CN211295084U - Machining die for lead frame - Google Patents
Machining die for lead frame Download PDFInfo
- Publication number
- CN211295084U CN211295084U CN201922168143.4U CN201922168143U CN211295084U CN 211295084 U CN211295084 U CN 211295084U CN 201922168143 U CN201922168143 U CN 201922168143U CN 211295084 U CN211295084 U CN 211295084U
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- CN
- China
- Prior art keywords
- lead frame
- die
- frame units
- units
- connecting piece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to the technical field of lead frames, in particular to a lead frame, which comprises a lead frame body, wherein the lead frame body comprises two first lead frame units, two connecting pieces and two second lead frame units, one side of each first lead frame unit, which is close to each other, is connected with the connecting piece, one side of each connecting piece, which is close to each other, is connected with the second lead frame unit, one side of each second lead frame unit, which is close to each other, is connected with the same connecting piece, the first lead frame unit and the second lead frame unit are positioned in the same plane, the lead frame is bent by a processing mould in two steps, the minimum distance between the connecting piece of the lead frame and the first lead frame unit is firstly bent to 0.7mm, and then the minimum distance between the connecting piece and the first lead frame unit is bent to 1.067mm, the lead frame produced in the way is stable in structure, and the lead frame is not easy to deviate in the using process.
Description
Technical Field
The utility model relates to a lead frame technical field especially relates to a mold processing for lead frame.
Background
At present, in the process of manufacturing the TO-252 type lead frame by stamping, the TO-252 type lead frame needs TO be bent, the conventional bending operation is generally completed in one step, the operation mode is convenient, but the structure of the lead frame is not stable enough, and the lead frame is easy TO shift in the using process.
In view of the above-mentioned drawbacks, a mold for manufacturing a lead frame is proposed to make it more industrially useful.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a processing die for a lead frame.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a lead frame comprises a lead frame body, wherein the lead frame body comprises two first lead frame units, connecting pieces and two second lead frame units, the connecting pieces are connected to one sides, close to each other, of the first lead frame units, the second lead frame units are connected to one sides, close to each other, of the connecting pieces, the same connecting piece is connected to one side, close to each other, of the second lead frame units, the first lead frame units and the second lead frame units are located in the same plane, the connecting pieces are parallel to the first lead frame units, the minimum distance between the connecting pieces and the first lead frame units is 1.067mm, a first positioning hole is formed in one end, far away from each other, of the first lead frame units, and the first lead frame units are provided with positioning rods, and the positioning rods on the two first lead frame units of the same lead frame body are positioned on the same straight line.
Preferably, the connecting piece is provided with two chip grooves corresponding to each other, and the connecting piece between the chip grooves is also provided with a through groove.
Preferably, both ends of the connecting piece are provided with a first welding table and a second welding table, the first welding table is provided with a first lock hole, and the second welding table is provided with a second lock hole.
Preferably, the connecting piece is further provided with two third locking holes corresponding to each other, the third locking holes are located between the chip slots, and the third locking holes are close to the adjacent chip slots.
Preferably, a second positioning hole is further formed between the adjacent lead frame bodies, and the second positioning hole is located on the second lead frame unit.
The utility model provides a mold processing for lead frame, includes movable mould seat and cover half group, set gradually stamping die, first correction mould, second correction mould, correction mould and cutting die on the cover half group.
Preferably, the stamping die is matched with the lead frame body.
Preferably, the depth of the first correction die is smaller than the depth of the second correction die.
The utility model has the advantages that:
1. this processing mould for lead frame divides two steps to bend the lead frame, rolls over to 0.7mm with the minimum distance between the connection piece of lead frame and the first lead frame unit earlier, rolls over to 1.067mm with the minimum distance between connection piece and the first lead frame unit again, and the stable in structure of the lead frame of producing like this, the lead frame is difficult for taking place the skew in the use.
2. Be provided with the locating lever on the first lead frame unit, regard the locating lever as the zero-bit, avoid whole lead frame to appear turning left or turning right the skew, finally, the lead frame of producing is exactly a rectangle, rather than a parallelogram for the qualification rate of product is high.
Drawings
Fig. 1 is a schematic front view of a lead frame according to the present invention;
fig. 2 is a schematic front view of the lead frame according to the present invention;
fig. 3 is an enlarged schematic structural diagram of a lead frame shown in fig. 1;
fig. 4 is a schematic front view of a first lead frame unit of a lead frame according to the present invention;
fig. 5 is a schematic front view of a second lead frame unit of the lead frame according to the present invention;
fig. 6 is a schematic side view of a lead frame according to the present invention;
fig. 7 is a schematic structural view of a processing mold for a lead frame according to the present invention.
In the figure: the lead frame comprises a lead frame body 1, a first lead frame unit 2, a connecting piece 3, a second lead frame unit 4, a fixed die set 5, a stamping die 6, a first correcting die 7, a second correcting die 8, a correcting die 9, a cutting die 10, a positioning rod 21, a first positioning hole 22, a chip groove 31, a first locking hole 32, a second locking hole 33, a third locking hole 34, a through groove 35 and a second positioning hole 41.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-7, a lead frame comprises a lead frame body 1, wherein the lead frame body 1 comprises two first lead frame units 2, two connecting pieces 3 and two second lead frame units 4, one side, close to each other, of each first lead frame unit 2 is connected with the connecting piece 3, one side, close to each other, of each connecting piece 3 is connected with the second lead frame unit 4, one side, close to each other, of each second lead frame unit 4 is connected with the same connecting piece 3, the first lead frame units 2 and the second lead frame units 4 are located in the same plane, the connecting pieces 3 are parallel to the first lead frame units 2, the minimum distance between the connecting pieces 3 and the first lead frame units 2 is 1.067mm, one end, far away from each other, of each first lead frame unit 2 is provided with a first positioning hole 22, and the first lead frame units 2 are provided with positioning rods 21, the positioning rods 21 on the two first lead frame units 2 of the same lead frame body 1 are on the same straight line.
Furthermore, two chip grooves 31 corresponding to each other are arranged on the connecting sheet 3, and a through groove 35 is further arranged on the connecting sheet 3 between the chip grooves 31.
Furthermore, both ends of the connecting piece 3 are provided with a first welding table and a second welding table, the first welding table is provided with a first lock hole 32, and the second welding table is provided with a second lock hole 33.
Furthermore, the connecting sheet 3 is further provided with two third locking holes 34 corresponding to each other, the third locking holes 34 are located between the chip slots 31, and the third locking holes 34 are close to the adjacent chip slots 31.
Further, a second positioning hole 41 is further disposed between adjacent lead frame bodies 1, and the second positioning hole 41 is located on the second lead frame unit 4.
The utility model provides a mold processing for lead frame, includes movable mould seat and cover die set 5, set gradually stamping die 6, first mould 7, the second mould 8, correction die 9 and the cutting die 10 of revising on the cover die set 5.
Further, the stamping die 6 is matched with the lead frame body 1.
Further, the depth of the first correction die 7 is smaller than the depth of the second correction die 8.
In the embodiment, the lead frame is bent by the processing die in two steps, the lead frame is preliminarily formed by the stamping die 6, then the minimum distance between the connecting piece 3 and the first lead frame 2 unit of the lead frame is folded to 0.7mm by the first correcting die 7, then the minimum distance between the connecting piece 3 and the first lead frame 2 unit is folded to 1.067mm by the second correcting die 8, then the correction is carried out by the correcting die 9, and finally the lead frame is cut into single lead frame bodies 1 by the cutting die 10, so that the produced lead frame bodies 1 are stable in structure, and the lead frame bodies 1 are not prone to deviation in the using process.
The first lead frame unit 2 is provided with the positioning rod 21, the positioning rod 21 is used as a zero position, the phenomenon that the whole lead frame deviates leftwards or rightwards is avoided, and finally, the produced lead frame is a rectangle instead of a parallelogram, so that the product percent of pass is high.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (8)
1. A lead frame comprises a lead frame body (1) and is characterized in that the lead frame body (1) comprises two first lead frame units (2), connecting pieces (3) and two second lead frame units (4), one sides, close to each other, of the first lead frame units (2) are connected with the connecting pieces (3), one sides, close to each other, of the connecting pieces (3) are connected with the second lead frame units (4), one sides, close to each other, of the second lead frame units (4) are connected with the same connecting piece (3), the first lead frame units (2) and the second lead frame units (4) are located in the same plane, the connecting pieces (3) are parallel to the first lead frame units (2), the minimum distance between the connecting pieces (3) and the first lead frame units (2) is 1.067mm, one end of each first lead frame unit (2) far away from each other is provided with a first positioning hole (22), positioning rods (21) are arranged on the first lead frame units (2), and the positioning rods (21) on the two first lead frame units (2) of the same lead frame body (1) are located on the same straight line.
2. Lead frame according to claim 1, characterized in that the connecting piece (3) is provided with two mutually corresponding chip slots (31), and that the connecting piece (3) between the chip slots (31) is further provided with a through slot (35).
3. Lead frame according to claim 2, characterized in that the connection piece (3) is provided at both ends with a first soldering station and a second soldering station, the first soldering station being provided with a first locking hole (32) and the second soldering station being provided with a second locking hole (33).
4. Lead frame according to claim 3, characterized in that the connecting piece (3) is further provided with two third locking holes (34) corresponding to each other, the third locking holes (34) are located between the chip slots (31), and the third locking holes (34) are adjacent to the adjacent chip slots (31).
5. Lead frame according to claim 4, characterized in that between adjacent lead frame bodies (1) there is further arranged a second positioning hole (41), said second positioning hole (41) being located on the second lead frame unit (4).
6. The lead frame processing die according to any one of claims 1 to 5, comprising a movable die holder and a fixed die set (5), wherein the fixed die set (5) is provided with a stamping die (6), a first correcting die (7), a second correcting die (8), a correcting die (9) and a cutting die (10) in sequence.
7. A tool for lead frames according to claim 6, characterized in that the stamping die (6) is adapted to the lead frame body (1).
8. The processing mold for lead frames according to claim 6, wherein the depth of the first correcting die (7) is smaller than the depth of the second correcting die (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922168143.4U CN211295084U (en) | 2019-12-06 | 2019-12-06 | Machining die for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922168143.4U CN211295084U (en) | 2019-12-06 | 2019-12-06 | Machining die for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211295084U true CN211295084U (en) | 2020-08-18 |
Family
ID=72019162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922168143.4U Active CN211295084U (en) | 2019-12-06 | 2019-12-06 | Machining die for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211295084U (en) |
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2019
- 2019-12-06 CN CN201922168143.4U patent/CN211295084U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220713 Address after: 221000 building a11, electronic information industrial park, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee after: Saiken Electronics (Xuzhou) Co.,Ltd. Address before: 215416 Building 5, No. 3, Huangqiao Road, Shuangfeng town, Taicang City, Suzhou City, Jiangsu Province Patentee before: SAIKEN ELECTRON (SUZHOU) CO.,LTD. |