CN211318244U - Double-sided defect image acquisition equipment and vertical clamping device - Google Patents

Abstract

The utility model relates to a two-sided defect image acquisition equipment and perpendicular clamping device, including receiving element, clamping device and two at least area array cameras. A receiving unit adapted to receive a surface image of the circuit board; a holding device adapted to hold the circuit board in a manner that the circuit board is in a vertical state; at least two area-array cameras adapted to be positioned to defect positions indicated by the surface images in two opposite surfaces of the circuit board and to capture defect images of the defects, the quality of the defect images being higher than the quality of the surface images.

Description

Double-sided defect image acquisition equipment and vertical clamping device

Technical Field

The utility model relates to a two-sided defect image acquisition equipment, this two-sided defect image acquisition equipment can obtain two defect images simultaneously, has shortened data acquisition's time.

Background

A Printed Circuit Board (PCB) is an electronic component that uses an insulating Board as a substrate and has holes and wires on the surface thereof to connect electronic components. With the development of semiconductor integrated circuit technology, printed circuit boards have been developed from single-sided boards to double-sided boards, multilayer boards, flexible wiring boards, and the like, and have been developed to have high precision, high density, and high reliability.

In the process of manufacturing and manufacturing the PCB board, the PCB board is often subjected to various types of defects, which are influenced by various factors. Therefore, how to effectively control the yield of the PCB board and perform the inspection and analysis on the defects of the PCB board has become an increasingly important issue for manufacturers of the electronic circuit boards.

The traditional PCB defect detection and analysis generally adopts an off-line optical detection mode, and the mode has low efficiency and cannot be suitable for the large-scale production of the PCB. One improved solution is to increase the in-line optical scanning of the PCB board. Specifically, by installing a line optical scanning device at the exit of an electronic circuit board production line, one-sided or double-sided fast scanning of each PCB is achieved. And then, storing the scanned complete image data into a background workstation or server, detecting and analyzing the image data by the workstation or server, and backing up the processing result in the workstation or server according to the serial number. The detection personnel call the PCB data to be detected and analyzed in the workstation or the server through the single-panel overhaul station. After detection and analysis, the quality of the PCB is judged by detection personnel, and meanwhile, the defects on the PCB are marked manually. However, in this method, the inspector can only inspect and analyze one side at a time, and thus the efficiency is low, and the requirement of mass production of PCB boards cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a two-sided defect image acquisition equipment is provided, this two-sided defect image acquisition equipment can obtain two defect images simultaneously, has shortened data acquisition's time.

The utility model discloses a solve above-mentioned technical problem and the technical scheme who adopts provides a two-sided defect image acquisition equipment, include: a receiving unit adapted to receive a surface image of the circuit board; a holding device adapted to hold the circuit board in a manner that the circuit board is in a vertical state; and at least two area-array cameras adapted to be positioned to defect positions indicated by the surface images in two opposite surfaces of the circuit board and to capture defect images of the defects, the quality of the defect images being higher than the quality of the surface images.

In an embodiment of the present invention, the clamping device includes: a frame adapted to place the circuit board in a vertical state; the first manipulator is arranged on the frame and is suitable for clamping a first edge of the circuit board; the second manipulator is arranged on the frame and is suitable for clamping a second edge of the circuit board; the at least two area-array cameras are movably arranged on two opposite sides of the frame respectively so as to shoot defect images of two opposite surfaces of the circuit board respectively.

The utility model discloses an in an embodiment, still include centre gripping control module, clamping device still includes first splint and second splint, first manipulator is established on the first splint, the second manipulator is established on the second splint, wherein centre gripping control module configuration is according to the size of circuit board in the first direction remove in the first direction first splint and/or second splint.

In an embodiment of the present invention, the clamping device further comprises a manipulator adapted to place the circuit board on the clamping device.

In an embodiment of the present invention, the apparatus further comprises at least two marking devices, the marking devices move along a first direction and a second direction, and mark the type of the defect on the circuit board, the second direction intersects with the first direction.

Another aspect of the utility model provides a defect image acquisition system, include: a detection apparatus, comprising: the system comprises at least two linear array cameras, a first detector, a second detector and a controller, wherein the at least two linear array cameras are arranged on a platform, a circuit board to be detected moves on the platform along a conveying direction, the at least two linear array cameras are respectively suitable for shooting surface images of two opposite surfaces of the circuit board in the moving process of the circuit board, and the platform is provided with a first outlet and a second outlet; and a double-sided defect image capturing device comprising: the bearing table is connected with the second outlet and is suitable for receiving and bearing the circuit board in a horizontal state; a receiving unit adapted to receive a surface image of the circuit board; a holding device adapted to hold the circuit board in a manner such that the circuit board is in a vertical state; and the area array camera is suitable for positioning to the position of the defect in the surface image and shooting a defect image of the defect, wherein the quality of the defect image is higher than that of the surface image.

Another aspect of the utility model provides a perpendicular clamping device, include: a frame adapted to place the circuit board in a vertical state; the first manipulator is arranged on the frame and is suitable for clamping a first edge of the circuit board; the second manipulator is arranged on the frame and is suitable for clamping the second edge of the circuit board; the first clamping plate and the second clamping plate are arranged, the first mechanical arm is arranged on the first clamping plate, and the second mechanical arm is arranged on the second clamping plate; and the clamping control module is used for moving the first clamping plate and/or the second clamping plate in a first direction according to the size of the circuit board in the first direction, wherein the first direction is a vertical direction.

In an embodiment of the present invention, the electronic device further includes a receiving unit for receiving a size of the circuit board in the first direction.

In an embodiment of the present invention, the present invention further includes: the at least two first driving mechanisms are respectively arranged on two opposite sides of the frame and used for driving the area array camera for shooting the circuit board and the marking device for marking the circuit board to move along a first direction; and the at least two second driving mechanisms are respectively arranged on the other two opposite sides of the frame and are used for driving the area array camera for shooting the circuit board and the marking device for marking the circuit board to move along a second direction, and the second direction is vertical to the first direction.

The utility model discloses owing to adopt above technical scheme, make it compare with prior art, have following apparent advantage:

the utility model discloses a two-sided defect image acquisition equipment stands up the circuit board through perpendicular clamping device, uses two area array cameras to shoot the defect position of two relative surfaces of circuit board, can obtain two defect images simultaneously, has shortened data acquisition's time. On the basis, the double sides of the circuit board can be analyzed simultaneously, the image processing time is shortened, the efficiency and the accuracy of defect analysis are improved, and therefore the automatic and intelligent operation of a circuit board defect detection and analysis system can be realized.

The utility model discloses a defect image acquisition system can shoot the surface image of two relative surfaces of circuit board on line, then will need carry out defect image acquisition's circuit board and do further two-sided defect image acquisition and do defect type mark, is showing the circuit board quantity that has reduced the off-line defect image acquisition of needs.

The utility model discloses a perpendicular clamping device can make things convenient for the area array camera to shoot from two surfaces of circuit board with the vertical position centre gripping with the circuit board to help realizing two-sided defect image acquisition.

Drawings

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings, wherein:

fig. 1 is a schematic front view of a double-sided defect analysis apparatus according to an embodiment of the present invention;

fig. 2 is a schematic side view of a double-sided defect analysis apparatus according to an embodiment of the present invention;

fig. 3 is a schematic side view of a double-sided defect analysis apparatus according to an embodiment of the present invention;

fig. 4 is an architecture diagram of a double-sided defect analysis apparatus according to an embodiment of the present invention;

fig. 5-7 are schematic structural views of a clamping device of a double-sided defect analysis apparatus according to an embodiment of the present invention;

fig. 8 is a schematic structural diagram of a marking device of a double-sided defect analysis apparatus according to an embodiment of the present invention;

fig. 9 is a schematic diagram of a defect detection and analysis system according to an embodiment of the present invention;

fig. 10 is an architecture diagram of a defect detection and analysis system according to an embodiment of the present invention.

Element numbering in the figures:

10-Defect detection and analysis System

20-circuit board

100-double-sided defect analysis equipment

110 to receiving unit

120-area array camera

130 to analysis Unit

140-clamping device

141 to frame

142 a-first manipulator

142 b-second robot

143 a-first splint

143b to second splint

150-clamping control module

151-track

160-mechanical arm

170-marking device

180-bearing table

190-first driving mechanism

191 to the first track

192 to second drive mechanism

193-second track

200-detection equipment

210-line camera

220 to detection unit

300-platform

310 to the first outlet

320 to the second outlet

400 storage device

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described herein, and thus the present invention is not limited by the specific embodiments disclosed below.

As used in this application and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements.

In describing the embodiments of the present invention in detail, the cross-sectional view showing the structure of the device is not enlarged partially according to the general scale for the convenience of illustration, and the schematic diagram is only an example, which should not limit the protection scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary words "below" and "beneath" can encompass both an orientation of up and down. The device may have other orientations (rotated 90 degrees or at other orientations) and the spatial relationship descriptors used herein should be interpreted accordingly. Further, it will also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present.

In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.

It will be understood that when an element is referred to as being "on," "connected to," "coupled to" or "contacting" another element, it can be directly on, connected or coupled to, or contacting the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly on," "directly connected to," "directly coupled to" or "directly contacting" another element, there are no intervening elements present. Similarly, when a first component is said to be "in electrical contact with" or "electrically coupled to" a second component, there is an electrical path between the first component and the second component that allows current to flow. The electrical path may include capacitors, coupled inductors, and/or other components that allow current to flow even without direct contact between the conductive components.

To the lower problem of above PCB board defect analysis efficiency, the utility model discloses a following embodiment describes a two-sided defect analysis equipment, and this two-sided defect analysis equipment can improve defect analysis's efficiency.

Fig. 1 is a schematic front structural diagram of a double-sided defect analysis apparatus according to an embodiment of the present invention. Fig. 2 and fig. 3 are schematic side views of a double-sided defect analysis apparatus according to an embodiment of the present invention. Fig. 4 is an architecture diagram of a double-sided defect analysis apparatus according to an embodiment of the present invention. The structure of the double-sided defect analysis apparatus 100 will be described below with reference to fig. 1 to 4.

The duplex defect analyzing apparatus 100 includes a receiving unit 110, at least two area-array cameras 120, and an analyzing unit 130. The receiving unit 110 may receive a surface image of the circuit board 20 to be analyzed. The analysis unit 130 may determine the location of the defect in the surface image from the surface image. At least two area-array cameras 120 may be positioned to defect positions indicated by surface images in two opposite surfaces of the circuit board 20 and capture defect images of the defects. Wherein the quality of the defect image is higher than the quality of the surface image. The analysis unit 130 may analyze the defect image to determine the type of the defect.

In an embodiment of the present invention, the circuit board 20 may be a circuit board. For example, the circuit board 20 may be a PCB board, an FPC board, or an FPCB board. An fpc (flexible Printed circuit) board, also called a flexible Printed circuit board, is a Printed circuit board having high reliability and flexibility, which is made of a polyimide or polyester film as a base material, and has the characteristics of high wiring density, light weight, thin thickness, good bendability, and the like. An fpcb (flexible Printed circuit board) is a rigid-flex circuit board: the circuit board with the FPC characteristic and the PCB characteristic is formed by combining a flexible circuit board and a rigid circuit board (PCB) together according to relevant process requirements through processes such as pressing and the like.

In an embodiment of the present invention, the double-sided defect analyzing apparatus 100 further includes a clamping device 140, and the clamping device 140 can clamp the circuit board 20 and make the circuit board 20 in a vertical state.

In an embodiment of the present invention, the clamping device 140 may include a frame 141, a first robot arm 142a, and a second robot arm 142 b. The frame 141 may place the circuit board 20 in a vertical state. The first robot 142a is disposed on the frame 141 to clamp a first edge of the circuit board 20. The second robot arm 142b is disposed on the frame 141 to hold the second edge of the circuit board 20.

Referring to fig. 1 to 3, in some examples of the present invention, the double-sided defect analysis apparatus 100 further includes a susceptor 180. The carrier stage 180 is connected to the frame 141. For example, the frame 141 may be fixed on the supporting stage 180, but the embodiment is not limited thereto.

In an embodiment of the present invention, the double-sided defect analyzing apparatus 100 further includes a clamping control module 150, the clamping device 140 further includes a first clamping plate 143a and a second clamping plate 143b, the first manipulator 142a is disposed on the first clamping plate 143a, and the second manipulator 142b is disposed on the second clamping plate 143 b. The chucking control module 150 serves to move the first chucking plate 143a and/or the second chucking plate 143b in the first direction according to the size of the circuit board 20 in the first direction.

In an embodiment of the present invention, the double-sided defect analyzing apparatus 100 further includes a manipulator 160, and the manipulator 160 can place the circuit board 20 on the holding device 140. In some examples, the robot 160 may also remove the circuit board 20 from the holding device 140.

Fig. 5-7 are schematic structural diagrams of a clamping device of a double-sided defect analysis apparatus according to an embodiment of the present invention. The structure of the clamping device 140 and the clamping control module 150 is further described below with reference to fig. 5-7.

In an embodiment of the present invention, one or more first manipulators 142a are disposed on the first clamping plate 143a, and one or more second manipulators 142b are disposed on the second clamping plate 143 b.

Referring to fig. 7, the first robot arms 142a may be fixed to the first clamping plate 143a, and a plurality of the first robot arms 142a may be disposed at the same or different distances. The first robot arm 142a may also be adjustably mounted on the first clamping plate 143 a. For example, the first clamping plate 143a may have a slide rail (not shown), and the plurality of first manipulators 142a may adjust the distance between the plurality of first manipulators 142a by sliding on the slide rail of the first clamping plate 143 a.

Similarly, the second robot arm 142b may be fixed to the second clamping plate 143b, and the plurality of second robot arms 142b may be disposed at the same or different distances. The second robot arm 142b may also be adjustably mounted on the second jaw 143 b. For example, the second clamping plate 143b may have a slide rail (not shown), and the plurality of second robot arms 142b may adjust the distance between the plurality of second robot arms 142b by sliding on the slide rail of the second clamping plate 143 b.

Referring to fig. 5, a plurality of first manipulators 142a are arranged on the first clamping plate 143a in the extending direction of the first clamping plate 143 a. The plurality of second robot arms 142b are arranged on the second clamping plate 143b in the extending direction of the second clamping plate 143 b. In some examples, the clamp control module 150 may also have a downwardly extending rail 151. The rail 151 is fixed to the frame 141, and both ends of the first clamping plate 143a and/or the second clamping plate 143b are movably (e.g., slidably) provided on the rail 151. The chucking control module 150 controls the first clamping plate 143a and/or the second clamping plate 143b to move along the rail 151 in the first direction according to the size of the circuit board 20 in the first direction.

In the example shown in fig. 5 and 6, the clamping device 140 has a first clamping plate 143a and a second clamping plate 143b which are oppositely disposed, and the second clamping plate 143b is parallel to the first clamping plate 143a and fixed to the frame 141. First, the second robot arm 142b on the second clamping plate 143b clamps the lower end of the circuit board 20 in the first direction. Then, the clamping control module 150 controls the first clamping plate 143a to move in the first direction along the rail 151 according to the size of the circuit board 20 in the first direction. When the first clamping plate 143a moves to a position suitable for clamping the upper end of the circuit board 20 in the first direction, the clamping control module 150 controls the first clamping plate 143a to stop moving. The first robot 142a on the first clamping plate 143a clamps the upper end of the circuit board 20 in the first direction.

It is understood that the clamping device 140 can select one or more first manipulators 142a on the first clamping plate 143a and one or more second manipulators 142b on the second clamping plate 143b to clamp the circuit board 20 according to the size of the circuit board 20 in the first direction.

In other examples of the present invention, the first clamping plate 143a may be fixed on the frame 141, and the clamping control module 150 controls the second clamping plate 143b to move along the rail 151 in the first direction according to the size of the circuit board 20 in the first direction. The clamping control module 150 may also control the first clamping plate 143a and the second clamping plate 143b to move along the rail 151 in the first direction according to the size of the circuit board 20 in the first direction, but the embodiment is not limited thereto.

For example, in the direction parallel to the paper surface shown in fig. 5, the first direction may be the extending direction of the rail 151, and the second direction may be the extending direction of the first clamping plate 143a or the second clamping plate 143 b. Wherein the first direction and the second direction intersect. Preferably, the first direction may be a vertical direction, the second direction may be a horizontal direction, and the first direction is perpendicular to the second direction.

In an embodiment of the present invention, at least two area-array cameras 120 are movably disposed on two opposite sides of the frame 141 respectively to capture the defect images of two opposite surfaces of the circuit board 20 respectively.

In some examples of the present invention, the double-sided defect analysis apparatus 100 further includes at least two first driving mechanisms 192 and at least two second driving mechanisms 190. The at least two first driving mechanisms 192 are respectively disposed on two opposite sides of the frame 141 to drive the at least two area array cameras 120 for photographing the circuit board 20 to move along the first direction of the surface of the circuit board 20. The at least two second driving mechanisms 190 are respectively disposed at the other opposite sides of the frame 141 to drive the at least two area-array cameras 120 for photographing the circuit board 20 to move along the second direction of the surface of the circuit board 20.

In the example shown in fig. 1, the first drive mechanism 192 may also have a first track 193 that extends in a first direction. The second drive mechanism 190 may also have a second track 191 extending in a second direction. The area-array camera 120 is disposed on the second rail 191. Both ends of the second rail 191 are movably (e.g., slidably) provided on the first rail 193. The second driving mechanism 190 may control the area array camera 120 to move in the second direction along the second rail 191. The first driving mechanism 192 may control the second track 191 to move in the first direction along the first track 193. By providing a first direction and a second direction that intersect (e.g., are perpendicular), the first drive mechanism 192 and the second drive mechanism 190 can control the area array camera 120 to move along the surface of the circuit board 20 and cover all areas of the surface of the circuit board 20. After the area array camera 120 is positioned to the defect position indicated by the surface image in the two opposite surfaces of the circuit board 20, a defect image of the defect position is captured. The quality of the defect image taken is higher than the quality of the surface image. Specifically, the defect image is captured by the area-array camera 120 in alignment with the defect, and thus has higher resolution and accuracy than the surface image. In this way, the analysis unit 130 may analyze the defect image with high accuracy to more accurately judge the type of the defect.

In some examples, the defect on the surface image may also have a coordinate location. For example, in the surface image of the circuit board 20 partitioned in the rectangular coordinate system, each defect on the surface image may have a corresponding coordinate position, for example, (X1, Y1), (X2, Y2), … (Xn, Yn). After the receiving unit 110 receives the surface image of the circuit board 20 to be analyzed, which has the defect coordinate position, the analyzing unit 130 controls the area-array camera 120 to move and position to the corresponding defect position according to the defect coordinate position.

In the field of printed circuit boards, defects to be detected include basic defects such as open circuits, short circuits, notches, burrs, pinholes, residual copper, and the like. In addition, the line width, line width and position deviation of the precise line can be included. The open circuit and short circuit are qualitatively analyzed, that is, the open circuit and short circuit are detected. Quantitative analysis is needed for gaps, burrs, pinholes, residual copper, line width, position deviation and the like, namely when the 7 defects are detected, the defects are determined by combining the positions and the size relation of the defects. Although the types of defects are limited, the patterns of the circuit board and the expression forms of the defects vary widely. In an embodiment of the present invention, the image analysis unit is constructed by deep learning, and the combination of big data analysis makes the unit have certain generalization ability and self-learning function. Deep learning has found widespread use in the field of image recognition and classification. According to the existing deep learning algorithm, the neural network model of the analysis unit 130 of the embodiment of the present invention is constructed for determining the defect type.

Typically, the process of generating the neural network model includes the construction of the network model, the production of a training data set, and the testing of the network model. The appropriate Neural network model may be selected from various Neural network models, such as convolutional Neural network cnn (convolutional Neural network), Recurrent Neural Network (RNN), and Generative Adaptive Network (GAN). The embodiment of the present invention is an embodiment in which a CNN model is selected. The CNN model may include layers such as an input preprocessing layer, a feature extraction layer, and a prediction output layer. In some embodiments, a good training sample may be generated based on a sample of good circuit boards. The sample of good circuit boards may be an image generated from a design file of the circuit board. A fixed-size sliding window approach can be used to automatically generate a training sample size module on these images. Defect samples and types segmented from the local area acquisition image of the circuit board can also be obtained. For example, images may be acquired at local region locations provided in the preamble system, and the defect samples and types may be identified by manual segmentation. And then, training a neural network model by using the good product training sample, wherein the neural network model performs feature extraction on the defect sample in the training process. The trained neural network model may serve as a classifier for classifying defects. In addition, the neural network classifier can be calibrated by using the defect sample. And the defect position is accurately positioned by adopting a non-maximum inhibition technology. After neural network classifier training is complete, the defect image may be analyzed using the trained neural network classifier to determine the type of the defect. As described above, for the features to be quantitatively analyzed, the defect feature amount may be quantified in combination with the defect type.

It should be understood that an area-array camera is a device that acquires two-dimensional image information by pixel matrix shooting. The area-array camera may be, but is not limited to, a CMOS (Complementary Metal Oxide Semiconductor) camera and a CCD (Charge-coupled Device) camera. Preferably, the area-array camera may be a color CCD camera.

In an embodiment of the present invention, the double-sided defect analyzing apparatus 100 further includes at least two marking devices 170, and the analyzing unit 130 is configured to control the marking devices 170 to move along a first direction and a second direction, so as to mark the type of the defect on the circuit board 20, wherein the second direction intersects with the first direction. Preferably, the marking device 170 may employ a non-contact ink jet marking system.

Fig. 8 is a schematic structural diagram of a marking device of a double-sided defect analysis apparatus according to an embodiment of the present invention. Referring to fig. 1-3 and 8, in some examples, at least two marking devices 170 may be disposed on at least two second tracks 191, respectively. After the analyzing unit 130 determines the location of the defect in the surface image, the second driving mechanism 190 is configured to control the marking device 170 to move along the second track 191 in the second direction, and the first driving mechanism 192 is configured to control the second track 191 to move along the first track 193 in the first direction. By providing first and second directions that intersect (e.g., are perpendicular), first and second drive mechanisms 192, 190 may control movement of marking device 170 along the surface of circuit board 20 and cover all areas of the surface of circuit board 20. The marking device 170 marks the circuit board 20 according to the type of the defect determined by analyzing the defect image by the analyzing unit 130.

It is understood that the marking device 170 may be driven by a separate driving mechanism, especially a separate first driving mechanism (not shown), to move in the first direction, and the present invention is not limited to the arrangement.

The above embodiments of the utility model provide a two-sided defect analysis equipment, this two-sided defect analysis equipment can carry out the analysis to the two-sided while of circuit board, has shortened image processing's time, has improved defect analysis's efficiency and accuracy.

The utility model discloses an on the other hand provides a defect detecting and analytic system, and this defect detecting and analytic system can improve defect analysis's efficiency.

Fig. 9 is a schematic structural diagram of a defect detection and analysis system according to an embodiment of the present invention. Fig. 10 is an architecture diagram of a defect detection and analysis system according to an embodiment of the present invention. The structure of the defect detection and analysis system 10 is described below with reference to fig. 9 and 10.

The defect detection and analysis system 10 includes a detection apparatus 200 and a double-sided defect analysis apparatus 100.

The inspection apparatus 200 comprises a line camera 210 and an inspection unit 220. The line camera 210 is disposed on a platform 300. Wherein the circuit boards 20 to be inspected are moved on the platform 300 in the transport direction, the line camera 210 is adapted to take surface images of the circuit boards 20 during the movement of the circuit boards 20. The inspection unit 220 is electrically connected to the line camera 210 and the stage 300 and processes the surface image to determine whether the circuit board 20 is good during the movement of the circuit board 20. When the circuit board 20 is determined to be good, the detecting unit 220 controls the platform 300 to transfer the circuit board 20 to the first outlet 310, and when the circuit board 20 is determined not to be good, the detecting unit 220 controls the platform 300 to transfer the circuit board 20 to the second outlet 320. In some examples of the present invention, the platform 300 may be located on a production line of the circuit board 20.

In an embodiment of the present invention, the above-mentioned detecting apparatus 200 may include at least two line cameras 210, which are respectively used for shooting the first surface images of two opposite surfaces of the circuit board 20. A line camera is a device that employs a line image sensor. The linear array image sensor is divided into a monochrome image sensor and a color image sensor. The line camera may be, but is not limited to, a CMOS camera and a CCD camera. Preferably, the line camera may be a monochrome (e.g. black and white) CCD camera.

The double-sided defect analysis apparatus 100 includes a stage 180, a receiving unit 110, an area-array camera 120, and an analysis unit 130. The carrier stage 180 is connected to the second outlet 320 for receiving and carrying the circuit board 20 in a horizontal state. The receiving unit 110 is connected to the detecting unit 220 for receiving a surface image of the circuit board 20 to be analyzed. The area-array camera 120 is used to locate a defect position in the surface image and capture a defect image of the defect. Wherein the quality of the defect image is higher than the quality of the surface image. The analysis unit 130 is used to determine the location of the defect in the surface image and analyze the defect image to determine the type of defect.

In an embodiment of the present invention, the double-sided defect analysis apparatus 100 further includes a clamping device 140. The holding device 140 is used to hold the circuit board 20 in such a manner that the circuit board 20 is in a vertical state. In some examples, the double-sided defect analysis apparatus 100 further includes a robot 160, and the robot 160 may place the circuit board 20 onto the chucking device 140.

It should be understood that the inspection apparatus 200 captures first surface images of two opposite surfaces of the circuit board 20 by at least two line cameras 210, and determines whether the circuit board 20 is good or not based on the first surface images. Only when the circuit board 20 is defective, the inspection unit 220 controls the stage 300 to transfer the circuit board 20 to the second outlet 320 and place the circuit board 20 on the clamping device 140 by the robot 160 on the double-sided defect analyzing apparatus 100. In other examples, the circuit board 20 conveyed to the second outlet 320 may be manually placed on the clamping device 140 of the double-sided defect analysis apparatus 100, but the embodiment is not limited thereto.

Referring to fig. 9, in an embodiment of the present invention, the double-sided defect analysis apparatus 100 further includes a storage device 400. The storage device 400 may be connected to the detection unit 220 in the inspection device 200 and the reception unit 110 in the double-sided defect analysis device 100. For example, the inspection apparatus 200 may store a surface image of the circuit board 20 to be analyzed in the storage apparatus 400. The double-sided defect analysis apparatus 100 may acquire a surface image of the circuit board 20 to be analyzed from the storage apparatus 400.

It should be appreciated that the storage device 400 can be external memory to the computer, separate external memory, or a combination of both. The external memory may include, but is not limited to, magnetic storage devices (e.g., hard disk, floppy disk, magnetic strips), optical disks (e.g., Compact Disk (CD), Digital Versatile Disk (DVD)), smart cards, flash memory devices (e.g., electrically erasable programmable read-only memory (EPROM), usb disk, cards, sticks, key drives), and the like.

Further implementation details of the double-sided defect analysis apparatus in the defect detection and analysis system of the present embodiment may refer to the embodiments described in fig. 1 to 8, and are not expanded herein.

The above embodiment of the utility model provides a defect detection and analytic system, this defect detection and analytic system can examine out the yields in the circuit board on line, then do further two-sided analysis and do defect type mark with the defective products, are showing to have reduced the circuit board quantity that needs to be off-line analysis, have improved detection and analytic efficiency to can realize circuit board defect detection and analytic system's automation, intelligent operation. Another aspect of the present invention provides a vertical clamping device. The structure of the vertical clamping device will be described with reference to fig. 1-3 and 5-7.

It is understood that the vertical clamping device may include, but is not limited to, the clamping device 140 in the double-sided defect analysis apparatus 100, and the vertical clamping device may also include other devices/components and modules/units in the double-sided defect analysis apparatus 100, but the embodiment is not limited thereto.

Referring to fig. 1, the vertical clamping device (e.g., the clamping device 140) may include a frame 141, a first robot arm 142a, a second robot arm 142b, first and second clamping plates 143a and 143b, and a clamping control module 150.

The frame 141 may place the circuit board 20 in a vertical state. The first robot 142a is disposed on the frame 141 to clamp a first edge of the circuit board 20. The second robot arm 142b is disposed on the frame 141 to hold the second edge of the circuit board 20. The first robot 142a is provided on the first clamp plate 143a, and the second robot 142b is provided on the second clamp plate 143 b. The chucking control module 150 serves to move the first chucking plate 143a and/or the second chucking plate 143b in the first direction according to the size of the circuit board 20 in the first direction.

In an embodiment of the present invention, the vertical clamping device may further include a receiving unit 110. The receiving unit 110 is used to receive the size of the circuit board 20 in the first direction.

In an embodiment of the present invention, the vertical clamping device further includes at least two first driving mechanisms 190. At least two first driving mechanisms 190 are respectively disposed on opposite sides of the frame 141 for driving the area-array camera 120 for photographing the circuit board 20 to move along the surface of the circuit board 20.

In an embodiment of the present invention, the vertical clamping device further includes at least two second driving mechanisms (not shown). At least two second driving mechanisms are respectively disposed on two opposite sides of the frame 141 for carrying the marking device 170 for marking the circuit board 20 to move along the surface of the circuit board 20.

Further implementation details of the vertical clamping device of the present embodiment can refer to the embodiment described in fig. 1 to 8, and are not expanded here.

The above embodiment of the utility model provides a perpendicular clamping device, this perpendicular clamping device can make things convenient for area array camera to shoot from two surfaces of circuit board with the vertical state centre gripping with the circuit board to help realizing two-sided analysis. It should be understood that the foregoing has described a basic concept, and it will be apparent to those skilled in the art that the above disclosure is by way of example only, and is not intended to limit the present application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.

Also, this application uses specific language to describe embodiments of the application. Reference throughout this specification to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the present application is included in at least one embodiment of the present application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, some features, structures, or characteristics of one or more embodiments of the present application may be combined as appropriate.

Additionally, the order in which elements and sequences of the processes described herein are processed, the use of alphanumeric characters, or the use of other designations, is not intended to limit the order of the processes and methods described herein, unless explicitly claimed. While various presently contemplated embodiments have been discussed in the foregoing disclosure by way of example, it should be understood that such detail is solely for that purpose and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements that are within the spirit and scope of the embodiments herein disclosed. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by software-only solutions, such as installing the described system on an existing server or mobile device.

Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

Although the present invention has been described with reference to the present specific embodiments, it will be understood by those skilled in the art that the above embodiments are merely illustrative of the present invention, and various equivalent changes and substitutions may be made without departing from the spirit of the present invention, and therefore, changes and modifications to the above embodiments within the spirit of the present invention will fall within the scope of the claims of the present application.

Claims (7)

1. A double-sided defect image pickup apparatus characterized by comprising:

a receiving unit adapted to receive a surface image of the circuit board;

a holding device adapted to hold the circuit board in a manner that the circuit board is in a vertical state; and

at least two area-array cameras adapted to be positioned to defect positions indicated by the surface images in two opposite surfaces of the circuit board and to capture defect images of the defects, the quality of the defect images being higher than the quality of the surface images;

wherein the clamping device comprises:

a frame adapted to place the circuit board in a vertical state;

the first manipulator is arranged on the frame and is suitable for clamping a first edge of the circuit board; and

the second manipulator is arranged on the frame and is suitable for clamping the second edge of the circuit board;

the at least two area-array cameras are movably arranged on two opposite sides of the frame respectively so as to shoot defect images of two opposite surfaces of the circuit board respectively.

2. The double-sided defect image capture device of claim 1, further comprising a clamping control module, the clamping device further comprising a first clamping plate and a second clamping plate, the first robot being disposed on the first clamping plate, the second robot being disposed on the second clamping plate, wherein the clamping control module is configured to move the first clamping plate and/or the second clamping plate in a first direction depending on a dimension of the circuit board in the first direction, wherein the first direction is a vertical direction.

3. The double-sided defect image capturing apparatus of claim 1, further comprising a robot adapted to place said circuit board onto said holding device.

4. The double-sided defect image capturing apparatus of claim 1, further comprising at least two marking devices, the marking devices moving in a first direction and a second direction to mark the type of defect on the circuit board, the first direction being a vertical direction and the second direction being a horizontal direction.

5. A vertical clamping device, comprising:

a frame adapted to place the circuit board in a vertical state;

the first manipulator is arranged on the frame and is suitable for clamping a first edge of the circuit board;

the second manipulator is arranged on the frame and is suitable for clamping the second edge of the circuit board;

the first clamping plate and the second clamping plate are arranged, the first mechanical arm is arranged on the first clamping plate, and the second mechanical arm is arranged on the second clamping plate; and

and the clamping control module is used for moving the first clamping plate and/or the second clamping plate in a first direction according to the size of the circuit board in the first direction, wherein the first direction is a vertical direction.

6. The vertical clamping device of claim 5, further comprising a receiving unit for receiving a dimension of the circuit board in the first direction.

7. The vertical clamping device of claim 5, further comprising:

the at least two first driving mechanisms are respectively arranged on two opposite sides of the frame and used for driving the area array camera for shooting the circuit board and the marking device for marking the circuit board to move along a first direction;

and the at least two second driving mechanisms are respectively arranged on the other two opposite sides of the frame and are used for driving the area array camera for shooting the circuit board and the marking device for marking the circuit board to move along a second direction, wherein the second direction is a horizontal direction.

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