CN211402563U

CN211402563U - Electronic component temperature tester

Info

Publication number: CN211402563U
Application number: CN201921773838.9U
Authority: CN
Inventors: 叶敏; 吴大畏; 李晓强
Original assignee: Yeestor Microelectronics Co ltd
Current assignee: Deyi Microelectronics Co ltd
Priority date: 2019-10-19
Filing date: 2019-10-19
Publication date: 2020-09-01
Anticipated expiration: 2029-10-19

Abstract

The utility model relates to an electronic component temperature tester belongs to test fixture technical field, and its technical essential is: the testing circuit board is correspondingly provided with a mounting seat for mounting an electronic element and an external circuit module electrically connected with the electronic element, and the testing circuit board is correspondingly provided with a testing device for testing temperature corresponding to the mounting seat; the testing device comprises a testing box and a plurality of temperature elements arranged on the testing box, and the mounting seat is arranged inside the testing box. The utility model provides an electronic component temperature tester breaks away from out from electronic equipment through the mount pad that will install electronic component to set up testing arrangement and carry out independent heating or refrigeration to electronic component, reduce the influence of the temperature variation of hot survey operation and cold survey operation in-process to other circuit components and parts, improve and detect the precision.

Description

Electronic component temperature tester

Technical Field

The utility model belongs to the technical field of test fixture technique and specifically relates to an electronic component temperature tester is related to.

Background

The electronic component is a basic component constituting an electronic product. Flash memory cards are one type of electronic components, and are memories for storing electronic information by using flash memory technology, so that the flash memory cards have the advantage that data cannot be lost even in the case of power failure, and are widely used at present due to small volume.

Since the electronic device may be applied to different electronic devices, the environment applied to the electronic device may be a low temperature environment or a high temperature environment, and in order to ensure the use quality of the electronic device, after the electronic device is manufactured, the electronic device generally needs to be subjected to a cold testing operation and a hot testing operation respectively, so as to eliminate unqualified products.

For the better performance change of observing electronic component under different temperatures, through installing electronic component in the circuit of test operation, current electronic component is when carrying out cold test operation or hot test operation, through putting into cold test machine or hot test machine with electronic component and operation circuit whole, not only cause cold test machine and hot test machine volume grow, to the grow that occupies of space, because cold test machine and hot test machine need refrigerate or heat whole simultaneously, other circuit components and parts of being connected with electronic component can lead to the fact harmful effects along with the influence of temperature to electronic component's detection.

Therefore, a new technical solution is needed to solve the above technical problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an electronic component temperature tester breaks away from out from electronic equipment through the mount pad that will install electronic component to set up testing arrangement and carry out independent heating or refrigeration to electronic component, reduce the influence of the temperature variation in hot survey operation and the cold survey operation process to other circuit components and parts, improve the detection precision.

The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:

an electronic component temperature tester comprises a base and a plurality of test circuit boards arranged on the base, wherein each test circuit board is correspondingly provided with a mounting seat for mounting an electronic component and an external circuit module electrically connected with the electronic component, and the test circuit board is correspondingly provided with a test device for temperature test corresponding to the mounting seat; the testing device comprises a testing box and a plurality of temperature elements arranged on the testing box, and the mounting seat is arranged inside the testing box.

By adopting the technical scheme, the mounting seat of the electronic element is separated from the circuit module of the electronic product, the testing device corresponding to the mounting seat is arranged on the testing circuit board, the mounting seat is arranged in the testing box, the temperature element is arranged in the testing box, and the temperature element is utilized to carry out hot testing operation or cold testing operation on the electronic element, so that the size of the testing device is reduced, and meanwhile, the energy consumption required by the test is reduced; because the testing device carries out independent heating or refrigeration on the electronic element, the testing precision of the flash memory card is prevented from being reduced due to the fact that other electronic elements are affected by temperature when the whole electronic product is placed into the testing device.

The utility model discloses further set up to: the temperature element adopts a semiconductor refrigeration piece, one end of the temperature element is arranged in the test box, and the other end of the temperature element is arranged outside the test box.

Through adopting above-mentioned technical scheme, temperature element adopts the semiconductor refrigeration piece, through the electric current direction that changes the temperature element of flowing through to make temperature element be located the one end heating or the refrigeration of test box, make electronic component can carry out hot survey operation and cold survey operation in succession, avoid electronic component's repeated dismantlement and installation and waste time, reduce and move the material time, improve efficiency of software testing.

The utility model discloses further set up to: the test box is characterized in that heat radiating fins are arranged outside the test box corresponding to the temperature elements and attached to the temperature elements.

Through adopting above-mentioned technical scheme, temperature element adopts the semiconductor refrigeration piece to when making the test box internal cooling, the temperature element heating outside the test box, when heating in the test box, the temperature element refrigeration outside the test box increases the heat radiating area of temperature element tip through setting up radiating fin, accelerates the radiating rate of temperature element tip, reduces the influence of the temperature element refrigeration or the heating that lie in the test box outside in the test procedure to the test box inside temperature.

The utility model discloses further set up to: the test box includes the base with test circuit board fixed connection and the lid that articulates and set up on the base, when the lid fits on the base, the test box is inside to be airtight cavity.

By adopting the technical scheme, the box cover is hinged with the base, so that the test box can be conveniently opened to replace and take the electronic element; through setting up inclosed test box, reduce the test in-process, the exchange of test box inside and outside air to improve the inside temperature detection accuracy of test box.

The utility model discloses further set up to: the box cover is provided with a cooling fan, and the cooling fan is communicated with the inside of the test box.

Through adopting above-mentioned technical scheme, through setting up radiator fan for the inside heat of test box is discharged, shortens the required time of cooling down in the test box after the hot operation of surveying, improves efficiency of software testing.

The utility model discloses further set up to: the lid is kept away from and is equipped with the buckle with base articulated one end, buckle and base joint, when the buckle was pressed towards radiator fan one side, the buckle breaks away from the base.

Through adopting above-mentioned technical scheme, through set up the buckle on the lid, utilize buckle and base joint to guarantee in the test process, lid and base keep covering.

The utility model discloses further set up to: the electronic component fixing device is characterized in that a fixing piece is connected to the upper end of the mounting seat, an electronic component is arranged between the mounting seat and the fixing piece, and when the fixing piece moves towards one side of the mounting seat, the fixing piece and the mounting seat clamp the electronic component.

Through adopting above-mentioned technical scheme, through setting up the mounting, utilize the position relation between mounting and the mount pad to make electronic component fixed mounting on the mount pad, avoid electronic component to take place the pine in the test procedure, guarantee that electronic component and external circuit module keep the on-state.

The utility model discloses further set up to: the middle part of the fixing piece is hollowed to form a frame body, and the fixing piece is abutted to the edge of the electronic element.

Through adopting above-mentioned technical scheme, be the framework setting through setting up the mounting for when guaranteeing that the mounting compresses tightly electronic component, in making more the exposure in the test box of electronic component's up end, reduce the temperature difference in electronic component and the test box, improve the precision of test temperature.

To sum up, the utility model discloses a beneficial technological effect does: the installation seat for installing the flash memory card is separated from the circuit module of the electronic product and is independently arranged, and meanwhile, the test device is arranged aiming at the installation seat to carry out hot test operation or cold test operation on the electronic element, so that the size of the test device is reduced, and the reduction of the test precision of the flash memory card caused by the influence of temperature on other electronic elements when the whole electronic product is put into the test device is avoided; the test box is in a closed state in the test process, so that the air flow exchange inside and outside the test box is reduced, and the accuracy of temperature detection is ensured; by arranging the temperature element as the semiconductor refrigerating sheet, the testing device can realize two effects of heating and refrigerating, thereby reducing the times of taking and installing the electronic element on the installation seat, shortening the material moving time and improving the detection efficiency; through set up radiator fan at test box up end to shorten the required time of heat dissipation in the test box after the hot testing operation.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a partial sectional view of the present invention, which mainly shows the respective results of the testing device and the mounting base and the positional relationship therebetween.

In the figure, 1, a base; 2. testing the circuit board; 3. a mounting seat; 31. a fixing member; 311. an elastic buckle piece; 4. an external circuit module; 5. a testing device; 51. a test cartridge; 511. a base; 512. a box cover; 513. buckling; 514. a contact block; 52. a temperature element; 53. a heat dissipating fin; 54. a heat dissipation fan.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1 and 2, for the utility model discloses an electronic component temperature tester, set up test circuit board 2 on base 1 including base 1 and polylith, every test circuit board 2 all corresponds and is equipped with mount pad 3 and the electricity that is used for installing electronic component and connects in electronic component's external circuit module 4, and test circuit board 2 corresponds mount pad 3 and is equipped with testing arrangement 5 that is used for the temperature test. The mounting base 3 for mounting the electronic element is separated from the electronic equipment and is independently arranged, so that the reduction of the test precision of the electronic element caused by the influence of temperature on other electronic elements in the external circuit module 4 in the test process is avoided.

Referring to fig. 2, the testing device 5 includes a testing box 51 and a plurality of temperature elements 52 disposed on the testing box 51, and the mounting base 3 is disposed inside the testing box 51, and is cooled or heated by the temperature elements 52, so that the temperature inside the testing box 51 changes to meet the testing temperature required by the electronic component. In order to ensure that the test box 51 can continuously perform cold test operation and hot test operation, the temperature element 52 is a semiconductor refrigerating sheet, one end of the temperature element 52 is arranged inside the test box 51, and the other end of the temperature element 52 is arranged outside the test box 51. According to the theory of operation of semiconductor refrigeration piece, through the electric current flow direction that changes temperature element 52 of flowing through for the heat flow direction at temperature element 52 both ends changes, reaches the purpose that temperature element 52 is located the one end heating or the refrigeration of test box 51, thereby avoids electronic component's repeated dismantlement and installation and wasted time, reduces and moves the material time, improves efficiency of software testing.

Referring to fig. 2, the heat dissipation fins 53 are arranged outside the test box 51 corresponding to the temperature element 52, the heat dissipation fins 53 are attached to the temperature element 52, and the heat dissipation area of the end portion of the temperature element 52 is increased by using the heat dissipation fins 53, so that the heat dissipation speed of the end portion of the temperature element 52 is increased, and the influence of cooling or heating of the temperature element 52 outside the test box 51 on the internal temperature of the test box 51 in the test process is reduced. In order to further shorten the test time, the electronic element is firstly subjected to cold test operation in the test process; after the cold testing operation is completed, the direction of the current flowing through the temperature element 52 is changed to perform the hot testing operation on the electronic component.

Referring to fig. 2, in order to reduce the inaccurate internal detection temperature of the test box 51 caused by the exchange of the air inside and outside the test box 51 during the test, the test box 51 is closed and then is hermetically disposed during the test, so as to block the flow of the air inside and outside the test box 51. The test box 51 comprises a base 511 fixedly connected with the test circuit board 2 and a box cover 512 hinged to the base 511, and when the test box is in a test process, the box cover 512 covers the base 511, so that the interior of the test box 51 is a closed chamber, the temperature loss caused by convection of air inside and outside the test box 51 is reduced, and the accuracy of the test temperature is improved. One end of the box cover 512 is hinged with the base 511, the other end of the box cover is provided with a buckle 513, and the buckle 513 is clamped with the base 511, so that the box cover 512 and the base 511 can be stably covered. Buckle 513 and lid 512 sliding connection, and be equipped with the pressure spring between buckle 513 and the lid 512, make the pressure spring take place deformation through pressing buckle 513 to make buckle 513 slide on lid 512, buckle 513 withdraws from base 511 simultaneously, realizes that lid 512 opens.

Referring to fig. 2, in order to facilitate the testing personnel to know the testing temperature observed in the testing box 51 in time, the inner wall of the testing box 51 is provided with a temperature sensor, and the temperature sensor is connected with a display screen (not shown in the figure) to display the detected temperature. In order to shorten the time required for cooling the interior of the test box 51 after the thermal testing operation, the upper end surface of the box cover 512 is provided with a cooling fan 54, and the cooling fan 54 is communicated with the interior of the test box 51; when the heat test operation is completed, the heat in the test cassette 51 can be quickly discharged by turning on the heat dissipation fan 54.

Referring to fig. 1 and 2, in order to reduce the mutual influence between two adjacent testing devices 5 and effectively reduce the volume of the base 1, the temperature element 52 is disposed at the upper end of the box cover 512, so that the heat dissipation fins 53 are disposed on the upper end surface of the box cover 512. The heat dissipation fan 54 protrudes out of the upper end face of the test box 51, and a protective cover is covered above the heat dissipation fan 54; in order to improve the safety performance of the test, the upper end surface of the heat dissipation fan 54 is higher than the upper end surfaces of the heat dissipation fins 53, and when the buckle 513 is pressed towards one side of the heat dissipation fan 54, the buckle 513 is separated from the base 511, so that the situation that a tester is scalded due to the contact with the heat dissipation fins 53 when the box cover 512 is opened is avoided.

Referring to fig. 2, in order to facilitate the installation of the electronic component on the mounting base 3, the edge portion of the upper end surface of the mounting base 3 is protruded so that the electronic component can be embedded inside the mounting base 3, the upper end of the mounting base 3 is connected with a fixing member 31, the electronic component is only arranged between the mounting base 3 and the fixing member 31, when the fixing member 31 moves towards one side of the mounting base 3, the fixing member 31 and the mounting base 3 clamp the electronic component, and therefore it is ensured that the electronic component can be kept in a conduction state with the external circuit module 4 in the detection process. The one end of mounting 31 is articulated with mount pad 3 to make mounting 31 can overturn from top to bottom, mounting 31 deviates from its one end with mount pad 3 articulated and is equipped with elasticity cramp 311, and mount pad 3 corresponds and is equipped with the fixture block, through the joint between elasticity cramp 311 and the fixture block, thereby can press from both sides electronic component tightly after making mounting 31 be connected with mount pad 3.

Referring to fig. 2, in order to reduce the temperature difference between the electronic component and the test box 51, the middle portion of the fixing member 31 is hollowed out to form a frame, and the fixing member 31 abuts against the edge of the electronic component, so that the fixing member 31 is ensured to compress the electronic component, and the upper end surface of the electronic component is more exposed in the test box 51. In order to avoid that the elastic performance of the elastic buckle piece 311 is weakened to cause looseness between the elastic buckle piece 311 and the fixture block when the electronic component is used for a long time, so that the pressure applied to the electronic component is reduced, the lower end face of the box cover 512 is fixedly provided with the abutting block 514, the abutting block 514 abuts against the end, provided with the elastic buckle piece 311, of the fixing piece 31, and in the test process, the box cover 512 is kept closed, so that the abutting block 514 is kept abutting against the fixing piece 31, and the fixing piece 31 and the mounting base 3 are guaranteed to keep clamping the electronic component.

The specific implementation process of the embodiment: the electronic components are sequentially mounted on the mounting base 3, then the fixing member 31 is covered on the upper end surface of the electronic component, the elastic buckle piece 311 is buckled with the buckle block, then the box cover 512 is covered with the base 511, and the buckle 513 is buckled with the base 511, so that the electronic component is connected with the external circuit module 4. During the testing process, the electronic component is first subjected to a cold testing operation, i.e., the direction of the current flowing through the temperature element 52 is set, so that the end of the temperature element 52 located inside the test box 51 is cooled. After the cold testing operation is completed, the electronic component is subjected to a hot testing operation, that is, the direction of the current flowing through the temperature element 52 is set to be opposite to the direction of the current in the cold testing operation, so that the end of the temperature element 52 located in the test box 51 is heated. When the electronic component test is completed, the power supply to the temperature element 52 is stopped, the external circuit module 4 is turned off, and then the heat dissipation fan 54 is turned on, so that the heat in the test box 51 is rapidly dissipated by the heat dissipation fan 54. After the temperature in the box 51 to be tested is lowered, the box cover 512 is opened, the fixing member 31 is opened, and the electronic component is taken out from the mounting base 3. And then the next electronic element to be tested is arranged on the mounting seat 3, and the operation steps are repeated for testing.

The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. An electronic component temperature tester, characterized by: the testing device comprises a base (1) and a plurality of testing circuit boards (2) arranged on the base (1), wherein each testing circuit board (2) is correspondingly provided with a mounting seat (3) for mounting an electronic element and an external circuit module (4) electrically connected with the electronic element, and the testing circuit board (2) is correspondingly provided with a testing device (5) for temperature testing corresponding to the mounting seat (3); the testing device (5) comprises a testing box (51) and a plurality of temperature elements (52) arranged on the testing box (51), and the mounting seat (3) is arranged inside the testing box (51).

2. The electronic component temperature tester of claim 1, wherein: the temperature element (52) adopts a semiconductor refrigeration piece, one end of the temperature element (52) is arranged in the test box (51), and the other end of the temperature element is arranged outside the test box (51).

3. The electronic component temperature tester of claim 2, wherein: the external part of the test box (51) is provided with a heat radiating fin (53) corresponding to the temperature element (52), and the heat radiating fin (53) is attached to the temperature element (52).

4. The electronic component temperature tester of claim 1, wherein: the test box (51) comprises a base (511) fixedly connected with the test circuit board (2) and a box cover (512) hinged to the base (511), and when the box cover (512) covers the base (511), the interior of the test box (51) is a closed chamber.

5. The electronic component temperature tester of claim 4, wherein: the box cover (512) is provided with a heat radiation fan (54), and the heat radiation fan (54) is communicated with the interior of the test box (51).

6. The electronic component temperature tester of claim 5, wherein: the box cover (512) is far away from one end hinged with the base (511) and is provided with a buckle (513), the buckle (513) is connected with the base (511) in a clamping mode, and when the buckle (513) is pressed towards one side of the cooling fan (54), the buckle (513) is separated from the base (511).

7. The electronic component temperature tester of claim 1, wherein: the electronic component fixing device is characterized in that a fixing piece (31) is connected to the upper end of the installation base (3), an electronic component is arranged between the installation base (3) and the fixing piece (31), and when the fixing piece (31) moves towards one side of the installation base (3), the fixing piece (31) and the installation base (3) clamp the electronic component.

8. The electronic component temperature tester of claim 7, wherein: the middle part of the fixing piece (31) is hollowed to form a frame body, and the fixing piece (31) is abutted to the edge of the electronic element.