CN211376596U

CN211376596U - Cutter for cutting off metal wire in semiconductor packaging bonding process

Info

Publication number: CN211376596U
Application number: CN201922288953.3U
Authority: CN
Inventors: 张旭; 刘星宇; 谭和平
Original assignee: Chengdu Yeheng Electronic Co ltd
Current assignee: Chengdu Yeheng Electronic Co ltd
Priority date: 2019-12-19
Filing date: 2019-12-19
Publication date: 2020-08-28
Anticipated expiration: 2029-12-19

Abstract

The utility model discloses a cutter that is used for semiconductor package bonding in-process to cut off metal wire, including cutter body, cutter body includes cutter arbor and tool bit, and the cutter arbor is used for connecting outside metal wire cutting equipment, tool bit fixed connection is on the top of cutter arbor, its characterized in that, and the top of tool bit is equipped with the first inclined plane and the second inclined plane of mutual opposition, and the top and the bottom on first inclined plane are located the both sides of the vertical central line of tool bit respectively, and the crossing department that first inclined plane and second inclined plane upwards extend forms the horizontally sword blade that is used for cutting off the wire. The utility model discloses a sword blade is at the high-speed impact cut off the metal in-process, and the atress is even, difficult emergence fracture, and cutter long service life reduces the frequency of changing the cutter, is favorable to practicing thrift the cost.

Description

Cutter for cutting off metal wire in semiconductor packaging bonding process

Technical Field

The utility model relates to a semiconductor package technical field, concretely relates to cutter that is arranged in semiconductor package bonding process to cut off metal wire.

Background

At present, in the process of packaging a semiconductor, a lead frame is used as a carrier of a semiconductor chip, a bonding machine is used for welding (bonding) the chip and a lead of the lead frame by using aluminum, copper, silver or other metal wires to realize the electrical connection between an internal circuit of the chip and an external circuit, and the metal wires for bonding are cut by a cutter mechanism according to the required length and speed. The metal wire is required to be cut off in a flush manner after the ultrasonic welding wire is welded, so a cutter can be used in the bonding and packaging process, the working surface (edge surface) of the currently used cutter adopts a structure of a side single surface, one side of the cutter edge is an inclined surface, and the other side of the cutter edge is a straight surface; after the cutting edge is abraded, the cut end faces of the metal wires are not parallel and level; even the metal wire can not be cut completely, which may cause bad chip bonding and packaging.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cutter that is used for semiconductor package bonding in-process to cut off metal wire for solve the bonding metal wire and cut off the in-process, firstly because the working face is marginal sword blade, lead to the inhomogeneous condition of atress, secondly the cutting material resistance is great, cutter life is shorter, and it is very fast to change the frequency, leads to problem with high costs.

In order to solve the technical problem, the utility model discloses a following scheme:

the utility model provides a cutter that is used for semiconductor package bonding in-process to cut off metal wire, includes cutter body, cutter body includes cutter arbor and tool bit, and the cutter arbor is used for connecting outside metal wire cutting equipment, tool bit fixed connection is on the top of cutter arbor, and the top of tool bit is equipped with the first inclined plane and the second inclined plane of opposition each other, and the top and the bottom on first inclined plane are located the both sides of the vertical central line of tool bit respectively, and the crossing department that first inclined plane and second inclined plane upwards extend forms the horizontally sword blade that is used for cutting off the wire.

By adopting the technical scheme, the utility model comprises a cutter body, the cutter body comprises a cutter bar and a cutter head, the cutter bar is used for connecting external metal wire cutting equipment, the cutter head is fixedly connected with the top end of the cutter bar, the top end of the cutter head is provided with a first inclined plane and a second inclined plane which are opposite to each other, the top end and the bottom end of the first inclined plane are respectively arranged at two sides of the vertical central line of the cutter head, the top end of the first inclined plane is inclined towards the right side surface of the cutter head, the second inclined plane is inclined towards the left side surface of the cutter head, the intersection part of the upward extension of the second inclined plane and the first inclined plane forms a horizontal cutter edge, the cutter edge is used for cutting off metal wires, when in work, the external cutting equipment drives the cutter bar to vertically move downwards, thereby the cutter edge of the cutter head cuts off the metal wires, in the process of cutting, both side surfaces of the cutter edge are inclined planes, leading to uneven stress during rapid cutting; because in the tangent line process behind ultrasonic bonding, when the cutter working face cut off the metal wire fast, the sword blade can bear very big pressure in the twinkling of an eye, and operating condition is metal to metal cutting, is difficult for causing the sword blade to abrade like this and collapse and lacks, has prolonged the life of cutter, has practiced thrift the cost.

Further, as a preferred technical scheme, an included angle between the first inclined surface and the right side surface, adjacent to the knife edge, of the knife head is 36-50 degrees.

Due to the adoption of the technical scheme, repeated tests show that when the included angle between the first inclined plane and the right side surface of the cutter head adjacent to the cutter edge is 36-50 degrees, the stress of the cutter edge is more uniform.

Further, as a preferred technical scheme, an included angle between the second inclined plane and the right side face, adjacent to the knife edge, of the knife head is 15-35 degrees, and the second inclined plane extends downwards to intersect with the right side face of the knife head.

By adopting the technical scheme, after repeated practice tests, the included angle between the second inclined plane and the right side surface of the cutter head adjacent to the cutter edge is 15-35 degrees, and the second inclined plane extends downwards to intersect with the right side surface of the cutter head, so that the stress distribution at the cutter edge is more uniform, the risk of easy fracture in the high-speed impact cutting process is avoided, and the replacement frequency of the cutter is reduced.

Further, as a preferred technical scheme, the width value of the knife edge is 0.005-0.015 mm. Ensuring that the cut of the metal wire meets the requirements.

Further, as a preferred technical scheme, a third inclined plane is arranged on the cutter head, the top end of the third inclined plane is intersected with the bottom end of the first inclined plane, the intersection angle forms an obtuse angle, and the third inclined plane extends downwards to be intersected with the left side face of the cutter head.

Further, as a preferable technical scheme, the cutter head and the cutter rod are integrally formed. The cutter head and the cutter bar are integrally formed, so that the whole cutter has stronger impact resistance. Further prolonging the service life of the cutter.

Further, as a preferred technical scheme, the cutter body is made of an alloy material with impact resistance, high toughness and wear resistance. Because operating condition is metal to the metal cutting, the sword blade of this kind of alloy material's cutter body is difficult for wearing and tearing and lacks, can not cause the metal wire to cut off the terminal surface not parallel and level, guarantees that the metal wire cuts absolutely, reduces the bad risk of chip bonding encapsulation.

The utility model discloses beneficial effect who has:

1. in the cutting process of the bonding metal wire, both sides of the knife edge are inclined planes, so that the condition of uneven stress caused by the fact that the working surface is the edge knife edge is avoided, the knife edge is not prone to breaking in the process of cutting the metal wire through high-speed impact, the service life of the knife is prolonged, the cost of frequently replacing the knife by an enterprise is reduced, the resistance condition of a cutting material is reduced, and the cutting efficiency and the quality of the cutting end face are improved.

2. The cutter edge of the cutter made of the impact-resistant, high-toughness and wear-resistant alloy material is not easy to wear and collapse, the non-parallel end surfaces of the metal wire can not be cut off, the complete cutting of the metal wire is guaranteed, and the risk of poor chip bonding and packaging is reduced.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a tool tip;

fig. 3 is a schematic perspective view of fig. 1.

Reference numerals: 1-a cutter body, 2-a cutter bar, 3-a cutter head, 4-a first inclined plane, 5-a second inclined plane, 6-a third inclined plane, 7-a cutter cutting edge, 8-a left side surface and 9-a right side surface.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and the terms are only for convenience of description of the present invention and simplifying the description, but do not indicate or imply that the device or element to which the term refers must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should be further noted that, unless otherwise explicitly specified or limited, the terms "disposed," "opened," "mounted," "connected," and "connected" are to be construed broadly, e.g., as either a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Examples

The utility model provides a cutter for cutting off metal wire among semiconductor package bonding process, includes cutter body 1, cutter body 1 includes cutter arbor 2 and tool bit 3, and cutter arbor 2 is used for connecting outside metal wire cutting equipment, 3 fixed connection on the top of cutter arbor 2 of tool bit, the top of tool bit 3 are equipped with mutual opposition first inclined plane 4 and second inclined plane 5, and the top and the bottom on first inclined plane 4 are located the both sides of 3 vertical center lines of tool bit respectively, and the crossing department that first inclined

plane

4 and 5 upwards extensions on second inclined plane form the horizontally sword blade 7 that is used for cutting off the wire.

By adopting the technical scheme, referring to fig. 1-3, the utility model comprises a cutter body 1, the cutter body 1 is composed of a cutter bar 2 and a cutter head 3, the cutter bar 2 is used for connecting external metal wire cutting equipment, the cutter head 3 is fixedly connected with the top end of the cutter bar 2, the top of the cutter head 3 is provided with a first inclined plane 4 and a second inclined plane 5 which are opposite to each other, the top end and the bottom end of the first inclined plane 4 are respectively arranged at two sides of the vertical central line of the cutter head 3, the top end of the first inclined plane 4 inclines towards the right side surface 9 of the cutter head 3, the second inclined plane 5 inclines towards the left side surface 8 of the cutter head 3, the intersection of the upward extension of the second inclined plane 5 and the first inclined plane 4 forms a horizontal cutter edge 7, the cutter edge 7 is used for cutting metal wires, during operation, the external cutting equipment drives the cutter bar 2 to vertically move downwards, thereby, in the wire cutting process, the two side surfaces of the cutter edge 7 are inclined planes, so that the resistance for cutting a metal wire can be reduced, meanwhile, the problem that the stress is uneven when the metal wire is cut quickly due to the fact that the working surface is the edge cutter edge 7 when the metal wire is cut quickly is also avoided, because the cutter edge 7 can bear large pressure instantly when the metal wire is cut quickly by the cutter working surface in the ultrasonic bonding rear wire cutting process, and the working condition is that metal is cut for metal, the cutter edge 7 is not prone to being worn and broken, the service life of the cutter is prolonged, and the cost is saved.

On the basis of the above embodiment, the angle between the first bevel 4 and the right flank 9 of the cutting head 3 adjacent to the cutting edge 7 is 36-50 °.

The included angle between the second inclined surface 5 and the right side surface 9 of the cutter head adjacent to the cutter edge 7 is 15-35 degrees, and the second inclined surface 5 extends downwards to intersect with the right side surface 9 of the cutter head 3.

Specifically, when the included angle between the first inclined plane 4 and the right side face 9 of the cutter head 3 adjacent to the cutter edge 7 is 36-50 degrees, the included angle between the second inclined plane 5 and the right side face 9 of the cutter head 3 adjacent to the cutter edge 7 is 15-35 degrees, and the second inclined plane 5 extends downwards to intersect with the right side face 9 of the cutter head 3, so that the stress distribution at the cutter edge 7 is more uniform, the risk of easy breakage in the high-speed impact cutting process is avoided, and the replacement frequency of the cutter is reduced.

On the basis of the above-described embodiment, the width of the knife edge 7 has a value of 0.005-0.015 mm. Ensuring that the cut of the metal wire meets the requirements.

Specifically, the cutter head 3 is provided with a third inclined surface 6, the top end of the third inclined surface 6 is intersected with the bottom end of the first inclined surface 4, the intersection angle is an obtuse angle, and the third inclined surface 6 extends downwards to be intersected with the left side surface 8 of the cutter head 3.

In addition to the above embodiments, the cutting head 3 is integrally formed with the holder 2. The cutter head 3 and the cutter rod 5 are integrally formed, so that the whole cutter has stronger impact resistance. Further prolonging the service life of the cutter.

On the basis of the above embodiment, the cutter body 1 is made of an alloy material with impact resistance, high toughness and wear resistance. Because the working condition is that metal cuts, this kind of alloy material's cutter blade 7 is difficult for wearing and tearing, can not cause the metal wire to cut off the terminal surface not parallel and level, guarantees that the metal wire cuts absolutely, reduces the bad risk of chip bonding encapsulation.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and the technical essence of the present invention is that within the spirit and principle of the present invention, any simple modification, equivalent replacement, and improvement made to the above embodiments are all within the protection scope of the technical solution of the present invention.

Claims

1. The utility model provides a cutter for cutting off metal wire among semiconductor package bonding process, includes cutter body (1), cutter body (1) includes cutter arbor (2) and tool bit (3), and cutter arbor (2) are used for connecting outside metal wire cutting equipment, tool bit (3) fixed connection is on the top of cutter arbor (2), its characterized in that, and the top of tool bit (3) is equipped with first inclined plane (4) and the second inclined plane (5) of opposition each other, and the top and the bottom on first inclined plane (4) are located the both sides of tool bit (3) vertical center line respectively, and first inclined plane (4) and second inclined plane (5) are upwards crossing the department of extending and are formed horizontal sword blade (7) that are used for cutting off the wire.

2. The cutter for cutting off the metal wire in the bonding process of the semiconductor package according to claim 1, wherein the angle between the first inclined surface (4) and the right side surface (9) of the cutter head (3) adjacent to the cutting edge (7) of the cutter is 36-50 °.

3. The cutter for cutting off the metal wire in the bonding process of the semiconductor package according to claim 1, wherein the angle between the second inclined surface (5) and the right side surface (9) of the cutter head (3) adjacent to the cutting edge (7) of the cutter is 15-35 °, and the second inclined surface (5) extends downwards to intersect with the right side surface (9) of the cutter head (3).

4. The cutting blade for cutting off the metal wire in the bonding process of the semiconductor package according to claim 1, wherein the width of the cutting edge (7) is 0.005-0.015 mm.

5. The cutter for cutting off the metal wire in the bonding process of the semiconductor package according to claim 1, wherein the cutter head (3) is provided with a third inclined surface (6), the top end of the third inclined surface (6) is intersected with the bottom end of the first inclined surface (4) at an obtuse angle, and the third inclined surface (6) extends downwards to be intersected with the left side surface (8) of the cutter head (3).

6. The cutter for cutting off the metal wire in the bonding process of the semiconductor package as claimed in claim 1, wherein the cutter head (3) is integrally formed with the cutter bar (2).

7. The cutter for cutting off the metal wire in the bonding process of the semiconductor package according to claim 1, wherein the cutter body (1) is made of an alloy material with impact resistance, high toughness and wear resistance.