CN211279246U - Diamond wire slicer main shaft dismouting structure for silicon chip production - Google Patents

Abstract

The utility model discloses a silicon chip production is with golden wire slicer main shaft dismouting structure, comprising a base plate, avris fixed position of bottom plate upper end installs spacing extension board, the through-hole has been seted up to the avris position of the outside upper end of spacing extension board, the avris fixed position in the spacing extension board outside installs the motor support, the inside movable mounting of through-hole has the location axis of rotation, the upper end fixed mounting of motor support has driving motor, location axis of rotation output shaft passes fixed connection between through-hole and the axle sleeve, driving motor's output shaft passes fixed connection between through-hole and the axle sleeve. This silicon chip production is with diamond wire slicer main shaft dismouting structure carries out optimization improvement by a wide margin to the mounting structure of main shaft overall assembly on diamond wire slicer, detains through setting up holding ring and location, under the required condition of rotating the use of guaranteeing that the main shaft possesses normal work, makes things convenient for the main shaft to dismantle and install on equipment more, has effectively enlarged holistic application scope.

Description

Diamond wire slicer main shaft dismouting structure for silicon chip production

Technical Field

The utility model relates to a silicon chip production technical field specifically is a silicon chip production is with diamond wire slicer main shaft dismouting structure.

Background

The silicon element with the content of 25.8 percent in the crust provides an inexhaustible source for the production of monocrystalline silicon, and because the silicon element is one of the elements with the most abundant reserves in the crust, for the products of solar cells which are destined to enter large-scale markets, the reserve has the advantage that the silicon becomes one of the main photovoltaic materials, and the silicon wafer is an industrial product of the silicon element.

The diamond wire slicing machine is an important processing device in silicon wafer production, the diamond wire slicing machine adopts a mode of diamond wire unidirectional circulation or reciprocating circulation motion to enable the diamond wire and a cut object to form relative grinding motion, thereby realizing the cutting purpose, however, most of main shafts assembled on the diamond wire slicing machine for silicon wafer production in the existing market adopt an integral non-detachable fixed structure, although the stability of the whole body in the normal use work of actual application can be effectively ensured, the service life of the whole diamond wire slicing machine is bound with the service life of the whole diamond wire slicing machine due to the non-detachable main shaft, when the main shaft is damaged, partial part replacement can not be carried out according to the actual working condition, so that the use functionality of the whole body is greatly limited, and the single main shaft can not be detached according to the self condition required actually, thereby facilitating the inspection, replacement or maintenance, resulting in the disadvantage of narrow overall applicability.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip production is with golden wire slicer main shaft dismouting structure, in order to solve and propose whole more adoption integral type detachable fixed knot structure, though can effectively guarantee whole stability in practical application normal use work, but because unable dismantlement makes the holistic life of diamond wire slicer bind rather than, when the main shaft damages, can't carry out local part according to the operating condition of reality and change, so that holistic service function receives great restriction, and can not dismantle single main shaft according to actual required self condition, so that the inspection is changed or the maintenance, lead to the narrower problem of whole application scope.

In order to achieve the above object, the utility model provides a following technical scheme: a main shaft dismounting structure of a diamond wire slicer for silicon wafer production comprises a bottom plate, a limit support plate is fixedly arranged at the side position of the upper end of the bottom plate, a through hole is arranged at the side position of the upper end of the outer part of the limit support plate, a motor bracket is fixedly arranged at the side position of the outer side of the limit support plate, a positioning rotating shaft is movably arranged in the through hole, a driving motor is fixedly arranged at the upper end of the motor bracket, the output shaft of the positioning rotating shaft passes through the through hole and is fixedly connected with the shaft sleeve, the output shaft of the driving motor passes through the through hole and is fixedly connected with the shaft sleeve, a positioning ring is fixedly arranged at the lower end of the outer side of the shaft sleeve, a positioning buckle is movably arranged at the upper end of the positioning ring, the positioning ring is movably connected with the positioning buckle through a hinge shaft, a main shaft body is movably mounted inside the positioning ring, and a butt joint port is formed in the side position of the upper end of the positioning ring.

Preferably, the whole bottom plate is of a rectangular plate structure, two limiting support plates with the same specification are symmetrically fixed on two sides of the upper end face of the bottom plate, two through holes with the same specification are symmetrically formed in the upper ends of the outer portions of the two limiting support plates respectively, and the inner diameter of each through hole is matched with the outer diameter of the positioning rotating shaft.

Preferably, the motor support adopts the triangle bearing structure that the upper end is horizontal diaphragm outside spacing extension board wholly, and the external diameter size of axle sleeve is identical with the internal diameter size of location axis of rotation, and the holding ring is the semicircle ring structure that diameter size is the same with the location knot simultaneously, and the bottom position of location knot avris is fixed with the identical buckle of outside specification and the inside specification of interface.

Preferably, the output shaft of the driving motor is movably connected with the positioning rotating shaft on the same side through a transmission belt.

Preferably, the main shaft body is symmetrically provided with two connecting rods with the same specification between the two limiting support plates, the two sides of the main shaft body are symmetrically provided with two connecting rods with the same specification, the two connecting rods are movably connected with the positioning ring through the connecting rods, and the outer inclined ring of the main shaft body is provided with a wire groove in a surrounding manner.

Preferably, the inside avris fixed mounting of interface has the cardboard, and the outside position movable mounting of holding ring upper end avris has the press button, and the press button passes fixed connection between inside and the ejector pad of interface simultaneously.

Compared with the prior art, the beneficial effects of the utility model are that: the main shaft dismounting structure of the diamond wire slicer for silicon wafer production greatly optimizes and improves the mounting structure of the main shaft integrally assembled on the diamond wire slicer, and by arranging the positioning ring and the positioning buckle, under the condition of ensuring that the main shaft can be rotated and used for normal work, the main shaft is more convenient to disassemble and assemble on equipment, can meet different use requirements in practical application and use work, and is beneficial to effectively check the device, reduces the occurrence of faults, effectively prolongs the service life of the whole assembled equipment, and the transmission belt with the associated transmission function is arranged, so that the continuity and the fluency of the whole body in the actual use work are improved, the use effect and the working performance of the whole body are greatly improved, meanwhile, the wire grooves correspondingly formed in the two main shafts provide basic use conditions for integral machining, and the integral application range is effectively enlarged.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the main shaft splitting structure of the present invention;

FIG. 3 is a schematic front view of the present invention;

fig. 4 is a schematic top view of the present invention;

FIG. 5 is a schematic top view of the interface of the present invention;

FIG. 6 is a schematic view showing an opened state of the positioning buckle of the present invention;

fig. 7 is a schematic view of the structure of the rotation positioning shaft of the present invention.

In the figure: 1. a base plate; 2. a limiting support plate; 3. a through hole; 4. a motor bracket; 5. positioning the rotating shaft; 6. a drive motor; 7. a shaft sleeve; 8. a positioning ring; 9. positioning buckles; 10. a hinge shaft; 11. a main shaft body; 12. a connecting rod; 13. a wire slot; 14. a butt joint port; 15. clamping a plate; 16. pressing the button; 17. a push block; 18. a transmission belt; 19. and (5) buckling.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-7, the present invention provides a technical solution: a main shaft dismounting structure of a diamond wire slicer for silicon wafer production comprises a bottom plate 1, a limiting support plate 2 is fixedly installed at the side position of the upper end of the bottom plate 1, a through hole 3 is formed in the side position of the upper end of the outer portion of the limiting support plate 2, a motor support 4 is fixedly installed at the side position of the outer side of the limiting support plate 2, a positioning rotating shaft 5 is movably installed in the through hole 3, a driving motor 6 is fixedly installed at the upper end of the motor support 4, an output shaft of the positioning rotating shaft 5 penetrates through the through hole 3 and is fixedly connected with a shaft sleeve 7, an output shaft of the driving motor 6 penetrates through the through hole 3 and is fixedly connected with the shaft sleeve 7, a positioning ring 8 is fixedly installed at the lower end position of the outer side of the shaft sleeve 7, a positioning buckle 9 is movably installed at the upper end of the positioning ring 8;

furthermore, the whole bottom plate 1 is of a rectangular plate structure, two limiting support plates 2 with the same specification are symmetrically fixed on two sides of the upper end surface of the bottom plate 1, two through holes 3 with the same specification are symmetrically formed in the upper ends of the outer parts of the two limiting support plates 2 respectively, and the inner diameter of each through hole 3 is matched with the outer diameter of the positioning rotating shaft 5, so that the reasonable stability of the whole structure is guaranteed;

furthermore, the motor support 4 integrally adopts a triangular support structure with a horizontal transverse plate at the upper end outside the limiting support plate 2, the outer diameter of the shaft sleeve 7 is identical with the inner diameter of the positioning rotating shaft 5, meanwhile, the positioning ring 8 and the positioning buckle 9 are both semi-circular structures with the same diameter and size, and a buckle 19 with the external specification identical with the internal specification of the butt joint 14 is fixed at the bottom position of the side of the positioning buckle 9, so that the integral support stability of the motor support 4 is enhanced, and the working stability of the driving motor 6 is effectively improved;

furthermore, the output shaft of the driving motor 6 is movably connected with the positioning rotating shaft 5 at the same side through a transmission belt 18, so that the structural linkage of the whole is improved;

furthermore, two connecting rods 12 with the same specification are symmetrically arranged on the main shaft body 11 between the two limiting support plates 2, and are movably connected with the positioning ring 8 through the connecting rods 12, and the wire groove 13 is formed in the outer inclined ring of the main shaft body 11 in a surrounding manner, so that the use effect and the working performance of the whole body are effectively improved;

furthermore, a clamping plate 15 is fixedly arranged on the side inside the interface 14, a pressing buckle 16 is movably arranged on the outer position of the side of the upper end of the positioning ring 8, and the pressing buckle 16 penetrates through the interface 14 and is fixedly connected with a push block 17, so that the overall comprehensive use performance is improved, and the overall application range is effectively enlarged.

The working principle is as follows: the main shaft dismounting structure of the diamond wire slicing machine for silicon wafer production is characterized in that a main shaft body 11 is stably and correspondingly matched with specifications between positioning rings 8 which are correspondingly arranged on two sides inside limiting support plates 2 by connecting rods 12 which are symmetrically fixed on two sides of the main shaft body and is stably arranged at a proper position between the two limiting support plates 2, the main shaft body 11 is stably fixed in the positioning rings 8 by the positioning rings 8 through the specification matching between buckles 19 and butting ports 14, the two main shaft bodies 11 stably wind diamond cutting wires which are necessary for working on the main shaft bodies through wire grooves 13 which are correspondingly formed in the main shaft bodies to have basic working conditions for normal use, and when the main shaft dismounting structure is used, a driving motor 6 is started, so that an output shaft of the driving motor drives a positioning rotating shaft 5 and the main shaft body 11 which is connected with the outer part of the positioning rotating shaft 5 through, when the main shaft body 11 needs to be disassembled, the pressing buckle 16 can be pressed down, the push block 17 extrudes the buckle 19 to be separated from the clamping plate 15 in the butt joint port 14, the positioning buckle 9 is opened by utilizing the activity of the hinge shaft 10, the main shaft body 11 is taken out, and the whole application range is effectively expanded.

It should be finally noted that the above only serves to illustrate the technical solution of the present invention, and not to limit the scope of the present invention, and that simple modifications or equivalent replacements performed by those skilled in the art to the technical solution of the present invention do not depart from the spirit and scope of the technical solution of the present invention.

Claims (6)

1. The utility model provides a silicon chip production is with diamond wire slicer main shaft dismouting structure, includes the bottom plate, its characterized in that: the utility model discloses a motor, including bottom plate, locating support plate, through-hole, locating support plate, drive motor, locating rotation axis output shaft, locating support plate upper end, the avris position fixed mounting of bottom plate upper end has spacing support plate, the through-hole has been seted up to the avris position of the outside upper end of spacing support plate, the avris position fixed mounting in the spacing support plate outside has the motor support, the inside movable mounting of through-hole has the location axis of rotation, the upper end fixed mounting of motor support has driving motor, location axis of rotation output shaft passes fixed connection between through-hole and the axle sleeve, driving motor's output shaft passes fixed connection between through-hole and the axle sleeve, the lower extreme fixed mounting in the axle sleeve outside has.

2. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: the whole body of the base plate is of a rectangular plate body structure, two limiting support plates with the same specification are symmetrically fixed on two sides of the upper end face of the base plate, two through holes with the same specification are symmetrically formed in the upper ends of the outer portions of the two limiting support plates respectively, and the inner diameter of each through hole is matched with the outer diameter of the positioning rotating shaft.

3. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: the motor support is integrally in a triangular supporting structure with a horizontal transverse plate at the upper end outside the limiting support plate, the outer diameter of the shaft sleeve is identical to the inner diameter of the positioning rotating shaft, the positioning ring and the positioning buckle are of semicircular structures with the same diameter, and a buckle with the external specification identical to the internal specification of the butt joint is fixed at the bottom of the side of the positioning buckle.

4. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: and the output shaft of the driving motor is movably connected with the positioning rotating shaft at the same side through a transmission belt.

5. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: the main shaft body is symmetrically provided with two connecting rods with the same specification between the two limiting support plates, the two sides of the main shaft body are symmetrically provided with two connecting rods with the same specification, the two connecting rods are movably connected with the positioning ring through the connecting rods, and the outer inclined ring of the main shaft body is provided with a wire slot in a surrounding manner.

6. The spindle dismounting structure of a diamond wire slicer for silicon wafer production according to claim 1, wherein: the inside avris fixed mounting of interface has the cardboard, and the outside position movable mounting of holding ring upper end avris has the press button, presses the press button simultaneously and passes fixed connection between inside and the ejector pad of interface.

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