CN211412543U

CN211412543U - A packaging mechanism for module power encapsulating

Info

Publication number: CN211412543U
Application number: CN201922146574.0U
Authority: CN
Inventors: 杨吉程
Original assignee: Dongguan Yingju Power Supply Co ltd
Current assignee: Dongguan Yingju Power Supply Co ltd
Priority date: 2019-12-04
Filing date: 2019-12-04
Publication date: 2020-09-04
Anticipated expiration: 2029-12-04

Abstract

The utility model belongs to the technical field of the electronic product technique and specifically relates to a packaging mechanism for module power encapsulating is related to, including the face-piece, a filling mouth has been seted up to a tip of face-piece, and filling mouth department installs the drain pan, and one side both ends symmetry that the drain pan links to each other with the face-piece is provided with the side bone, and first pinhole has been seted up at the middle part of drain pan, and the second pinhole has been seted up to the edge part of drain pan, installs the PCBA circuit board in the face-piece, and the PCBA circuit board is close to one side of drain pan and installs a plurality of even equidistance and. The utility model discloses insert the PCBA circuit board to the face-piece in, use the glue-pouring machine to squeeze into proper amount high heat conduction AB glue in to the face-piece, later cover the drain pan to make first needle file and second needle file respectively with first pinhole, the cooperation of pegging graft of second pinhole, the finished product is accomplished after the glue solidification, and is convenient simple, reduces the mould cost effectively, and the mould is with low costs, and development cycle is short, is fit for being used for the small batch production of product.

Description

A packaging mechanism for module power encapsulating

Technical Field

The utility model relates to an electronic product technical field specifically is a packaging mechanism for module power encapsulating.

Background

The traditional DC-DC module power supply is usually produced by using an epoxy resin injection molding process due to high heat dissipation requirements, but the mold cost is high, and the development period is long.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a packaging mechanism for module power encapsulating to it requires high owing to the heat dissipation to propose current DC-DC module power among the above-mentioned background art, uses the technology production that epoxy moulded plastics usually, but the mould is with high costs, problem that development cycle is long.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a packaging mechanism for module power encapsulating, includes the face-piece, the filling mouth has been seted up to a tip of face-piece, filling mouth department installs the drain pan, one side both ends symmetry that drain pan and face-piece link to each other is provided with the side bone, a plurality of even equidistance are linear arrangement's first pinhole is seted up at the middle part of drain pan, a plurality of even equidistance are seted up to the edge part of drain pan and are linear arrangement's second pinhole, install the PCBA circuit board in the face-piece, a plurality of even equidistance are linear arrangement's first needle file and second needle file are installed to one side that the PCBA circuit board is close to.

Preferably, the first needle seat and the first needle holes are equal in number, corresponding in position, adaptive in size and matched in an inserted manner, and the second needle seat and the second needle holes are equal in number, corresponding in position, adaptive in size and matched in an inserted manner.

Preferably, the second needle seat is L-shaped in cross section.

Preferably, the lateral bone is provided with a through hole.

Preferably, the gap between the inner wall of the face shell and the PCBA circuit board is filled with A/B glue.

Preferably, the cross section of the bottom shell is matched with the sectional area of the filling opening in size, and the bottom shell is embedded in the filling opening.

Preferably, the side area of the PCBA circuit board is matched with the transverse cross-sectional area of the face shell.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this a packaging mechanism for module power encapsulating is when using, insert the PCBA circuit board in the face-piece earlier, use the encapsulating machine to squeeze into proper amount high heat conduction AB glue in to the face-piece, later cover the drain pan, and make first needle file and second needle file respectively with first pinhole, the cooperation of pegging graft of second pinhole, the finished product is accomplished after the glue solidification, only need above three step can accomplish the equipment, and is convenient simple, and the mould cost is reduced effectively, and the mould is with low costs, and development cycle is short, is fit for the small batch production who is used for the product.

2. The through hole is formed in the side bone of the packaging mechanism for the module power glue filling, the gap between the inner wall of the face shell and the PCBA circuit board is filled with the A/B glue, and after the high-heat-conduction A/B glue is injected into the face shell by using the glue filling machine, the A/B glue can be combined into a whole through the through hole, so that the stability of the structure is improved.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is an exploded schematic view of the present invention.

In the figure: 1. a bottom case; 11. a lateral bone; 12. a through hole; 13. a first pinhole; 14. a second pinhole; 2. a PCBA circuit board; 21. a second needle seat; 22. a first needle seat; 3. a face shell; 31. and (4) filling the opening.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-2, the present invention provides the following technical solutions:

the utility model provides a packaging mechanism for module power encapsulating, as shown in fig. 1 and fig. 2, including face-piece 3, filling mouth 31 has been seted up to a tip of face-piece 3, filling mouth 31 department installs drain pan 1, one side both ends symmetry that drain pan 1 links to each other with face-piece 3 is provided with side bone 11, a plurality of even equidistance are linear arrangement's first pinhole 13 has been seted up at the middle part of drain pan 1, a plurality of even equidistance are linear arrangement's second pinhole 14 has been seted up to the edge part of drain pan 1, install PCBA circuit board 2 in the face-piece 3, PCBA circuit board 2 is close to one side of drain pan 1 and installs a plurality of even equidistance and is linear arrangement's first needle file 22.

Further, the quantity of first needle file 22 and first pinhole 13 equals, the position is corresponding, size looks adaptation and both grafting cooperation, and second needle file 21 equals with the quantity of second pinhole 14, the position is corresponding, size looks adaptation and both grafting cooperation, is convenient for install and dismantle, and the cross-section of second needle file 21 is the L type.

Specifically, the through hole 12 is formed in the side frame 11, the gap between the inner wall of the face shell 3 and the PCBA circuit board 2 is filled with the A/B glue, and after the high-heat-conductivity A/B glue is injected into the face shell 3 through the glue pouring machine, the A/B glue can be combined into a whole through the through hole 12, so that the stability of the structure is improved.

In addition, the cross-section of drain pan 1 and the sectional area size looks adaptation of filling mouth 31, and drain pan 1 inlays and locates filling mouth 31 department, and the lateral area of PCBA circuit board 2 and the crosscut area looks adaptation of face-piece 3 are convenient for install, and it is convenient to constitute.

The packaging mechanism for module power encapsulating of this embodiment is when using, insert PCBA circuit board 2 in the face-piece 3 earlier, use the encapsulating machine to beat into appropriate amount high heat conduction AB glue in the face-piece 3, later cover drain pan 1, and make first needle file 22 and second needle file 21 respectively with first pinhole 13, the cooperation of pegging graft of second pinhole 14, the finished product is accomplished after the glue solidification, only need above three step can accomplish the equipment, and is convenient simple, reduce the mould cost effectively, the mould is with low costs, development cycle is short, be fit for the small batch production who is used for the product.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a packaging mechanism for module power encapsulating which characterized in that: including face-piece (3), filling mouth (31) have been seted up to a tip of face-piece (3), filling mouth (31) department installs drain pan (1), one side both ends symmetry that drain pan (1) and face-piece (3) link to each other is provided with side bone (11), a plurality of even equidistance are linear arrangement's first pinhole (13) have been seted up at the middle part of drain pan (1), a plurality of even equidistance are linear arrangement's second pinhole (14) have been seted up to the edge part of drain pan (1), install PCBA circuit board (2) in face-piece (3), PCBA circuit board (2) are close to one side of drain pan (1) and are installed first needle file (22) and second needle file (21) that a plurality of even equidistance are linear arrangement.

2. The packaging mechanism for the glue filling of the modular power supply of claim 1, wherein: the first needle seat (22) and the first needle holes (13) are equal in number, corresponding in position, adaptive in size and matched in an inserted mode, and the second needle seat (21) and the second needle holes (14) are equal in number, corresponding in position, adaptive in size and matched in an inserted mode.

3. The packaging mechanism for the glue filling of the modular power supply of claim 1, wherein: the section of the second needle seat (21) is L-shaped.

4. The packaging mechanism for the glue filling of the modular power supply of claim 1, wherein: the side bone (11) is provided with a through hole (12).

5. The packaging mechanism for the glue filling of the modular power supply of claim 1, wherein: and a gap between the inner wall of the face shell (3) and the PCBA circuit board (2) is filled with A/B glue.

6. The packaging mechanism for the glue filling of the modular power supply of claim 1, wherein: the section of the bottom shell (1) is matched with the sectional area of the filling opening (31), and the bottom shell (1) is embedded in the filling opening (31).

7. The packaging mechanism for the glue filling of the modular power supply of claim 1, wherein: the side area of the PCBA circuit board (2) is matched with the transverse cutting area of the face shell (3).