CN211318689U - Integrated voltage and temperature sampling device - Google Patents
Integrated voltage and temperature sampling device Download PDFInfo
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- CN211318689U CN211318689U CN201921462479.5U CN201921462479U CN211318689U CN 211318689 U CN211318689 U CN 211318689U CN 201921462479 U CN201921462479 U CN 201921462479U CN 211318689 U CN211318689 U CN 211318689U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
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Abstract
The utility model provides an integrated form voltage temperature sampling device, this sampling device include that one end and the electrically conductive connecting piece, the heat conduction of being surveyed the target part electrically conductive connection are connected the circuit board on being surveyed the target part and are used for transmitting temperature sampled signal's first temperature circuit interface terminal and second temperature circuit interface terminal. The circuit board includes the insulating layer, sets up voltage sampling circuit on the insulating layer, set up first temperature sampling circuit and second temperature sampling circuit on the insulating layer and attached temperature sensor on the insulating layer, two temperature line terminals all are connected to the temperature sampling circuit that corresponds respectively through the pad. The sampling device integrates the voltage line interface terminal and the temperature line interface terminal together, so that repeated hot-line operation can be avoided during installation, and the risk of battery short circuit is reduced. The voltage sampling circuit and the temperature sampling circuit are directly connected with the line interface terminal, so that an intermediate conversion terminal or a connector is omitted, and the cost is reduced.
Description
Technical Field
The utility model relates to a new forms of energy electric motor car battery system field especially relates to an integrated form voltage temperature collection system.
Background
With the rapid increase in the number of electric vehicles, traffic accidents related to electric vehicles have also increased year by year. The reason for this is mainly caused by thermal runaway of the battery. In order to effectively avoid the problems of personal safety, property safety and the like caused by traffic accidents, the temperature and the voltage of the battery must be collected and monitored in a reliable mode, and the generation of thermal runaway is avoided.
In an electric vehicle battery system, the temperature and voltage parameters of the battery are actually acquired by acquiring the temperature and voltage parameters of a pure copper or pure aluminum bus bar. The existing data acquisition terminal is connected to the bus bar in a multi-bolt mode, and the bus bar is soft in quality and low in mechanical strength, so that the bolt connection is easy to loosen. In addition, the voltage sampling line or the collecting terminal is made of pure copper and cannot be directly welded on the aluminum material by laser, although the voltage sampling line or the collecting terminal can be welded on the copper material by tin, the voltage sampling line or the collecting terminal is manually operated on the battery, and the safety risk is very high.
The voltage platform of the electric vehicle is hundreds of volts, the electric core is 3.7V at most, and dozens of strings or even hundreds of strings of batteries are needed to meet the requirement. This means that a large number of temperature and voltage acquisition terminals are required, which results in a large amount of labor and money spent in the production and maintenance processes. At present, adopt split type more to the sampling of battery voltage and temperature, wherein the temperature sampling adopts "matchhead" temperature sensor directly to scribble the spiro union behind the heat conduction glue bonding or the filler crimping terminal on the busbar, scribbles the heat conduction glue or the filler crimping terminal can appear bonding or crimping infirm, vibration in-process pine takes off the phenomenon.
For example, fig. 1 shows a split mechanism for acquiring the temperature and voltage of a battery cell in a battery system in the prior art. As shown in fig. 1, the structure includes a temperature data acquisition terminal 10a and a voltage data acquisition terminal 10 b. Wherein, temperature data acquisition terminal 10a includes line nose and temperature sampling structure, and line nose one end is passed through the spiro union and is set up on busbar 20, and other end caulking crimping temperature sampling structure, and the first thermistor of match can be adopted to temperature sampling structure head, and two temperature sampling lines are drawn forth to the first thermistor afterbody of match. The head of the voltage data acquisition terminal 10b may be a metal sheet, the metal sheet may be welded by laser or screwed on the bus bar 20, and the tail of the voltage data acquisition terminal 10b is crimped with the voltage sampling line. In addition, the temperature sampling structure is wrapped by a thick layer of heat-conducting glue with low heat conductivity coefficient, so that the data acquired by the sensor is inaccurate, and the reliability is reduced; the voltage data acquisition terminal is plugged, screwed or welded on the target (busbar 20). Because voltage and temperature are collected separately, electrified repetitive operation on the electric core increases the safety risk.
SUMMERY OF THE UTILITY MODEL
In view of this, the installation operation process in order to solve battery system's temperature, voltage acquisition structure among the prior art has the potential safety hazard, the utility model provides a reliable, low-cost integrated form voltage temperature sampling device, the technical scheme of the utility model as follows:
the sampling device comprises:
one end of the conductive connecting piece is electrically connected with the target piece to be detected;
the circuit board is connected to a tested target part in a heat conduction mode and comprises an insulating layer and a voltage sampling circuit arranged on the insulating layer, wherein two ends of the voltage sampling circuit are electrically connected to a voltage sampling interface terminal and the other end of the conductive connecting piece through corresponding bonding pads respectively, a first temperature sampling circuit and a second temperature sampling circuit are arranged on the insulating layer, and a temperature sensor attached to the insulating layer is attached to the insulating layer, and two ends of the temperature sensor are connected to the first temperature sampling circuit and the second temperature sampling circuit respectively;
the temperature sampling circuit comprises a first temperature circuit interface terminal and a second temperature circuit interface terminal which are used for transmitting temperature sampling signals, wherein the two temperature circuit terminals are respectively connected to corresponding temperature sampling circuits through bonding pads;
in some embodiments, the circuit board further comprises a substrate covered in whole or in part by an insulating layer attached thereto; one end of the conductive connecting piece is directly electrically connected with the substrate or the measured target piece.
In some embodiments, the voltage sampling line is provided with a locally narrowed over-current protection structure.
In some embodiments, the temperature sensor is a patch sensor.
In some embodiments, the circuit board is an aluminum-based circuit board, the circuit board is directly adhered to the target to be tested, and the conductive connecting piece is welded with the target to be tested.
In some embodiments, the circuit board is a flexible circuit board or an aluminum-based circuit board, the circuit board is adsorbed on the substrate, the conductive connecting member is welded with the substrate, and the substrate is welded with the target to be tested.
In some embodiments, the substrate is an aluminum substrate.
Through the utility model discloses an integrated form voltage temperature sampling device can obtain following technological effect: due to the adoption of the integrated voltage and temperature sampling device, the voltage sampling structure and the temperature sampling structure are integrated on one device, so that repeated hot-line operation can be avoided during installation, and the risk of short circuit of the battery is reduced. The voltage sampling circuit and the temperature sampling circuit are directly connected with the sampling terminal, so that an intermediate conversion terminal or a connector is omitted, and the cost is reduced.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
It will be appreciated by those skilled in the art that the objects and advantages that can be achieved with the present invention are not limited to the details set forth above, and that these and other objects that can be achieved with the present invention will be more clearly understood from the following detailed description.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. For convenience in illustrating and describing some portions of the present invention, corresponding parts of the drawings may be exaggerated, i.e., may be larger, relative to other components in an exemplary device actually manufactured according to the present invention. In the drawings:
FIG. 1 shows a schematic diagram of a prior art voltage and temperature line interface terminal utilized in a battery module;
fig. 2 is a schematic structural diagram illustrating an application of the integrated voltage and temperature sampling device provided by the present invention in a battery module;
fig. 3 shows a schematic structural diagram of an integrated voltage temperature sampling apparatus according to an embodiment of the present invention;
fig. 4 shows a schematic structural diagram of an integrated voltage temperature sampling apparatus according to another embodiment of the present invention.
Fig. 5 shows a schematic structural diagram of an integrated voltage temperature sampling apparatus according to another embodiment of the present invention.
Wherein the figures include the following reference numerals:
1. a battery module; 10. an integrated voltage temperature sampling device; 10a, a temperature sampling terminal; 10b, a voltage sampling terminal; 11. a conductive connection member; 12. a voltage sampling line interface terminal; 13. a first temperature line interface terminal; 14 second temperature line interface terminals, 100, a circuit board; 101. a substrate; 102. an insulating layer; 103. a temperature sensor; 104. a voltage sampling line; 105. a second temperature sampling line; 106. a first temperature sampling line; 20. a bus bar.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.
It should also be noted that, in order to avoid obscuring the invention with unnecessary details, only the structures and/or process steps that are closely related to the solution according to the invention are shown in the drawings, while other details that are not relevant to the invention are omitted.
It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, elements, steps or components, but does not preclude the presence or addition of one or more other features, elements, steps or components. It is also noted herein that the term "coupled," if not specifically stated, may refer herein to not only a direct connection, but also an indirect connection in which an intermediate is present. Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same or similar parts, or the same or similar steps.
In order to solve the problem that the installation and operation processes of the temperature and voltage acquisition structure of the battery system in the prior art have potential safety hazards, the utility model provides a reliable, low-cost integrated voltage and temperature sampling device, as shown in fig. 4 and 5, the sampling device 10 can comprise a conductive connecting piece 11, a base plate 101 and a circuit board 100. The substrate 101 is used for electrically connecting with the target device to be tested, or the substrate 101 is used only for fixing the circuit board 100 on the target device to be tested. When the substrate 101 only plays a role of fixing, one end of the conductive connecting member 11 can be conductively connected with the target component to be measured; when the substrate 101 functions as a conductive connection, one end of the conductive connection member 11 may be conductively connected to the substrate 101.
In some embodiments, the circuit board 100 is thermally connected to the target object to be tested, and the thermally conductive connection described herein may be a direct contact connection or a connection through the heat conductive sheet or the substrate 101. For example, the circuit board 100 is thermally connected to the substrate 101 fixed to the target object.
In some embodiments, the circuit board 100 of the present invention may be a flexible circuit board, and the material of the flexible circuit board is PI (polyimide) or PET (polyethylene terephthalate). The utility model discloses a circuit board 100 can directly bond on being surveyed the target part, if be equipped with 0.05 mm's structural adhesive and paste on being surveyed the target part. The utility model discloses a sampling device can gather the signal of telecommunication and the temperature information of quilt survey target piece, the utility model discloses sampling device's electrically conductive connecting piece 11 can the lug weld on quilt survey target piece.
When the utility model discloses a circuit board 100 directly bonds on being surveyed the target part, as shown in fig. 3, in this embodiment, circuit board 100 can adopt flexible circuit board, and circuit board 100's insulating layer plays the heat conduction, and the welding of conductive connecting piece 11 plays the electric conduction on being surveyed the target part.
When the circuit board 100 of the present invention is fixed on the target object to be tested through the substrate 101, as shown in fig. 4, in this embodiment, the circuit board 100 can adopt an aluminum-based circuit board, the insulating layer 102 of the circuit board 100 partially covers on the substrate 101, the substrate 101 is welded with the conductive connecting member 11 and the target object to be tested, and the substrate 101 plays a role in heat conduction and electric conduction. The substrate 101 may be an aluminum substrate.
When the utility model discloses a circuit board 100 passes through base plate 101 to be fixed on being surveyed the target part, as shown in fig. 5, in this embodiment, circuit board 100 can adopt aluminium base circuit board, and circuit board 100 adsorbs on the whole terminal surfaces of base plate 101, base plate 101 with be surveyed the target part welding, conductive connecting piece 11 with be surveyed the target part welding, base plate 101 plays the heat conduction effect, conductive connecting piece 11 plays the electrically conductive effect. The substrate 101 may be an aluminum substrate.
In some embodiments, the substrate 101 may be covered in whole or in part by the circuit board 100 attached thereto. For example, the circuit board 100 is attached to the substrate 101 in a partially covered manner, and the circuit board 100 may include an insulating layer 102, a first temperature sampling line 106 and a second temperature sampling line 105 disposed on the insulating layer 102, and a temperature sensor 103 attached to the insulating layer 102. Wherein, the insulating layer 102 is adhered to the substrate 101, and both ends of the temperature sensor 103 are respectively connected with the first temperature sampling line 106 and the second temperature sampling line 105.
In some embodiments, the sampling device 10 further includes a first temperature line interface terminal 13 and a second temperature line interface terminal 14, both of which are respectively connected to corresponding temperature sampling lines through pads for transmitting temperature sampling signals. In some embodiments, the sampling device 10 further includes a voltage sampling interface terminal 12 electrically connected to the substrate 101 for transmitting a voltage sampling signal.
The substrate 101 and the insulating layer 102 are mounted with a temperature and voltage acquisition structure. In some embodiments, the temperature sensor 103 has two terminals. As shown in fig. 2, the substrate 101 may be an aluminum substrate, and the substrate 101 is electrically connected to the target to be measured, and may be welded or bonded; the integrated voltage temperature sampling device 10 may be disposed on the bus bar 20 by laser welding the substrate 101, the bus bar 20 is typically made of copper or aluminum, and the bus bar 20 may be electrically connected to the cell tab portion of the battery module 1 by laser welding.
Through the utility model discloses an integrated form voltage temperature sampling device can obtain following technological effect: due to the fact that the integrated voltage and temperature sampling device is adopted, the voltage sampling structure and the temperature sampling structure are integrated on the same device, repeated hot-line operation can be avoided during installation, and the risk of short circuit of the battery is reduced. The voltage sampling circuit and the temperature sampling circuit are directly connected with the sampling terminal, so that an intermediate conversion terminal or a connector is omitted, and the cost is reduced.
In some embodiments, as shown in fig. 4, the voltage sampling interface terminal 12 may be directly connected to the substrate 101 through a pad. The voltage line interface terminal 12 may be mounted on the substrate 101 at a portion not covered with the insulating layer 102. In this embodiment, the voltage line interface terminal 12 may be electrically connected by soldering to a side of the substrate 101 where the insulating layer 102 is not provided. In this embodiment, since the voltage line interface terminal 12 can collect an electrical signal (current or potential difference) on the bus bar through the conductive substrate 101, an additional line does not need to be provided.
In some embodiments, as shown in fig. 3, a voltage sampling line 104 disposed on the circuit board 100 is further connected between the voltage sampling interface terminal 12 and the substrate 101, the voltage sampling interface terminal 12 is connected to one end of the voltage sampling line 104 through a corresponding pad, the other end of the voltage sampling line 104 is further connected to the conductive connecting member 11, one end of the conductive connecting member 11 is disposed on the circuit board 100 so as to be electrically connected to the voltage sampling line 104, and the other end of the conductive connecting member 104 is soldered on the substrate 101. In this embodiment, the voltage line interface terminal 12 is mounted on the insulating layer 102; the conductive connecting member 11 is connected to the substrate 101 and bent upward to extend to the insulating layer 102, and the conductive connecting member 11 is connected to the voltage line interface terminal 12 through the voltage sampling line 104. The voltage line interface terminal 12 is mounted on the insulating layer 102, and needs to be connected to the conductive substrate 101 by using the voltage sampling line 104, so as to collect the bus power-on signal.
In some embodiments, the thickness of insulating layer 102 may be in the range of 0.01mm to 0.5 mm. In some embodiments, the insulating layer 102 does not completely cover the upper end surface of the substrate 101, and is attached to the substrate in a partially covering manner for mounting or connecting the voltage line interface terminal 12. In some embodiments, insulating layer 102 may be a highly thermally conductive, highly insulating ceramic powder filled polymer (primarily epoxy). The insulating layer 102 has a conductivity of 0.1W/m.K or more. The insulating layer 102 has a sufficiently high thermal conductivity and a sufficiently thin thickness that do not affect temperature sampling, enabling the temperature sensor 103 to collect the temperature of the substrate 101 through the insulating layer 102, thereby collecting the temperature of the bus bar 20 or the battery. In some implementations, the insulating layer 102 may be a Printed Circuit Board (pcb). The insulating layer 102 may be connected to the substrate 101 using an adhesive.
Copper and its alloy, gold, silver, zinc, nickel and other metals have better tin soldering weldability, while aluminum, stainless steel, cast iron and other metals have poor tin soldering weldability, can not be welded together in a common tin soldering mode, and can be welded by laser. In this embodiment, the material of the substrate 101 may be copper or aluminum, the conductive connection member 11 may be nickel or copper, and one end of the conductive connection member 11 may be connected to the substrate 101 by laser welding. The other end of the conductive connection member 11 may be electrically connected to an input terminal of the voltage sampling line 104 by soldering.
In some embodiments, as shown in FIG. 3, the voltage sampling line 104 is provided with a locally narrowed over-current protection structure. The input end and the conductive connection structure of the voltage sampling circuit 104, and the output end of the voltage sampling circuit 104 and the voltage line interface terminal 12 can be connected by soldering through a bonding pad, and the whole or part of the voltage sampling circuit 104 except the bonding pad is narrow, so that the overcurrent protection effect is realized. Simultaneously, also more be favorable to the protection the utility model discloses a sampling device.
In some embodiments, the first temperature sampling line 106 and the first temperature line interface terminal 13, one terminal of the temperature sensor 103 may be connected by soldering; the second temperature sampling line 105 and the second temperature line interface terminal 14, the other terminal of the temperature sensor 103 may be connected by soldering. In this embodiment, the temperature sensor 103 may be a surface mount temperature sensor, the temperature sensor 103 should be insulated from the substrate 101, and the temperature sensor 103 collects the temperature of the substrate 101 through the insulating layer 1021. An insulating layer 102 with high thermal conductivity or thin enough is designed between the temperature sensor 103 and the substrate 101, so that the reliability is improved without affecting the temperature sampling.
In some embodiments, the temperature sensor 103 may be a patch sensor. In some embodiments, the temperature sensor 103 may be a matchhead type temperature-sensing thermistor, the resistance of which changes significantly with the change of temperature, and the temperature information is converted into an electrical signal under the condition of an external power supply, so as to measure the temperature of the bus bar. The sampling device of the utility model can also adopt temperature sensors of other forms, such as thermocouples, Resistance Temperature Detectors (RTD), infrared rays and semiconductor sensors.
In some embodiments, the circuit board 100 may include the insulating layer 102, the circuit board 100 may further integrate the voltage sampling line 104, the temperature sensor 103, the first temperature sampling line 106, the second temperature sampling line 105, and the like, and the circuit board 100 may be industrially produced in a batch manner, and has advantages of low process cost, assembly interchangeability, and the like.
According to the utility model discloses a sampling device, the beneficial effect that can obtain includes at least:
1) the voltage sampling circuit and the temperature sampling circuit are directly electrically connected with the line interface terminal through soldering tin, so that an intermediate conversion terminal or a connector is omitted, and the cost is reduced.
2) Due to the fact that the integrated voltage temperature sampling device is adopted, the voltage sampling interface terminal and the temperature sampling interface terminal are integrated on the device, repeated hot-line operation can be avoided when the device is installed on a bus bar, and the risk of short circuit of a battery is reduced.
3) An insulating layer with high heat conductivity coefficient or enough thinness is designed between the temperature sensor and the substrate, and the reliability is improved under the condition that temperature sampling is not influenced.
4) The sampling device can be automatically laser welded on the bus bar, and the process cost of the whole battery system is reduced.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments and/or in combination with or instead of the features of the other embodiments.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and it will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. An integrated voltage temperature sampling device, the sampling device comprising:
one end of the conductive connecting piece is electrically connected with the target piece to be detected;
the circuit board is connected to a tested target part in a heat conduction mode and comprises an insulating layer, a voltage sampling circuit, a first temperature sampling circuit, a second temperature sampling circuit and a temperature sensor, wherein the voltage sampling circuit is arranged on the insulating layer; the two ends of the voltage sampling circuit are electrically connected to the voltage sampling interface terminal and the other end of the conductive connecting piece through corresponding bonding pads respectively, and the two ends of the temperature sensor are connected to the first temperature sampling circuit and the second temperature sampling circuit respectively;
the temperature sampling circuit comprises a first temperature line interface terminal and a second temperature line interface terminal which are used for transmitting temperature sampling signals, wherein the two temperature line terminals are respectively connected to corresponding temperature sampling lines through bonding pads.
2. The sampling device of claim 1, wherein the circuit board further comprises a substrate for fixing the circuit board on a target object to be tested, the substrate being covered in whole or in part by the circuit board attached thereon;
one end of the conductive connecting piece is directly electrically connected with the substrate or the measured target piece.
3. The sampling device of claim 1 or 2, wherein the voltage sampling line is provided with a locally narrowed over-current protection structure.
4. The sampling device of claim 3, wherein the temperature sensor is a patch sensor.
5. The sampling device of claim 1, wherein the circuit board is a flexible circuit board or an aluminum-based circuit board, the circuit board is directly adhered to the target object, and the conductive connecting member is welded to the target object.
6. The sampling device of claim 2, wherein the circuit board is an aluminum-based circuit board, the circuit board is directly adhered to the target object, the conductive connecting member is welded to the base plate, and the base plate is welded to the target object.
7. The sampling device of claim 2 or 6, wherein the substrate is an aluminum substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921462479.5U CN211318689U (en) | 2019-09-04 | 2019-09-04 | Integrated voltage and temperature sampling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921462479.5U CN211318689U (en) | 2019-09-04 | 2019-09-04 | Integrated voltage and temperature sampling device |
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| CN211318689U true CN211318689U (en) | 2020-08-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116826221A (en) * | 2023-08-31 | 2023-09-29 | 苏州维信电子有限公司 | Temperature acquisition assembly and temperature acquisition circuit board for new energy battery pack |
-
2019
- 2019-09-04 CN CN201921462479.5U patent/CN211318689U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116826221A (en) * | 2023-08-31 | 2023-09-29 | 苏州维信电子有限公司 | Temperature acquisition assembly and temperature acquisition circuit board for new energy battery pack |
| CN116826221B (en) * | 2023-08-31 | 2024-01-02 | 苏州维信电子有限公司 | Temperature acquisition assembly and temperature acquisition circuit board for new energy battery pack |
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