CN211425649U

CN211425649U - Sensor circuit board

Info

Publication number: CN211425649U
Application number: CN202020302828.3U
Authority: CN
Inventors: 施文钦; 曾昭文
Original assignee: Tangzhi Science & Technology Hunan Development Co ltd
Current assignee: Tangzhi Science & Technology Hunan Development Co ltd
Priority date: 2020-03-12
Filing date: 2020-03-12
Publication date: 2020-09-04
Anticipated expiration: 2030-03-12

Abstract

The utility model discloses a sensor circuit board, install when inside the sensor, the sensing element through the side-mounting of circuit board body can be sensitive by the vibration impact physical quantity of position finding and convert it into charge signal, the signal conditioning circuit through the side-mounting of circuit board body can be voltage signal with the charge signal conversion of sensing element output, make things convenient for the back level acquisition circuit to gather, thereby realize the monitoring to the position finding vibration impact signal, the step board that sets up through the bottom of circuit board body can conveniently weld the pin that is used for monitoring temperature signal's temperature element, that is to say, can strike sensing element and temperature element at the inside integrated vibration of sensor simultaneously. Therefore, compared with the prior art, the vibration impact signal of the measured position can be monitored when the temperature sensor is installed inside the sensor, meanwhile, the temperature measuring element for monitoring the temperature signal is convenient to integrate, and the installation space of the sensor is saved.

Description

Sensor circuit board

Technical Field

The utility model relates to a monitoring facilities technical field, in particular to sensor circuit board.

Background

The sensor is widely applied to the fields of machinery, ships, rail transit and the like as a monitoring device, wherein a vibration impact sensor is mounted on a rotating part of a travelling part of a common motor train unit, a physical quantity of vibration impact at a measured position is sensed by a sensitive element on an internal circuit board of the sensor, and the physical quantity of vibration impact at the measured position is converted into an electric signal and then transmitted through a connecting cable, so that a vibration impact signal is monitored.

However, in actual operation, the running speed of the motor train unit is extremely high, and the fault of the rotating component of the running gear of the motor train unit is easy to cause too large vibration impact and cause too high temperature, so that not only the vibration impact of the rotating component of the running gear of the motor train unit but also the temperature monitoring needs to be realized. However, the existing vibration impact sensor can only monitor vibration impact signals, a temperature sensor needs to be separately installed for monitoring temperature signals, a temperature measuring element in the sensor detects the temperature signals of a measured position, and the temperature signals are transmitted through a connecting cable, so that more installation space is consumed.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a sensor circuit board can realize being convenient for simultaneously the integrated temperature element who is used for monitoring temperature signal to the monitoring by position vibration impact signal of being surveyed when installing inside the sensor, practices thrift the installation space of sensor.

The utility model provides a sensor circuit board, including the circuit board body, the side of circuit board body is installed sensing element and signal conditioning circuit, sensing element is used for the vibration impact physical quantity of the sensitive position of being surveyed and converts it into the charge signal, signal conditioning circuit is used for converting the charge signal of sensing element output into voltage signal; the bottom of the circuit board body is provided with a step plate, and the step plate is used for welding pins of the temperature measuring element.

Preferably, the thickness of the step plate is smaller than that of the circuit board body.

Preferably, the periphery of the bottom end of the circuit board body is provided with a conical surface for signal transmission.

Preferably, the top end of the circuit board body is provided with a limiting step for radial fixation.

Preferably, the periphery of the top end of the circuit board body is provided with a protrusion for positioning.

Preferably, the sensitive element and the signal conditioning circuit are externally provided with a shielding case for shielding interference.

Preferably, the signal conditioning circuit comprises a first charge amplification module, a second charge amplification module and a differential amplification module;

the input end of the first charge amplification module and the input end of the second charge amplification module are respectively connected with two ends of the sensitive element and are used for converting the charge signal output by the sensitive element into a voltage signal;

the first input end and the second input end of the differential amplifying module are respectively connected with the output end of the first charge amplifying module and the output end of the second charge amplifying module, and the output end of the differential amplifying module is connected with the input end of a rear-stage detection system and used for differentially amplifying voltage signals output by the first charge amplifying module and the second charge amplifying module.

Preferably, the first charge amplification module comprises a first operational amplifier, a first capacitor, a first resistor and a second resistor, and the second charge amplification module comprises a second operational amplifier, a second capacitor, a third resistor and a fourth resistor;

the inverting input end of the first operational amplifier is used as the input end of the first charge amplification module, the non-inverting input end of the first operational amplifier is connected with a reference voltage, the output end of the first operational amplifier is used as the output end of the first charge amplification module, two ends of the first capacitor are respectively connected with the inverting input end of the first operational amplifier and the output end of the first operational amplifier, the first end of the first resistor is connected with the inverting input end of the first operational amplifier, the second end of the first resistor is connected with the first end of the second resistor, and the second end of the second resistor is connected with the output end of the first operational amplifier;

the inverting input end of the second operational amplifier is used as the input end of the second charge amplification module, the non-inverting input end of the second operational amplifier is connected to the reference voltage, the output end of the second operational amplifier is used as the output end of the second charge amplification module, two ends of the second capacitor are respectively connected with the inverting input end of the second operational amplifier and the output end of the second operational amplifier, the first end of the third resistor is connected with the inverting input end of the second operational amplifier, the second end of the third resistor is connected with the first end of the fourth resistor, and the second end of the fourth resistor is connected with the output end of the second operational amplifier.

Preferably, the differential amplification module comprises a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor and a third operational amplifier;

a first end of the fifth resistor is used as a first input end of the differential amplification module, a second end of the fifth resistor is respectively connected with a first end of the sixth resistor and an inverting input end of the third operational amplifier, a second end of the sixth resistor is connected to the reference voltage, a first end of the seventh resistor is used as a second input end of the differential amplification module, a second end of the seventh resistor is respectively connected with a first end of the eighth resistor and a non-inverting input end of the third operational amplifier, a second end of the eighth resistor is connected with an output end of the third operational amplifier, and a common end of the eighth resistor is used as an output end of the differential amplification module.

Preferably, the signal conditioning circuit further includes a bootstrap module, configured to boost a voltage of the voltage signal output by the first charge amplification module and the second charge amplification module.

Preferably, the bootstrap module comprises a ninth resistor, a tenth resistor and a third capacitor;

the first end of the ninth resistor is connected with the connection node of the second end of the first resistor and the first end of the second resistor, the second end of the ninth resistor is connected with the first end of the third capacitor, the second end of the third capacitor is connected with the first end of the tenth resistor, and the second end of the tenth resistor is connected with the connection node of the second end of the third resistor and the first end of the fourth resistor.

Preferably, the bootstrap module comprises an eleventh resistor and a fourth capacitor;

the first end of the eleventh resistor is connected with a connection node between the second end of the first resistor and the first end of the second resistor, the second end of the eleventh resistor is connected with the first end of the fourth capacitor, and the second end of the fourth capacitor is connected with a connection node between the second end of the third resistor and the first end of the fourth resistor.

Preferably, the signal conditioning circuit further comprises an anti-interference module for improving the anti-interference capability of the sensitive element.

Preferably, the anti-interference module comprises a twelfth resistor, a thirteenth resistor, a fifth capacitor and a sixth capacitor;

a first end of the twelfth resistor is connected to the first end of the sensing element and the first end of the fifth capacitor, a second end of the twelfth resistor is connected to the first end of the thirteenth resistor, a second end of the thirteenth resistor is connected to the second end of the sensing element and the first end of the sixth capacitor, a common terminal of the twelfth resistor and the thirteenth resistor is connected to the reference voltage, a second end of the fifth capacitor is connected to the input terminal of the first charge amplification module, and a second end of the sixth capacitor is connected to the input terminal of the second charge amplification module.

Preferably, the interference rejection module comprises a fourteenth resistor, a seventh capacitor and an eighth capacitor;

a first end of the fourteenth resistor is connected to the first end of the sensing element and the first end of the seventh capacitor, a second end of the fourteenth resistor is connected to the second end of the sensing element and the first end of the eighth capacitor, a second end of the seventh capacitor is connected to the input end of the first charge amplification module, and a second end of the eighth capacitor is connected to the input end of the second charge amplification module.

Preferably, the signal conditioning circuit further comprises a first power supply processing module;

the input end of the first power supply processing module is connected with an input power supply, the first output end of the first power supply processing module is used for providing power supply voltage, and the second output end of the first power supply processing module is used for providing the reference voltage.

Preferably, the first power supply processing module comprises a diode, a fifteenth resistor, a ninth capacitor, a tenth capacitor and a first voltage regulator tube;

the anode of the diode is used as the input end of the first power processing module, the cathode of the diode is respectively connected with the first end of the fifteenth resistor and the first end of the ninth capacitor, the common end of the diode is used as the first output end of the first power processing module, the second end of the fifteenth resistor is respectively connected with the first end of the tenth capacitor and the cathode of the first voltage regulator tube, the common end of the fifteenth resistor is used as the second output end of the first power processing module, and the second end of the ninth capacitor, the second end of the tenth capacitor and the anode of the first voltage regulator tube are all connected with the ground.

Preferably, the signal conditioning circuit further comprises a second power supply processing module;

the input end of the second power supply processing module is connected with the second output end of the first power supply processing module, and the output end of the second power supply processing module is used for supplying power to the temperature measuring element.

Preferably, the second power supply processing module comprises a sixteenth resistor, an eleventh capacitor and a second voltage regulator tube;

and a first end of the sixteenth resistor is used as an input end of the second power supply processing module, a second end of the sixteenth resistor is respectively connected with a first end of the eleventh capacitor and a cathode of the second voltage-stabilizing tube, a common end of the sixteenth resistor is used as an output end of the second power supply processing module, and a second end of the eleventh capacitor and an anode of the second voltage-stabilizing tube are both connected with the ground.

Preferably, the second power supply processing module comprises a fourth operational amplifier, a seventeenth resistor and a twelfth capacitor;

the non-inverting input end of the fourth operational amplifier is used as the input end of the second power supply processing module, the inverting input end of the fourth operational amplifier is respectively connected with the output end of the fourth operational amplifier and the first end of the seventeenth resistor, the second end of the seventeenth resistor is connected with the first end of the twelfth capacitor, the common end of the seventeenth resistor is used as the output end of the second power supply processing module, and the second end of the twelfth capacitor is connected with the ground.

Preferably, the signal conditioning circuit further comprises an electrostatic protection module for providing electrostatic protection;

the electrostatic protection module comprises a first electrostatic discharge tube, a second electrostatic discharge tube, a third electrostatic discharge tube and a fourth electrostatic discharge tube;

the first end of the first electrostatic discharge tube is connected with the input end of the first power supply processing module, the first end of the second electrostatic discharge tube is connected with the second output end of the first power supply processing module, the first end of the third electrostatic discharge tube is connected with the output end of the differential amplification module, the first end of the fourth electrostatic discharge tube is connected with the output end of the temperature measuring element, and the second end of the first electrostatic discharge tube, the second end of the second electrostatic discharge tube, the second end of the third electrostatic discharge tube and the second end of the fourth electrostatic discharge tube are all connected with the ground.

The utility model provides a sensor circuit board, install when the sensor is inside, the sensing element through the side-mounting of circuit board body can be sensitive by the vibration impact physical quantity of position finding and convert it into charge signal, the signal conditioning circuit through the side-mounting of circuit board body can be with the charge signal conversion of sensing element output for voltage signal and amplify, make things convenient for the back level acquisition circuit to gather, thereby realize the monitoring to the position finding vibration impact signal, the step board that sets up through the bottom of circuit board body can conveniently weld the pin that is used for monitoring temperature signal's temperature element, that is to say, can impact sensing element and temperature element at the inside integrated vibration of sensor simultaneously. Therefore, compared with the prior art, the vibration impact signal of the measured position can be monitored when the temperature sensor is installed inside the sensor, meanwhile, the temperature measuring element for monitoring the temperature signal is convenient to integrate, and the installation space of the sensor is saved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic perspective view of a sensor circuit board according to an embodiment of the present invention;

fig. 2 is a schematic front view of a sensor circuit board according to an embodiment of the present invention;

fig. 3 is a schematic left-view diagram of a sensor circuit board according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a signal conditioning circuit according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of another signal conditioning circuit according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of another signal conditioning circuit according to an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a first power processing module according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a second power processing module according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of another second power processing module according to an embodiment of the present invention.

Detailed Description

In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or be indirectly disposed on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, the meaning of a plurality of or a plurality of is two or more unless specifically limited otherwise.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for understanding and reading the contents disclosed in the specification, and are not used for limiting the conditions that the present application can implement, so the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should still fall within the scope of the technical content disclosed in the present application without affecting the efficacy and the achievable purpose of the present application.

Referring to fig. 1 to 3, an embodiment of the present invention provides a sensor circuit board, including a circuit board body 1, a sensing element 2 and a signal conditioning circuit 3 are installed on a side surface of the circuit board body 1, the sensing element 2 is used for sensing a vibration impact physical quantity of a measured position and converting the vibration impact physical quantity into a charge signal, and the signal conditioning circuit 3 is used for converting the charge signal output by the sensing element 2 into a voltage signal; the bottom end of the circuit board body 1 is provided with a step plate 11, and the step plate 11 is used for welding pins of the temperature measuring element.

The embodiment of the utility model provides an in, this sensor circuit board is generally installed inside sensor housing, the sensing element 2 through the side-mounting of circuit board body 1 can be sensitive by the vibration impact physical quantity of position finding and convert it into charge signal, can convert the charge signal of sensing element 2 output into voltage signal through signal conditioning circuit 3, make things convenient for the back level acquisition circuit to gather, thereby realize the monitoring to by position vibration impact signal of position finding, step board 11 through the bottom setting of circuit board body 1 can conveniently weld the pin that is used for monitoring temperature signal's temperature element, that is to say, can impact sensing element and temperature element at the inside integrated vibration of sensor simultaneously. Therefore, compared with the prior art, the vibration impact signal of the measured position can be monitored when the temperature sensor is installed inside the sensor, meanwhile, the temperature measuring element for monitoring the temperature signal is convenient to integrate, and the installation space of the sensor is saved.

Specifically, on the basis of the above embodiments, in some optional embodiments of the present invention, the thickness of the step plate 11 is smaller than the thickness of the circuit board body 1.

The embodiment of the utility model provides an in, need remain sufficient insulation distance between considering temperature element's pin and the sensor casing, consequently will be used for the thickness design of 11 of the step board of welding temperature element pin for being less than the thickness of circuit board body 1, can increase the interval of temperature element pin and sensor casing, guarantee the withstand voltage requirement of sensor. Specifically, the temperature measuring element needs to extend into the interior of the measured component to accurately monitor the temperature signal thereof, so the temperature measuring element is generally inserted into the bottom end of the sensor housing and extends into the mounting hole of the measured component along with the sensor base during mounting. However, the sensor mounting holes are generally bolt holes, so that the inner space of the bottommost end of the sensor shell is limited, and if the pins of the temperature measuring element are directly welded on the circuit board body 1, the distance between the pins of the temperature measuring element and the sensor shell is too close to meet the pressure-resistant requirement of the sensor. And through designing the thickness of the step plate 11 to be smaller than the thickness of the circuit board body 1, after the pins of the temperature measuring element are welded on the step plate 11, the distance between the pins and the shell of the sensor can be increased, and the sufficient insulation distance is ensured, so that the failure rate of the pressure resistance of the sensor can be reduced.

In order to improve the signal monitoring sensitivity of the sensor, in some specific embodiments of the present invention, the periphery of the bottom end of the circuit board body 1 is provided with a conical surface 12 for signal transmission. The embodiment of the utility model provides an in, through setting up conical surface 12, help sensor housing with bottom received vibration impact signal transmission to the sensing element 2 on the circuit board body 1, improve the signal monitoring sensitivity of sensor. Optionally, when the sensor structure is designed, an inner conical surface matched with the conical surface 12 may be arranged on the inner wall of the bottom of the sensor housing, so that the sensor circuit board may be conveniently fixed.

In order to improve the fixed effect of sensor circuit board the utility model discloses some specific embodiments, the top of circuit board body 1 is equipped with the spacing step 13 that is used for radial fixation. The embodiment of the utility model provides an in, after inserting sensor circuit board sensor housing's bottom, generally need carry out axial fixity to sensor circuit board through pressing cover or gland, set up spacing step 13 through the top at circuit board body 1, can cooperate with pressing the cover, radially fixed sensor circuit board.

In order to be able to control the accurate positioning of the sensor circuit board, on the basis of the above embodiments, in some embodiments of the present invention, the periphery of the top end of the circuit board body 1 is provided with a protrusion 14 for positioning. The embodiment of the utility model provides an in, set up arch 14 through the periphery on the top of circuit board body 1, can pinpoint the sensor circuit board. Optionally, when the sensor structure is designed, the guide groove matched with the protrusion 14 can be formed in the inner wall of the sensor shell, so that when the sensor circuit board is installed on the sensor shell, the protrusion 14 can be embedded into the guide groove of the sensor shell, the sensor circuit board is conveniently positioned, and the sensitivity consistency of the sensor can be improved.

As an alternative embodiment of the present invention, the sensing element 2 and the signal conditioning circuit 3 are provided with shielding cases for shielding interference. The embodiment of the utility model provides an in, set up the shield cover through the outside at sensing element 2 and signal conditioning circuit 3, can prevent external interference, improve signal transmission's stability.

Referring to fig. 4 to 9, in some embodiments of the present invention, the signal conditioning circuit 3 includes a first charge amplifying module 310, a second charge amplifying module 320 and a differential amplifying module 330;

the input end of the first charge amplification module 310 and the input end of the second charge amplification module 320 are respectively connected to two ends of the sensing element 2, and are used for converting the charge signal output by the sensing element 2 into a voltage signal;

the first input end and the second input end of the differential amplifying module 330 are respectively connected to the output end of the first charge amplifying module 310 and the output end of the second charge amplifying module 320, and the output end of the differential amplifying module 330 is connected to the input end of the rear-stage detection system, and is configured to differentially amplify the voltage signals output by the first charge amplifying module 310 and the second charge amplifying module 320.

Specifically, on the basis of the above embodiments, in some optional embodiments of the present invention, the first charge amplifying module 310 includes a first operational amplifier, a first capacitor, a first resistor and a second resistor, and the second charge amplifying module 320 includes a second operational amplifier, a second capacitor, a third resistor and a fourth resistor;

the inverting input end of the first operational amplifier is used as the input end of the first charge amplification module 310, the non-inverting input end of the first operational amplifier is connected with the reference voltage, the output end of the first operational amplifier is used as the output end of the first charge amplification module 310, two ends of the first capacitor are respectively connected with the inverting input end of the first operational amplifier and the output end of the first operational amplifier, the first end of the first resistor is connected with the inverting input end of the first operational amplifier, the second end of the first resistor is connected with the first end of the second resistor, and the second end of the second resistor is connected with the output end of the first operational amplifier;

the inverting input end of the second operational amplifier is used as the input end of the second charge amplification module 320, the non-inverting input end of the second operational amplifier is connected to the reference voltage, the output end of the second operational amplifier is used as the output end of the second charge amplification module 320, two ends of the second capacitor are respectively connected to the inverting input end of the second operational amplifier and the output end of the second operational amplifier, the first end of the third resistor is connected to the inverting input end of the second operational amplifier, the second end of the third resistor is connected to the first end of the fourth resistor, and the second end of the fourth resistor is connected to the output end of the second operational amplifier.

In the embodiment of the present invention, the first charge amplification module 310 is composed of a first operational amplifier N1A, a first capacitor C1, a first resistor R1 and a second resistor R2, and the second charge amplification module 320 is composed of a second operational amplifier N1B, a second capacitor C2, a third resistor R3 and a fourth resistor R4. The non-inverting input ends of the first operational amplifier N1A and the second operational amplifier N1B are both connected to the reference voltage VDD, the inverting input ends of the first operational amplifier N1A and the second operational amplifier N1B are respectively connected to two ends of the sensor 2, and the output ends of the first operational amplifier N1A and the second operational amplifier N1B are respectively connected to the first input end and the second input end of the differential amplification module 330; a first capacitor C1 and a second capacitor C2 are used for realizing charge-to-voltage conversion, wherein the first capacitor C1 is connected between the inverting input terminal of the first operational amplifier N1A and the output terminal of the first operational amplifier N1A, and the second capacitor C1 is connected between the inverting input terminal of the second operational amplifier N1B and the output terminal of the first operational amplifier N1A; the first resistor R1 and the second resistor R2 are connected in series and then are connected in parallel to two ends of the first capacitor C1, and the first resistor R1 and the second resistor R2 are used for guaranteeing normal static operation of the first operational amplifier N1A; the third resistor R3 and the fourth resistor R4 are connected in series and then connected in parallel to two ends of the second capacitor C2, so as to ensure that the second operational amplifier N1B works normally in a static state.

Further, on the basis of the above embodiments, in some alternative embodiments, the differential amplifying module 330 includes a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, and a third operational amplifier; a first end of the fifth resistor is used as a first input end of the differential amplification module 330, a second end of the fifth resistor is connected to a first end of the sixth resistor and an inverting input end of the third operational amplifier, respectively, a second end of the sixth resistor is connected to the reference voltage, a first end of the seventh resistor is used as a second input end of the differential amplification module 330, a second end of the seventh resistor is connected to a first end of the eighth resistor and a non-inverting input end of the third operational amplifier, respectively, a second end of the eighth resistor is connected to an output end of the third operational amplifier, and a common end of the eighth resistor is used as an output end of the differential amplification module 330.

In the embodiment of the present invention, the differential amplifying module 330 is composed of two sets of symmetrical fifth resistor R5, sixth resistor R6, seventh resistor R7, eighth resistor R8 and third operational amplifier N1C. A first end of the fifth resistor R5 and a first end of the seventh resistor R7 are respectively connected to the output end of the first charge amplification module 310 and the output end of the second charge amplification module 320, and a second end of the fifth resistor R5 and a second end of the seventh resistor R7 are respectively connected to the inverting input end of the third operational amplifier N1C and the non-inverting input end of the third operational amplifier N1C; a first end of the sixth resistor R6 is connected to the reference voltage VDD, and a second end of the sixth resistor R6 is connected to a connection node between a second end of the fifth resistor R5 and the inverting input terminal of the third operational amplifier N1C; a first end of the eighth resistor R8 is connected to a connection node between a second end of the seventh resistor R7 and the non-inverting input terminal of the third operational amplifier N1C, a second end of the eighth resistor R8 is connected to the output terminal of the third operational amplifier N1C, and a common terminal of the eighth resistor R8 is connected to the input terminal of the post-detection system; the positive power supply end of the third operational amplifier N1C is connected to the power supply voltage VCC, and the ground end of the third operational amplifier N1C is grounded.

Further, on the basis of the above embodiments, in some optional embodiments, the signal conditioning circuit 3 further includes a bootstrap module 340, configured to boost the voltage of the voltage signals output by the first charge amplifying module 310 and the second charge amplifying module 320. In this embodiment, considering that the gain of the sensing device 2 is too small in the low frequency range, the bootstrap module 340 is designed between the first charge amplifying module 310 and the second charge amplifying module 320, so as to boost the voltage of the voltage signals output by the first charge amplifying module 310 and the second charge amplifying module 320.

Optionally, on the basis of the foregoing embodiment, in a specific implementation manner, the bootstrap module 340 includes a ninth resistor, a tenth resistor, and a third capacitor; the first end of the ninth resistor is connected with the connection node of the second end of the first resistor and the first end of the second resistor, the second end of the ninth resistor is connected with the first end of the third capacitor, the second end of the third capacitor is connected with the first end of the tenth resistor, and the second end of the tenth resistor is connected with the connection node of the second end of the third resistor and the first end of the fourth resistor.

In the embodiment of the present invention, the bootstrap module 340 is composed of a ninth resistor R9, a tenth resistor R10 and a third capacitor C3. The ninth resistor R9 and the tenth resistor R10 are both current-limiting resistors, the first end of the ninth resistor R9 is connected between the first resistor R1 and the second resistor R2, and the second end of the ninth resistor R9 is connected with one end of the third capacitor C3; a first end of the tenth resistor R10 is connected between the third resistor R3 and the fourth resistor R4, and a second end of the tenth resistor R10 is connected to the other end of the third capacitor C3; the third capacitor C3 is a bootstrap capacitor, and is used to boost the voltage of the voltage signals output by the first charge amplification module 310 and the second charge amplification module 320, so as to compensate the defect that the gain of the sensing element 2 is too small in the low frequency range.

Optionally, in another specific embodiment, the bootstrap module 340 includes an eleventh resistor and a fourth capacitor; the first end of the eleventh resistor is connected with a connection node between the second end of the first resistor and the first end of the second resistor, the second end of the eleventh resistor is connected with the first end of the fourth capacitor, and the second end of the fourth capacitor is connected with a connection node between the second end of the third resistor and the first end of the fourth resistor. In this embodiment, the bootstrap module 340 is composed of an eleventh resistor R11 and a fourth capacitor C4.

As the preferred embodiment of the present invention, the signal conditioning circuit 3 further includes an anti-interference module 350 for improving the anti-interference capability of the sensing element 2.

Further, on the basis of the foregoing embodiment, in a specific implementation manner, the anti-interference module 350 includes a twelfth resistor, a thirteenth resistor, a fifth capacitor, and a sixth capacitor, where a first end of the twelfth resistor is connected to the first end of the sensing element 2 and the first end of the fifth capacitor, a second end of the twelfth resistor is connected to the first end of the thirteenth resistor, a second end of the thirteenth resistor is connected to the second end of the sensing element 2 and the first end of the sixth capacitor, a common end of the twelfth resistor and the thirteenth resistor is connected to the reference voltage, a second end of the fifth capacitor is connected to the input end of the first charge amplification module 310, and a second end of the sixth capacitor is connected to the input end of the second charge amplification module 320.

In the embodiment of the present invention, the anti-interference module 350 is composed of a twelfth resistor R12, a thirteenth resistor R13, a fifth capacitor C5 and a sixth capacitor C6. The twelfth resistor R12 and the thirteenth resistor R13 are connected in series to two ends of the sensor 2, a common terminal of the twelfth resistor R12 and the thirteenth resistor R13 is connected to the reference voltage VDD, the fifth capacitor C5 is connected in series between the first end of the sensor 2 and the input terminal of the first charge amplification module 310, and the sixth capacitor C6 is connected in series between the second end of the sensor 2 and the input terminal of the second charge amplification module 320, so that the anti-interference capability of the sensor 2 can be effectively improved.

Optionally, in another specific embodiment, the immunity module 350 includes a fourteenth resistor, a seventh capacitor, and an eighth capacitor, where a first end of the fourteenth resistor is connected to the first end of the sensing element 2 and the first end of the seventh capacitor, a second end of the fourteenth resistor is connected to the second end of the sensing element 2 and the first end of the eighth capacitor, a second end of the seventh capacitor is connected to the input end of the first charge amplification module 310, and a second end of the eighth capacitor is connected to the input end of the second charge amplification module 320. In this embodiment, the anti-jamming module 350 is composed of a fourteenth resistor R14, a seventh capacitor C7, and an eighth capacitor C8.

As a preferred embodiment of the present invention, the signal conditioning circuit 3 further includes a first power processing module 360; the input end of the first power processing module 360 is connected to an input power, the first output end of the first power processing module 360 is used for providing a power voltage, and the second output end of the first power processing module 360 is used for providing a reference voltage.

The embodiment of the utility model provides an in, in order to guarantee signal conditioning circuit 3's stability, consequently increased first power processing module 360 in signal conditioning circuit 3, its input inserts external input power, and first output provides stable mains voltage for signal conditioning circuit 3, and the second output provides stable reference voltage for signal conditioning circuit 3 to improve reference voltage's precision.

Specifically, in the above embodiment, the first power processing module 360 includes a diode, a fifteenth resistor, a ninth capacitor, a tenth capacitor, and a first voltage regulator tube; the anode of the diode is used as the input end of the first power processing module 360, the cathode of the diode is respectively connected with the first end of the fifteenth resistor and the first end of the ninth capacitor, the common end of the diode is used as the first output end of the first power processing module 360, the second end of the fifteenth resistor is respectively connected with the first end of the tenth capacitor and the cathode of the first voltage regulator tube, the common end of the diode is used as the second output end of the first power processing module 360, and the second end of the ninth capacitor, the second end of the tenth capacitor and the anode of the first voltage regulator tube are all connected with the ground.

In the embodiment of the present invention, the first power processing module 360 is composed of a diode V1, a fifteenth resistor R15, a ninth capacitor C9, a tenth capacitor C10, and a first voltage regulator tube Z1; the diode V1 is an anti-reverse diode, and the anode of the diode V1 is connected with an external input power supply; the ninth capacitor C9 is a filter capacitor, and has a first terminal connected to the cathode of the diode V1 and a second terminal connected to ground; a connection node between the cathode of the diode V1 and the first end of the ninth capacitor C9 outputs a power supply voltage VCC to supply power to the positive power supply terminal of the operational amplifier in the signal conditioning circuit 3; the fifteenth resistor R15 is a current-limiting resistor for limiting the maximum current flowing through the first regulator tube Z1, and has a first end connected to the connection node between the cathode of the diode V1 and the first end of the ninth capacitor C9; a tenth capacitor C10 is a filter capacitor, a first voltage regulator tube Z1 is a voltage regulator diode, the first end of the tenth capacitor C10 and the cathode of the first voltage regulator tube Z1 are both connected with the second end of a fifteenth resistor R15, and the first end of the tenth capacitor C10 and the anode of the first voltage regulator tube Z1 are both connected with the ground; the connection node between the second terminal of the fifteenth resistor R15, the first terminal of the tenth capacitor C10, and the cathode of the first regulator tube Z1 outputs the reference voltage VDD, which provides the reference voltage for the first charge amplification module 310, the second charge amplification module 320, the differential amplification module 330, and the like. Optionally, the sensing element 2 may also be powered by the reference voltage VDD; when the temperature measuring element arranged in the sensor outputs analog signals such as a platinum resistor temperature sensitive device, the temperature measuring element outputting the analog signals can also be directly powered by the reference voltage VDD.

Further, on the basis of the above embodiments, in some optional embodiments, the signal conditioning circuit 3 further includes a second power supply processing module 370; the input end of the second power processing module 370 is connected to the second output end of the first power processing module 360, and the output end of the second power processing module 370 is used for supplying power to the temperature measuring element.

The embodiment of the utility model provides an in, the temperature element of considering sensor internally mounted is probably digital signal output, and sensing element 2 is analog signal output, in order to avoid mutual interference, consequently still increased second power processing module 370 in signal conditioning circuit 3, the second output of first power processing module 360 is connected to its input, and its output is digital signal output's temperature element power supply.

Optionally, in a specific embodiment, the second power processing module 370 includes a sixteenth resistor, an eleventh capacitor, and a second voltage regulator; a first end of the sixteenth resistor is used as an input end of the second power processing module 370, a second end of the sixteenth resistor is respectively connected to a first end of the eleventh capacitor and a cathode of the second voltage regulator tube, a common end of the sixteenth resistor is used as an output end of the second power processing module 370, and a second end of the eleventh capacitor and an anode of the second voltage regulator tube are both connected to ground.

In the embodiment of the present invention, the second power processing module 370 is composed of a sixteenth resistor R16, an eleventh capacitor C11, and a second voltage regulator tube Z2; the sixteenth resistor R16 is a current-limiting resistor for limiting the maximum current flowing through the second voltage regulator tube Z2, and the first end of the sixteenth resistor R16 is connected to the reference voltage VDD; an eleventh capacitor C11 is a filter capacitor, a second voltage regulator tube Z2 is a voltage regulator diode, a first end of the eleventh capacitor C11 and a cathode of the second voltage regulator tube Z2 are both connected with a second end of a sixteenth resistor R16, and a first end of the eleventh capacitor C11 and an anode of the second voltage regulator tube Z2 are both connected with the ground; and the connection node of the second end of the sixteenth resistor R16, the first end of the eleventh capacitor C11 and the cathode of the second voltage regulator tube Z2 is used as the output end of the second power processing module 370 to supply power for the temperature measuring element for outputting digital signals. That is to say, in this embodiment, the reference voltage VDD supplies power to the temperature measuring element outputting the digital signal after passing through the separate voltage stabilizing circuit, and the circuit is simple and has low cost.

Optionally, in another specific embodiment, the second power processing module 370 includes a fourth operational amplifier, a seventeenth resistor and a twelfth capacitor; the non-inverting input terminal of the fourth operational amplifier is used as the input terminal of the second power processing module 370, the inverting input terminal of the fourth operational amplifier is connected to the output terminal of the fourth operational amplifier and the first terminal of the seventeenth resistor, respectively, the second terminal of the seventeenth resistor is connected to the first terminal of the twelfth capacitor, the common terminal of the seventeenth resistor is used as the output terminal of the second power processing module 370, and the second terminal of the twelfth capacitor is connected to ground.

In the embodiment of the present invention, the second power processing module 370 is composed of a fourth operational amplifier N1D, a seventeenth resistor R17 and a twelfth capacitor C12; the fourth operational amplifier N1D is used as a voltage follower, the non-inverting input terminal of the fourth operational amplifier is connected to the reference voltage VDD, and the inverting input terminal of the fourth operational amplifier is short-circuited with the output terminal; the seventeenth resistor R17 is a current-limiting resistor, and has a first end connected to the node connecting the inverting input terminal and the output terminal of the fourth operational amplifier N1D; the twelfth capacitor C12 is a filter capacitor, and has a first end connected to the second end of the seventeenth resistor R17, and a second end connected to ground; the connection node between the second end of the seventeenth resistor R17 and the first end of the twelfth capacitor C12 serves as the output end of the second power processing module 370, and supplies power to the temperature measuring element outputting digital signals. That is to say, in this embodiment, the reference voltage VDD supplies power to the temperature measuring element outputting the digital signal after passing through the voltage follower circuit, so as to realize voltage follower and improve the driving capability.

As a preferred embodiment of the present invention, the signal conditioning circuit 3 further includes an electrostatic protection module for providing electrostatic protection; the electrostatic protection module comprises a first electrostatic discharge tube, a second electrostatic discharge tube, a third electrostatic discharge tube and a fourth electrostatic discharge tube; the first end of the first electrostatic discharge tube is connected with the input end of the first power supply processing module 360, the first end of the second electrostatic discharge tube is connected with the second output end of the first power supply processing module 360, the first end of the third electrostatic discharge tube is connected with the output end of the differential amplification module 330, the first end of the fourth electrostatic discharge tube is connected with the output end of the temperature measuring element, and the second end of the first electrostatic discharge tube, the second end of the second electrostatic discharge tube, the second end of the third electrostatic discharge tube and the second end of the fourth electrostatic discharge tube are all connected with the ground.

The embodiment of the utility model provides an in, in order to improve signal conditioning circuit 3 prevent the static ability, still designed the electrostatic protection module in signal conditioning circuit 3, can provide electrostatic protection. Specifically, the electrostatic protection module includes a first electrostatic discharge tube ESD1, a second electrostatic discharge tube ESD2, a third electrostatic discharge tube ESD3, and a fourth electrostatic discharge tube ESD 4; the first end of the first electrostatic discharge tube ESD1 is connected to the input end of the first power processing module 360, the first end of the second electrostatic discharge tube ESD2 is connected to the second output end of the first power processing module 360, the first end of the third electrostatic discharge tube ESD3 is connected to the output end of the differential amplification module 330, the first end of the fourth electrostatic discharge tube ESD4 is connected to the output end of the temperature measuring element, and the second ends of the first electrostatic discharge tube ESD1, the second electrostatic discharge tube ESD2, the third electrostatic discharge tube ESD3 and the fourth electrostatic discharge tube ESD4 are all connected to ground, so as to perform electrostatic protection on the power input interface, the reference voltage output interface, the sensitive element output interface and the temperature measuring element output interface. Optionally, when the encoder chip is installed inside the sensor, the first end of the second electrostatic discharge tube ESD2 may be selectively connected to the output end of the encoder chip, so as to perform electrostatic protection on the output interface of the encoder chip.

Optionally, a resistor R18 is connected between the input end of the first charge amplification module 310 and the first end of the sensor 2, and a resistor R19 is connected between the input end of the second charge amplification module 320 and the second end of the sensor 2, so that the interference rejection capability of the input signals of the first charge amplification module 310 and the second charge amplification module 320 can be improved.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A sensor circuit board is characterized by comprising a circuit board body, wherein a sensitive element and a signal conditioning circuit are mounted on the side surface of the circuit board body, the sensitive element is used for sensing vibration impact physical quantity of a measured position and converting the vibration impact physical quantity into a charge signal, and the signal conditioning circuit is used for converting the charge signal output by the sensitive element into a voltage signal; the bottom of the circuit board body is provided with a step plate, and the step plate is used for welding pins of the temperature measuring element.

2. The sensor circuit board of claim 1, wherein the thickness of the step plate is less than the thickness of the circuit board body.

3. The sensor circuit board of claim 1, wherein the outer circumference of the bottom end of the circuit board body is provided with a tapered surface for signal transmission.

4. The sensor circuit board of claim 1, wherein the top end of the circuit board body is provided with a limit step for radial fixation.

5. The sensor circuit board according to claim 4, wherein an outer periphery of the top end of the circuit board body is provided with a projection for positioning.

6. The sensor circuit board of claim 1, wherein the sensing element and the signal conditioning circuit are externally provided with a shield for shielding interference.

7. The sensor circuit board of any one of claims 1 to 6, wherein the signal conditioning circuit comprises a first charge amplification module, a second charge amplification module, and a differential amplification module;

8. The sensor circuit board of claim 7, wherein the first charge amplification module comprises a first operational amplifier, a first capacitor, a first resistor, and a second resistor, and the second charge amplification module comprises a second operational amplifier, a second capacitor, a third resistor, and a fourth resistor;

9. The sensor circuit board of claim 8, wherein the differential amplification module comprises a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor, and a third operational amplifier;

10. The sensor circuit board of claim 9, wherein the signal conditioning circuit further comprises a bootstrap module for boosting the voltage of the voltage signals output by the first and second charge amplification modules.

11. The sensor circuit board of claim 10, wherein the bootstrap module includes a ninth resistor, a tenth resistor, and a third capacitor;

12. The sensor circuit board of claim 10, wherein the bootstrap module comprises an eleventh resistor and a fourth capacitor;

13. The sensor circuit board of claim 7, wherein the signal conditioning circuit further comprises an anti-jamming module for improving the anti-jamming capability of the sensing element.

14. The sensor circuit board of claim 13, wherein the tamper resistant module comprises a twelfth resistor, a thirteenth resistor, a fifth capacitor, and a sixth capacitor;

15. The sensor circuit board of claim 13, wherein the immunity module includes a fourteenth resistor, a seventh capacitor, and an eighth capacitor;

16. The sensor circuit board of claim 8, wherein the signal conditioning circuit further comprises a first power processing module;

17. The sensor circuit board of claim 16, wherein the first power processing module comprises a diode, a fifteenth resistor, a ninth capacitor, a tenth capacitor, and a first voltage regulator;

18. The sensor circuit board of claim 17, wherein the signal conditioning circuit further comprises a second power processing module;

19. The sensor circuit board of claim 18, wherein the second power processing module comprises a sixteenth resistor, an eleventh capacitor, and a second voltage regulator;

20. The sensor circuit board of claim 18, wherein the second power processing module comprises a fourth operational amplifier, a seventeenth resistor, and a twelfth capacitor;

21. The sensor circuit board of claim 16, wherein the signal conditioning circuit further comprises an electrostatic protection module for providing electrostatic protection;