CN211391955U

CN211391955U - Heat conduction electron embedment mucilage binding is put

Info

Publication number: CN211391955U
Application number: CN201922218476.3U
Authority: CN
Inventors: 王浦勋
Original assignee: Qingdao Kerongda Electrical Technology Co ltd
Current assignee: Qingdao Kerongda Electrical Technology Co ltd
Priority date: 2019-12-12
Filing date: 2019-12-12
Publication date: 2020-09-01
Anticipated expiration: 2029-12-12

Abstract

The utility model discloses a heat conduction electron embedment mucilage binding is put relates to the embedment mucilage binding and is put the field, which comprises a frame, establish the conveyer belt in the frame, first support is established to the conveyer belt both sides, establish the embedment device on the first support, the embedment device is including storing up gluey jar, store up gluey tank bottoms portion and establish weighing sensor, store up gluey tank bottoms and establish rubber transmission pipe, the second support is established to first support one side, the bracing piece is established at second support top, establish condensing equipment on the bracing piece, condensing equipment includes electric telescopic handle, casing and clamp plate, electric telescopic handle connects the clamp plate, electric telescopic handle is last to establish spring and spring both ends and is connected with clamp plate and casing. The utility model discloses simple structure to the pouring sealant quantity accurate control, the colloid solidifies with higher speed, ensures that no bubble remains in the colloid, improves pouring sealant quality and product property ability.

Description

Heat conduction electron embedment mucilage binding is put

Technical Field

The utility model belongs to the technical field of the pouring sealant device and specifically relates to a heat conduction electron embedment mucilage binding is put.

Background

The heat-conducting pouring sealant is a low-viscosity flame-retardant bi-component addition type organic silicon heat-conducting pouring sealant, can be cured at room temperature and also can be cured by heating, and has the characteristic that the curing is faster when the temperature is higher; the high-performance electric insulation material has excellent electric insulation performance, can resist environmental pollution, avoids damage to products due to environmental factors such as stress, vibration and humidity, and is particularly suitable for products requiring good heat dissipation performance on potting materials. The product has excellent physical and chemical resistance. The resin has extremely low shrinkage, does not release heat during curing, has no solvent or curing by-products, has repairability, and can be deeply cured into an elastomer. Good thermal conductivity and flame retardance, low viscosity, good leveling property, soft rubber-like formed by curing, good impact resistance, strong adhesive force, insulation, moisture resistance, shock resistance, corona resistance, leakage resistance and chemical medium resistance. The conventional heat conduction electronic component is inconvenient to carry out encapsulation treatment, and the efficiency of the encapsulation treatment of the heat conduction electronic component is low.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defect that exists among the prior art, the utility model provides a heat conduction electron embedment mucilage binding is put.

The utility model provides a technical scheme that its technical problem adopted is: a heat-conducting electronic pouring sealant device comprises a frame, wherein a conveying belt is arranged on the frame, first supports are turned on two sides of the conveying belt, a sealant pouring device is arranged on the first supports and comprises a sealant storage tank, the sealant storage tank is fixedly connected with the first supports, a sealant pouring opening is formed in the top of the sealant storage tank, an electric heating layer is arranged outside the sealant storage tank, a weighing sensor is arranged at the bottom of the sealant storage tank, a sealant conveying pipe is arranged at the bottom of the side wall of the sealant storage tank, an electromagnetic valve is arranged in the middle of the sealant conveying pipe, a sealant spraying opening is formed below the sealant conveying pipe, a regulating valve is arranged between the electromagnetic valve and the sealant spraying opening, the sealant spraying opening is positioned right above the conveying belt, a second support is arranged on one side of the first support, a supporting rod is arranged at the top of the second support and positioned above the conveying belt, a condensing device is arranged on the supporting rod and comprises an electric telescopic rod, a shell and a pressing plate, the bottom of the electric telescopic rod penetrates through the upper portion of the shell to enter the shell, the output end of the electric telescopic rod is fixedly connected with the pressing plate, the electric telescopic rod is sleeved with the spring, two ends of the spring are fixedly connected with the pressing plate and the shell respectively, the sealing rubber ring in contact with the electric telescopic rod is arranged above the shell, and the sealing strip is arranged at the bottom of the shell.

In the above heat-conducting electronic potting adhesive device, the outside of the adhesive storage tank is wrapped with the heat-insulating layer.

In the heat-conducting electronic potting adhesive device, the temperature sensor is arranged in the adhesive storage tank.

Foretell heat conduction electron embedment mucilage binding is put, electric heating layer, temperature sensor, solenoid valve and weighing sensor access controller, the controller is located the outside lateral wall of glue storage tank.

The refrigeration plate is arranged inside the shell, the exhaust pipe is arranged at the top of the shell, and the exhaust pipe is connected with the vacuum pump.

The beneficial effects of the utility model are that, the utility model discloses simple structure, reasonable in design, weighing sensor electricity allies oneself with the solenoid valve, to the alternative quantity accurate control of pouring sealant every time, can not have the colloid overflow to leak or the point is glued inadequately, and condensing equipment compresses, cools down and evacuation to the work piece after the pouring sealant is thick, and the colloid solidifies with higher speed, ensures that no bubble remains in the colloid, improves pouring sealant quality and product property ability.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the glue pouring device of the present invention;

fig. 3 is a schematic structural diagram of the condensing device of the present invention.

In the figure, 1, a rack, 2, a conveyor belt, 3, a first support, 4, a glue pouring device, 41, a glue storage tank, 42, a glue pouring opening, 43, an electric heating layer, 44, a weighing sensor, 45, a glue conveying pipe, 46, an electromagnetic valve, 47, a glue spraying opening, 48, an adjusting valve, 5, a second support, 6, a supporting rod, 7, a condensing device, 71, an electric telescopic rod, 72, a shell, 73, a pressing plate, 74, a spring, 75, a sealing rubber ring, 76, a sealing strip, 8, a heat preservation layer, 9, a temperature sensor, 10, a controller, 11, a refrigeration plate and 12, an air exhaust pipe are arranged.

Detailed Description

In order to more clearly illustrate the technical solution of the present invention, the following provides a further description of the present invention with reference to the accompanying drawings, and obviously, the following described drawings are only one embodiment of the present invention, and for those skilled in the art, other embodiments can be obtained according to the drawings and the embodiment without any creative work, and all belong to the protection scope of the present invention.

A heat conduction electronic pouring sealant device comprises a frame 1, a conveying belt 2 is arranged on the frame 1, first supports 3 are arranged on two sides of the conveying belt 2, a sealant pouring device 4 is arranged on the first supports 3, the sealant pouring device 4 comprises a sealant storage tank 41, the sealant storage tank 41 is fixedly connected with the first supports 3, a sealant pouring port 42 is arranged at the top of the sealant storage tank 41, an electric heating layer 43 is arranged outside the sealant storage tank 41, a weighing sensor 44 is arranged at the bottom of the sealant storage tank 41, a sealant conveying pipe 45 is arranged at the bottom of the side wall of the sealant storage tank 41, an electromagnetic valve 46 is arranged in the middle of the sealant conveying pipe 45, a sealant spraying port 47 is arranged below the sealant conveying pipe 45, an adjusting valve 48 is arranged between the electromagnetic valve 46 and the sealant spraying port 47, the sealant pouring flow rate when different workpieces are filled with sealant is adjusted, during use, the weighing sensor 44 records the total weight of the sealant in the sealant storage tank 41 in advance, then the first workpiece is poured, the weighing sensor 44 records the remaining alternate, obtaining the required glue for glue filling once, when glue is automatically filled, when the glue is reduced by a certain amount, closing the electromagnetic valve 46 to complete one-time glue filling and quantitative control, wherein the glue spraying port 47 is positioned right above the conveyor belt 2, the second support 5 is arranged on one side of the first support 3, the top of the second support 5 is provided with the support rod 6, the support rod 6 is positioned above the conveyor belt 2, the support rod 6 is provided with the condensing device 7, the condensing device 7 comprises an electric telescopic rod 71, a shell 72 and a pressing plate 73, the electric telescopic rod 71 is vertically arranged, the output end of the electric telescopic rod 71 is vertically downward, the bottom of the electric telescopic rod 71 penetrates through the upper part of the shell 72 to enter the shell 72, the output end of the electric telescopic rod 71 is fixedly connected with the pressing plate 73, the electric telescopic rod 71 is sleeved with a spring 74, two ends of the spring 74 are respectively fixedly connected with the pressing plate, sealing strip 76 is established to casing 72 bottom, and sealing strip 76 forms sealedly with conveyer belt 2 to the inside work piece of casing 72, and clamp plate 73 compresses the casting glue, and the colloid solidifies with higher speed of refrigeration board 11, and the evacuation ensures that no bubble etc. in the colloid, improves casting glue quality and product property ability.

In detail, store up gluey jar 41 outside parcel heat preservation 8, store up gluey jar 41 inside temperature sensor 9 of establishing, electric heating layer 43, temperature sensor 9, solenoid valve 46 and weighing sensor 44 access controller 10, controller 10 is located the outside lateral wall of storage gluey jar 41, the inside refrigeration board 11 that sets up of casing 72, exhaust tube 12 is established at casing 72 top, vacuum pump is connected to exhaust tube 12.

The above embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and the protection scope of the present invention is defined by the claims. Various modifications and equivalents of the invention can be made by those skilled in the art within the spirit and scope of the invention, and such modifications and equivalents should also be considered as falling within the scope of the invention.

Claims

1. The utility model provides a heat conduction electron embedment mucilage binding is put, includes frame (1), its characterized in that: establish conveyer belt (2) on frame (1), first support (3) are established to conveyer belt (2) both sides, establish encapsulating device (4) on first support (3), encapsulating device (4) are including storing up gluey jar (41), store up gluey jar (41) and first support (3) fixed connection, store up gluey jar (41) top and establish glue pouring mouth (42), store up gluey jar (41) peripheral hardware electric heating layer (43), store up gluey jar (41) bottom and establish weighing sensor (44), store up gluey jar (41) lateral wall bottom and establish glue conveying pipe (45), solenoid valve (46) are established to glue conveying pipe (45) middle part, glue conveying pipe (45) below is established glue spraying mouth (47) and solenoid valve (46) and glue spraying mouth (47) between establish governing valve (48), glue spraying mouth (47) are located conveyer belt (2) directly over, first support (3) one side is established second support (5), bracing piece (6) and bracing piece (6) are located conveyer belt (2) top are established at second support (5) top, establish condensing equipment (7) on bracing piece (6), condensing equipment (7) include electric telescopic handle (71), casing (72) and clamp plate (73), electric telescopic handle (71) vertical setting and output are vertical downwards, inside casing (72) top entering casing (72) was seen through to electric telescopic handle (71) bottom, electric telescopic handle (71) output fixed connection clamp plate (73), electric telescopic handle (71) is gone up the cover and is established spring (74) and spring (74) both ends respectively with clamp plate (73) and casing (72) fixed connection, casing (72) top is established and is sealed rubber ring (75) with electric telescopic handle (71) contact, sealing strip (76) are established to casing (72) bottom.

2. The heat-conducting electronic potting adhesive device of claim 1, wherein the adhesive storage tank (41) is externally wrapped with an insulating layer (8).

3. A heat-conducting electronic potting compound device as claimed in claim 1, wherein a temperature sensor (9) is provided inside the glue storage tank (41).

4. A heat-conducting electronic potting compound device as claimed in claim 1, wherein the electrical heating layer (43), temperature sensor (9), solenoid valve (46) and load cell (44) are connected to a controller (10), the controller (10) being located on an outer side wall of the glue storage tank (41).

5. The heat-conducting electronic potting adhesive device of claim 1, wherein a refrigerating plate (11) is arranged inside the housing (72), an air suction pipe (12) is arranged on the top of the housing (72), and the air suction pipe (12) is connected with a vacuum pump.