CN211309521U - Intelligent communication chip constant temperature storage management device - Google Patents
Intelligent communication chip constant temperature storage management device Download PDFInfo
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- CN211309521U CN211309521U CN201921439671.2U CN201921439671U CN211309521U CN 211309521 U CN211309521 U CN 211309521U CN 201921439671 U CN201921439671 U CN 201921439671U CN 211309521 U CN211309521 U CN 211309521U
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Abstract
The utility model discloses a management device is stored to intelligence communication chip constant temperature, including depositing the case, installing sealed chamber door, the equidistance in the terminal surface outside before depositing the case and installing at the multiunit rack of depositing the incasement side and installing the air supply case at depositing the roof portion, the multiunit slide rail has been seted up to the top equidistance of multiunit rack, and the inboard of multiunit slide rail all slips and has place the board. The utility model discloses in, at first, inside is provided with circulating multilayer air supply structure, and this kind of structure can be diversified to depositing the incasement portion and supplying air and handling, has both promoted the inside circulation of storage management device, and the constant temperature of the intelligent communication chip of also being convenient for simultaneously stores the processing, and secondly, adopts the combination formula to place the structure, and the processing of placing and taking of the intelligent communication chip of being convenient for of this kind of structure, and the daily operation of the operating personnel of both being convenient for uses, has also promoted the functional of storage management device simultaneously.
Description
Technical Field
The utility model relates to a storage device technical field is used in the processing of communication chip, especially relates to an intelligent communication chip constant temperature stores management device.
Background
There are many classifications of smart chips, and the classifications may vary depending on the application. The intelligent chip generally acts together with the induction system and the power transmission system, makes up for each other and exerts respective advantages. The general intelligent chip is equivalent to a single chip microcomputer and is responsible for processing the collected induction signals, and then the electric motor is driven by the electric switch to transmit instructions to the transmission system to complete the initial effect.
After the existing intelligent communication chip is processed, the intelligent communication chip needs to be put into the constant-temperature storage management device for storage, however, the existing constant-temperature storage management device still has the defects: at first, adopt the building formula to place the structure mostly, the circulation in inside space is relatively poor, and the cover face of air supply is comparatively limited simultaneously, is difficult to keep the inside constant temperature environment of storage management device to influence intelligent communication chip's constant temperature and store the processing, secondly, adopt the integral type to place the structure mostly, the intelligent communication chip of not being convenient for place the processing, the operation is got up and is wasted time and energy.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: the intelligent communication chip constant-temperature storage management device is provided for solving the problems that the internal circulation of the traditional intelligent communication chip constant-temperature storage management device is poor, the coverage of air supply is limited, and the constant-temperature environment inside the storage management device is difficult to maintain.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an intelligent communication chip constant temperature stores management device, installs including depositing the case, installing sealed chamber door, the equidistance in the terminal surface outside before depositing the case and installing the multiunit rack of depositing the incasement side and installing the air supply case at depositing the roof portion, the multiunit slide rail has been seted up to the top equidistance of multiunit rack, and the inboard of multiunit slide rail all slips and has placed the board, the air supply dish is all installed to the bottom that the inboard that deposits the case and the bottom of multiunit rack of air supply case, and the bottom of air supply dish is the rectangle array intercommunication and has multiunit air supply shower nozzle, wherein the multiunit the intercommunication has the air duct between the air supply dish, the air supply case communicates with depositing.
As a further description of the above technical solution:
the top equidistance of placing the board has seted up the multiunit standing groove, and the inboard of multiunit standing groove all inlays and is equipped with the rubber gasket.
As a further description of the above technical solution:
the inboard of rack is provided with the extrusion spring that is the horizontal distribution, and the one end and the rack fixed connection of extrusion spring, the other end with place board fixed connection, the bottom of rack is located the below of placing the board and rotates through the pivot and be connected with the driving plate, and the inboard of driving plate is the vertical locking piece that runs through the rack that is provided with, and wherein the inside of placing the board is located the top of locking piece and has seted up the locked groove.
As a further description of the above technical solution:
the outside fixedly connected with of locking piece runs through the traveller of driving plate, and wherein the inside of driving plate is located the outside of traveller and has seted up the spout.
As a further description of the above technical solution:
the top inner side of the air supply box is provided with an air supply machine, an output shaft of the air supply machine is positioned on the inner side of the air supply box and is connected with air supply blades in a transmission mode, and a plurality of groups of heating resistance wires are arranged on the inner side of the air supply box and below the air supply blades.
As a further description of the above technical solution:
an electric control switch is installed at the top of the front end face of the storage box, and the output end of the electric control switch is electrically connected with the input ends of the air feeder and the heating resistance wire respectively.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. in the utility model, a circulating multilayer air supply structure is arranged inside, air supply discs are arranged at the bottom of an air supply box and the bottom of a plurality of groups of placing frames, air ducts are communicated among the groups of air supply discs, the air supply box is communicated with a storage box through an air duct, when an air supply fan in the air supply box drives an air supply blade to rotate, air in the storage box is sucked into the air supply box through the air duct to be heated under the action of air flow, and the heated air enters the air supply discs under the action of the air ducts, so that the hot air is uniformly sent into the top of the placing frames through an air supply nozzle by the groups of air supply discs, thereby carrying out constant-temperature air supply treatment on intelligent communication chips on the groups of placing frames, the structure can carry out air supply treatment on the interior of the storage box in multiple directions, thereby not only improving the circulation inside the storage management device, meanwhile, the constant-temperature storage processing of the intelligent communication chip is facilitated.
2. The utility model discloses in, adopt the combination formula to place the structure, the slide rail has all been seted up on the multiunit rack, and the inboard sliding joint at the slide rail has place the board, and be provided with the extrusion spring between the rack and place the board, driving plate and locking piece, when needing to put into the standing groove of placing on the board with intelligent communication chip, with the ascending lifting that makes progress of driving plate, because lever principle's effect, the locking piece just can the inside locking groove of placing the inboard of roll-off downwards, under the effect of extrusion spring, place the board and just can be the outside roll-off of horizontally, operating personnel alright place intelligent communication chip in the inside of standing groove, the intelligent communication chip's of being convenient for of this kind of structure placing and the processing of taking, the daily operation use of the operating personnel of both being convenient for, the functional of storage management device has also been promoted simultaneously.
Drawings
Fig. 1 shows a schematic structural diagram provided according to an embodiment of the present invention;
fig. 2 shows a schematic cross-sectional structure at a-a according to an embodiment of the present invention;
fig. 3 shows a schematic cross-sectional structure diagram at B-B provided in accordance with an embodiment of the present invention.
Illustration of the drawings:
1. a storage box; 2. sealing the box door; 3. an electric control switch; 4. placing a rack; 401. a slide rail; 5. placing the plate; 501. a placement groove; 502. locking the groove; 6. a drive plate; 601. a chute; 7. an air supply box; 8. an air supply plate; 801. an air supply nozzle; 9. an air duct; 10. an air intake duct; 11. a blower; 12. an air supply blade; 13. heating resistance wires; 14. a compression spring; 15. a rubber gasket; 16. a locking block; 1601. a slide column.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides an intelligent communication chip constant temperature stores management device, including depositing case 1, install the sealed chamber door 2 in the terminal surface outside before depositing case 1, the equidistance is installed and is being deposited 1 inboard multiunit rack 4 and install the supply-air box 7 of depositing case 1 top, multiunit slide rail 401 has been seted up to multiunit rack 4's top equidistance, and the inboard of multiunit slide rail 401 all slips and place board 5, the bottom of supply-air box 7 is located the inboard of depositing case 1 and the bottom of multiunit rack 4 all installs air supply dish 8, and the bottom of air supply dish 8 is the rectangle array intercommunication and has multiunit air supply shower nozzle 801, wherein the intercommunication has air duct 9 between the multiunit air supply dish 8, supply-air box 7 is linked together through breathing pipe 10 and depositing case 1, the setting of multiunit air supply shower nozzle 801, air supply dish 8 air flow rate and.
Specifically, as shown in fig. 1 and fig. 3, a plurality of sets of placing grooves 501 are equidistantly formed on the top of the placing plate 5, rubber gaskets 15 are embedded in the inner sides of the plurality of sets of placing grooves 501, extruding springs 14 are horizontally arranged on the inner side of the placing rack 4, one end of each extruding spring 14 is fixedly connected with the placing rack 4, the other end of each extruding spring 14 is fixedly connected with the placing plate 5, the bottom of the placing rack 4 is positioned below the placing plate 5 and is rotatably connected with a transmission plate 6 through a rotating shaft, and a locking block 16 penetrating through the placing rack 4 is vertically arranged on the inner side of the transmission plate 6, wherein a locking groove 502 is formed on the inner side of the placing plate 5 above the locking block 16, a sliding column 1601 penetrating through the transmission plate 6 is fixedly connected on the outer side of the transmission plate 6, wherein a sliding groove 601 is formed on the outer side of the sliding column 1601 inside of the transmission plate 6, and the, on the other hand has avoided the direct and holding groove 501 contact of intelligent communication chip to reduced the production of the impaired phenomenon of intelligent communication chip rigidity, extrusion spring 14's setting, be convenient for place 5 elasticity roll-off racks 4 of board, driving plate 6's setting, the motion regulation of the vertical direction of the locking piece 16 of being convenient for is handled, the setting of locking piece 16 and locked groove 502 can be fixed the inboard at slide rail 401 with placing board 5, the setting of traveller 1601 and spout 601 simultaneously, the driving plate 6 of being convenient for is handled the transmission of the vertical direction of locking piece 16.
Specifically, as shown in fig. 1 and fig. 2, a blower 11 is installed on the inner side of the top of the air supply box 7, an output shaft of the blower 11 is located on the inner side of the air supply box 7 and is connected with an air supply blade 12 in a transmission manner, a plurality of groups of heating resistance wires 13 are installed on the inner side of the air supply box 7 and below the air supply blade 12, an electronic control switch 3 is installed on the top of the front end face of the storage box 1, an output end of the electronic control switch 3 is electrically connected with input ends of the blower 11 and the heating resistance wires 13 respectively, when the blower 11 drives the air supply blade 12 to rotate, air in the storage box 1 can be sucked into the air supply box 7 through the air suction pipe 10, the plurality of groups of heating resistance wires 13 are arranged, and can perform uniform constant-temperature heating treatment on the air, and.
The working principle is as follows: when the intelligent communication chip storage box is used, when the intelligent communication chip needs to be stored, the transmission plate 6 below the placing plate 5 at the designated position is lifted upwards, the lock block 16 on the inner side of the transmission plate 6 can slide downwards out of the lock groove 502 in the placing plate 5 under the action of the rotating shaft, the placing plate 5 can slide outwards in the sliding rail 401 in a horizontal mode under the action of the extrusion spring 14, the intelligent communication chip can be uniformly placed in the placing groove 501, the placing plate 5 is pushed inwards after the placing is finished, when the lock groove 502 moves to the position above the lock block 16, the lock block 16 can slide upwards into the lock groove 502 under the combined action of the lever principle and gravity, so that the locking and fixing treatment of the placing plate 5 is finished, when the constant-temperature air supply treatment needs to be carried out on the inside of the storage box 1, the electric control switch 3 is pressed, when the air feeder 11 in the air feeding box 7 drives the air feeding blades 12 to rotate, under the action of air flow, deposit the inside air of case 1 and just can enter into the inside of air supply box 7 through breathing pipe 10, the inside multiunit heating resistor 13 that sets up of air supply box 7 simultaneously can carry out constant temperature heat treatment with the air of sending into, the air after the heat treatment just can the air duct 9 enter into the inside of multiunit air supply dish 8, multiunit air supply dish 8 can be through multiunit air supply shower nozzle 801, with the even top of sending into rack 4 of homothermal hot-air, thereby carry out constant temperature air supply with the intelligent communication chip of placing on the multiunit rack 4 and handle.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. An intelligent communication chip constant-temperature storage management device comprises a storage box (1), a sealing box door (2) arranged on the outer side of the front end face of the storage box (1), a plurality of groups of placing frames (4) arranged on the inner side of the storage box (1) at equal intervals, and an air supply box (7) arranged on the top of the storage box (1), it is characterized in that a plurality of groups of sliding rails (401) are arranged on the tops of the plurality of groups of placing racks (4) at equal intervals, and the inner sides of the plurality of groups of slide rails (401) are all connected with placing plates (5) in a sliding way, the bottom of the air supply box (7) is positioned at the inner side of the storage box (1) and the bottom of the plurality of groups of placing frames (4) are all provided with air supply discs (8), and the bottom of the air supply disk (8) is communicated with a plurality of groups of air supply nozzles (801) in a rectangular array, wherein air ducts (9) are communicated among the air supply discs (8), and the air supply box (7) is communicated with the storage box (1) through an air suction pipe (10).
2. The constant-temperature storage and management device for the intelligent communication chips as recited in claim 1, wherein a plurality of sets of placing grooves (501) are formed in the top of the placing plate (5) at equal intervals, and rubber gaskets (15) are embedded in the inner sides of the plurality of sets of placing grooves (501).
3. The constant-temperature storage and management device for the intelligent communication chips as claimed in claim 2, wherein the inner side of the placing frame (4) is provided with horizontally distributed extrusion springs (14), one ends of the extrusion springs (14) are fixedly connected with the placing frame (4), the other ends of the extrusion springs are fixedly connected with the placing plate (5), the bottom of the placing frame (4) is located below the placing plate (5) and is rotatably connected with a transmission plate (6) through a rotating shaft, the inner side of the transmission plate (6) is vertically provided with a locking block (16) penetrating through the placing frame (4), and a locking groove (502) is formed in the position, above the locking block (16), of the inside of the placing plate (5).
4. The intelligent communication chip constant-temperature storage management device according to claim 3, wherein a sliding column (1601) penetrating through the transmission plate (6) is fixedly connected to the outside of the lock block (16), and a sliding groove (601) is formed in the transmission plate (6) and located on the outer side of the sliding column (1601).
5. The intelligent communication chip constant-temperature storage and management device as claimed in claim 1, wherein a blower (11) is installed on the inner side of the top of the air supply box (7), an output shaft of the blower (11) is located on the inner side of the air supply box (7) and is in transmission connection with an air supply blade (12), and a plurality of groups of heating resistance wires (13) are installed on the inner side of the air supply box (7) below the air supply blade (12).
6. The intelligent communication chip constant-temperature storage management device as claimed in claim 1 or 5, wherein an electric control switch (3) is mounted at the top of the front end face of the storage box (1), and the output end of the electric control switch (3) is electrically connected with the input ends of the air blower (11) and the heating resistance wire (13) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921439671.2U CN211309521U (en) | 2019-09-02 | 2019-09-02 | Intelligent communication chip constant temperature storage management device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921439671.2U CN211309521U (en) | 2019-09-02 | 2019-09-02 | Intelligent communication chip constant temperature storage management device |
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| Publication Number | Publication Date |
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| CN211309521U true CN211309521U (en) | 2020-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921439671.2U Active CN211309521U (en) | 2019-09-02 | 2019-09-02 | Intelligent communication chip constant temperature storage management device |
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| CN (1) | CN211309521U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113104397A (en) * | 2021-04-21 | 2021-07-13 | 来恩伟业(鹤壁)电子科技有限责任公司 | Protective storage device for capacitor |
-
2019
- 2019-09-02 CN CN201921439671.2U patent/CN211309521U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113104397A (en) * | 2021-04-21 | 2021-07-13 | 来恩伟业(鹤壁)电子科技有限责任公司 | Protective storage device for capacitor |
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Effective date of registration: 20210331 Address after: 518000 floor 1, 2nd floor, 3rd floor, 4th floor and 5th floor, No.1 Factory building, YUDAFU Industrial Park, No.10 Xingye West Road, Heyi community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Jiangyuan Zhizao Technology Co.,Ltd. Address before: 518000 buildings 1 and 2, YUDAFU Industrial Park, Xingye West Road, Heyi community, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN YU DA FU ELECTRONIC Co.,Ltd. |