CN211320136U

CN211320136U - White light illumination structure packaged by multilayer fluorescent glass film

Info

Publication number: CN211320136U
Application number: CN202020316373.0U
Authority: CN
Inventors: 孟遥; 王乐; 黄敏航; 夏国飞; 张宏; 邾强强; 冯玉祥
Original assignee: LONGTENG LIGHTING GROUP CO Ltd
Current assignee: Longteng Lighting Group Co., Ltd
Priority date: 2020-03-15
Filing date: 2020-03-15
Publication date: 2020-08-21
Anticipated expiration: 2030-03-15

Abstract

The utility model relates to a white light illumination structure of multilayer fluorescence glass film encapsulation. The fluorescent glass film is of a laminated film structure and comprises a layer of green powder film and a layer of red powder film, wherein the green powder film and the red powder film are used for compounding green light and red light emitted under the excitation of the blue light LED chip and blue light emitted by the blue light LED chip to obtain white light. The utility model discloses a white light LED color rendering is good, luminous efficiency is high, can effectively solve light decay, heat dissipation and ageing scheduling problem.

Description

White light illumination structure packaged by multilayer fluorescent glass film

Technical Field

The utility model belongs to the technical field of the nondestructive test of ferromagnetism pressure-bearing equipment defect, concretely relates to metal pipeline device of detecting a flaw of magnetic is combined to low frequency electromagnetism.

Background

As a novel illumination means, compared with the traditional incandescent lamp and kerosene lamp, the LED illumination technology has the advantages of small volume, long service life, no pollution, strong stability, high efficiency, energy conservation, high response speed and the like, has wide application prospect in the fields of illumination and display, and has comprehensively replaced other illumination means as a novel environment-friendly illumination technology. Among them, the white LED has advantages of high luminous efficiency, low power consumption, long life, environmental protection, etc., which cannot be compared with other conventional lighting, and is considered as an excellent green light source in the 21 st century. White LEDs are the most promising lighting source to replace incandescent and fluorescent lamps.

The current industrialized method for obtaining the white light LED is dispensing: one or two kinds of fluorescent powder and silica gel or epoxy resin are mixed evenly and then are dripped on a blue LED chip, and then the LED after the glue dispensing is arranged in an oven to be heated so as to solidify the fluorescent powder glue. Because the particles of the fluorescent material are relatively large, the fluorescent material is easily deposited above the LED chip in the packaging process from dispensing to complete curing of the fluorescent powder glue, and light spots are formed on the surface after the LED is lightened, so that the emitted light is not uniform, and the light color quality of the LED is influenced. Since the phosphor is mixed in the silica gel and directly coated on the chip, about 60% of the blue light is absorbed by the LED chip after the phosphor is back-scattered, resulting in a decrease in the blue light emission efficiency, i.e., a decrease in the LED light emission efficiency. The LED chip can generate heat after working for a long time, the fluorescent powder and the silica gel are tightly attached to the periphery of the chip, so that the fluorescent material is heated and aged, the light attenuation of the fluorescent powder is enhanced, meanwhile, the chip can not give off heat in time, the service life of the chip is shortened, and the service life of the white light LED is further shortened.

SUMMERY OF THE UTILITY MODEL

In order to effectively solve the problems of consistent light output, uniform light color, light decay, heat dissipation, aging and the like of the white light LED, a novel solution is provided at present, fluorescent powder is not in direct contact with a chip, the fluorescent powder and glass powder are mixed to form a fluorescent glass film which is arranged on the blue light chip, and a certain distance exists between the chip and the fluorescent glass film, so that the problems existing in the traditional dispensing method can be solved.

Therefore, the utility model adopts the technical scheme that: a white light illumination structure packaged by a multilayer fluorescent glass film comprises a substrate, a blue light LED chip and a fluorescent glass film, wherein the fluorescent glass film is of a laminated film structure, and the fluorescent glass film is not in contact with the blue light LED chip.

Furthermore, the fluorescent glass film is a green powder film and a red powder film.

Further, the emission peak of the LED blue light chip is 450 nm.

Further, the thickness of the green powder film and the thickness of the red powder film are both 50 μm.

Further, the green powder film is arranged close to the blue LED chip.

Compared with the prior art, the utility model has the advantages of as follows: 1) the utility model provides a white light LED light-emitting unanimous, photochromic even, light decay, heat dissipation and ageing scheduling problem.

2) The utility model discloses the packaging technology that traditional phosphor powder was compared to the fluorescent glass film that uses has solved fluorescent material thermal aging, phosphor powder light decay reinforcing, chip scheduling problem that can not in time dispel the heat, has improved white light LED's light efficiency.

3) The utility model discloses a laminated structure of fluorescence glass film has improved white light LED's color rendering index.

The utility model provides a white light illumination structure of multilayer fluorescence glass film encapsulation, this white light illumination structure can overcome among the prior art light-emitting inhomogeneous, the thermal ageing scheduling problem that is heated, can show the color rendering index who promotes white light LED.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure, 1 is a substrate, 2 is a blue light LED chip, and 3 is a fluorescent glass film;

the film 31 is green powder film, and the film 32 is red powder film.

Detailed Description

The utility model discloses the technical scheme who adopts does: the white light illumination structure comprises a substrate 1, a blue light LED chip 2 and a fluorescent glass film 3, wherein the fluorescent glass film is of a laminated film structure and comprises a green powder film 31 and a red powder film 32, and the green powder film and the red powder film are excited by the blue light LED chip to emit green light and red light.

The light conversion material of the green powder film is LuAG Ce³⁺@SiO₂The LuAG: Ce³⁺@SiO₂The chemical formula of (A) is: lu (Lu)_3-xCe_xAl₅O₁₂@SiO₂(0.03<x ≤0.15)。

The light conversion material of the red powder film is CaAlSiN₃:Eu²⁺。

The laminated film structure comprises a green powder film and a red powder film.

The utility model discloses stromatolite membrane structure is the green powder membrane of one deck and the red powder membrane of one deck, and there are light absorption and loss in the fluorescence glass film, and the rete is too much can influence the light efficiency.

The emission peak of the blue LED chip is 450 nm.

The present invention will be described in detail with reference to the accompanying drawings. It is to be noted that structural, methodological, or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.

The white light illumination structure of the present invention will be described in detail with reference to the accompanying drawings.

Please refer to fig. 1, fig. 1 is a schematic structural diagram of the present invention. As shown, the white light illumination structure includes: a substrate 1, a blue LED chip 2 and a fluorescent glass film 3. The blue LED chip 2 is a semiconductor blue light source emitting blue light. The working principle is that electric energy is converted into light energy, and the main material of the chip is monocrystalline silicon. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. When the two semiconductors are connected, a P-N junction is formed between them. When current is applied to the wafer through the wire, electrons are pushed to the P region where they recombine with holes and then emit energy in the form of photons, which is the principle of LED light emission. The wavelength of the light is the color of the light, and the emission peak 450nm is blue light.

Further, the preparation process of the fluorescent glass film adopts a high-temperature solid-phase sintering method, and comprises the following steps:

1) weighing a required sample according to the metering ratio of each element in the chemical formula of the contained fluorescent powder, placing the sample into an agate grinding bowl, and adding a small amount of alcohol to mix uniformly; after the raw materials are naturally dried, the mixed raw materials are moved into a BN crucible and placed in a crucible filled with 95 percent of N₂-5%H₂The temperature is raised to 1800 ℃ at the temperature rising rate of 15-30 ℃/min in a high-temperature air pressure furnace with the reducing atmosphere, and the temperature is kept for 2 hours; and taking out the sample after cooling to room temperature, grinding again, and sieving to obtain powder with uniform particles.

2) Respectively and uniformly mixing the green powder and red powder samples prepared in the step 1) with glass powder according to a certain proportion, adding an organic glue material, stirring to be in a gel state, coating the obtained slurry on a sapphire substrate on a heating table to obtain a fluorescent glass film, finally placing the fluorescent glass film in a muffle furnace for sintering, and keeping the temperature at the highest temperature for 10 min.

The temperature gradient of the fluorescent glass film is 700-900 ℃, and the optimal firing temperature is 850 ℃;

the main component of the low-melting-point glass powder is K₂O-Na₂O-Al₂O₃-SiO₂；

The ratio of the fluorescent powder to the glass powder in the fluorescent glass film is 1: 1;

the thickness of the single-layer monochromatic fluorescent glass film is 50 mu m.

Claims

1. The white light illumination structure packaged by the multilayer fluorescent glass thin film is characterized by comprising a substrate, a blue light LED chip and a fluorescent glass thin film, wherein the fluorescent glass thin film is of a laminated film structure, and the fluorescent glass thin film is not in contact with the blue light LED chip.

2. The structure of claim 1, wherein the fluorescent glass film is a green phosphor film and a red phosphor film.

3. The white light illumination structure encapsulated by the multi-layer fluorescent glass film as claimed in claim 1, wherein the emission peak of the blue LED chip is 450 nm.

4. The structure of claim 2, wherein the green and red films are 50 μm thick.

5. The structure of claim 2, wherein the green phosphor film is disposed adjacent to the blue LED chip.