CN211349242U - Dual-processor module and electronic device - Google Patents

Abstract

The utility model provides a dual processor module and electronic equipment, dual processor module includes: the first processor module comprises a first processor unit and a first connector unit which are configured on the mainboard; a second processor module comprising: a circuit board; the second processor unit is configured on the circuit board; and the second connector unit is configured on the circuit board and is spliced with the first connector unit on the mainboard to realize the connection of the second processor module and the mainboard when the second processor module is stacked on the first processor module. The utility model greatly reduces the overall length of the mainboard and the chassis, the independent processor module is easy to plug and unplug, and the configuration flexibility of the server or the memory system is greatly improved; meanwhile, the two processor modules enable the relative positions of the two CPUs and the internal memories thereof to be different, so that the situation that the former CPU and the internal memory are preheated by the latter CPU and the internal memory thereof is avoided, and the heat dissipation of the system is improved.

Description

Dual-processor module and electronic device

Technical Field

The utility model relates to a server or memory technical field especially relate to a dual processor module and electronic equipment.

Background

For enterprise level servers or storage, 2 or more CPUs are typically required to meet the computing power required for their business.

For a mainstream single control module server or storage with a height of 2U or more than 2U in the current market, the system layout of two CPUs and their memories is generally divided into two ways: the two CPUs are placed side by side from left to right or staggered and placed front and back. As shown in fig. 1 and 2.

For the mainstream dual control module server or storage with a height of 2U or more than 2U in the current market, the system layout of two CPUs and their memories is generally: the two CPUs are placed side by side in front and back. As shown in fig. 3 and 4.

In either of the above placement modes, the server or the storage system needs to increase the width or length of the circuit board to meet the space requirements of the two CPUs and the memories thereof. Under the condition of a certain width, more space can be obtained only by lengthening the whole case. In other words, a system supporting dual CPUs has a much longer chassis than a system supporting only a single CPU.

Standard 19 "server rack depths typically include 900 mm, 1000 mm, 1200 mm. Among them, 1000 mm deep cabinets are used in large numbers in current data centers and various machine rooms. The layout of the CPU affects the length of the chassis and, in turn, the type of server rack to which the system is adapted. The length of the chassis of a server or storage device that can be adapted to a standard rack is decisively influenced. On the premise of ensuring that the functions of the system are not reduced, how to make the chassis shorter to adapt to more types of racks becomes a challenge to be faced by designers.

In addition, if two CPUs are placed one behind the other, either misaligned in fig. 2 or completely side-by-side in fig. 4, the former group of CPUs and their memories may have a preheating problem for the latter group of CPUs and their memories. Thus, the heat dissipation of the CPU and its memory in the latter group, and the expansion card behind it, will face a great challenge. The heat dissipation design of the system may need to consider a fan with larger heat sink and higher rotational speed to meet the heat dissipation requirements. This will greatly increase the system cost.

From the above, the layout of the existing dual CPU mainly has the following disadvantages:

1) two CPUs are arranged in front and back, so that the main board and the case are longer. Is not suitable for a machine frame with shallow depth.

2) The former CPU and its memory preheat the latter CPU and its memory, which is not good for heat dissipation.

3) For the application of a single CPU, although the CPU and its memory may be omitted, the CPU socket, memory slot, CPU-related power supply, and peripheral circuits required on the motherboard cannot be removed from the motherboard, and the cost of these components still needs to be paid for by the customer.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a dual processor module and an electronic device for solving the problem that the dual CPU layout affects the length of the chassis in the prior art.

To achieve the above and other related objects, the present invention provides a dual processor module, comprising: the first processor module comprises a first processor unit and a first connector unit which are configured on the mainboard; a second processor module comprising: a circuit board; the second processor unit is configured on the circuit board; and the second connector unit is configured on the circuit board and is spliced with the first connector unit on the mainboard to realize the connection of the second processor module and the mainboard when the second processor module is stacked on the first processor module.

In an embodiment of the present invention, the second processor unit is disposed on the front side of the circuit board, and the second connector unit is disposed on the back side of the circuit board.

In an embodiment of the present invention, the second processor module further includes at least one memory cell disposed on the front surface of the circuit board.

In an embodiment of the present invention, the second processor module further includes: the tray bracket is used for bearing the circuit board, and the bottom of the tray bracket can expose the second connector unit; and a handle which is arranged on the tray support and can lift the tray support upwards.

In an embodiment of the present invention, the handle includes: the handheld portion, connect in handheld portion both sides and with tray support swing joint's first rotating part and second rotating part.

In an embodiment of the present invention, the number of the handles is two, and the handles are respectively disposed at two ends of the tray support.

In an embodiment of the present invention, the first connector unit includes a plurality of first connectors distributed on one side or both sides of the first processor unit, the second connector unit includes a plurality of second connectors distributed on one side or both sides of the opposite surface of the second processor unit, and the number and the position of the second connectors correspond to the first connectors.

In an embodiment of the present invention, the second processor module further includes: a power circuit and a preset peripheral function control circuit which are configured on the circuit board.

An embodiment of the utility model provides an electronic equipment is still provided, electronic equipment includes as above dual processor module.

As described above, the utility model discloses a dual processor module and electronic equipment has following beneficial effect:

1. the utility model discloses in, stack an independent processor module including another configuration processor module on the mainboard, form the layout structure of dual processor, the length (142 millimeters) of an at least DDR4 memory slot has been saved to the mainboard, reduces the holistic length of mainboard and quick-witted case greatly, has further saved server or memory system cost.

2. The utility model discloses in, the easy plug of independent processor module can be according to different application demands, and a CPU and memory have been increased or have been removed fast, have improved server or memory system's configuration flexibility greatly.

3. When a user only needs one CPU, the independent processor module is not installed, thereby saving the cost of the entire server or memory system.

4. The utility model discloses in, two relative position of processor module with two CPU and memory have avoided the back a set of CPU and memory to the preheating condition of preceding CPU and memory, have improved the heat dissipation of system, and the more economic heat dissipation design of messenger becomes possible.

5. The utility model discloses in, what the layout structure of dual processor formed is the server or the memory system of short quick-witted case, compares with the system of long quick-witted case, with the more extensive server frame that is suitable for and the different degree of depth. Even in some harsh application scenes, the method can also be applied. Therefore, the utility model discloses the suitability is stronger.

Drawings

Fig. 1 to 4 are schematic diagrams showing a layout of dual CPUs in the prior art.

Fig. 5 is a schematic diagram illustrating the principle structure of the dual processor module according to the present invention.

Fig. 6 is a schematic structural diagram of the first processor module in the dual-processor module according to the present invention.

Fig. 7 is a schematic diagram of the front structure of the second processor module in the dual processor module of the present invention.

Fig. 8 is a schematic diagram of a reverse structure of a second processor module in the middle dual-processor module according to the present invention.

Fig. 9 is a schematic diagram showing the first processor module and the second processor module stacked and connected in the dual-processor module of the present invention.

Fig. 10 is a schematic diagram of a preferred structure of the second processor module in the dual processor module according to the present invention.

Fig. 11 is a schematic diagram of the first processor module and the second processor module before being assembled in the middle dual-processor module of the present invention.

Fig. 12 is a schematic diagram of the first processor module and the second processor module of the dual processor module according to the present invention after being assembled.

Description of the element reference numerals

100 dual processor module

110 first processor Module

111 main board

112 first processor unit

113 first connector unit

113 a-113 e first connector

114a first memory cell

114b second memory cell

120 second processor module

121 circuit board

122 second processor unit

123 second connector unit

123 a-123 e second connector

124 third memory cell

125 fourth memory cell

126 tray support

127 handle

200 case

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

Please refer to fig. 5 to 12. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.

An object of the embodiment of the utility model is to provide a dual processor module and electronic equipment for solve among the prior art dual CPU arrangement mode influence quick-witted case length, unable nimble configuration CPU quantity and heat dispersion scheduling problem.

The principle and implementation of a dual-processor module and an electronic device of the present embodiment will be described in detail below, so that those skilled in the art can understand a dual-processor module and an electronic device of the present embodiment without creative efforts.

As shown in fig. 5, the present embodiment provides a dual processor module 100, where the dual processor module 100 includes: a first processor module 110 and a second processor module 120. The first processor module 110 is configured on the motherboard 111, the second processor module 120 is an independent processor module, and is connected to the motherboard 111 in a pluggable manner, and when the motherboard 111 is inserted, the second processor module 120 and the first processor module 110 form a double-processor layout stacked up and down.

In this embodiment, the processors are CPUs, the first processor module 110 is a first CPU module, and the second processor module 120 is a second CPU module.

The dual processor module 100 of the present embodiment is described in detail below.

In the present embodiment, as shown in fig. 5, the first processor module 110 includes a first processor unit 112 and a first connector unit 113 disposed on the motherboard 111. The motherboard 111 is a motherboard of a chassis, such as a chassis motherboard of a server or a chassis motherboard of a memory. In this embodiment, other structures of the main board 111 are not specifically limited and described.

In the present embodiment, as shown in fig. 6, the first processor unit 112 includes a processor socket (i.e., a CPU socket) and a processor Chip (CPU); the processor chip is disposed in the processor socket.

In the present embodiment, as shown in fig. 6, the first connector unit 113 includes a plurality of first connectors, such as a first connector 113a, a first connector 113b, a first connector 113c, a first connector 113d, and a first connector 113e shown in fig. 6. The plurality of first connectors are distributed on one side or two sides of the first processor unit 112, and the specific configuration number and the specific configuration position of the plurality of first connectors are set according to actual requirements. For example, as shown in fig. 6, the number of the first connectors is five, and the first connectors are distributed on two sides of the first processor unit 112, wherein two (the first connector 113a and the first connector 113b) are located at the upper end and the lower end of the right side of the first processor unit 112, and three (the first connector 113c, the first connector 113d, and the first connector 113e) are located at the left side of the first processor unit 112. The position of the first connector is merely exemplary and not limiting.

In addition, the first processor module 110 further includes at least one memory unit, and each memory unit includes a memory slot and a memory bank inserted into the memory slot. Such as first memory cell 114a and second memory cell 114b shown in fig. 6.

In this embodiment, as shown in fig. 5, the second processor module 120 includes: a circuit board 121, a second processor unit 122 and a second connector unit 123.

The circuit board 121 is used for electrical connection and signal transmission. The circuit board 121 may be a circuit board 121 with any structure in the prior art, and the specific structure of the circuit board 121 itself is not further described in this embodiment.

In the present embodiment, as shown in fig. 5, the second processor unit 122 is disposed on the circuit board 121, and the second connector unit 123 is disposed on the circuit board 121, and further, as shown in fig. 7 and 8, in the present embodiment, the second processor unit 122 is disposed on the front side of the circuit board 121, and the second connector unit 123 is disposed on the back side of the circuit board 121.

As shown in fig. 7, the second processor unit 122 is disposed on the front surface of the circuit board 121, and the second processor unit 122 includes a processor socket (i.e., a CPU socket) and a processor Chip (CPU); the processor chip is disposed in the processor socket.

In this embodiment, as shown in fig. 7, the second processor module 120 further includes at least one memory unit disposed on the front surface of the circuit board 121. Each memory unit comprises a memory slot and a memory bank inserted into the memory slot. For example, as shown in fig. 7, the second processor module 120 includes a third memory unit 124 and a fourth memory unit 125, which are respectively located at the upper and lower sides of the second processor unit 122. In this embodiment, only the number and the positions of the memory cells on the circuit board 121 are exemplarily described, and those skilled in the art can configure the number and the positions of the memory cells on the circuit board 121 according to actual requirements.

In this embodiment, the second connector unit 123 is disposed on the opposite side of the circuit board 121, and the second connector unit 123 includes a plurality of second connectors distributed on one side or two sides of the opposite side of the second processor unit 122, and the number and the position of the second connectors correspond to those of the first connectors.

As shown in fig. 8, for example, the second connector unit 123 includes a second connector 123a, a second connector 123b, a second connector 123c, a second connector 123d, and a second connector 123 e. The second connectors are distributed on one or two opposite sides of the second processor unit 122, that is, the distribution positions and the number of the second connectors correspond to the number and the positions of the first connectors on the main board 111. For example, the positions and number of the second connectors as in fig. 8 correspond to the number and positions of the first connectors as in fig. 6. As shown in fig. 8, the number of the second connectors is also five, wherein the second connectors 123a and 123b on the circuit board 121 are distributed to correspond to the first connectors 113a and 113b on the motherboard 111, and the second connectors 123c, 123d and 123e on the circuit board 121 correspond to the first connectors 113c, 113d and 113e on the motherboard 111, respectively. The position of the second connector is merely exemplary and not limiting.

In this embodiment, as shown in fig. 9, when the second processor module 120 is stacked on the first processor module 110, the circuit board 121 provided with the second processor unit 122 faces upward, the circuit board 121 provided with the second connector unit 123 faces downward, and the second connector unit 123 is plugged with the first connector unit 113 on the motherboard 111 to connect the second processor module 120 with the motherboard 111.

In this embodiment, an independent processor module is stacked on another processor module disposed on the motherboard 111 to form a layout structure of a dual processor, the motherboard 111 saves the length (142 mm) of at least one DDR4 memory slot, the overall length of the motherboard 111 and the chassis is greatly reduced, and the cost of a server or a storage system is further saved. Even in some harsh application scenes, the method can also be applied. Therefore, the utility model discloses the suitability is stronger.

Meanwhile, the relative positions of the two CPUs and the internal memories of the two processor modules are used, so that the situation that the former CPU and the internal memory are preheated by the latter group of CPUs and the internal memories of the latter group of CPUs as shown in fig. 4 is avoided, the heat dissipation of a server or a storage system is improved, and the more economical heat dissipation design is possible.

In addition, in this embodiment, the independent second processor module 120 is easy to plug and unplug, and a CPU and its memory can be quickly added or removed from the motherboard 111 according to different application requirements, thereby greatly improving the configuration flexibility of the server or the storage system. When the user needs only one CPU, the separate second processor module 120 is not mounted on the motherboard 111, thereby saving the cost of the entire server or memory system.

In this embodiment, as shown in fig. 10, the second processor module 120 further includes: a tray support 126 and a handle 127.

The tray support 126 is used for carrying the circuit board 121 and the second connector unit 123 is exposed from the bottom; the handle 127 is disposed on the tray support 126, and can lift the tray support 126 upward.

Specifically, in the present embodiment, the handle 127 includes: handheld portion with connect in handheld portion both sides and with tray support 126 swing joint's first rotating part and second rotating part.

That is, in this embodiment, the circuit board 121 of the second processor module 120 is installed on a small tray (tray support 126), and the rotatable handles 127 are installed on the front and back of the tray support 126, so that the second processor module 120 (independent CPU module) can be conveniently plugged in and pulled out.

In the present embodiment, one of the handles 127 is installed in the middle of the tray support 126, and the second processor module 120 is lifted by one of the handles 127, and in another embodiment, as shown in fig. 10, two of the handles 127 are preferably arranged at two ends of the tray support 126, respectively.

In addition, in this embodiment, the second processor module 120 further includes: a power circuit and a predetermined peripheral function control circuit disposed on the circuit board 121. The preset peripheral function control circuit may be configured according to actual requirements, and this embodiment is not specifically limited and described in detail.

The dual processor module 100 of the present embodiment is implemented as follows:

as shown in fig. 10 and 11, when the chassis 200 needs a dual-CPU configuration, the side of the second processor module 120 having the connector faces downward and is stacked on the first processor module 110, and the connector on the second processor module 120 is inserted into the connector on the motherboard 111 to achieve connection with the motherboard 111. After plugging, as shown in fig. 12. When the chassis 200 only needs one CPU, the independent second processor module 120 is not mounted on the motherboard 111, and the second processor module 120 is pulled out from the motherboard 111, thereby greatly improving the configuration flexibility of the server or the memory system.

The present embodiment also provides an electronic device comprising the dual processor module 100 as described above. The electronic equipment is a server, a memory, an industrial computer or the like. For example, the electronic device is a single control module server or a memory or an industrial computer with a height of 2U or more than 2U, or the electronic device is a double control module server or a memory or an industrial computer with a height of 2U or more than 2U. The dual processor module 100 has been described in detail above, and the dual processor module 100 of the electronic device is not described in detail herein.

Furthermore, in order to highlight the innovative part of the present invention, the technical features that are not too closely related to the solution of the technical problem proposed by the present invention are not introduced in the present embodiment, but this does not indicate that there are no other structural and functional features in the present embodiment.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the invention in a schematic manner, and only the components related to the invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.

To sum up, in the utility model, an independent processor module is stacked on another processor module disposed on the motherboard to form a layout structure of dual processors, the motherboard saves the length (142 mm) of at least one DDR4 memory slot, the overall length of the motherboard and the chassis is greatly reduced, and the cost of a server or a memory system is further saved; in the utility model, the independent processor module is easy to plug and unplug, and a CPU and a memory thereof can be rapidly added or removed according to different application requirements, thereby greatly improving the configuration flexibility of the server or the memory system; when a user only needs one CPU, the independent processor module is not installed, so that the cost of the whole server or a memory system is saved; in the utility model, the relative positions of two CPUs and the memories thereof are used by the two processor modules, thereby avoiding the preheating condition of the former CPU and the memories thereof by the latter group of CPUs and the memories thereof, improving the heat dissipation of the system and enabling the more economic heat dissipation design to be possible; the utility model discloses in, what the layout structure of dual processor formed is the server or the memory system of short quick-witted case, compares with the system of long quick-witted case, with the more extensive server frame that is suitable for and the different degree of depth. Even in some harsh application scenes, the method can also be applied. Therefore, the utility model discloses the suitability is stronger. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (9)

1. A dual processor module, comprising:

the first processor module comprises a first processor unit and a first connector unit which are configured on the mainboard;

a second processor module comprising:

a circuit board;

the second processor unit is configured on the circuit board;

and the second connector unit is configured on the circuit board and is spliced with the first connector unit on the mainboard to realize the connection of the second processor module and the mainboard when the second processor module is stacked on the first processor module.

2. The dual processor module of claim 1, wherein: the second processor unit is configured on the front surface of the circuit board, and the second connector unit is configured on the back surface of the circuit board.

3. The dual processor module of claim 2, wherein: the second processor module further comprises at least one memory unit configured on the front side of the circuit board.

4. The dual processor module of claim 1, 2 or 3, wherein: the second processor module further comprises:

the tray bracket is used for bearing the circuit board, and the bottom of the tray bracket can expose the second connector unit;

and a handle which is arranged on the tray support and can lift the tray support upwards.

5. The dual processor module of claim 4, wherein: the handle includes: the handheld portion, connect in handheld portion both sides and with tray support swing joint's first rotating part and second rotating part.

6. The dual processor module of claim 5, wherein: the two handles are respectively arranged at two ends of the tray bracket.

7. The dual processor module of claim 1, 2 or 3, wherein: the first connector unit comprises a plurality of first connectors distributed on one side or two sides of the first processor unit, the second connector unit comprises a plurality of second connectors distributed on one side or two sides of the opposite surface of the second processor unit, and the number and the positions of the second connectors correspond to those of the first connectors.

8. The dual processor module of claim 1, 2 or 3, wherein: the second processor module further comprises:

a power circuit and a preset peripheral function control circuit which are configured on the circuit board.

9. An electronic device, characterized in that: the electronic device comprises a dual processor module as claimed in any one of claims 1 to 8.

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