CN211350486U - Subminiature electromagnetic relay base - Google Patents

Subminiature electromagnetic relay base Download PDF

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Publication number
CN211350486U
CN211350486U CN201921924541.8U CN201921924541U CN211350486U CN 211350486 U CN211350486 U CN 211350486U CN 201921924541 U CN201921924541 U CN 201921924541U CN 211350486 U CN211350486 U CN 211350486U
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CN
China
Prior art keywords
slot
hole
glue
electromagnetic relay
base body
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Active
Application number
CN201921924541.8U
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Chinese (zh)
Inventor
何小兵
徐勇
高山
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Sichuan Hongfa Electroacoustic Co ltd
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Sichuan Hongfa Electroacoustic Co ltd
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Priority to CN201921924541.8U priority Critical patent/CN211350486U/en
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Publication of CN211350486U publication Critical patent/CN211350486U/en
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Abstract

The utility model provides a subminiature electromagnetic relay base, including the base body to and be used for the slot of ann's inserting pin on the base body slot or hole are seted up to the slot side. According to the technical scheme, the lead-out pins can be reliably fixed, and meanwhile, the permeation quantity of glue is increased, so that the contact area between the glue and the lead-out pins is greatly increased, and the sealing performance of the relay is improved.

Description

Subminiature electromagnetic relay base
Technical Field
The utility model belongs to the technical field of electromagnetic relay structural design, in particular to subminiature electromagnetic relay base structural design.
Background
Push-down subminiature electromagnetic relay mainly uses in the household electrical appliances field, have higher requirement to the sealing performance of product, especially the air conditioner field, along with novel refrigerant progressively takes the place of using widely, the leakproofness to the relay has more proposed the high requirement, traditional relay plastic envelope all adopts epoxy glue to cover the bottom plate and realizes (see figure 1), nevertheless because structural limitation, the thickness that epoxy covered is less, lead to gluing and pin-out contact area less, lead to the high temperature that the pin received when the relay welds the upper plate and hardly scatters and disappears fast, can appear gluing and pin-out combination variation's the condition, lead to leaking at last.
Disclosure of Invention
In order to solve the above problem, the utility model provides a base structure in pin slot side fluting or hole, concrete technical scheme as follows:
a microminiature electromagnetic relay base comprises a base body and a slot for inserting a lead-out pin on the base body, wherein a groove or a hole is formed in the side face of the slot.
Preferably, the slot or aperture is centrally located to the side of the longer side of the socket.
Preferably, the cross section of the slot or the hole is rectangular, and the longer side of the cross section of the slot or the hole is smaller than the longer side of the slot and is parallel to the longer side of the slot.
Preferably, the slot or the hole on the side surface of the slot penetrates through the base body.
The utility model discloses a technical scheme has obvious technological effect: a groove or a hole is additionally formed in the side of the pin leading-out slot, the contact area of glue and the pin leading-out can be increased, the glue can flow downwards along the hole, the glue sticking area of the reed is increased, the temperature of the pin leading-out brought by high-temperature welding can be quickly dissipated, and leakage caused by poor bonding of the glue and the pin leading-out is effectively avoided.
Drawings
Fig. 1 is a schematic view of a slot structure of a conventional subminiature relay base
Fig. 2 is a schematic view of the structure of the base slot of the present invention
FIG. 3 is a schematic view taken along line A-A in FIG. 2
The reference numbers in the figures denote:
1. a base body 2, a slot 3, a slot or a hole.
Detailed Description
The technical solution of the present invention is explained in detail below with reference to the accompanying drawings, and particularly, it is suggested that the drawings disclosed herein are only examples of the technical solution, and the explanation below for the drawings is to enable a person having ordinary skill in the art to understand and implement the technical solution of the present invention according to the examples, and does not constitute any limitation to the technical solution of the present invention.
As shown in fig. 1, the slot structure of the electromagnetic relay base in the prior art, the plastic package of the relay is realized by covering the bottom plate with epoxy resin glue, but due to structural limitation, the thickness covered by the epoxy resin is small, so that the contact area between the glue and the lead-out pins is small, the high temperature received by the lead-out pins is difficult to dissipate rapidly when the relay is welded on the upper plate, the glue and the lead-out pins are combined to be poor, and finally, leakage is caused. The utility model discloses following technical scheme is provided to this defect to reach the area of contact who increases glue and pin-out, improve the purpose of base leakproofness.
As shown in fig. 2 and 3, a subminiature electromagnetic relay base includes a base body 1 and a slot 2 for inserting a pin on the base body 1, and unlike the prior art, a slot or a hole 3 is formed on a side surface of the slot 2. Like this, when adopting epoxy glue to cover the bottom plate, glue can permeate down through the groove of slot 2 side or hole 3, in reliable fixed pin extraction, has still increased gluey infiltration volume for glue and pin extraction's area of contact increase.
In order to equalize the forces on the pins received in the slot 2, the slot or hole 3 is preferably centered on the longer side of the slot 2, and both sides of the slot 2 may be provided with the slot or hole 3, as the space of the base structure allows.
As shown in fig. 2, in order to increase the contact area between the glue and the pin, the cross-section of the slot or hole 3 is designed to be rectangular, and the longer side of the rectangle is slightly smaller than the longer side of the slot 2 and is parallel to the longer side of the slot 2. Of course, this does not mean that the cross-sectional shape is designed as a rectangle as the only choice, and other cross-sectional shapes, such as a circle, a semicircle, etc., can be selected according to the actual situation, as long as the contact area between the glue and the lead-out pin can be increased under the conditions of the shape, the size, and the structure permission of the base body 1 of the existing slot 2.
As shown in fig. 3, the groove or hole 3 located on the side surface of the slot 2 may be formed to penetrate the base body 1.
The drawings and the description with the drawings are only specific examples for further explaining the objects, technical solutions and advantages of the present invention in detail, and the present invention is not limited thereto. Any modification, equivalent replacement, improvement and the like made within the scope of the disclosure of the present invention are all included in the protection scope of the present invention.

Claims (2)

1. The utility model provides a subminiature electromagnetic relay base, includes the base body to and be used for the slot of ann's plug-in pin on the base body slot or hole, its characterized in that are seted up to the slot side: the slot or hole is positioned in the center of the side surface of the longer side of the slot, and the slot or hole penetrates through the base body.
2. The subminiature electromagnetic relay base of claim 1, wherein: the cross section of the groove or the hole is rectangular, and the longer side of the cross section of the groove or the hole is smaller than the longer side of the slot and is parallel to the longer side of the slot.
CN201921924541.8U 2019-11-09 2019-11-09 Subminiature electromagnetic relay base Active CN211350486U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921924541.8U CN211350486U (en) 2019-11-09 2019-11-09 Subminiature electromagnetic relay base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921924541.8U CN211350486U (en) 2019-11-09 2019-11-09 Subminiature electromagnetic relay base

Publications (1)

Publication Number Publication Date
CN211350486U true CN211350486U (en) 2020-08-25

Family

ID=72102414

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921924541.8U Active CN211350486U (en) 2019-11-09 2019-11-09 Subminiature electromagnetic relay base

Country Status (1)

Country Link
CN (1) CN211350486U (en)

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