CN211403124U - Chip assembly and developing cartridge having the same - Google Patents
Chip assembly and developing cartridge having the same Download PDFInfo
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- CN211403124U CN211403124U CN201922326340.4U CN201922326340U CN211403124U CN 211403124 U CN211403124 U CN 211403124U CN 201922326340 U CN201922326340 U CN 201922326340U CN 211403124 U CN211403124 U CN 211403124U
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Abstract
The utility model discloses a chip module and development box that has it, the chip module includes: the chip comprises a substrate, a first terminal, a second terminal and a third terminal, wherein the first terminal, the second terminal and the third terminal are arranged on the substrate at intervals, and at least one of the first terminal and the second terminal is higher than the third terminal; the switching device includes: the chip is mounted on the shell, the electric connecting piece is in contact fit with the third terminal, the chip and the imaging device mainboard can be electrically connected through the first terminal, the second terminal and the third terminal, and therefore the chip can be verified legally through the imaging device mainboard.
Description
Technical Field
The utility model belongs to the technical field of developing box chip technique and specifically relates to a chip assembly and developing box that has it are related to.
Background
An image forming apparatus such as a printer, a copy or a facsimile machine generally needs to perform a printing or copying operation using toner or ink, and the toner or ink is contained in an ink cartridge of the image forming apparatus. Powder cartridges are generally required to be used for powder adding of imaging devices, but imaging devices of different models need to be matched with corresponding powder cartridges to work normally.
In the related art, since the developing cartridge and the chip mounted on the developing cartridge have to be replaced after a certain period of use (the developer in the developing cartridge is used up). The imaging device mainboard sets up in imaging device, and the chip on the development box must set up to suitable structure, just can be when the installation development box, and the chip on the development box and imaging device mainboard normal contact communication, even the new development box also can't be by normal use's the condition will appear otherwise.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. For this reason, an object of the present invention is to provide a chip assembly that can be mated with a main board of an imaging apparatus, so that the chip assembly passes the validity verification of the imaging apparatus.
The utility model discloses a development box with chip subassembly is further provided.
According to the utility model discloses chip subassembly of first aspect embodiment, include: the chip comprises a substrate, a first terminal, a second terminal and a third terminal, wherein the first terminal, the second terminal and the third terminal are arranged on the substrate at intervals, at least one of the first terminal and the second terminal is higher than the third terminal, a first contact part is arranged on one side of the first terminal far away from the substrate, and a second contact part is arranged on one side of the second terminal far away from the substrate; the switching device includes: the chip is arranged on the shell, the electric connecting piece is arranged on the shell, and the electric connecting piece is in contact fit with the third terminal.
According to the utility model discloses chip subassembly can couple together chip and imaging device mainboard electricity through first terminal, second terminal and third terminal to can carry out the legitimacy through the imaging device mainboard and verify the chip.
According to some embodiments of the invention, the first terminal comprises: two first backup pads and first diaphragm, first diaphragm is connected two between the first backup pad, two first backup pad still connect in the base plate, it is gapped between first diaphragm and the base plate.
According to some embodiments of the invention, the first terminal further comprises: the second transverse plate is fixed on the base plate and connected with one first supporting plate.
According to some embodiments of the present invention, the distance between the first terminal and the third terminal is greater than the distance between the second terminal and the third terminal, and the second terminal is one of an arc-shaped plate, a cylindrical plate, a hollow polygonal plate, and a bent plate bent by a flat plate for multiple times.
According to some embodiments of the invention, the housing comprises: outer frame, bottom plate and installation department, the bottom plate connect in the outer frame, the installation department install in on the bottom plate and with the mounting groove is injectd to the bottom plate, the base plate inserts in the mounting groove, electric connector set up in the installation department.
According to some embodiments of the utility model, the casing is in one side of installation department is left dodges first terminal with the district of dodging of second terminal.
According to some embodiments of the invention, the electrical connector comprises: third diaphragm, second backup pad, first swash plate and second swash plate, first diaphragm set up in the surface of installation department just does the third contact site, the second backup pad is connected the third diaphragm with between the first swash plate, the second swash plate with first swash plate is connected and the junction ends the butt and touches the third terminal.
According to some embodiments of the utility model, the installation department is provided with the socket, the free end of third diaphragm inserts socket department.
According to some embodiments of the present invention, the outer frame is provided with a hook.
According to the utility model discloses developing box of second aspect embodiment includes: the casing is installed on the box body.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural view of a developing cartridge according to an embodiment of the present invention;
fig. 2 is an exploded view of a developing cartridge according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a chip assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a housing according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electrical connector according to an embodiment of the present invention.
Reference numerals:
s: a developing cartridge;
100: a chip assembly;
10: a chip; 11: a substrate; 12: a first terminal; 121: a first transverse plate; 122: a first support plate; 123: a second transverse plate; 13: a second terminal; 131: a second contact portion;
20: a switching device; 21: a housing; 211: an outer frame; 212: a base plate; 213: an installation part; 214: mounting grooves; 215: a hook is clamped; 216: a socket; 22: an electrical connection; 221: a third transverse plate; 222: a second support plate; 223: a first sloping plate; 224: a second swash plate; 23: an avoidance zone;
200: and (5) a box body.
Detailed Description
Embodiments of the present invention are described in detail below, and the embodiments described with reference to the drawings are exemplary.
The chip assembly 100 according to an embodiment of the present invention is described below with reference to fig. 3 to 5, and as shown in fig. 1, the chip assembly 100 is applied to a developing cartridge S, which may be disposed on a cartridge body 200.
As shown in fig. 3, the chip assembly 100 includes: the chip 10 comprises a substrate 11, a first terminal 12, a second terminal 13 and a third terminal, wherein the first terminal 12, the second terminal 13 and the third terminal are arranged on the substrate 11 at intervals, and the first terminal 12 and the second terminal 13 are higher than the third terminal. One side of the first terminal 12, which is far away from the substrate 11, is set as a first contact portion, the first contact portion can electrically connect the first terminal 12 with the imaging device motherboard, and by setting the first terminal 12, information can be transmitted between the chip 10 and the chip terminal of the imaging device motherboard, so that the chip assembly 100 can be validated by the chip of the imaging device motherboard.
The side of the second terminal 13 far from the substrate 11 is provided with a second contact part 131, the second contact part 131 can electrically connect the second terminal 13 with the imaging device main board, and by providing the second terminal 13, information can be transmitted between the chip 10 and the chip terminal of the imaging device main board, so that the chip assembly 100 can be legally verified by the imaging device.
As shown in fig. 3 to 5, the adapter 20 includes: the chip 10 is arranged on the shell 21, the electric connecting piece 22 is in contact fit with the third terminal, the electric connecting piece 22 and the third terminal are respectively two, the two electric connecting pieces 22 and the third terminal are in one-to-one correspondence, and the third terminal on the chip 10 can be electrically connected with the chip terminal of the imaging device mainboard by arranging the electric connecting piece 22, so that information can be transmitted between the chip 10 and the imaging device mainboard. Further, a side of the electric connection member 22 remote from the third terminal is provided as a third contact portion which can be brought into contact with a chip terminal of the image forming apparatus main board, so that the third terminal can be electrically connected with the image forming apparatus main board through the third contact portion.
Thus, the chip and the chip of the imaging device main board can be electrically connected through the first terminal, the second terminal and the third terminal and by using the electrical connection member 22 of the transfer device 20, so that the chip can be legally verified through the imaging device main board. Moreover, such a chip assembly 100 can ensure good contact with the chip of the imaging device, and thus can ensure information transfer stability.
As shown in fig. 2 and 3, the first terminal 12 is far from the third terminal relative to the second terminal 13, and therefore, it can be seen that, in the length direction of the chip 10, the first terminal 12, the second terminal 13 and the two third terminals are sequentially arranged, and the three terminals thus arranged can improve the structural stability of the chip 10 and can make the structure of the chip 10 reasonable.
As shown in fig. 2, the first terminal 12 includes: two first supporting plates 122 and first horizontal plate 121, two first supporting plates 122 are connected to base plate 11 to two first supporting plates 122 are all perpendicular to base plate 11, and first horizontal plate 121 is connected between two first supporting plates 122, and first horizontal plate 121 is perpendicular to two first supporting plates 122. Further, a gap is provided between the first horizontal plate and the base plate 11. Through the first horizontal plate 121 and the two first supporting plates 122, the chip 10 can be electrically connected to the imaging device motherboard, so that information can be transmitted between the chip 10 and the imaging device motherboard. Also, by providing two first support plates 122, the structural reliability of the first terminal 12 can be ensured.
Further, as shown in fig. 2, the first terminal 12 further includes: the second transverse plate 123, the second transverse plate 123 is attached to and fixed on the base plate 11, the second transverse plate 123 is connected with one first supporting plate 122, the connection stability of the first terminal 12 and the chip 10 can be improved by arranging the second transverse plate 123, and the use reliability of the chip 10 is ensured.
And, second diaphragm 123 and base plate 11 parallel arrangement, first diaphragm 121 and second diaphragm 123 and base plate 11 parallel arrangement, so set up can make the setting of first terminal 12 reasonable, promote the contact stability of first terminal 12 and imaging device mainboard.
Optionally, with respect to the first terminal 12, the distance between the first terminal 12 and the third terminal is larger than the distance between the second terminal 13 and the third terminal, that is to say the second terminal 13 is disposed between the first terminal 12 and the third terminal. Since the main board of the image forming apparatus is formed with the cylindrical connector and the protrusions are formed at both sides of the diameter of the connector, the second terminal 13 may be one of an arc-shaped plate, a cylindrical plate, a hollow polygonal plate, and a bent plate bent multiple times from a flat plate. Through setting up second terminal 13 to one of arc, cylinder shaped plate, hollow polygon plate and the bending plate of buckling many times by the flat board, can make the protruding contact on second terminal 13 and the connecting piece to can realize being connected electrically between second terminal 13 and the imaging device mainboard, and then can realize the signal transmission between chip 10 and the imaging device mainboard.
As shown in fig. 4, the housing 21 includes: the substrate 11 may be fixed to the housing 21 by inserting the substrate 11 into the mounting groove 214, and the mounting stability of the substrate 11 may be improved by connecting the bottom plate 212 to the outer frame 211, the bottom plate 212, and the mounting portion 213 mounted on the bottom plate 212 and defining the mounting groove 214 with the bottom plate 212, and inserting the substrate 11 into the mounting groove 214. The electric connecting piece 22 is arranged on the mounting part 213, and the electric connecting piece 22 is arranged on the mounting part 213, so that the connection stability of the electric connecting piece 22 can be improved, and the electric connecting piece 22 is ensured not to be separated from the shell 21 in the using process.
As shown in fig. 4, the housing 21 has a bypass area 23 on one side of the mounting portion 213 for bypassing the first terminal 12 and the second terminal 13, and the first terminal 12 and the second terminal 13 can be disposed on the chip 10 by disposing the bypass area 23 and disposed on one side of the mounting portion 213, so that the chip assembly 100 can be structurally reasonable, and the connection accuracy between the chip assembly 100 and the main board of the imaging device can be improved.
As shown in fig. 5, the electrical connector 22 includes: a third horizontal plate 221, a second support plate 222, a first inclined plate 223, and a second inclined plate 224, the first horizontal plate 121 is disposed on the surface of the mounting portion 213 and is a third contact portion, by which connection between the chip 10 and the imaging apparatus main board can be made. The second supporting plate 222 is connected between the third horizontal plate 221 and the first inclined plate 223, the second inclined plate 224 is connected with the first inclined plate 223 to form a V shape, and the connection part is in contact with the third terminal, and the third contact part and the third terminal can be electrically connected by arranging the second inclined plate 224 and the first inclined plate 223, so that signal transmission between the third terminal and the imaging device main board can be realized.
Referring to fig. 2 and 3, the mounting portion 213 is provided with the insertion hole 216, the free end of the third horizontal plate 221 is inserted into the insertion hole 216, the third horizontal plate 221 can be fixed on the mounting portion 213 by providing the insertion hole 216 and inserting the free end of the third horizontal plate 221 into the insertion hole 216, the stability of the electrical connector 22 mounted on the mounting portion 213 can be improved, and the stability of the electrical connector 22 mounted on the chip assembly 100 can be improved.
As shown in fig. 1 and 2, the present invention further provides a developing cartridge S including: a cartridge body 200 and a chip assembly 100, a case 21 is mounted on the cartridge body 200, and a receiving chamber is formed in the cartridge body 200, in which a developer can be stored.
In addition, the outer frame 211 is provided with the trip 215, is provided with the buckle with trip 215 complex on the box body 200, through set up on the outer frame 211 and mutually support between the buckle that sets up on the box body 200 and the trip 215 and be connected, can fix the casing 21 on the box body 200 to can fix the chip subassembly 100 on the box body 200. Moreover, the hook 215 and the snap are simply connected, which facilitates the maintenance or replacement of the multi-chip module 100 at a later stage.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A chip assembly, comprising:
a chip including a substrate, a first terminal, a second terminal, and a third terminal, the first terminal, the second terminal, and the third terminal being spaced apart on the substrate, at least one of the first terminal and the second terminal being higher than the third terminal;
a transition device, the transition device comprising: the chip is arranged on the shell, the electric connecting piece is arranged on the shell, and the electric connecting piece is in contact fit with the third terminal.
2. The chip assembly of claim 1, wherein the first terminal comprises: two first backup pads and first diaphragm, first diaphragm is connected two between the first backup pad, two first backup pad still connect in the base plate, it is gapped between first diaphragm and the base plate.
3. The chip assembly of claim 2, wherein the first terminal further comprises: the second transverse plate is fixed on the base plate and connected with one first supporting plate.
4. The die assembly of claim 1, wherein a distance between the first terminal and the third terminal is greater than a distance between a second terminal and the third terminal, the second terminal being one of an arc-shaped plate, a cylindrical plate, a hollow polygonal plate, and a bent plate bent from a flat plate multiple times.
5. The chip assembly of claim 1, wherein the housing comprises: outer frame, bottom plate and installation department, the bottom plate connect in the outer frame, the installation department install in on the bottom plate and with the mounting groove is injectd to the bottom plate, the base plate inserts in the mounting groove, electric connector set up in the installation department.
6. The chip assembly of claim 5, wherein the housing leaves an area on one side of the mounting portion that is free of the first and second terminals.
7. The chip assembly of claim 5, wherein the electrical connections comprise: third diaphragm, second backup pad, first swash plate and second swash plate, the third diaphragm set up in the surface of installation department just is the third contact site, the second backup pad is connected the third diaphragm with between the first swash plate, the second swash plate with first swash plate is connected and the junction ends the butt and touches the third terminal.
8. The chip assembly of claim 7, wherein the mounting portion is provided with a socket into which a free end of the third cross plate is inserted.
9. The chip assembly of claim 5, wherein the outer frame is provided with a snap.
10. A developing cartridge, characterized by comprising:
a box body;
the chip assembly of any one of claims 1 to 9, the casing mounted on the cartridge body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922326340.4U CN211403124U (en) | 2019-12-20 | 2019-12-20 | Chip assembly and developing cartridge having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922326340.4U CN211403124U (en) | 2019-12-20 | 2019-12-20 | Chip assembly and developing cartridge having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211403124U true CN211403124U (en) | 2020-09-01 |
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ID=72216421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922326340.4U Active CN211403124U (en) | 2019-12-20 | 2019-12-20 | Chip assembly and developing cartridge having the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211403124U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113917813A (en) * | 2021-09-15 | 2022-01-11 | 珠海益捷科技有限公司 | Developing cartridge and process cartridge |
-
2019
- 2019-12-20 CN CN201922326340.4U patent/CN211403124U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113917813A (en) * | 2021-09-15 | 2022-01-11 | 珠海益捷科技有限公司 | Developing cartridge and process cartridge |
| CN113917813B (en) * | 2021-09-15 | 2024-04-16 | 珠海益捷科技有限公司 | Developing cartridge and process cartridge |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 202, Building G10, South China New Material Innovation Park, No. 31, Kefeng Road, High-tech Industrial Development Zone, Guangzhou, Guangdong, 510700 Patentee after: Guangzhou Zhongnuo Microelectronics Co.,Ltd. Address before: 510663 No. 202, G10 building, Southern China new material innovation park, No. 31, Ke Feng Road, Guangzhou hi tech Industrial Development Zone, Guangdong Patentee before: GUANGZHOU ZHONO ELECTRONIC TECHNOLOGY Co.,Ltd. |