CN211389607U - Encapsulation cutting machine with cooling device - Google Patents

Encapsulation cutting machine with cooling device Download PDF

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Publication number
CN211389607U
CN211389607U CN201921993894.3U CN201921993894U CN211389607U CN 211389607 U CN211389607 U CN 211389607U CN 201921993894 U CN201921993894 U CN 201921993894U CN 211389607 U CN211389607 U CN 211389607U
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China
Prior art keywords
blade
water
pipe
work platform
cooling device
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CN201921993894.3U
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Chinese (zh)
Inventor
李志卫
张仕俊
何浪
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Suzhou Xinmit Electronic Technology Co ltd
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Suzhou Xinmit Electronic Technology Co ltd
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Priority to CN201921993894.3U priority Critical patent/CN211389607U/en
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Abstract

The utility model discloses an encapsulation cutting machine with cooling device relates to encapsulation cutting machine technical field, aims at solving the problem that current technique influences the life of blade easily. The technical scheme is that a cutting device is arranged on a working platform, the cutting device comprises a blade used for cutting a silicon wafer and a driving assembly used for driving the blade to move, the silicon wafer is placed on a fixing plate, the fixing plate is placed on the working platform, a driving part used for driving the fixing plate to move is arranged on the working platform, a water pipe is arranged on the cutting device, a water spraying hole facing the blade is formed in the water pipe, a water tank is arranged in the machine body, a water pump is connected onto the water tank, and a water outlet of the water pump is connected with the water pipe. When the encapsulation cutting machine during operation, start the water pump, the water pipe spouts the coolant liquid to the blade under the drive effect of water pump to can cool off the blade, thereby can effectively increase the life of blade.

Description

Encapsulation cutting machine with cooling device
Technical Field
The utility model belongs to the technical field of the technique of encapsulation cutting machine and specifically relates to an encapsulation cutting machine with cooling device is related to.
Background
The development of science and technology is continuously driving the development of semiconductors, automation, computers and other technologies, so that the use of high-technology products, semiconductor silicon wafers, is more and more extensive.
And the silicon wafer cutting machine adopts a high-strength cutter plated with copper-zinc alloy on the surface when cutting the silicon wafer, and the cutter is finally manufactured into the silicon wafer under the condition of a certain acting force in a high-speed running state.
The current chinese patent of granting No. CN208005012U discloses a silicon chip cutting machine of fixed silicon chip of being convenient for in one, which comprises a bod, a pedestal, remove the seat, servo base and bracing piece, the universal wheel is installed to the below of organism, and the below of organism is fixed with the spike, remove the seat and install in the outside of slide, and the top of removing the seat is provided with the control handle, servo base is fixed in the top of organism, and servo slide is installed to servo base's top, servo slide's top is fixed with the host computer, and the outside of host computer is provided with servo motor, the one end of bracing piece is connected with the host computer, and the other end of bracing piece is connected with the blade. When using, at first, push away suitable position through the universal wheel with the organism, support the supporting legs on the plane, open the shift knob of control box, utilize the control handle control to remove the seat and drive the base and slide on the slide, the spherical structure on the control handle can not harm personnel's hand, the operation panel is in the top of slide, the operation panel removes simultaneously, place the silicon chip on 2 fixed blocks, screw up the bolt, fix the silicon chip, make the silicon chip more accurate at cutting in-process position, servo motor drives servo slide and moves on servo base, the host computer, the cutting structure that bracing piece and blade constitute, cut the silicon chip.
However, the above prior art solutions have the following drawbacks: when the silicon wafer cutting machine is used for cutting a silicon wafer, the contact surface of the cutting blade cuts above the silicon wafer and generates friction, the blade generates heat due to the friction, and if the cutting operation is carried out for a long time, the temperature of the blade is higher and higher, so that the service life of the blade is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a encapsulation cutting machine with cooling device, its life that can effectively increase the blade.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme: the utility model provides an encapsulation cutting machine with cooling device, includes the organism, be provided with work platform on the organism, the last cutting device that is provided with of work platform, cutting device is including the blade that is used for cutting the silicon chip and the drive assembly who is used for driving the blade and removes, and the silicon chip is placed on the fixed plate, the fixed plate is placed on work platform, just work platform is last to be provided with the driving medium that is used for driving the fixed plate and removes, the last water pipe that is provided with of cutting device, be provided with the hole for water spraying towards the blade on the water pipe, be provided with the water tank in the organism, be connected with the water pump on the water tank, the delivery port.
Through adopting above-mentioned technical scheme, when encapsulation cutting machine during operation, start the water pump, the water pipe spouts the coolant liquid to the blade under the drive effect of water pump to can cool off the blade, thereby can effectively increase the life of blade. On the other hand, the cooling liquid can effectively remove static electricity generated when the blade is contacted with the silicon wafer, can lubricate the silicon wafer and the blade, and can achieve the effect of being convenient for cutting.
The utility model discloses further set up to: the water pipe comprises a vertical pipe and a transverse pipe, one end of the vertical pipe is connected with a water outlet of the water pump, the other end of the vertical pipe is connected with the transverse pipe, the transverse pipe is located on one side, away from the driving assembly, of the blade, the transverse pipe is arranged along the length direction of the machine body and has a gap with the blade, and the water spraying hole is located on one side, close to the blade, of the transverse pipe.
Through adopting above-mentioned technical scheme, coolant liquid in the water tank flows into in the violently pipe through the standpipe, and violently manages one side that is close to the blade and be provided with the hole for water spraying, coolant liquid through the even spraying of hole for the temperature of blade reduces, makes the even cover of coolant liquid on the blade, thereby can further increase the life of blade.
The utility model discloses further set up to: a buffer box is arranged between the transverse pipe and the vertical pipe.
Through adopting above-mentioned technical scheme, coolant liquid in the water tank can flow into the buffering incasement through the standpipe earlier, then the even spraying of horizontal pipe and hole for water spraying of the coolant liquid of buffering incasement is on the blade. When the cooling liquid in the water tank is gradually reduced until the cooling liquid is not available, the transverse pipe can continuously spray water to the blade through the cooling liquid in the buffer tank, and therefore the situation that no cooling liquid exists on the blade when the water tank is replaced can be avoided.
The utility model discloses further set up to: the utility model discloses a cutting device, including work platform, wind instrument board, water tank, cutting device, work platform, be provided with the wind instrument board on the work platform, the wind instrument board sets up along its length direction, the wind instrument board is located cutting device's below, the wind instrument board has the clearance with work platform along its width direction's both ends, the water tank is located the below that just is located the wind instrument board on the work platform.
By adopting the technical scheme, the organ plate is provided with the grooves along the width direction of the working platform, and sprayed cooling liquid flows into the water tank along the grooves, so that the situation that the cooling liquid flows to the bottom surface to pollute the environment can be avoided. And the cooling liquid is recycled, so that the production cost can be reduced while the environment-friendly production is realized.
The utility model discloses further set up to: the silicon wafer fixing device is characterized in that the fixing plate is in a round table shape, the silicon wafer is placed in the middle of the fixing plate, and the area of the top end of the fixing plate is smaller than that of the bottom end of the fixing plate.
Through adopting above-mentioned technical scheme, the fixed plate is round platform form, and the area on fixed plate top is less than the area of fixed plate bottom, can further be convenient for spray the coolant liquid on the blade and flow to the piano board.
The utility model discloses further set up to: the two sides of the working platform, which are positioned on the piano plate, are provided with filter screens, and the filter screens are positioned below the piano plate.
Through adopting above-mentioned technical scheme, can effectively filter the impurity that contains in the coolant liquid through the filter screen to can be convenient for recycle.
The utility model discloses further set up to: the filter screen extends to form a connecting plate, a counter bore penetrates through the connecting plate, a connecting hole corresponding to the counter bore is formed in the working platform, and a bolt is inserted into the counter bore and the connecting hole together.
Through adopting above-mentioned technical scheme, the filter screen is used the back for a long time, is blockked up by impurity easily, and rotates the bolt for when bolt and work platform contactless, can take off the filter screen, be convenient for change the filter screen, and can firmly fix filter screen and work platform through the bolt, thereby can be convenient for the installation and the dismantlement of filter screen.
The utility model discloses further set up to: and a connecting rod is arranged on the filter screen.
Through adopting above-mentioned technical scheme, be convenient for take off the filter screen through the connecting rod to can further reach the effect of the operation of being convenient for.
To sum up, the utility model discloses a beneficial technological effect does:
1. through the arrangement of the water pipe, the water spraying holes and the water tank, the service life of the blade can be effectively prolonged;
2. due to the arrangement of the piano plate, the production cost can be reduced while the environment-friendly production is realized;
3. through the arrangement of the filter screen, the connecting plate and the bolts, the filter screen can be conveniently mounted and dismounted.
Drawings
Fig. 1 is a schematic overall structure diagram of a package cutting machine with a cooling device according to an embodiment of the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
fig. 3 is a schematic structural diagram showing the connection relationship between the water tank and the water pump according to the embodiment of the present invention;
FIG. 4 is an enlarged view of portion B of FIG. 3;
fig. 5 is a schematic structural diagram for embodying a filter screen according to an embodiment of the present invention;
fig. 6 is an enlarged view of a portion C in fig. 5.
In the figure, 1, a machine body; 11. a working platform; 12. a mounting cavity; 13. a cutting device; 14. a blade; 15. a drive assembly; 16. a fixing plate; 2. a water tank; 21. a water pump; 22. a water pipe; 23. a vertical tube; 24. a transverse tube; 25. a cache box; 26. a water spray hole; 3. a piano plate; 31. a filter screen; 32. a connecting plate; 33. a counter bore; 34. connecting holes; 35. a bolt; 36. a connecting rod; 37. and (4) a groove.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, for the utility model discloses an encapsulation cutting machine with cooling device, including organism 1, be provided with work platform 11 on the organism 1 and be located the installation cavity 12 of work platform 11 below, be provided with cutting device 13 on work platform 11, cutting device 13 is including the blade 14 that is used for cutting the silicon chip and the drive assembly 15 that is used for driving blade 14 and removes. The silicon wafer is vacuum-adsorbed in the middle of the fixing plate 16, and the fixing plate 16 is in a truncated cone shape, that is, the area of the top end of the fixing plate 16 is smaller than the area of the bottom end of the fixing plate 16. And a transmission member for driving the fixed plate 16 to move is arranged in the mounting cavity 12.
Referring to fig. 3 and 4, a water tank 2 having an upward opening is provided in the installation chamber 12 (see fig. 1), and a water pump 21 is connected to the water tank 2. The cutting device 13 is provided with a water pipe 22, in this embodiment, the water pipe 22 includes a vertical pipe 23 and a horizontal pipe 24, one end of the vertical pipe 23 is connected to the water outlet of the water pump 21, the other end of the vertical pipe 23 is connected to a buffer tank 25, the bottom of the buffer tank 25 is communicated with the horizontal pipe 24, the horizontal pipe 24 is located on one side of the blade 14 far away from the driving component 15 and has a gap with the blade 14, and the horizontal pipe 24 is arranged along the length direction of the machine body 1 (refer to fig. 1). A plurality of water spraying holes 26 are uniformly distributed on one side of the transverse pipe 24 close to the blade 14, and the water spraying holes 26 are distributed along the length direction of the machine body 1.
Referring to fig. 1 and 3, the working platform 11 is provided with the organ plate 3, the organ plate 3 is arranged along the length direction of the working platform 11, both ends of the organ plate 3 along the length direction of the working platform 11 are connected with the working platform 11, the organ plate 3 is located below the cutting device 13, and the transmission member passes through the organ plate 3 and is connected with the fixed plate 16. The two ends of the wind instrument plate 3 and the installation cavity 12 in the width direction of the machine body 1 are provided with gaps, and the water tank 2 is positioned below the wind instrument plate 3.
Referring to fig. 5 and 6, filter screens 31 are provided in the mounting cavity 12 and on both sides of the piano plate 3 in the width direction of the working platform 11, and the filter screens 31 are located below the piano plate 3. Grooves 37 are formed in the top surface of the machine body 1 and on the two side walls in the width direction of the machine body, and the grooves 37 extend to the inner wall of the mounting cavity 12. The filter screen 31 extends to form a connecting plate 32 extending into the groove 37, the connecting plate 32 is provided with counter bores 33 along the side wall of the machine body 1 in the length direction, the machine body 1 is provided with connecting holes 34 corresponding to the counter bores 33 in a penetrating manner, and the counter bores 33 and the connecting holes 34 are provided with bolts 35 in a penetrating manner. The bolt 35 is rotated, so that when the bolt 35 is not in contact with the working platform 11, the filter screen 31 can be taken down, the filter screen 31 is convenient to replace, the filter screen 31 and the working platform 11 can be firmly fixed through the bolt 35, and the filter screen 31 can be conveniently mounted and dismounted. And the filter screen 31 is provided with the connecting rod 36, which can further facilitate the disassembly of the filter screen 31.
The implementation principle of the embodiment is as follows:
when the encapsulation cutting machine works, the water pump 21 is started, and the water pipe 22 sprays cooling liquid to the blade 14 under the driving action of the water pump 21, so that the blade 14 can be cooled. And the sprayed cooling liquid flows to the water tank 2 through the filter screen 31 under the guiding action of the fixed plate 16 and the gusset plate 3, so that the cooling liquid can be recycled.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims (8)

1. The utility model provides a encapsulation cutting machine with cooling device, includes organism (1), be provided with work platform (11) on organism (1), be provided with cutting device (13) on work platform (11), cutting device (13) are including blade (14) that are used for cutting the silicon chip and drive assembly (15) that are used for driving blade (14) to remove, and the silicon chip is placed on fixed plate (16), fixed plate (16) are placed on work platform (11), just be provided with the driving medium that is used for driving fixed plate (16) to remove on work platform (11), its characterized in that: the cutting device (13) is provided with a water pipe (22), the water pipe (22) is provided with a water spraying hole (26) facing the blade (14), the machine body (1) is internally provided with a water tank (2), the water tank (2) is connected with a water pump (21), and a water outlet of the water pump (21) is connected with the water pipe (22).
2. The package cutter with cooling device according to claim 1, wherein: the water pipe (22) comprises a vertical pipe (23) and a transverse pipe (24), one end of the vertical pipe (23) is connected with a water outlet of the water pump (21), the other end of the vertical pipe (23) is connected with the transverse pipe (24), the transverse pipe (24) is located on one side, away from the driving assembly (15), of the blade (14), the transverse pipe (24) is arranged along the length direction of the machine body (1) and has a gap with the blade (14), and the water spraying hole (26) is located on one side, close to the blade (14), of the transverse pipe (24).
3. The package cutter with cooling device according to claim 2, wherein: a buffer box (25) is arranged between the transverse pipe (24) and the vertical pipe (23).
4. The package cutter with cooling device according to claim 1, wherein: be provided with wind instrument board (3) on work platform (11), wind instrument board (3) set up along its length direction, wind instrument board (3) are located the below of cutting device (13), wind instrument board (3) have the clearance with work platform (11) along its width direction's both ends, water tank (2) are located work platform (11) and are located the below of wind instrument board (3).
5. The package cutter with cooling device according to claim 1, wherein: the silicon wafer fixing device is characterized in that the fixing plate (16) is in a circular truncated cone shape, the silicon wafer is placed in the middle of the fixing plate (16), and the area of the top end of the fixing plate (16) is smaller than that of the bottom end of the fixing plate (16).
6. The package cutter with cooling device according to claim 4, wherein: work platform (11) are gone up and are located wind instrument board (3) and all are provided with filter screen (31) along the both sides of work platform (11), filter screen (31) all are located the below of wind instrument board (3).
7. The package cutter with cooling device according to claim 6, wherein: the filter screen (31) extends to form a connecting plate (32), a counter bore (33) penetrates through the connecting plate (32), a connecting hole (34) corresponding to the counter bore (33) is formed in the working platform (11), and a bolt (35) is inserted into the counter bore (33) and the connecting hole (34) together.
8. The package cutter with cooling device according to claim 7, wherein: the filter screen (31) is provided with a connecting rod (36).
CN201921993894.3U 2019-11-18 2019-11-18 Encapsulation cutting machine with cooling device Active CN211389607U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921993894.3U CN211389607U (en) 2019-11-18 2019-11-18 Encapsulation cutting machine with cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921993894.3U CN211389607U (en) 2019-11-18 2019-11-18 Encapsulation cutting machine with cooling device

Publications (1)

Publication Number Publication Date
CN211389607U true CN211389607U (en) 2020-09-01

Family

ID=72225371

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921993894.3U Active CN211389607U (en) 2019-11-18 2019-11-18 Encapsulation cutting machine with cooling device

Country Status (1)

Country Link
CN (1) CN211389607U (en)

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