CN211406659U - Thermal management assembly and device including thermal management assembly - Google Patents

Abstract

The utility model relates to a thermal management subassembly and including device of thermal management subassembly. In an exemplary embodiment, the thermal management assembly includes at least one flexible heat dissipating material including portions that wrap in different non-parallel directions around respective portions of the component, which may be configured to be coupled to and/or along sides of the device housing. The heat sink material is operable to define at least a portion of a thermally conductive thermal path around a respective portion of the component.

Description

Thermal management assembly and device including thermal management assembly

Technical Field

The present disclosure relates generally to thermal management assemblies (e.g., configured for heat dissipation, etc.) suitable for use with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP + transceivers, quad small form-factor pluggable (QSFP) transceivers, QSFP + transceivers, XFP transceivers, etc.) and other devices (e.g., memory card readers, etc.).

Background

This section provides background information related to the present disclosure that is not necessarily prior art.

Electrical components (e.g., semiconductors, integrated circuit packages, transistors, etc.) typically have pre-designed temperatures at which the electrical components operate optimally. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. But the operation of the electrical components generates heat. If heat is not removed, the electrical components may then operate at temperatures significantly higher than their normal or desired operating temperatures. Such excessive temperatures may adversely affect the operating characteristics of the electrical components and the operation of the associated devices.

To avoid or at least reduce adverse operating characteristics from heat generation, heat should be removed, for example, by conducting heat from the operating electrical component to a heat sink. The heat sink may then be cooled by conventional convection and/or radiation techniques. During conduction, heat may be transferred from an operating electrical component to a heat sink through direct surface contact between the electrical component and the heat sink and/or through contact of the electrical component and the heat sink surface through an intermediate medium or Thermal Interface Material (TIM). Thermal interface materials may be used to fill gaps between heat transfer surfaces to improve heat transfer efficiency compared to filling gaps with air, which is a relatively poor conductor of heat.

By way of further background, small form-factor pluggable (SFP) transceivers may be compact hot-plug transceivers for electrical communications, data communications applications, and the like. SFP transceivers may couple a network device motherboard (e.g., for switches, routers, media converters, etc.) to an optical fiber or copper network cable. SFP transceivers may support communication standards including synchronous fiber optic networks, gigabit ethernet, fibre channel. As used herein, small form-factor pluggable (SFP) transceivers also include other small form-factor pluggable transceivers, such as SFP + transceivers, quad small form-factor pluggable (QSFP) transceivers, QSFP + transceivers, and the like.

SUMMERY OF THE UTILITY MODEL

This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.

In an exemplary embodiment, a thermal management assembly for transferring heat from a device including a housing includes at least one flexible heat dissipating material including portions that wrap in different non-parallel directions around respective portions of a component configured to be coupled to and/or along a side of the housing, whereby the heat dissipating material is operable to define at least a portion of a thermally conductive thermal path around the respective portions of the component.

According to another aspect, there is provided a device comprising a housing and a thermal management assembly as described above, wherein the component comprises first and second opposing ends and a third portion generally between the first and second opposing ends, and wherein the flexible heat dissipating material comprises: first and second portions that are generally wound about the respective first and second ends of the component in a first direction that is generally parallel to a direction in which an object can be slidably inserted into and removed from the housing; and third and fourth portions of the flexible heat dissipating material that are generally wrapped around the third portion of the component in a second direction that is non-parallel to the direction in which the object can be slidably inserted into and removed from the housing.

According to yet another aspect, a thermal management assembly is provided that includes at least one flexible heat dissipating material that includes portions that are wrapped in different non-parallel directions around respective portions of the thermal management assembly.

According to yet another aspect, there is provided a device comprising a housing, a component configured to be coupled to and/or along a side of the housing, and a thermal management assembly as described above for transferring heat from the device, wherein the flexible heat dissipating material comprises portions that are wrapped in different non-parallel directions around respective portions of the component, whereby the heat dissipating material is operable to define at least a portion of a thermally conductive thermal path around the respective portions of the component.

Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.

Drawings

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

Figure 1 is a cross-sectional side view of a small form-factor pluggable (SFP) transceiver in accordance with an example embodiment.

Fig. 2 is a perspective view of the spring contacts and metal plate of the SFP transceiver shown in fig. 1.

Fig. 3 is a cross-sectional side view of the SFP transceiver shown in fig. 1, and also shows the graphite sheet wrapped around the spring contacts and the metal plate in accordance with an exemplary embodiment.

Fig. 4 is a perspective view of the coiled spring contact shown in fig. 3 with a graphite sheet of metal plate.

Fig. 5 is a cross-sectional side view of the SFP transceiver shown in fig. 3, and also showing a cable connector received in the SFP transceiver.

Fig. 6 is a perspective view of an exemplary thermally and electrically conductive material wound around the thermal interface material shown in fig. 1.

Figure 7 is a cross-sectional side view of a small form-factor pluggable (SFP) transceiver including first and second graphite sheets wrapped around respective first and second metal plates and spring contacts according to an exemplary embodiment.

Fig. 8 is a cross-sectional side view of the SFP transceiver shown in fig. 7, and also showing the thermal interface material between the graphite sheet and the external heat sink.

Fig. 9 is a cross-sectional side view of the SFP transceiver shown in fig. 8, and also showing cable connectors received in a cage of the SFP transceiver.

Figure 10 is a perspective view of a transceiver including a thermal management assembly according to an example embodiment with a graphite sheet disposed around an end of the thermal management assembly.

Fig. 11 is a perspective view of the rolled graphite sheet from fig. 10, shown without the thermal management assembly or transceiver.

Fig. 12 is a perspective view of a transceiver including a thermal management assembly according to an example embodiment, wherein a first sheet of graphite and a second sheet of graphite are wrapped around a portion of the thermal management assembly.

Fig. 13 is a perspective view of the rolled graphite sheet from fig. 12, shown without the thermal management assembly or transceiver.

Fig. 14 is a perspective view of a transceiver including a thermal management assembly according to an example embodiment, wherein a first sheet of graphite and a second sheet of graphite are wrapped around a portion of the thermal management assembly.

Fig. 15 is a perspective view of the rolled graphite sheet from fig. 14, shown without the thermal management assembly or transceiver.

Fig. 16 is a perspective view of a transceiver including a thermal management assembly according to an example embodiment, where portions of the same/single graphite sheet are wound around portions of the thermal management assembly in different non-parallel directions.

Fig. 17 is a perspective view of the rolled graphite sheet from fig. 16, shown without the thermal management assembly or transceiver.

FIG. 18 shows an overview of simulation models used during a QSFP (quad Small form-factor pluggable) simulation study to monitor and compare maximum heat source temperatures for thermal management components having different configurations.

Fig. 19 shows the thermal simulation results using the model shown in fig. 18, along with the wound graphite sheet according to the embodiment shown in fig. 10 and 11.

Fig. 20 shows the thermal simulation results using the model shown in fig. 18, along with the first and second sheets of wound graphite according to the embodiment shown in fig. 12 and 13.

Fig. 21 shows the thermal simulation results using the model shown in fig. 18, along with graphite sheets having portions wound in two non-parallel directions according to the embodiment shown in fig. 16 and 17.

Corresponding reference characters indicate corresponding, although not necessarily identical, parts throughout the several views of the drawings.

Detailed Description

Exemplary embodiments will now be described more fully with reference to the accompanying drawings.

The demand for an increasing number of connection devices at increasingly faster speeds combined with physically smaller base stations may result in higher base station temperatures. Small form-factor pluggable (e.g., SFP +, QSFP +, etc.) connections may be designed to shut down above eighty-five degrees celsius. When a shutdown occurs, users may become frustrated by being unable to maintain a connection on their mobile phone, computer, etc. This is also a health risk in the case of medical devices such as personal alarms, which are converted from a cable connection to a wireless connection.

SFP connections can produce heat dissipation of up to two watts or more. In some applications, SFP ports may be stacked and grouped in large numbers, thus generating a large amount of combined heat.

Disclosed herein are exemplary embodiments of thermal management components suitable for use (e.g., configured for heat dissipation, etc.) with transceivers (e.g., small form-factor pluggable (SFP) transceivers, SFP + transceivers, quad small form-factor pluggable (QSFP) transceivers, QSFP + transceivers, XFP transceivers, etc.) as well as other devices (e.g., memory card readers, etc.). In an exemplary embodiment, one or more heat sinks are applied to a metal spring assembly (e.g., one or more graphite sheets wrapped around portions of a metal spring assembly or the like) to improve the thermal performance of a device (e.g., a QSFP or other transceiver, a memory card reader, or the like). The metal spring assembly may include a metal plate and a spring contact, as shown in any one or more of fig. 1-5 and 7-9.

In an exemplary embodiment, a device (e.g., a transceiver, a memory card reader, etc.) generally includes a housing (e.g., a holder, etc.). A heat dissipating (broadly, thermal management) assembly may be coupled to a side of the housing such that an object (e.g., a connector, a memory card, etc.) inserted into the housing is in thermal contact with the heat dissipating assembly such that the heat dissipating assembly may define at least a portion of a thermally conductive thermal path from the inserted object to another component (e.g., the housing, a heat sink, a thermal interface material, a thermoelectric module, a heat spreader, a heat sink, etc.). One or more flexible heat dissipating packages or materials (e.g., one or more sheets of graphite, etc.) may be substantially wound (broadly, disposed) around one or more portions (e.g., top and bottom portions, etc.). Is part of the heat dissipation assembly.

For example, portions of the graphite sheet can be wrapped (broadly, disposed) around portions of the heat dissipation assembly in different directions (e.g., in two non-parallel directions, in a perpendicular direction, in the X and Y directions, etc.). Continuing with this example, one or more portions of the graphite sheet may be wrapped around one or more ends of the heat dissipation assembly in a first direction parallel to the sliding direction of the object into/out of the housing. One or more other portions of the graphite sheet may be wound around one or more sides of the heat dissipation assembly in a second direction that is not parallel (e.g., perpendicular, etc.) to the first direction.

The heat sink assembly may include one or more spring finger contacts (broadly, resiliently flexible contacts or elements). The spring finger contacts may provide mechanical or spring pressure, for example, between the inserted object, the housing, and the flexible heat dissipation package, which in turn may improve thermal contact between the heat dissipation assembly (e.g., coiled heat dissipation material, etc.), the housing, and the inserted object.

The exemplary transceivers disclosed herein may provide one or more (or none) of the following advantages: enhanced cooling with increased reliability (e.g., increased reliability even after multiple connections and disconnections of the cable connector to the transceiver); enhancing heat transfer; modularization and flexibility; allowing the use of thermoelectric modules (TEMs) and/or Thermal Interface Materials (TIMs); allowing different materials to meet different height requirements, length requirements, thermal conductivity requirements, passive or active applications, ability to cool the cable connector and housing or cage, etc.

Referring now to the drawings, fig. 1 illustrates an exemplary embodiment of a small form-factor pluggable (SFP) transceiver 100 (broadly, an apparatus) incorporating one or more aspects of the present disclosure. As shown, the SFP transceiver 100 includes a small form-factor pluggable cage 102 (broadly, a housing). The cage 102 is adapted to receive a small form-factor pluggable cable connector (broadly, a connector). SFP transceiver 100 also includes an external heat sink 104. A Thermal Interface Material (TIM)106 is generally located (e.g., thermally coupled, etc.) between the top or other side of the holder 102 and the external heat sink 104. TIM106 may be used to transfer heat from cage 102 to external heat sink 104.

SFP transceiver 100 also includes spring contacts 108 coupled to the top side of cage 102, such spring contacts 108 being generally located between the cable connector and TIM 106. Spring contacts 108 may be configured to contact a cable connector received in cage 102 to define, provide, establish, or create at least a portion of a thermally conductive thermal path between the cable connector and the top side of cage 102 to thereby increase heat transfer from the cable connector to the top side of cage 102.

The cage 102 may be any suitable cage capable of receiving SFP cable connectors. The cage 102 may receive the cable connectors via any suitable releasable coupling engagement, including but not limited to a friction fit, a snap fit, etc. The cage 102 may include interfaces, such as optical cable interfaces, power cable interfaces, and the like, for transmitting and/or receiving signals via the SFP connectors. This interface may allow communication with and/or from the cable connector to a motherboard, Printed Circuit Board (PCB), network card, etc. on which the holder 102 is mounted.

The cage 102 may comprise any suitable material, including metal, etc. For example, the cage 102 may comprise a material suitable for shielding noise (e.g., electromagnetic interference (EMI) shielding, etc.) generated by the transfer of data through the cable connector. Alternative embodiments may include other devices, such as other transceivers (e.g., SFP + transceivers, XFP + transceivers, QSFP + transceivers, etc.) having housings or holders configured for use with other connectors besides SFP cable connectors, etc. Accordingly, aspects of the present disclosure should not be limited to SFP transceivers and SFP cable connectors.

Heat sink 104 is adapted to transfer heat away from holder 102 and the cable connectors received within holder 102 to reduce the temperature of holder 102 and cable connectors to maintain the temperature of holder 102 and cable connectors below a specified threshold or the like. Heat sink 104 may comprise any suitable heat sink material, construction, etc. suitable for reducing the temperature of holder 102 and cable connector. For example, the heat sink material and configuration may be selected such that heat sink 104 is able to dissipate heat at a rate sufficient to maintain the temperature of cage 102 and cable connector below a prescribed threshold temperature at which operation of the cable connector would otherwise be impaired. Heat transfer to heat sink 104 may reduce the amount of heat transferred from the cable connector to the board of SFP transceiver 100, thus reducing the amount of heat that may be further dissipated from the board to more sensitive components.

The thermal interface material 106 may include any suitable material (e.g., gap filler, etc.) for increasing heat transfer from the top of the cage (e.g., from the spring contacts 108 that define a portion of the top of the cage) to the heat sink 104. The thermal interface material 106 may provide increased thermal conductivity over air gaps because the thermal interface material 106 may fill gaps between surfaces that would otherwise be separated by air. Thus, the thermal interface material 106 may have a higher thermal conductivity than air.

Thermal interface material 106 may be coupled between the top side of cage 102 and heat sink 104 to transfer heat from cage 102 to heat sink 104. In some embodiments, the thermal interface material 106 may include one or more thermoelectric modules. For example, thermoelectric modules may be coupled between the top side of the cage 102 and the heat sink 104 to transfer heat from the cage 102 (e.g., connectors received in the cage, spring contacts 108 in contact with the connectors, etc.) to the heat sink 104. For example, thermal interface material 106 may be coupled between thermoelectric modules and holder 102, thermoelectric modules and heat sink 104, etc. to increase thermal conductivity from holder 102 to thermoelectric modules and/or heat sink 104.

The thermoelectric module may be any suitable module capable of transferring heat between opposite sides of the module when a voltage is applied to the module. The thermoelectric modules may have a cold side oriented toward the holder 102 and a hot side oriented toward the heat sink 104. The cold side of the thermoelectric module may be in direct contact with the top side of the holder 102; the top side of the cage 102 may be contacted via a thermal interface material or the like. Similarly, the hot side of the thermoelectric module may be in direct contact with the heat sink 104; the heat sink 104 may be contacted via a thermal interface material 106 or the like.

As shown in fig. 1, the spring contacts 108 are coupled to a top side of the cage 102 and may be configured to contact a cable connector (not shown) received in the cage 102. Spring contacts 108 help create a thermally conductive thermal path between the cable connector and the top side of cage 102 (e.g., a thermally conductive thermal path from the connector to thermal interface material 106, etc.) to enhance heat transfer from the cable connector to the top side of cage 102. For example, spring contacts 108 may provide mechanical or spring pressure between cable connector and cage 102, thermal interface material 106, etc., thereby improving thermal contact between cable connector and cage 102, thermal interface material 106, etc.

Spring contacts 108 may comprise any suitable thermally conductive material (including stainless steel, etc.) capable of transferring heat from the cable connector to the top of cage 102. Spring contacts 108 may comprise a material that is sufficiently stiff to maintain at least some mechanical pressure between the cable connector and the top of cage 102. In some embodiments, the spring contacts 108 comprise a metalized thermally conductive material.

The spring contacts 108 may be coupled to the cage 102 using any suitable connection. In some embodiments, the spring contacts 108 may be coupled to the cage 102 via laser welding, via riveting, via glue, or the like.

The spring contacts 108 may be sized to apply mechanical pressure between a connector received in the cage 102 and a top side of the cage 102, the thermal interface material 106, and the like. For example, spring contacts 108 may have a height corresponding to the distance between the cable connector and the top side of holder 102 when the cable connector is inserted into holder 102, may have a height slightly greater than the distance between the cable connector and the top side of holder 102 when the cable connector is inserted into holder 102 such that the cable connector slightly deforms spring contacts 108 when inserted into holder 102, and so on. Thus, the spring contacts 108 may comprise a compressible, deformable, etc. material to apply mechanical pressure to the cable connector.

The spring contacts 108 may be coupled to a metal plate 110 (broadly, a conductive bracket). The metal plate 110 may increase the surface area in contact with the cable connector when the cable connector is received in the cage 102, thus increasing the thermal conductivity from the cable connector to the top of the cage through the spring contacts 108. In some embodiments, the top side of the cage 102 may include an opening in which the metal plate 110 is positioned such that the metal plate 110 and/or the spring contacts 108 define at least a portion of the top side of the cage 102.

The metal plate 110 may comprise any thermally conductive material suitable for transferring heat from the cable connector to the spring contacts 108. The metal plate 110 may be adapted to increase the surface area of mechanical pressure, thermal contact, etc. applied to the cable connector when the cable connector is received in the holder 102.

Fig. 2 shows an exemplary metal plate 110 with spring contacts 108. As shown in fig. 2, the metal plate 110 may be integrally formed with the spring contacts 108. For example, a piece of metal may be cut to form the spring contact portion. The spring contacts 108 may then be defined by bending the cut spring contact portions upward from the metal plate 110. In other embodiments, the spring contacts 108 may be coupled to the metal plate 110, attached to the metal plate 110, or the like.

The metal plate 110 may include a rounded end 112. The rounded end 112 may be adapted to allow a cable connector to be inserted against the bottom side of the metal plate 110 without catching on the end of the metal plate 110. For example, rounded end 112 may allow the connector to slide over the edge of metal plate 110 and under the edge of metal plate 110 when the cable connector is inserted into cage 102. The rounded end may be formed using any suitable technique, including bending the metal plate 110, etc.

Although fig. 2 shows four spring contacts 108, it is apparent that other embodiments may include any suitable number of spring contacts, including but not limited to a single spring contact, two spring contacts, three spring contacts, more than four spring contacts, etc. Similarly, fig. 2 shows the metal plate 110 as having a rectangular shape, but it should be appreciated that other embodiments may include any other suitable shape for the metal plate 110, including a circular metal plate, a square metal plate, and the like.

Fig. 3 illustrates an exemplary embodiment of a small form-factor pluggable (SFP) transceiver 200 embodying one or more aspects of the present invention. As shown in fig. 3, the graphite sheet 114 is wrapped around at least a portion of the spring contact 108. Similar to SFP transceiver 100 of fig. 1, SFP transceiver 200 shown in fig. 2 includes small form-factor pluggable cage 102. The cage 102 is adapted to receive a small form-factor pluggable cable connector (not shown). SFP transceiver 200 also includes an external heat sink 104. A Thermal Interface Material (TIM) and/or a thermoelectric module (TEM)106 is coupled between the top side of the cage 102 and the external heat sink 104 to transfer heat from the cage 102 to the external heat sink 104.

SFP transceiver 200 also includes spring contacts 108 connected to the top side of cage 102. This spring contact 108 is adapted to contact a cable connector received in the cage 102 to create a thermally conductive thermal path between the cable connector and the top side of the cage 102 to increase heat transfer from the cable connector to the top side of the cage 102.

As shown in fig. 3, the graphite sheet 114 is wrapped around at least a portion of the metal plate 110 and the spring contact 108. The graphite sheet 114 may be adapted to increase the thermal conductivity between the cable connectors received in the cage 102 and the top side of the cage 102. In some embodiments, the top side of the cage 102 may include an opening within which the graphite sheet 114 is positioned to thereby define a portion of the top side of the cage 102. Accordingly, the graphite sheet 114 may contact the thermal interface material 106 to dissipate and transfer heat from the cable connector to the thermal interface material 106.

Any suitable graphite material (or other heat dissipating material) capable of being wrapped around at least a portion of the spring contacts 108, the metal plate 110, etc. may be used. For example, the graphite sheet 114 may have a very high thermal conductivity and may conduct heat well from the cable connector to the top of the cage 102.

Fig. 4 shows the spring contact 108, metal plate 110 and graphite sheet 112 of fig. 3. As shown in fig. 4, the graphite sheet 114 may be wrapped around at least a portion of the spring contact 108 and the metal plate 110. The graphite sheet 114 is shown wound around the metal sheet 110 in a direction parallel to the length of the metal sheet 110 and/or parallel to the direction in which the connector 116 is slidably inserted into and removed from the cage 102 (fig. 5). Obviously, other embodiments may include one or more graphite sheets wrapped around the spring contacts 108 and/or the metal plate 110 in other directions.

In some embodiments, the graphite sheet 114 may comprise synthetic graphite. The graphite sheet 114 can include a layer of polyethylene terephthalate (PET) for improved mechanical and/or abrasion resistance and/or an adhesive material (e.g., a Pressure Sensitive Adhesive (PSA), etc.) for adhering the graphite sheet 114 to a surface (for attaching the graphite sheet 114 to a surface, etc.). In an exemplary embodiment, the graphite sheet 114 may comprise a material such as Tgon from Laerde corporation^TM9017、Tgon^TM9025、 Tgon^TM9040、Tgon^TM9070 and/or Tgon^TM9100 graphite flakes such as synthetic graphite flakes (e.g., Tgon)^TM9000 series of graphite flakes, etc.). Table 1 below includes Tgon from Laerd^TMAdditional details of the 9000 series of synthetic graphites.

In some embodiments, graphite sheet 114 may include a label with indicia indicating the performance of SFP transceiver 200. Using a graphite label for SFP transceiver 200 may increase thermal conductivity from the cable connector to a heat sink or the like while also providing information about the performance of SFP transceiver 200.

Fig. 5 shows the SFP transceiver 200 of fig. 3 with the cable connector 116 received in the cage 102. As shown in fig. 5, when the cable connector 116 is received in the cage 102, the cable connector 116 contacts the graphite sheet 114 on the bottom surface of the metal plate 110.

As described above, the spring contacts 108 and metal plates 110 wrapped by the graphite sheet 114 increase the thermal conductivity from the cable connector to the top of the cage 102, in the event that heat from the cable connector 116 can be dissipated by the heat sink 104 via the thermal interface material 106, which may include one or more thermoelectric modules.

In some embodiments, thermally and electrically conductive material may be wrapped around at least a portion of TIM 106. Thus, TIM106 and the material wrapped around TIM106 may provide a thermally and electrically conductive path between SFP transceiver cage 102 and a heat sink or other material, among other things. This may increase heat transfer away from cable connectors received in the cage 102 and also electrically ground the cage 102.

Fig. 6 illustrates an exemplary TIM106 and thermally and electrically conductive material 118 wrapped around TIM 106. Although fig. 6 shows thermally/electrically conductive material 118 wrapped around the top, bottom, and sides of TIM106, it should be understood that other embodiments may include thermally/electrically conductive material 118 wrapped around other portions of TIM106 (e.g., ends of TIM106, etc.).

TIM106 may comprise any material suitable for conducting heat from cage 102 to an external heat sink or the like. Exemplary thermal interface materials that may be used in exemplary embodiments include thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbing materials or hybrid thermal/EMI absorbing materials, thermal putties, heat dissipating pads, and the like. TIM106 is compressible between cage 102 and the heat sink. For example, in some embodiments, TIM106 may include a fabric-over-foam (fabric) material such that TIM106 may provide both a thermal interface material and an electrically and thermally conductive fabric wrapped around at least a portion of the thermal interface material. The fabric plus foam material may be wrapped with a metal (e.g., copper, foil, or other metal foil, etc.).

In some embodiments, TIM106 may comprise a silicone elastomer. The silicon elastomer may be filled with a suitable thermally conductive material (including ceramics, boron nitride, etc.). The silicone elastomer may be treated to allow the thermally and electrically conductive material 118 to adhere to the silicone elastomer. For example, TIM106 may comprise a thermal interface material from Laplace, Inc., e.g., Tputty ^TM502 series thermal gap filler, Tflex^TMSeries gap fillers (e.g., Tflex)^TM300 series thermal gap filler, Tflex ^TM600 series thermal gap Filler, Tflex ^TM700 series thermal gap filler, etc.), Tpcm^TMSeries of thermal phase change materials (e.g. Tpcm)^TM580 series phase change material, Tpcm^TM780 series phase change materials, Tpcm^TM900 series phase change material, etc.), Tpli^TMSeries gap fillers (e.g., Tpli)^TM200 series gap filler, etc.), IceKap p^TMSerial thermal interface materials and/or CoolZorb^TMSeries of thermally conductive microwave absorbing materials (e.g., CoolZorb)^TM400 series thermally conductive microwave absorbing material, CoolZorb ^TM500 series heat conductive microwave absorbing material, CoolZorb ^TM600 series thermally conductive microwave absorbing materials, etc.), and the like. In some example embodiments, TIM106 may include a compliant gap filler having high thermal conductivity. By way of example, TIM106 may comprise a Laplace thermal interface material, e.g., Tflex ^TM200、Tflex^TM HR200、Tflex ^TM300、Tflex^TM300TG、Tflex^TM HR400、Tflex ^TM500、Tflex ^TM600、Tflex^TMHR600、Tflex^TM SF600、Tflex ^TM700、Tflex^TMOne or more of SF800 thermal gap fillers.

TIM106 may include elastomeric and/or ceramic particles, metal particles, ferrite electromagnetic interference/radio frequency interference absorbing particles, metal or glass fiber mesh in a matrix of rubber, gel, wax, or the like. TIM106 may include compliant or conformable silicon pads, silicon-free materials (e.g., silicon-free gap filler materials, thermoplastic and/or thermoset polymers, elastomeric materials, etc.), wire mesh materials, polyurethane foams or gels, thermally conductive additives, and the like. TIM106 may be configured to have sufficient conformability, compliance, and/or flexibility (e.g., not having to undergo phase change or reflow, etc.) to accommodate tolerances or gaps by flexing at low temperatures (e.g., room temperature of 20 ℃ to 25 ℃, etc.) and/or to allow a thermal interface material to closely conform (e.g., in a relatively tight-fitting and encapsulated manner, etc.) to a mating surface when placed in contact (pressed against, etc.) with the mating surface (including uneven, curved, or uneven mating surfaces).

TIM106 may include a soft thermal interface material formed from an elastomer and at least one thermally conductive metal, boron nitride, and/or ceramic filler such that the soft thermal interface material is conformable even without undergoing a phase change or reflow. In some example embodiments, TIM106 may comprise a ceramic-filled silicon elastomer, a boron nitride-filled silicon elastomer, or a thermal phase change material including a substantially non-reinforced membrane.

Exemplary embodiments may include one or more thermal interface materials having a high thermal conductivity (e.g., 1W/mK (watts per meter per kelvin), 1.1W/mK, 1.2W/mK, 2.8W/mK, 3W/mK, 3.1W/mK, 3.8W/mK, 4W/mK, 4.7W/mK, 5W/mK, 5.4W/mK, 6W/mK, etc.) depending on the particular material used to make the thermal interface material and the loading percentage of the thermally conductive filler, if any. These thermal conductivities are merely examples, as other embodiments may include thermal interface materials having a thermal conductivity greater than 6W/mK, less than 1W/mK, or other values between 1 and 6W/mK. Thus, aspects of the present disclosure should not be limited to use with any particular thermal interface material, as example embodiments may include a wide range of thermal interface materials.

Thermally/electrically conductive material 118 wrapped around TIM106 may comprise any material suitable for conducting heat from cage 102 and for electrically grounding cage 102. In some embodiments, the thermally/electrically conductive material 118 may include foil (e.g., copper foil, etc.), metalized and/or plated fabric (e.g., nickel-copper plated nylon, etc.), metalized plastic, graphite sheet, and the like. The thermally/electrically conductive material 118 may comprise a graphite sheet (e.g., Tgon) from Leld corporation^TM9000 series of graphite flakes, etc.), e.g., Tgon^TM9017、Tgon^TM9025、Tgon^TM9040、 Tgon^TM9070 toAnd/or Tgon^TM9100 synthetic graphite sheet. Table 1 below includes Tgon from Laerd^TMAdditional details of the 9000 series of synthetic graphites.

Thermally and electrically conductive material 118 may have any suitable thickness that allows material 118 to wrap around at least a portion of TIM 106. For example, in some embodiments, the thermally and electrically conductive material can have a thickness of less than about one hundred micrometers (um) (e.g., 17um, 25um, 40um, 70um, 100um, etc.). The material may have any suitable thermal conductivity (e.g., about 500 to 1900W/mK, etc.).

Fig. 7-9 illustrate an exemplary embodiment of a small form-factor pluggable (SFP) transceiver 300 embodying one or more aspects of the present invention. SFP transceiver 300 may be similar to SFP transceiver 200 of fig. 3. As shown in fig. 7-9, a plurality of graphite sheets 314 are wrapped around portions of the spring contact 308. The graphite sheets 314 form a plurality of individual rings that increase the cross-section for heat transfer and shorten the heat transfer path.

The SFP transceiver 300 includes a small form-factor pluggable cage 302, the cage 302 adapted to receive a small form-factor pluggable cable connector 316 (fig. 9). The cage 302 may be any suitable cage capable of receiving the SFP cable connectors 316. The cage 302 may have dimensions corresponding to the SFP connectors 316 to allow the SFP cable connectors 316 to be inserted into the cage 302. The cage 302 may receive the cable connectors 316 via any suitable releasable coupling engagement, including but not limited to a friction fit, a snap fit, etc. The cage 302 may include interfaces, such as optical cable interfaces, power cable interfaces, and the like, for transmitting and/or receiving signals via the SFP connector 316. This interface may allow communication with and/or from the cable connector 316 to a motherboard, Printed Circuit Board (PCB), network card, etc. on which the cage 302 is mounted.

The cage 302 may comprise any suitable material, including metal, etc. For example, the cage 302 may comprise a material suitable for shielding noise (e.g., electromagnetic interference (EMI) shielding, etc.) generated by the transfer of data through the cable connector. Alternative embodiments may include other devices, such as other transceivers (e.g., SFP + transceivers, XFP + transceivers, QSFP + transceivers, etc.), devices having housings or holders configured for use with other connectors besides SFP cable connectors, etc. Accordingly, aspects of the present disclosure should not be limited to SFP transceivers and SFP cable connectors.

SFP transceiver 300 also includes a spring contact 308 coupled to the top side of cage 302, which spring contact 308 may be similar or identical to spring contact 108 shown in fig. 1-5. The spring contacts 308 may be configured (e.g., sized, shaped, formed of an elastic material, etc.) to provide mechanical or spring pressure for biasing the top and bottom of the graphite sheet 314, respectively, against the top of the thermal interface material 306 (fig. 8 and 9) and the connector 316, respectively, and/or in good thermal contact with the top of the thermal interface material 306 (fig. 8 and 9) and the connector 316, respectively. In turn, this may improve thermal contact between the top of the connector 316 and the bottom of the graphite sheet 314, as well as between the top of the graphite sheet 314 and the thermal interface material 306.

The spring contacts 308 may comprise any suitable thermally conductive material capable of transferring heat (including stainless steel, etc.). The spring contacts 308 may comprise a material sufficiently stiff to maintain at least a portion of the mechanical pressure between the graphite sheet 314 and the cable connector 316 and thermal interface material 306. In some embodiments, the spring contacts 308 comprise a metalized thermally conductive material.

The spring contacts 308 may be coupled or attached using any suitable connection. In some embodiments, the spring contact 308 may be coupled to the cage 302 via laser welding, via riveting, via glue, or the like. The spring contacts 308 may be configured (e.g., have a height, etc.) such that the cable connectors 316 slightly deform, etc. the spring contacts 308 when inserted into the cage 302. Accordingly, the spring contacts 308 may comprise a material that is elastically compressible, deformable, or the like to apply mechanical pressure to the cable connector.

In this illustrated embodiment, the spring contacts 308 may include multiple sets (e.g., first and second, etc.) or multiple spring contacts 308, each of the spring contacts 308 being coupled to a respective one of multiple (e.g., first and second, etc.) metal plates 310. By way of example, SFP transceiver 300 may include first and second metal plates 310 having spring contacts 308, metal plates 310 and spring contacts 308 similar or identical to metal plates 110 and spring contacts 108 shown in fig. 2. Accordingly, the first and second metal plates 310 shown in fig. 7 to 9 may also be integrally formed with the spring contact 308. For example, a piece of metal can be cut (e.g., stamped, etc.) to form the spring contact portion. The spring contacts 308 may then be defined by bending the cut spring contact portions upward from the respective metal plates 310. In other embodiments, the spring contact 308 may be coupled to the metal plate 310, attached to the metal plate 310, or the like.

The first and second metal plates 310 may include rounded or upwardly bent end portions. The rounded ends may facilitate the wrapping of graphite sheet 314 around metal plate 310 and/or allow cable connector 316 to be inserted along the bottom side of metal plate 310 without catching on the ends of metal plate 310. For example, the rounded ends may allow the connector 316 to slide over and under the edges of the graphite sheet 314 and the metal plate 310 when the cable connector 316 is inserted into the cage 302. The rounded end may be formed using any suitable technique, including bending the metal plate 310, etc.

In some embodiments, the top side of the cage 302 may include one or more openings in which the metal plate 310 is positioned such that the metal plate 310 and/or the spring contacts 308 define at least a portion of the top side of the cage 302.

Metal plate 310 may comprise any thermally conductive material suitable for transferring heat from the cable connector to spring contacts 108308. The metal plate 310 may be adapted to increase the surface area of mechanical pressure, thermal contact, etc. applied to the cable connector when the cable connector is received in the holder 302.

As shown in fig. 7, the first and second sheets of graphite 314 are wrapped around the respective first and second metal plates 310 and portions of the spring contacts 308. Thus, the first and second graphite sheets 314 form first and second separate loops that help to increase the cross-section for transferring heat and shorten the heat transfer path. When the cable connector 316 is received in the cage 302, the cable connector 316 contacts the graphite sheet 314 along the bottom surface of the metal plate 310.

Any suitable graphite material (or other suitable heat dissipating material) may be used for graphite sheet 314 that can be wrapped around at least a portion of spring contacts 308, metal plate 310, or the like. For example, the graphite sheet 314 may have a very high thermal conductivity and may conduct heat well from the cable connector 316 to the top of the cage 302.

Each graphite sheet 314 may be wrapped around at least a portion of the spring contact 308 and the corresponding metal plate 310 in a direction parallel to the length of the metal plate 310 (e.g., fig. 4, etc.) and/or parallel to the direction in which the connector 316 is slidably inserted into and removed from the cage 302. Obviously, other embodiments may include one or more graphite sheets wrapped around the spring contact 308 and/or the metal plate 310 in other directions.

In some embodiments, the graphite sheets 314 may be synthetic. Graphite sheet 314 may include a layer of polyethylene terephthalate (PET) for enhanced mechanical resistance and/or abrasion resistance, and may include adhesive material or the like for securing graphite sheet 314 to a surface, for attaching graphite sheet 314 to a surface. In an exemplary embodiment, one or more of the graphite sheets 314 may comprise a material such as Tgon from Laerd corporation^TM9017、 Tgon^TM9025、Tgon^TM9040、Tgon^TM9070 and/or Tgon^TM9100 graphite flakes such as synthetic graphite flakes (e.g., Tgon)^TM9000 series of graphite flakes, etc.). Table 1 below includes Tgon having a single crystal structure in the carbon plane^TMAdditional details of the 9000 series of synthetic graphites.

In some embodiments, graphite sheet 314 may include a label with indicia indicating the performance of SFP transceiver 300. Using a graphite label for SFP transceiver 300 may increase thermal conductivity from the cable connector to a heat sink or the like while also providing information about the performance of SFP transceiver 300.

SFP transceiver 300 may also include one or more external heat sinks and one or more Thermal Interface Materials (TIMs). As shown in fig. 8 and 9, a Thermal Interface Material (TIM)306 is generally located (e.g., coupled in thermal contact, etc.) between a graphite sheet 314 and an external heat sink 304. The TIM306 may be used to more efficiently transfer heat from the graphite sheet 314 to the external heat sink 304. Although fig. 8 and 9 show a single TIM306 positioned on top of two graphite sheets 314 and extending across the two graphite sheets 314, other embodiments may include first and second TIMs positioned on top of first and second graphite sheets 314, respectively. Similarly, although fig. 8 and 9 also show a single heat sink 304 positioned on top of the TIM306, other implementations may include first and second heat sinks positioned on top of the first and second TIMs, respectively.

The heat sink 304 is adapted to transfer heat away from the cage 302 and the cable connectors 316 received within the cage 302 to reduce the temperature of the cage 302 and the cable connectors 316, to maintain the temperature of the cage 302 and the cable connectors 316 below a specified threshold, and the like. Heat sink 304 may comprise any suitable heat sink material, construction, etc. suitable for reducing the temperature of cage 302 and cable connectors 316. For example, the heat sink material and configuration may be selected such that the heat sink 304 is able to dissipate heat at a rate sufficient to maintain the temperature of the cage 302 and cable connectors 316 below a specified threshold temperature at which the operation of the cable connectors 316 may otherwise be impaired. Heat transfer to heat sink 304 may reduce the amount of heat transferred from cable connectors 316 to the board of SFP transceiver 300, thus reducing the amount of heat that may be further dissipated from the board to more sensitive components.

Thermal interface material 306 may include any suitable material (e.g., gap filler, silicon elastomer, etc.) for increasing heat transfer to heat sink 304. Thermal interface material 306 may provide increased thermal conductivity than air gaps because thermal interface material 306 may fill gaps between surfaces that would otherwise be separated by air. Thus, the thermal interface material 306 may have a higher thermal conductivity than air.

Thermal interface material 306 may be similar to or the same as exemplary TIM106 shown in fig. 6 and described above. Thus, the thermal interface material306 may also comprise a thermally and electrically conductive material, such as a foil (e.g., copper foil, etc.), a metalized and/or electroplated fabric (e.g., nickel-copper plated nylon, etc.), a metalized plastic, a graphite sheet, or the like, wrapped around the TIM 306. The thermally and electrically conductive material wound around the TIM306 may comprise a graphite sheet from Lard corporation (e.g., Tgon)^TM9000 series of graphite flakes, etc.), e.g., Tgon^TM9017、Tgon^TM9025、Tgon^TM9040、 Tgon^TM9070 and/or Tgon^TM9100 synthetic graphite sheet. Table 1 below includes Tgon having a single crystal structure in the carbon plane^TMAdditional details of the 9000 series of synthetic graphites.

In some embodiments, thermal interface material 306 may be or may include one or more thermoelectric modules. For example, a thermoelectric module may be coupled between heat sink 304 and the top of graphite sheet 314 to transfer heat from graphite sheet 314 to heat sink 304. For another embodiment, thermal interface material 306 may be coupled between the thermoelectric module and the holder 302, between the thermoelectric module and the heat sink 304, between the thermoelectric module and the graphite sheet 314, etc., between the top of the holder 302 and the graphite sheet 314, etc. to increase thermal conductivity along the heat transfer path from the holder 302 to the thermoelectric module to the heat sink 304.

The thermoelectric module may be any suitable module capable of transferring heat between opposite sides of the module when a voltage is applied to the module. The thermoelectric module may have a cold side oriented toward the holder 302 and a hot side oriented toward the heat sink 304. The cold side of the thermoelectric module may be in direct contact with the top side of the holder 302; may be in thermal contact with the top side of the cage 302 via the thermal interface material 306 and/or the graphite sheet 314, etc. Similarly, the hot side of the thermoelectric module may be in direct contact with heat sink 304; may be in thermal contact with heat sink 304 via thermal interface material 306 and/or graphite sheet 314, etc.

Fig. 10 illustrates an exemplary embodiment of a QSFP transceiver 400 (broadly, an apparatus) and a thermal management component 420 embodying one or more aspects of the present invention. As shown in fig. 10, the transceiver 400 includes a cage 402 (broadly, a housing) adapted to receive a connector 416. Although fig. 10 illustrates thermal management component 420 being used with QSFP transceiver 400, thermal management component 420 may be used with other transceivers (e.g., SFP transceivers, SFP + transceivers, XFP transceivers, QSFP + transceivers, etc.), other devices (e.g., memory card readers, etc.) having housings or holders configured for use with other objects (e.g., memory cards, etc.) other than cable connectors, etc. Thus, aspects of the present invention should not be limited to use with any one particular type of device.

The graphite sheet 414 (broadly, a heat spreader) is wrapped (broadly, disposed) around the end 422 of the thermal management assembly 420. The graphite sheet 414 is wound around the end 422 in a direction substantially parallel to the direction in which the connector 416 is slidably inserted into the holder 502 and removed from the holder 502.

End 422 may be defined by one or more portions of thermal management assembly 420. For example, thermal management assembly 420 may include a first or top portion 424 defining an end 422. The thermal management assembly 420 may also include a second or bottom portion coupled to the top portion 424 and disposed generally below the top portion 424. The bottom portion may include one or more features (e.g., rounded or curved edges or lip portions, etc.) to facilitate sliding of the connector 416 under the bottom portion when the connector 416 is slidably inserted into the holder 402 or when the connector 416 is removed from the holder 402.

The thermal management assembly 420 may include one or more spring contacts configured (e.g., sized, shaped, formed of an elastomeric material, etc.) to provide mechanical or spring pressure for biasing a lower portion of the graphite sheet 414 against and/or in good thermal contact with a top portion of the connector 416, and for biasing an upper portion of the graphite sheet 414 against and/or in good thermal contact with another surface (e.g., a thermal interface material, etc.). This, in turn, can improve the thermal contact between the top of the connector 416 and the lower portion of the graphite sheet 414, and between the upper portion of the graphite sheet 414 and another surface. The spring contacts of the thermal management assembly 420 may be similar or identical to the spring contacts 108 shown in fig. 1-5, and/or the spring contacts 308 shown in fig. 7-9.

The top portion 424, bottom portion, and/or spring contacts may be made of metal (e.g., stainless steel, etc.) or other suitable thermally conductive material. The top portion 424 may also include a latch member 426 (broadly, an engagement member) configured to extend downwardly along a sidewall of the cage 402. The latch member 426 may include a latching surface and an opening to enable latching of the top portion 424 to the corresponding structure 428 of the cage 402. Alternatively, other methods of mechanically coupling top portion 424 to cage 402 may be used in other exemplary embodiments.

Although fig. 10 illustrates top portion 424 as a single piece, other exemplary embodiments may include more than one top portion 424 spanning the top of cage 402. Similarly, fig. 10 shows a single graphite sheet 414 wrapped around the end portion 424. Alternative embodiments may include one or more additional graphite sheets wrapped around other portions of the thermal management assembly 420. For example, one or more graphite sheets may be wrapped around and opposite the end portions 430 and/or the middle portion 432 of the thermal management assembly 420.

The thermal management component 420 may be configured to diffuse and transfer heat from the connector 416 (broadly, a heat source) to one or more other components, such as the housing or cage 402, a heat sink, a thermal interface material, a thermoelectric module, a heat spreader, a heat dissipation device, and the like. For example, the thermal management component 420 may be configured to diffuse and transfer heat directly from the connector 416 or another heat source (e.g., an integrated circuit, etc.) to an external heat sink (e.g., a heat sink with fins, etc.), as shown in fig. 18. Alternatively, for example, the thermal management assembly 420 may be configured to diffuse and transfer heat from the connector 416 (or other heat source) to a heat sink via a thermal interface material. See, for example, heat sinks 104, 304 and thermal interface materials 106, 306 disclosed herein and illustrated in fig. 1, 3, 5, 6, 8, and 9.

Accordingly, thermal management assembly 420 may include or be used with one or more external heat sinks and/or one or more Thermal Interface Materials (TIMs), as disclosed herein. Similar to that shown in fig. 3 and 5, a Thermal Interface Material (TIM) may be generally positioned (e.g., coupled in thermal contact, etc.) between the graphite sheet 414 and an external heat sink. In this case, the TIM may be used to more effectively transfer heat from the graphite sheet 414 to an external heat sink.

Fig. 12 illustrates an exemplary embodiment of a QSFP transceiver 500 (broadly, an apparatus) and a thermal management component 520 embodying one or more aspects of the present invention. As shown in fig. 12, the transceiver 500 includes a holder 502 (broadly, a housing) adapted to receive a connector. Although fig. 12 illustrates thermal management component 520 being used with QSFP transceiver 500, thermal management component 520 may be used with other transceivers (e.g., SFP transceivers, SFP + transceivers, XFP transceivers, QSFP + transceivers, etc.), other devices (e.g., memory card readers, etc.) having housings or holders configured for use with other objects (e.g., memory cards, etc.) other than cable connectors, etc. Thus, aspects of the present invention should not be limited to use with any one particular type of device.

First and second sheets of graphite 514 (broadly, heat spreaders) are wrapped (broadly, disposed) around a portion 534 of the thermal management assembly 520. The first and second graphite sheets 514, 514 are wrapped around the portion 534 in a direction generally parallel to the direction in which the connector will be slidably inserted into and removed from the cage 502. In other words, the first and second graphite sheets 514, 514 are wound around the portion 534 in a direction generally parallel to the length of the holder 502.

The first and second graphite sheets 514, 514 extend through respective first, second and third openings 536, 538, 540 (e.g., slots, etc.) of the thermal management assembly 520. The first and second openings 536 and 538 are adjacent to the opposite ends 522 and 530 of the thermal management assembly 520. The third opening 540 is located approximately midway in the thermal management assembly 520 between the openings 536 and 538.

The third opening 540 may be wide enough to allow portions of the first and second graphite sheets 514, 514 to pass through the same third opening 540. As shown in fig. 12 and 13, the portions of the first and second graphite sheets 514 and 514 that pass through the third opening 540 may be spaced apart from each other with a gap or spacing distance therebetween.

Portion 534 and openings 536, 538, and 540 may be defined by one or more portions of thermal management assembly 520. For example, the thermal management assembly 520 may include a first or top portion 524 that defines a portion 534 and openings 536, 538, and 540. Thermal management assembly 520 may also include a second or bottom portion coupled to top portion 524 and disposed generally below top portion 524. The bottom portion may include one or more features (e.g., rounded or curved edges or lip portions, etc.) to facilitate sliding of the connector under the bottom portion when the connector is slidably inserted into the holder 502 or removed from the holder 502.

The thermal management assembly 520 can include one or more spring contacts configured (e.g., sized, shaped, formed of an elastic material, etc.) to provide mechanical or spring pressure for biasing a lower portion of the graphite sheet 514 against and/or in good thermal contact with a top portion of the connector, and for biasing an upper portion of the graphite sheet 514 against and/or in good thermal contact with another surface (e.g., a thermal interface material, etc.). This, in turn, can improve the thermal contact between the top of the connector and the lower portion of the graphite sheet 514, and between the upper portion of the graphite sheet 514 and another surface. The spring contacts of the thermal management assembly 520 may be similar or identical to the spring contacts 108 shown in fig. 1-5, and/or the spring contacts 308 shown in fig. 7-9.

The top portion 524, bottom portion, and/or spring contacts may be made of metal (e.g., stainless steel, etc.) or other suitable thermally conductive material. The top portion 524 may also include a latch member 526 (broadly, an engagement member) configured to extend downwardly along a sidewall of the cage 502. The latching member 526 may include a latching surface and an opening to enable latching of the top portion 524 to a corresponding structure 528 of the cage 502. Alternatively, other methods of mechanically coupling top portion 524 to cage 502 may be used in other exemplary embodiments.

Thermal management component 520 may be configured to spread and transfer heat from the connectors within cage 502 to one or more other components, such as housing or cage 502, heat sinks, thermal interface materials, thermoelectric modules, heat spreaders, heat sinks, and the like. For example, the thermal management assembly 520 may be configured to diffuse and transfer heat directly from a connector or other heat source (e.g., an integrated circuit, etc.) to an external heat sink (e.g., a heat sink with fins, etc.), as shown in fig. 18. Alternatively, for example, the thermal management component 520 may be configured to diffuse and transfer heat from connectors within the cage 502 to a heat sink via a thermal interface material. See, for example, heat sinks 104, 304 and thermal interface materials 106, 306 disclosed herein and illustrated in fig. 1, 3, 5, 6, 8, and 9.

Accordingly, thermal management assembly 520 may include or be used with one or more external heat sinks and/or one or more Thermal Interface Materials (TIMs), as disclosed herein. Similar to that shown in fig. 8 and 9, a Thermal Interface Material (TIM) may be generally positioned (e.g., coupled in thermal contact, etc.) between the graphite sheet 514 and an external heat sink. In this case, the TIM may be used to more effectively transfer heat from the graphite sheet 514 to an external heat sink.

Fig. 14 illustrates an exemplary embodiment of a QSFP transceiver 600 (broadly, an apparatus) and a thermal management component 620 embodying one or more aspects of the present invention. As shown in fig. 14, the transceiver 600 includes a cage 602 (broadly, a housing) adapted to receive a connector. Although fig. 14 shows thermal management component 620 being used with QSFP transceiver 600, thermal management component 620 may be used with other transceivers (e.g., SFP transceivers, SFP + transceivers, XFP transceivers, QSFP + transceivers, etc.), other devices (e.g., memory card readers, etc.) having housings or holders configured for use with other objects (e.g., memory cards, etc.) other than cable connectors, etc. Thus, aspects of the present invention should not be limited to use with any one particular type of device.

First and second sheets 614 (broadly, heat spreaders) are wrapped (broadly, arranged) around respective first and second portions 634 of the thermal management assembly 620. First and second graphite sheets 614, 614 are wrapped around first and second portions 634, 634 in a direction substantially parallel to the direction in which the connector will be slidably inserted into and removed from cage 602. In other words, first and second graphite sheets 614, 614 are wrapped around first and second portions 634, 634 in a direction substantially parallel to the length of holder 602.

In the exemplary embodiment, first and second portions 634 are defined by first or second top portion 624 of thermal management assembly 620. First and second top portions 624, 624 and first and second graphite sheets 614, 614 may be configured (e.g., sized, shaped, positioned, etc.) such that adjacent ends of first and second graphite sheets 614, 614 are in thermal contact with each other, e.g., without any appreciable gap, without a significant separation distance, and/or with substantially zero gap therebetween.

The thermal management assembly 620 may also include one or more bottom portions coupled to the top portion 624 and disposed generally below the top portion 624. The bottom portion may include one or more features (e.g., rounded or curved edges or lip portions, etc.) to facilitate sliding of the connector under the bottom portion when the connector is slidably inserted into the cage 602 or removed from the cage 602.

The thermal management assembly 620 may include one or more spring contacts configured (e.g., sized, shaped, formed of an elastic material, etc.) to provide mechanical or spring pressure for biasing a lower portion of the graphite sheet 614 against and/or in good thermal contact with a top portion of the connector, and for biasing an upper portion of the graphite sheet 614 against and/or in good thermal contact with another surface (e.g., a thermal interface material, etc.). This, in turn, may improve thermal contact between the top of the connector and the lower portion of graphite sheet 614 and between the upper portion of graphite sheet 614 and another surface. The spring contacts of the thermal management assembly 620 can be similar or identical to the spring contacts 108 shown in fig. 1-5, and/or the spring contacts 308 shown in fig. 7-9.

The first and second top portions 624, bottom portions, and/or spring contacts may be made of metal (e.g., stainless steel, etc.) or other suitable thermally conductive material. The first and second top portions 624, 624 may also include latch members 626 (broadly, engagement members) configured to extend down the side walls of the cage 602. The latch members 626 may include latching surfaces and openings to enable the top portion 624 to latch to corresponding structures 628 of the cage 602. Alternatively, other methods of mechanically coupling top portion 624 to cage 602 may be used in other exemplary embodiments.

Thermal management assembly 620 may be configured to spread and transfer heat from the connectors within cage 602 to one or more other components, such as a housing or cage 602, a heat sink, a thermal interface material, a thermoelectric module, a heat spreader, a heat sink, and the like. For example, the thermal management assembly 620 may be configured to diffuse and transfer heat directly from a connector or other heat source (e.g., an integrated circuit, etc.) to an external heat sink (e.g., a heat sink with fins, etc.), as shown in fig. 18. Alternatively, for example, the thermal management assembly 620 may be configured to spread and transfer heat from connectors within the cage 602 to a heat sink via a thermal interface material. See, for example, heat sinks 104, 304 and thermal interface materials 106, 306 disclosed herein and illustrated in fig. 1, 3, 5, 6, 8, and 9.

Accordingly, thermal management assembly 620 may include or be used with one or more external heat sinks and/or one or more Thermal Interface Materials (TIMs), as disclosed herein. Similar to that shown in fig. 8 and 9, a Thermal Interface Material (TIM) may be generally positioned (e.g., coupled in thermal contact, etc.) between graphite sheet 614 and an external heat sink. In this case, the TIM may be used to more effectively transfer heat from the graphite sheet 614 to an external heat sink.

Fig. 16 illustrates an exemplary embodiment of a QSFP transceiver 700 (broadly, an apparatus) and a thermal management component 720 embodying one or more aspects of the present invention. As shown in fig. 16, the transceiver 700 includes a cage 702 (broadly, a housing) adapted to receive a connector. Although fig. 16 illustrates thermal management component 720 as being used with QSFP transceiver 700, thermal management component 720 may be used with other transceivers (e.g., SFP transceivers, SFP + transceivers, XFP transceivers, QSFP + transceivers, etc.), other devices (e.g., memory card readers, etc.) having housings or holders configured for use with other objects (e.g., memory cards, etc.) other than cable connectors, etc. Thus, aspects of the present invention should not be limited to use with any one particular type of device.

The graphite sheet 714 (broadly, a heat spreader) is wrapped (broadly, arranged) around portions of the thermal management assembly 720 in different non-parallel directions. More specifically, the exemplary embodiment includes first and second (or end) portions 742, 744 of the same/single graphite sheet 714 that are generally coiled around opposing end portions 722, 730, respectively, of the thermal management assembly 720 in a direction that is generally parallel to the direction in which the connector will be slidably inserted into and removed from the cage 702. In other words, the first and second portions 742, 744 of the same/single graphite sheet 714 are generally wound around the opposite ends 722, 730, respectively, of the thermal management assembly 720 in a direction generally parallel to the length of the cage 702.

Also in the exemplary embodiment, third and fourth (or intermediate) portions 746 and 748 of the same/single graphite sheet 714 are wrapped generally about the intermediate portion 734 of the thermal management assembly 720 in a direction that is non-parallel to the wrapping direction of the first and second portions 742 and 744. The third portion 746 and the fourth portion 748 of the same/single graphite sheet 714 are generally wrapped around the middle portion 734 of the thermal management assembly 720 in a direction that is generally perpendicular to the direction in which the connector will be slidably inserted into and removed from the cage 702. In other words, the third and fourth portions 746, 748 of the same/single graphite sheet 714 are generally wound around the middle portion 734 of the thermal management assembly 720 in a direction that is generally perpendicular to the length of the cage 702.

The opposing ends 722, 730 and the intermediate portion 734 may be defined by one or more portions of the thermal management assembly 720. For example, the thermal management assembly 720 may include a first or top portion 724 defining portions 722, 730, 734. The thermal management assembly 720 may also include a second or bottom portion coupled to the top portion 724 and disposed generally below the top portion 724. The bottom portion may include one or more features (e.g., rounded or curved edges or lip portions, etc.) to facilitate sliding of the connector under the bottom portion when the connector is slidably inserted into or removed from the holder 702.

The thermal management assembly 720 may include one or more spring contacts configured (e.g., sized, shaped, formed of an elastomeric material, etc.) to provide mechanical or spring pressure for biasing a lower portion of the graphite sheet 714 against and/or in good thermal contact with the top of the connector, and for biasing an upper portion of the graphite sheet 714 against and/or in good thermal contact with another surface (e.g., a thermal interface material, etc.). This, in turn, can improve the thermal contact between the top of the connector and the lower portion of the graphite sheet 714 and between the upper portion of the graphite sheet 714 and the other surface. The spring contacts of the thermal management assembly 720 may be similar or identical to the spring contacts 108 shown in fig. 1-5, and/or the spring contacts 308 shown in fig. 7-9.

The top portion 724, the bottom portion 710, and/or the spring contacts may be made of metal (e.g., stainless steel, etc.) or other suitable thermally conductive material. The top portion 724 may also include a latch member 726 (broadly, an engagement member) configured to extend downwardly along a sidewall of the cage 702. The latching member 726 may include a latching surface and an opening to enable latching of the top portion 724 to a corresponding structure 728 of the cage 702. Alternatively, other methods of mechanically coupling the top portion 724 to the cage 702 may be used in other exemplary embodiments.

The thermal management component 720 may be configured to spread and transfer heat from the connectors within the cage 702 to one or more other components, such as the housing or cage 702, a heat sink, a thermal interface material, a thermoelectric module, a heat spreader, a heat sink, and the like. For example, the thermal management component 720 may be configured to diffuse and transfer heat directly from a connector or other heat source (e.g., an integrated circuit, etc.) to an external heat sink (e.g., a heat sink with fins, etc.), as shown in fig. 18. Alternatively, for example, the thermal management assembly 720 may be configured to spread and transfer heat from the connectors within the cage 702 to a heat sink via a thermal interface material. See, for example, heat sinks 104, 304 and thermal interface materials 106, 306 disclosed herein and illustrated in fig. 1, 3, 5, 6, 8, and 9.

Accordingly, thermal management assembly 720 may include or be used with one or more external heat sinks and/or one or more Thermal Interface Materials (TIMs), as disclosed herein. Similar to that shown in fig. 3 and 5, a Thermal Interface Material (TIM) may be generally positioned (e.g., coupled in thermal contact, etc.) between the graphite sheet 714 and an external heat sink. In this case, the TIM may be used to more effectively transfer heat from the graphite sheet 714 to an external heat sink.

Exemplary embodiments that include winding portions of the same/single graphite sheet (or other heat spreader) in different non-parallel directions can provide the benefit of eliminating the challenging task of positioning portions of graphite sheet into relatively narrow gaps, slots, or small spaces (e.g., slots 536, 538, 540 shown in fig. 12) during winding in high volume production. Another potential benefit is that a single graphite wrap may enable an easier manufacturing process than having two graphite sheets wrapped around two components (e.g., component 624 in fig. 14), respectively, which may require two product lines. And if the two parts are not interchangeable, the positioning of the two parts is not interchangeable. In this case, more care may be required during assembly to ensure correct positioning of the two components, which in turn may introduce the possibility of assembly errors in mass production. With a single graphite wrap, it is possible to have a more simplified production line and/or easier graphite wrap in automated mass production. In addition, the unitary structure of a single graphite wrap may have greater structural stability in actual operation to resist rotational vibration than multiple graphite wraps that may have the potential to rotate along their length.

Fig. 18 illustrates a simulation model overview used during a QSFP (quad small form-factor pluggable) simulation study to monitor and compare maximum heat source temperatures when different thermal management components are used, specifically, the thermal management component 420 shown in fig. 10, the thermal management component 620 shown in fig. 12, and the thermal management component 720 shown in fig. 16.

For the simulations, each thermal management assembly 420, 620, and 720 included a graphite sheet or layer 414, 614, 714 with a thin layer of polyethylene terephthalate (PET) and Pressure Sensitive Adhesive (PSA), respectively, along each side of the graphite (e.g., a 0.05mm thick PSA/PET layer)Etc.). PET can provide increased mechanical and/or abrasion resistance to graphite. PSAs can be used to adhere graphite to other surfaces. Also for simulations, the graphene sheets 414, 614, 714 comprise Tgon having a single crystal structure in the carbon plane^TM9000 series of synthetic graphites. Table 1 below includes Tgon from Laerd^TMAdditional details of the 9000 series of synthetic graphites.

During simulation, the power generation of the integrated circuit was 6 watts (W). The cooling method includes a fan blowing over the heat sink at a flow rate of 40 cubic feet per minute (CFM) while the rest of the system is under natural convection and radiation, with an ambient temperature (Tamb) of 22 degrees celsius (c).

Fig. 19 shows the thermal simulation results using the model shown in fig. 18, along with a wound graphite sheet 414 according to the embodiment shown in fig. 10 and 11. As shown in fig. 19, the maximum temperature of the integrated circuit (broadly, the heat source) is 73.1 degrees celsius (° c).

Fig. 20 shows the thermal simulation results using the model shown in fig. 18, along with first and second sheets 614 of wound graphite according to the embodiment shown in fig. 12 and 13. As shown in fig. 20, the maximum temperature of the integrated circuit (broadly, the heat source) is 63.9 degrees celsius (deg.c).

Fig. 21 shows the thermal simulation results using the model shown in fig. 18, along with a single graphite sheet 714 having portions wound in two non-parallel directions according to the embodiment shown in fig. 16 and 17. As shown in fig. 21, the maximum temperature of the integrated circuit (broadly, the heat source) is 65.8 degrees celsius (° c).

In general, a comparison of fig. 19, 20, and 21 shows the thermal performance improvement and lower maximum temperature achievable by using graphite to define multiple thermal paths (e.g., fig. 12-17, etc.), which improves thermal diffusion.

In an exemplary embodiment, a transceiver (broadly, a device) (e.g., a small form-factor pluggable (SFP) transceiver, an SFP + transceiver, a quad small form-factor pluggable (QSFP) transceiver, a QSFP + transceiver, an XFP transceiver, other devices besides transceivers, etc.) includes a cage (broadly, a housing) (e.g., an SFP cage, etc.) adapted to receive a connector (e.g., an SFP cable connector, other cable connector, etc.). At least one of the thermal interface material and the thermoelectric module is typically between one side (e.g., a top side, another side, etc.) of the cage and an external heat sink. The at least one spring contact is typically coupled to a side of the cage between the connector and at least one of the thermal interface material and the thermoelectric module. The at least one spring contact and at least one of the thermal interface material and the thermoelectric module define at least a portion of a thermally conductive thermal path between the connector and an external heat sink.

The at least one spring contact may include at least four spring contacts, each spring contact being coupled to a side of the cage generally between the connector and the thermal interface material and/or the thermoelectric module.

The transceiver may also include a metal plate coupled to the at least one spring contact. The metal plate may be substantially parallel to a side of the cage and in contact with a connector received in the cage, thereby defining a thermally conductive thermal path between the connector and the at least one spring contact. The transceiver may also include graphite, which is typically wrapped around the metal plate and at least a portion of the at least one spring contact. The side of the holder may include an opening. The metal plate may be positioned within the opening such that the metal plate and/or the at least one spring contact thereby define at least a portion of a side of the cage.

The transceiver may further include a tag disposed on the holder. The tag may include graphite and include indicia about the transceiver.

The at least one spring contact may be coupled to the top of the cage via laser welding.

In an exemplary embodiment, at least one of the thermal interface material and the thermoelectric module is a thermoelectric module.

In another exemplary embodiment, at least one of the thermal interface material and the thermoelectric module is a thermal interface material. The transceiver may further include a thermally and electrically conductive material wrapped around at least a portion of the thermal interface material for conducting heat from the cage and for electrically grounding the cage. The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material may include at least one of copper foil, plated fabric, nickel-copper plated nylon, graphite sheet, and synthetic graphite sheet including a polyethylene terephthalate (PET) layer for enhanced mechanical resistance and/or abrasion resistance. The thermal interface material may include a ceramic and/or a boron nitride filled silicon elastomer. The thermal interface material may include a surface treated to enable the thermally and electrically conductive material to adhere to the silicone elastomer.

In another exemplary embodiment, a transceiver (broadly, a device) (e.g., a small form-factor pluggable (SFP) transceiver, an SFP + transceiver, a quad small form-factor pluggable (QSFP) transceiver, a QSFP + transceiver, an XFP + transceiver, other devices in addition to transceivers, etc.) includes a cage (broadly, a housing) (e.g., a small form-factor pluggable cage, etc.) adapted to receive a connector (e.g., a small form-factor pluggable cable connector, other cable connector, etc.). The thermal interface material is generally located between a side (e.g., top side, another side, etc.) of the holder and the external heat sink. The thermally and electrically conductive material is wrapped around at least a portion of the thermal interface material. The thermal interface material and the thermally and electrically conductive material define at least a portion of a thermally conductive thermal path between the holder and the external heat sink. The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material is operable to electrically ground the holder.

The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material may comprise at least one of copper foil, plated fabric, nickel-copper plated nylon, graphite sheet, and synthetic graphite sheet comprising a polyethylene terephthalate (PET) layer for enhanced mechanical resistance and/or abrasion resistance. The thickness of the thermally and electrically conductive material wrapped around at least a portion of the thermal interface material may be less than about one hundred microns. The thermal interface material may include a ceramic and/or a boron nitride filled silicon elastomer. The thermal interface material may include a surface treated to enable the thermally and electrically conductive material to adhere to the silicone elastomer.

In further exemplary embodiments, a transceiver (broadly, a device) (e.g., a small form-factor pluggable (SFP) transceiver, an SFP + transceiver, a quad small form-factor pluggable (QSFP) transceiver, a QSFP + transceiver, an XFP + transceiver, other devices in addition to transceivers, etc.) includes a cage (broadly, a housing) (e.g., a small form-factor pluggable cage, etc.) adapted to receive a connector (e.g., a small form-factor pluggable cable connector, other cable connector, etc.). The thermal interface material is generally located between a side (e.g., top side, another side, etc.) of the holder and the external heat sink. The thermally and electrically conductive material is wrapped around at least a portion of the thermal interface material. At least one spring contact is coupled to the top side of the cage generally between the connector and the thermal interface material.

The at least one spring contact, the thermal interface material, and the thermally and electrically conductive material may define at least a portion of a thermally conductive thermal path between the connector and an external heat sink. The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material is operable to electrically ground the holder.

The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material may comprise at least one of copper foil, plated fabric, nickel-copper plated nylon, graphite sheet, and synthetic graphite sheet comprising a polyethylene terephthalate (PET) layer for enhanced mechanical resistance and/or abrasion resistance.

The transceiver may further include a thermoelectric module coupled to the thermal interface material.

The transceiver may further include a metal plate coupled to the at least one spring contact. The metal plate may be substantially parallel to the top side of the cage and in contact with the connector received in the cage to thereby define a thermally conductive thermal path between the connector and the at least one spring contact. The transceiver may further include graphite generally wrapped around the metal plate and at least a portion of the at least one spring contact. The top side of the cage may include an opening. The metal plate may be located within the opening such that the metal plate and/or the at least one spring contact thus defines at least a portion of the top side of the cage.

Methods and assemblies for transferring heat from a heat source of a connector (e.g., small form factor pluggable (SFP) cable connector, other cable connector, etc.) within a housing or cage (e.g., small form factor pluggable cage, etc.) of a device, such as a transceiver (e.g., small form factor pluggable (SFP) transceiver, SFP + transceiver, quad small form factor pluggable (QSFP) transceiver, QSFP + transceiver, XFP + transceiver, other devices besides transceivers, etc.), are also disclosed. In an exemplary embodiment, an assembly includes at least one of a thermal interface material and a thermoelectric module and at least one spring contact positionable generally between a connector and the at least one of a thermal interface material and a thermoelectric module. At least one of the thermal interface material and the thermoelectric module may be positioned between the at least one spring contact and the external heat sink for transferring heat from the holder to the external heat sink. The at least one spring contact, the thermal interface material, and/or the thermoelectric module are operable to define at least a portion of a thermally conductive thermal path between the connector and an external heat sink.

The at least one spring contact may comprise at least four spring contacts.

The assembly may further include a metal plate coupled to the at least one spring contact. The metal plate may be configured to be substantially parallel to a top side of the cage and to contact a connector received in the cage to thereby define a thermally conductive thermal path between the connector and the at least one spring contact. The assembly may further include graphite generally wrapped around the metal plate and at least a portion of the at least one spring contact.

Small form factor pluggable transceivers (broadly, devices) (e.g., small form factor pluggable (SFP) transceivers, SFP + transceivers, quad small form factor pluggable (QSFP) transceivers, QSFP + transceivers, XFP + transceivers, devices other than transceivers, etc.) may include components, a small form factor pluggable cage (broadly, a housing), and a small form factor pluggable cable connector (broadly, a connector) located within the cage. The sides (e.g., top side, other side, etc.) of the cage may include openings. The metal plate may be located within the opening such that the metal plate and/or the at least one spring contact thus defines at least a portion of the top side of the cage.

In an exemplary embodiment, at least one of the thermal interface material and the thermoelectric module is a thermoelectric module.

In another exemplary embodiment, at least one of the thermal interface material and the thermoelectric module is a thermal interface material. The assembly may further include a thermally and electrically conductive material wrapped around at least a portion of the thermal interface material for conducting heat from the holder and for electrically grounding the holder. The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material may comprise at least one of copper foil, plated fabric, nickel-copper plated nylon, graphite sheet, and synthetic graphite sheet comprising a polyethylene terephthalate (PET) layer for enhanced mechanical resistance and/or abrasion resistance. The thermal interface material may include a ceramic and/or a boron nitride filled silicon elastomer. The thermal interface material may include a surface treated to enable the thermally and electrically conductive material to adhere to the silicone elastomer.

In another exemplary embodiment, the assembly includes a thermal interface material generally between the top side of the holder and the external heat sink. The thermally and electrically conductive material is wrapped around at least a portion of the thermal interface material. The thermal interface material and the thermally and electrically conductive material are operable to define at least a portion of a thermally conductive thermal path between the holder and an external heat sink. The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material is operable to electrically ground the holder.

The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material may comprise at least one of copper foil, plated fabric, nickel-copper plated nylon, graphite sheet, and synthetic graphite sheet comprising a polyethylene terephthalate (PET) layer for enhanced mechanical resistance and/or abrasion resistance.

The thickness of the thermally and electrically conductive material wrapped around at least a portion of the thermal interface material may be less than about one hundred microns.

The thermal interface material may include a ceramic and/or a boron nitride filled silicon elastomer. The thermal interface material may include a surface treated to enable the thermally and electrically conductive material to adhere to the silicone elastomer.

Small form factor pluggable transceivers (broadly, devices) (e.g., small form factor pluggable (SFP) transceivers, SFP + transceivers, quad small form factor pluggable (QSFP) transceivers, QSFP + transceivers, XFP + transceivers, devices other than transceivers, etc.) may include components, a small form factor pluggable cage (broadly, a housing), and a small form factor pluggable cable connector (broadly, a connector) located within the cage. The thermal interface material and the thermally and electrically conductive material may define a thermally conductive heat path between the holder and the external heat sink. The thermally and electrically conductive material wrapped around at least a portion of the thermal interface material may electrically ground the holder.

In exemplary embodiments comprising one or more graphite sheets, the graphite sheets may comprise one or more Tgon^TM9000 series of graphite flakes. Tgon^TMThe 9000 series of graphite sheets comprises synthetic graphite thermal interface materials that have a carbon in-plane single crystal structure and are ultra-thin, lightweight, flexible, and provide excellent in-plane thermal conductivity. Tgon^TMThe 9000 series of graphite sheets can be used for a variety of heat spreading applications where in-plane thermal conductivity dominates and in confined spaces. Tgon^TMThe 9000 series of graphite sheets may have a thermal conductivity of from about 600 to about 1900W/mK, may help reduce hot spots and protect sensitive areas, may allow for slim device design due to ultra-thin sheet thickness of about 17 to 25 microns, may have a thermal conductivity of from about 2.05g/cm³To 2.25g/cm³Is light weight, can be flexible and can withstand 10,000 deflections at a 6 mm radius. Table 1 below includes information on Tgon^TMAdditional details of the 9000 series of graphite sheets.

TABLE 1

The exemplary embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that the exemplary embodiments may be embodied in several different forms without the specific details, and should not be construed as limiting the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Moreover, the benefits and improvements that may be realized with one or more exemplary embodiments of the present disclosure are provided for purposes of illustration only and are not limiting of the scope of the present disclosure, as the exemplary embodiments disclosed herein may provide all of the above-mentioned benefits and improvements or none at all and still fall within the scope of the present disclosure.

Specific dimensions, specific materials, and/or specific shapes disclosed herein are exemplary in nature and do not limit the scope of the disclosure. The disclosure herein of specific values and specific value ranges for a given parameter is not exhaustive of other values and value ranges that may be used in one or more of the examples disclosed herein. Moreover, it is contemplated that any two particular values for a particular parameter recited herein may define the endpoints of a range of values that may be suitable for the given parameter (i.e., the disclosure of a first value and a second value for a given parameter may be interpreted as disclosing that any value between the first value and the second value may also be employed for the given parameter). For example, if parameter X is illustrated herein as having a value a and is also illustrated as having a value Z, it is contemplated that parameter X may have a range of values from about a to about Z. Similarly, it is contemplated that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping, or distinct) encompasses all possible combinations of ranges of values for which endpoints of the disclosed ranges can be clamped. For example, if parameter X is exemplified herein as having a value in the range of 1-10 or 2-9 or 3-8, it is also contemplated that parameter X may have other ranges of values including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. At least one embodiment includes the above-described features, for example, when an inclusive phrase is used, such as "may include," etc. As used herein, the singular forms "a", "an" and "the" may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises" and "comprising" are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on," "engaged to," "connected to" or "coupled to" another element or layer, it can be directly on, engaged, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in the same fashion (e.g., "between … …" versus "directly between … …", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The term "about" when applied to a value indicates that the calculation or measurement allows the value to be slightly imprecise (near exact in value; approximately or reasonably close in value; nearly). If, for some reason, the imprecision provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein indicates at least variations that may result from ordinary methods of measuring or using such parameters. For example, the terms "generally," "about," and "approximately" may be used herein to mean within manufacturing tolerances.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence unless clearly indicated by the context. Thus, a first element, component, region, layer or section could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms (such as "inner," "outer," "below," "lower," "above," "upper," and the like) may be used herein for convenience in describing the relationship of one element or feature to another element or feature as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The foregoing description of the embodiments has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements, contemplated or stated uses or features of a particular embodiment are generally not limited to that particular embodiment, but, where appropriate, are interchangeable and can be used in a selected embodiment (even if the embodiment is not specifically shown or described). The same can also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Cross Reference to Related Applications

This application claims benefit and priority from U.S. provisional application No.62/747,589, filed on 18/10/2018. The entire disclosure of the above application is incorporated herein by reference.

Claims (28)

1. A thermal management assembly for transferring heat from a device comprising a housing, the thermal management assembly comprising at least one flexible heat dissipating material comprising portions that wrap in different non-parallel directions around respective portions of a component configured to be coupled to and/or along a side of the housing, whereby the heat dissipating material is operable to define at least a portion of a thermally conductive thermal path around the respective portions of the component.

2. The thermal management assembly of claim 1, wherein the member comprises first and second opposing ends and a third portion generally between the first and second opposing ends, and wherein the flexible heat dissipating material comprises:

first and second portions that are wrapped substantially around the respective first and second ends of the component; and

a third portion and a fourth portion of the flexible heat dissipating material that are substantially wrapped around the third portion of the component.

3. The thermal management assembly of claim 2, wherein:

the first and second portions being wrapped substantially around the respective first and second ends of the component in a first direction; and is

The third and fourth portions of the flexible heat dissipating material are wrapped around the third portion of the member generally in a second direction that is non-parallel to the first direction.

4. The thermal management assembly of claim 3, wherein the first and second directions are substantially perpendicular to each other.

5. The thermal management assembly of any of claims 2, 3, 4, wherein the flexible heat dissipating material is a single piece of flexible heat dissipating material integrally comprising the first, second, third and fourth portions.

6. The thermal management assembly of claim 5, wherein the single sheet of flexible heat dissipating material comprises synthetic graphite and/or natural graphite.

7. The thermal management assembly of any of claims 2, 3, 4, wherein:

the first and second portions of the flexible heat dissipating material include opposing first and second ends, respectively, spaced apart from one another along an upper surface of the component; and is

The third and fourth portions of the flexible heat dissipating material include opposing third and fourth ends, respectively, spaced apart from one another along an upper surface of the component.

8. The thermal management assembly of claim 1, wherein the member comprises opposing first and second ends and a third portion generally between the opposing first and second ends, and wherein the flexible heat dissipating material comprises a single piece of flexible heat dissipating material integrally comprising:

first and second portions that are wrapped substantially around the respective first and second ends of the component; and

a third portion and a fourth portion of the flexible heat dissipating material that are substantially wrapped around the third portion of the component.

9. The thermal management assembly of claim 1, wherein the member comprises first and second opposing ends and a third portion generally between the first and second opposing ends, and wherein the flexible heat dissipating material comprises a single piece of graphite integrally comprising:

first and second portions that are wrapped substantially around the respective first and second ends of the component; and

a third portion and a fourth portion of the flexible heat dissipating material that are substantially wrapped around the third portion of the component.

10. The thermal management assembly of claim 9, wherein the monolithic graphite comprises synthetic graphite and/or natural graphite.

11. The thermal management assembly of any of claims 8, 9, 10, wherein:

the first and second portions being wrapped substantially around the respective first and second ends of the component in a first direction; and is

The third and fourth portions of the flexible heat dissipating material are wrapped substantially around the third portion of the component in a second direction substantially perpendicular to the first direction.

12. The thermal management assembly of any of claims 1, 2, 3, 4, 8, 9, 10, wherein:

the component comprises at least one spring contact configured to provide mechanical and/or spring pressure for biasing one or more portions of the flexible heat dissipating material against and/or in thermal contact with another surface; and/or

The component includes at least one latching member configured to extend downwardly along at least one side wall of the housing, the latching member including a latching surface and an opening to enable the component to latch to a corresponding structure along the side wall of the housing.

13. The thermal management assembly of claim 1, wherein the heat dissipating material is a single piece of flexible heat dissipating material integrally including the portion wrapped around the respective portion of the component, and wherein the integral portion of the single piece of flexible heat dissipating material is wrapped in different non-parallel directions around the respective portion of the component.

14. The thermal management assembly of claim 1, wherein the flexible heat dissipating material comprises at least one or more sheets of flexible heat dissipating material comprising portions wrapped in different non-parallel directions around the respective portions of the component.

15. The thermal management assembly of claim 14, wherein the at least one or more sheets of flexible heat dissipating material comprises synthetic graphite and/or natural graphite.

16. A device comprising a housing and the thermal management assembly of claim 1, wherein the member comprises first and second opposing ends and a third portion generally between the first and second opposing ends, and wherein the flexible heat dissipating material comprises:

first and second portions that are generally wound about the respective first and second ends of the component in a first direction that is generally parallel to a direction in which an object can be slidably inserted into and removed from the housing; and

a third portion and a fourth portion of the flexible heat dissipating material that are generally coiled around the third portion of the component in a second direction that is non-parallel to the direction in which the object can be slidably inserted into and removed from the housing.

17. The apparatus of claim 16, wherein:

the apparatus is a small form-factor pluggable transceiver; and

the housing is a small form factor pluggable cage adapted to receive a small form factor pluggable cable connector.

18. The apparatus of claim 16 or 17, wherein:

the third and fourth portions of the flexible heat dissipating material are wound substantially around the third portion of the component in the second direction, the second direction being substantially perpendicular to the direction in which the object can be slidably inserted into and removed from the housing; and is

The flexible heat dissipating material is a single piece of graphite integrally including the first, second, third and fourth portions.

19. A thermal management assembly comprising at least one flexible heat dissipating material comprising portions that are wrapped in different non-parallel directions around respective portions of the thermal management assembly.

20. The thermal management assembly of claim 19, wherein the flexible heat dissipating material comprises:

first and second portions that are generally wrapped around respective first and second ends of a component of the thermal management assembly; and

a third portion and a fourth portion of the flexible heat dissipating material wrapped substantially around a third portion of the member substantially between the first and second opposing ends of the member.

21. The thermal management assembly of claim 20, wherein:

the first and second portions being wrapped substantially around the respective first and second ends of the component in a first direction; and is

The third and fourth portions of the flexible heat dissipating material are wrapped substantially around the third portion of the member in a second direction that is non-parallel to the first direction.

22. The thermal management assembly of claim 21, wherein the first and second directions are substantially perpendicular to each other.

23. The thermal management assembly of any of claims 20, 21, 22 wherein the flexible heat dissipating material is a single piece of flexible heat dissipating material integrally comprising the first, second, third and fourth portions.

24. The thermal management assembly of claim 23, wherein the single sheet of flexible heat dissipating material comprises synthetic graphite and/or natural graphite.

25. A device comprising a housing, a component configured to be coupled to and/or along a side of the housing, and the thermal management assembly of claim 19, for transferring heat from the device, wherein the flexible heat dissipating material comprises portions that are wrapped in different non-parallel directions around respective portions of the component, whereby the heat dissipating material is operable to define at least a portion of a thermally conductive thermal path around the respective portions of the component.

26. The device of claim 25, wherein the member includes first and second opposing ends and a third portion generally between the first and second opposing ends, and wherein the flexible heat dissipating material comprises:

first and second portions that are generally wound about the respective first and second ends of the component in a first direction that is generally parallel to a direction in which an object can be slidably inserted into and removed from the housing; and

a third portion and a fourth portion of the flexible heat dissipating material that are generally coiled around the third portion of the component in a second direction that is non-parallel to the direction in which the object can be slidably inserted into and removed from the housing.

27. The apparatus of claim 26, wherein:

the apparatus is a small form-factor pluggable transceiver; and is

The housing is a small form factor pluggable cage adapted to receive a small form factor pluggable cable connector.

28. The apparatus of claim 26 or 27, wherein:

the third and fourth portions of the flexible heat dissipating material are wound substantially around the third portion of the component in the second direction, the second direction being substantially perpendicular to the direction in which the object can be slidably inserted into and removed from the housing; and is

The flexible heat dissipating material is a single piece of graphite integrally including the first, second, third and fourth portions.

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