CN211293770U

CN211293770U - Contact type temperature control device for chip testing

Info

Publication number: CN211293770U
Application number: CN202020118479.XU
Authority: CN
Inventors: 丛维; 金生
Original assignee: Shanghai Youcun Technology Co ltd
Current assignee: Shanghai Youcun Technology Co ltd
Priority date: 2020-01-19
Filing date: 2020-01-19
Publication date: 2020-08-18
Anticipated expiration: 2030-01-19

Abstract

The utility model discloses a contact temperature control device for chip testing belongs to chip testing technical field, and it includes the fixed plate, the positive below fixedly connected with backup pad of fixed plate, the upper surface mosaic of backup pad has three semiconductor refrigeration piece. This a contact temperature control device for chip test, through setting up the semiconductor refrigeration piece, after the semiconductor refrigeration piece circular telegram, the upper surface and the lower surface of semiconductor refrigeration piece heat respectively and refrigerate, heat one side and chip mutual contact, play the effect of intensification, when needs are to the chip cooling, controller control fan starts, the fan can blow the air conditioning that the semiconductor refrigeration piece was made in the gas storage cover to the chip through the second through-hole, can reduce the temperature of chip like this, thereby it is convenient to have brought for workman's temperature regulation, it is complicated to avoid traditional water-cooling structure, the great problem of occupation space, thereby the degree of difficulty of making and operating has been reduced.

Description

Contact type temperature control device for chip testing

Technical Field

The utility model belongs to the technical field of the chip test, specifically be a contact temperature control device for chip test.

Background

The chip need test it after the design, in the test procedure, need exert different temperatures to the chip, test its performance under different temperatures, but temperature control device during current contact, the majority adopts the water-cooling, because the water-cooling is not only complicated in structure, consumes a large amount of water resources, but also occupation space, the troublesome poeration to measurement has brought inconvenience.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

In order to overcome the above defect of prior art, the utility model provides a contact temperature control device for chip test has solved that traditional water-cooling control by temperature change structure is complicated, consumes a large amount of water resources, occupation space, troublesome poeration's problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a contact temperature control device for chip test, includes the fixed plate, the positive below fixedly connected with backup pad of fixed plate, the upper surface of backup pad is inlayed and is had three semiconductor refrigeration piece, the first through-hole of a plurality of has all been seted up to the position that the backup pad lower surface corresponds three semiconductor refrigeration piece, the lower surface of backup pad is provided with the gas storage cover, a plurality of second through-hole, a plurality of have been seted up to the upper surface of backup pad the second through-hole is located the left and right sides of three semiconductor refrigeration piece respectively, the lower surface of gas storage cover is provided with the fan, the back fixed connection of fan is in the positive below of fixed plate.

The position that the backup pad upper surface corresponds three semiconductor refrigeration piece all is provided with examines test table, it is provided with the chip in the test table to examine, the lower surface overlap joint of chip is at the upper surface of semiconductor refrigeration piece, the upper surface overlap joint of chip has the block rubber, the last fixed surface of block rubber is connected with the connecting rod, the top of connecting rod pass the third through-hole and with the bottom fixed connection of slide bar, the lower surface at the casing is seted up at the third through-hole, the positive top of back fixed connection at the fixed plate of casing, the sliding sleeve has been cup jointed on the surface of slide bar, the sliding sleeve joint is at the upper surface of casing, the spring has been cup jointed on the surface of slide bar, the top and the bottom of spring are fixed connection respectively on the upper surface of shells inner wall and.

As a further aspect of the present invention: and a one-way valve is arranged on the lower surface of the support plate corresponding to the second through hole.

As a further aspect of the present invention: and temperature sensors are arranged below the left side surface and the right side surface of the inner wall of the detection table.

As a further aspect of the present invention: the right side of the front lower part of the fixing plate is provided with a controller and a power supply, and the power supply is positioned on the right side of the controller.

As a further aspect of the present invention: the top end of the sliding rod is provided with a pull ring, and the pull ring is made of rubber.

(III) advantageous effects

Compared with the prior art, the beneficial effects of the utility model reside in that:

1. this a contact temperature control device for chip test, through setting up the semiconductor refrigeration piece, after the semiconductor refrigeration piece circular telegram, the upper surface and the lower surface of semiconductor refrigeration piece heat respectively and refrigerate, heat one side and chip mutual contact, play the effect of intensification, when needs are to the chip cooling, controller control fan starts, the fan can blow the air conditioning that the semiconductor refrigeration piece was made in the gas storage cover to the chip through the second through-hole, can reduce the temperature of chip like this, thereby it is convenient to have brought for workman's temperature regulation, it is complicated to avoid traditional water-cooling structure, the great problem of occupation space, thereby the degree of difficulty of making and operating has been reduced.

2. This a contact temperature control device for chip test, through setting up the block rubber, the connecting rod, the third through-hole, the slide bar, sliding sleeve and spring, when fixed chip, can use the pull ring to mention the slide bar, connecting rod and block rubber for the block rubber breaks away from and examines test table, changes the chip, then loosens the pull ring of being mentioned, and the elasticity that the spring produced drives connecting rod and block rubber downstream, fixes the chip, has guaranteed the stability of chip in the testing process.

3. This a contact temperature control device for chip test through setting up the check valve, when the fan starts, the fan aerifys in to the gas storage cover, and the air current can drive the air conditioning in the gas storage cover and flow to the chip through check valve and second through-hole, cools down to it, and when the fan stop work, the check valve can prevent the air conditioning flow direction second through-hole that the semiconductor refrigeration piece was made to guaranteed that the second through-hole only can just work when the cooling.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

FIG. 2 is an enlarged schematic view of part A of the present invention;

fig. 3 is a left-side view schematically illustrating the structure of the present invention;

in the figure: the device comprises a fixing plate 1, a supporting plate 2, a semiconductor refrigerating sheet 3, a first through hole 4, an air storage cover 5, a second through hole 6, a check valve 7, a fan 8, a controller 9, a power supply 10, a detection table 11, a temperature sensor 12, a chip 13, a rubber block 14, a connecting rod 15, a third through hole 16, a shell 17, a sliding rod 18, a sliding sleeve 19, a spring 20 and a pull ring 21.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

As shown in fig. 1-3, the utility model provides a technical solution: a contact temperature control device for chip testing comprises a fixing plate 1, a controller 9 and a power supply 10 are arranged on the right side of the front lower portion of the fixing plate 1, the power supply 10 is arranged on the right side of the controller 9, the controller 9 is arranged to receive and send instructions, so that workers can more conveniently control normal operation of semiconductor refrigerating sheets 3 and a fan 8, a supporting plate 2 is fixedly connected to the front lower portion of the fixing plate 1, three semiconductor refrigerating sheets 3 are embedded on the upper surface of the supporting plate 2, the semiconductor refrigerating sheets 3 are arranged, the upper surface and the lower surface of the semiconductor refrigerating sheets 3 after being electrified respectively perform heating and refrigerating, the upper surface of the semiconductor refrigerating sheets can heat up a chip 13, a plurality of first through holes 4 are formed in the positions, corresponding to the three semiconductor refrigerating sheets 3, of the lower surface of the supporting plate 2, a cover 5 is arranged on the lower surface of the supporting plate 2, a plurality of second through holes 6 are formed in, the plurality of second through holes 6 are respectively positioned at the left side and the right side of the three semiconductor refrigeration sheets 3, the position of the lower surface of the support plate 2 corresponding to the second through holes 6 is provided with a check valve 7, when the fan 8 is started, the fan 8 inflates the air storage cover 5, the air flow can drive the cold air in the air storage cover 5 to flow to the chip 13 through the check valve 7 and the second through holes 6 to cool the chip, when the fan 8 stops working, the check valve 7 can prevent the cold air produced by the semiconductor refrigeration sheets 3 from flowing to the second through holes 6, thereby ensuring that the air flow only can be produced by the second through holes 6 when the temperature is lowered, the lower surface of the air storage cover 5 is provided with the fan 8, the back surface of the fan 8 is fixedly connected below the front surface of the fixing plate 1, through the fan 8, the fan 8 can blow the cold air produced by the semiconductor refrigeration sheets 3 in the air storage cover 5 to the chip, this allows the chip 13 to be cooled.

The upper surface of the supporting plate 2 is provided with a detection table 11 corresponding to the positions of the three semiconductor refrigerating sheets 3, the lower parts of the left side surface and the right side surface of the inner wall of the detection table 11 are provided with temperature sensors 12, the temperature around the chip 13 can be monitored in real time by arranging the temperature sensors 12, the display of the temperature sensors on the display screen of the controller 9 brings convenience for workers to adjust the temperature, the chip 13 is arranged in the detection table 11, the lower surface of the chip 13 is lapped on the upper surface of the semiconductor refrigerating sheets 3, the upper surface of the chip 13 is lapped with a rubber block 14, the rubber block 14 is arranged, the rubber block 14 is non-conductive and has better flexibility, the chip 13 cannot be damaged when the chip 13 is fixed, so that the chip 13 is protected, the upper surface of the rubber block 14 is fixedly connected with a connecting rod 15, the top end of the connecting rod 15 passes through a third, the third through hole 16 is opened on the lower surface of the shell 17, the back of the shell 17 is fixedly connected above the front of the fixing plate 1, the surface of the sliding rod 18 is sleeved with a sliding sleeve 19, the sliding sleeve 19 is clamped on the upper surface of the shell 17, by arranging the sliding rod 18 and the sliding sleeve 19, the sliding rod 18 can stably and smoothly slide up and down in the sliding sleeve 19, thereby ensuring the stable and smooth up-and-down movement of the connecting rod 15, the surface of the sliding rod 18 is sleeved with a spring 20, the top end and the bottom end of the spring 20 are respectively fixedly connected on the upper surface of the inner wall of the shell 17 and the top end of the connecting rod 15, by arranging the spring 20, when a worker loosens the lifted pull ring 21, the elastic force generated by the spring 20 drives the rubber block 14 to move down through the connecting rod 15, the rubber block 14 can stably fix the chip 13 in the detection platform 11, the top end, the pull ring 21 is used to facilitate the worker lifting the slide bar 18, thereby facilitating the worker lifting the rubber block 14.

The utility model discloses a theory of operation does:

s1, when the detection device is used, a worker lifts the sliding rod 18 by using the pull ring 21, the sliding rod 18 drives the connecting rod 15 and the rubber block 14 to move upwards, the worker places the chip 13 in the detection platform 11, then the lifted pull ring 21 is released, the connecting rod 15 and the rubber block 14 are driven to move downwards by the elastic force generated by the spring 20, and the rubber block 14 can stably fix the chip 13 in the detection platform 11;

s2, then, use controller 9 control semiconductor refrigeration piece 3 circular telegram as required, the upper surface of semiconductor refrigeration piece 3 heats, heat chip 13, and its lower surface refrigeration, cold air can be stored in gas storage cover 5, when chip 13 needs the cooling, controller 9 control semiconductor refrigeration piece 3 stop work, fan 8 starts, fan 8 blows to gas storage cover 5 is interior, blow the cold air in gas storage cover 5 to chip 13 through check valve 7 and second through-hole 6, cool it, temperature sensor 12 monitors the temperature of chip 13 in real time.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. A contact temperature control device for chip testing, includes fixed plate (1), its characterized in that: the fixing plate is characterized in that a supporting plate (2) is fixedly connected to the lower portion of the front face of the fixing plate (1), three semiconductor refrigerating sheets (3) are inlaid on the upper surface of the supporting plate (2), a plurality of first through holes (4) are formed in positions, corresponding to the three semiconductor refrigerating sheets (3), of the lower surface of the supporting plate (2), a gas storage cover (5) is arranged on the lower surface of the supporting plate (2), a plurality of second through holes (6) are formed in the upper surface of the supporting plate (2), the second through holes (6) are respectively located on the left side and the right side of the three semiconductor refrigerating sheets (3), a fan (8) is arranged on the lower surface of the gas storage cover (5), and the back face of the fan (8) is fixedly connected to the lower portion of;

the upper surface of the supporting plate (2) is provided with a detection table (11) corresponding to the positions of the three semiconductor refrigeration sheets (3), a chip (13) is arranged in the detection table (11), the lower surface of the chip (13) is overlapped on the upper surface of the semiconductor refrigeration sheets (3), a rubber block (14) is overlapped on the upper surface of the chip (13), a connecting rod (15) is fixedly connected to the upper surface of the rubber block (14), the top end of the connecting rod (15) penetrates through a third through hole (16) and is fixedly connected with the bottom end of a sliding rod (18), the third through hole (16) is arranged on the lower surface of a shell (17), the back surface of the shell (17) is fixedly connected above the front surface of the fixing plate (1), the surface of the sliding rod (18) is sleeved with a sliding sleeve (19), the sliding sleeve (19) is clamped on the upper surface of the shell (17), and the surface of the sliding rod (18) is sleeved with a spring (, the top end and the bottom end of the spring (20) are respectively and fixedly connected to the upper surface of the inner wall of the shell (17) and the top end of the connecting rod (15).

2. The contact temperature control device for chip testing according to claim 1, wherein: and a one-way valve (7) is arranged on the lower surface of the support plate (2) at a position corresponding to the second through hole (6).

3. The contact temperature control device for chip testing according to claim 1, wherein: temperature sensors (12) are arranged below the left side face and the right side face of the inner wall of the detection table (11).

4. The contact temperature control device for chip testing according to claim 1, wherein: the right side of the front lower part of the fixing plate (1) is provided with a controller (9) and a power supply (10), and the power supply (10) is located on the right side of the controller (9).

5. The contact temperature control device for chip testing according to claim 1, wherein: the top end of the sliding rod (18) is provided with a pull ring (21), and the pull ring (21) is made of rubber.