edge 1610. For example: the first edge 1610 of the circuit board 161 is curved, the second edge 1620 of the chip 162 is straight, and a portion of the second edge 1620 is aligned with or below the first edge 1610 while another portion is below the first edge 1610. Another example is: the first edge 1610 of the circuit board 161 and the second edge 1620 of the chip 162 are both straight lines, the first edge 1610 intersects the second edge 1620, and a portion of the first edge 1610 is located below the second edge 1620 and another portion is located above the second edge 1620. Correspondingly, at least a portion of the chip 162 also extends beyond the first edge 1610 of the circuit board 161, thereby being located outside of the circuit board 161.

Optionally, in some embodiments, the chip 162 is a light emitting chip, and the light emitting chip 162 includes a light emitting surface 1626. When the circuit board structure 160a is disposed on the sidewall 150 of the fixing frame 15, the first edge 1610 is the top edge of the circuit board 161 closest to the protection layer 100, because the light emitting surface 1626 of the light emitting chip 162 is beyond the first edge 1610 of the circuit board 161 as the top edge, the light emitting surface 1626 of the light emitting chip 162 becomes the closest portion of the light source module 16 from the lower surface 102 of the protection layer 100. The minimum distance between the light emitting surface 1626 of the light emitting chip 162 and the lower surface 102 of the protection layer 100 may be the reserved safety distance S in the foregoing embodiment.

In the foregoing embodiment, the chip 162 is mainly taken as an example of a light emitting chip, and is used to describe an application situation of the circuit board structure 161 in a fingerprint detection scene under a screen. It is understood that in other embodiments, the chip 162 in the circuit board structure 161 of the present application may also be a chip with other functions. The application of the circuit board structure 161 in various scenarios where the chip 162 needs to be as close as possible to a specific position is within the scope of the present application.

In the embodiments and modifications of the present application, the optical detection device 10 may be a mobile phone, a tablet computer, an intelligent watch, an augmented reality/virtual reality device, a human body motion detection device, an auto-driven automobile, an intelligent home device, a security device, a medical device, an intelligent robot, or the like, or any of the above components.

It is to be appreciated that although the present application is generally described in the context of fingerprints for illustrative purposes, the circuit board structures 160, 160a and their modified embodiments are not limited to the detection of fingerprints, and the detection objects of the circuit board structures 160, 160a and their modified embodiments can be any objects to be imaged. Generally, a test object may have various characteristics including a biological characteristic. It should be noted that, as an example, the embodiment of the present invention is described with a finger print as a detection object, and it is understood that lines such as a palm, a toe, a palm print, a skin surface texture, and the like can also be used as features of the detection object of the present invention or an external object to be detected.

It should be noted that, in the present embodiment, the optical detection apparatus 10 and other embodiments are described, and the structures, numbers, positions, driving manners, and the like of the light source module 16, the detection module 19, the protection layer 100, the display panel 105, the circuit board 161, the chip 162, the driving circuit 163, the optical film layer 107, the backlight unit 106, and the like can be applied to the embodiments described in the present application and other or modified embodiments, and the replacement, change, extension, arrangement, combination, collocation, increase, decrease, omission, multiplexing, and the like thereof are all within the protection scope of the present application.

It should be noted that, those skilled in the art can understand that, without creative efforts, some or all of the embodiments of the present invention, and some or all of the deformation, replacement, alteration, split, combination, extension, etc. of the embodiments should be considered as covered by the inventive idea of the present invention, and belong to the protection scope of the present invention.

Any reference in this specification to "one embodiment," "an embodiment," "example embodiment," etc., means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment. Further, when a particular feature or structure is described in connection with any embodiment, it is submitted that it is within the purview of one skilled in the art to effect such feature or structure in connection with other ones of the embodiments.

The orientations or positional relationships indicated in the specification of "length", "width", "upper", "lower", "left", "right", "front", "rear", "back", "front", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., which may appear in the present invention, are orientations or positional relationships indicated on the basis of the drawings, and are only for convenience of describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Like reference numbers and letters refer to like items in the figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance. In the description of the present invention, "plurality" or "a plurality" means at least two or two unless specifically defined otherwise. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, "disposed," "mounted" or "connected" is to be understood in a broad sense, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The above description is only for the specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. The terms used in the following claims should not be construed to limit the invention to the specific embodiments disclosed in the specification. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (15)

1. A circuit board structure is characterized by comprising a circuit board and a chip electrically connected on the circuit board, wherein the circuit board is used for providing electric signals for the chip, the circuit board comprises a first edge positioned on one side of the circuit board, the chip comprises a second edge positioned on one side of the circuit board, the second edge of the chip is aligned with the first edge of the circuit board, or at least part of the second edge of the chip exceeds the first edge of the circuit board.

2. The circuit board structure according to claim 1, wherein the chip is a light emitting chip including a light emitting face for emitting a light beam, and the second edge is one of the light emitting faces.

3. The circuit board structure according to claim 2, wherein the circuit board comprises a first surface for connecting the chip, the light emitting face being perpendicular to the first surface; or the light emitting surface is obliquely arranged at a preset angle relative to the first surface.

4. The circuit board structure of claim 2, wherein the light emitting chips are one or more of LED, VCSEL, OLED, MICRO-LED, MINI-LED.

5. The circuit board structure of claim 2, wherein the light beam emitted by the light emitting chip is infrared light or near infrared light, and the wavelength range is 700 nm to 2500 nm.

6. The circuit board structure according to claim 1, wherein the circuit board is one or more of a flexible circuit board, a rigid circuit board, and a rigid-flex board.

7. The circuit board structure of claim 1, wherein the circuit board comprises a first portion and a second portion connected to each other, the first portion comprises the first edge and a third edge opposite to the first edge, the second portion extends outward from the first portion on a side where the third edge is located, and the chip is electrically connected to the first portion.

8. The circuit board structure according to claim 7, further comprising a driving circuit, wherein the driving circuit is disposed on the second portion, the driving circuit is electrically connected to the chip through traces disposed on the first portion and the second portion, and the driving circuit is configured to drive the chip to operate.

9. The circuit board structure according to claim 7, wherein the first portion is an elongated rectangular thin plate having a length direction and a width direction perpendicular to each other, the first edge is parallel to the length direction of the first portion, and the second portion extends along the width direction of the first portion.

10. The circuit board structure of claim 1, comprising a plurality of said chips, said plurality of said chips being spaced along said first edge.

11. The circuit board structure of claim 10, wherein the spacing between each two adjacent chips is equal; or

At least two different pitches are arranged between the adjacent chips of the plurality of pairs.

12. The circuit board structure according to claim 1, wherein the chip is a light emitting chip, the light emitting chip includes a light emitting surface for emitting a light beam, the circuit board includes a first surface for connecting the light emitting chip, the light emitting surface is perpendicular to the first surface, the light emitting surface and the first edge are aligned with each other, or the light emitting surface exceeds the first edge.

13. A light source module, comprising a circuit board structure according to any one of claims 1 to 12, wherein the chip is a light emitting chip for emitting a detection light beam, and the detection light beam is used for biological feature detection.

14. An optical inspection device having an underscreen biometric detection function, comprising:

the protective layer comprises an upper surface and a lower surface which are oppositely arranged, and the upper surface is provided with a detection area which can be directly touched by an external object during detection;

the display module is positioned below the lower surface and used for displaying pictures through the protective layer;

the light source module is used for emitting a detection light beam to an external object located above the protective layer, the light source module is the light source module in claim 13, the first edge is a side edge of the circuit board closest to the lower surface of the protective layer, the light emitting chip includes a light emitting surface for emitting the light beam, and the second edge is one edge of the light emitting surface.

15. The optical detection device according to claim 14, wherein the light emitting chip emits the detection light beam to an external object above the protection layer through the light emitting surface, the light emitting surface faces the protection layer, and the optical detection device further comprises a detection module configured to receive the detection light beam returned by the external object to obtain the biometric information of the external object.

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