CN211279242U - Motor mounting platform for processing silicon wafer - Google Patents
Motor mounting platform for processing silicon wafer Download PDFInfo
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- CN211279242U CN211279242U CN201921505838.0U CN201921505838U CN211279242U CN 211279242 U CN211279242 U CN 211279242U CN 201921505838 U CN201921505838 U CN 201921505838U CN 211279242 U CN211279242 U CN 211279242U
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Abstract
The utility model provides a motor mounting platform for silicon wafer processing, including supporting mechanism, roller and adjustment mechanism, the supporting mechanism includes raceway platform and the support column that is connected with the raceway platform, and the raceway platform sets up along the horizontal direction, still reserves a plurality of mounting rails on the raceway platform, and the mounting rails are still parallel to each other, and the roller sets up in the mounting rail, and the roller is cylindrical, and the raceway platform still connects a plurality of support columns; one end of each support column is connected with the bottom surface of the mounting platform, a mounting groove is reserved at the other end of each support column, and the plurality of support columns are connected to the adjusting mechanism through the mounting grooves respectively; the adjusting mechanism comprises a thread groove and an anchor bolt matched with the thread groove, the thread groove is fixed in the mounting groove, and the anchor bolt is further connected with the thread groove through a threaded end of the anchor bolt. The utility model provides the high security and the convenience of electrode installation in the silicon wafer course of working.
Description
Technical Field
The utility model belongs to the technical field of silicon wafer production, concretely relates to a motor mounting platform for processing of silicon wafer.
Background
The multi-wire cutting technology is a novel cutting processing method for processing silicon wafers, and the working principle of the method is that metal wires are wound on a roller to form a wire net, the metal wires are driven by a guide wheel system to reciprocate at a high speed to bring blade materials into a processing area to grind the silicon wafers, and a crystal bar is cut into hundreds of thin slices with relatively consistent thickness at one time.
A common multi-wire cutting machine, such as the NTC442DM, has a compact machine type structure and a narrow working space. In actual operation, because the operating area of NTC442DM is very narrow, the reel motor body is bulky and very heavy, and there is not hoist and mount space in the motor fixed area, can't dismantle fast and maintain when running into the trouble to still have the potential safety hazard in operation process.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a motor mounting platform for processing of silicon wafer has improved the security and the convenience of electrode mount in the silicon wafer course of working.
In order to realize the purpose, the utility model discloses a technical scheme be:
the utility model provides a motor mounting platform for silicon wafer processing which characterized in that: the roller type rolling device comprises a supporting mechanism, a roller and an adjusting mechanism, wherein the supporting mechanism comprises a raceway platform and supporting columns connected with the raceway platform, the raceway platform is arranged along the horizontal direction, a plurality of mounting rails are reserved on the raceway platform and are parallel to each other, the roller is arranged in the mounting rails, the roller is cylindrical, and the raceway platform is further connected with the supporting columns; one end of each support column is connected with the bottom surface of the mounting platform, a mounting groove is reserved at the other end of each support column, and the plurality of support columns are connected to the adjusting mechanism through the mounting grooves respectively; adjusting mechanism include the thread groove and with thread groove assorted rag bolt, the thread groove is fixed in the inside of mounting groove, rag bolt still through rag bolt's threaded end connect in the thread groove.
Further, the raceway platform is a rectangular plate.
Further, the mounting rail is a semi-cylindrical groove.
Further, the number of the supporting columns is more than 4.
Further, the support column still includes first support column and second support column, first support column passes through adjustment mechanism and sets up in the outside ground of equipment, the second support column passes through adjustment mechanism and sets up at the inside end of equipment, first support column with the second support column all sets up to 2, and the line between the first support column and the line between the second support column all parallels with the mounting rail.
Furthermore, the foundation bolt is a flat-head bolt.
The utility model has the advantages that: the utility model discloses a motor mounting platform for processing of silicon wafer, according to the inside motor fixed platform of equipment, with the difference in height at the outer scene horizon of equipment, the raceway platform of the supporting leg that varies of adjustable height of design, the second support column is the low supporting leg, puts in the inside bottom surface of equipment, and first support column is the high supporting leg, puts in the outside ground of equipment. In addition, the whole mounting platform plane is horizontal to the motor fixing platform in the equipment by adjusting the adjusting mechanism below the supporting column, so that convenience and safety of the motor in the mounting and dismounting processes are realized.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a view showing the combination of the present invention and a diamond wire slicer;
fig. 3 is a matching view of the support column and the adjusting mechanism.
Wherein, each reference number in the figure is: 1. raceway platform, 2, mounting rail, 3, roller, 4, support column, 401, first support column, 402, second support column, 5, mounting groove, 6, thread groove, 7, rag bolt, 8, motor, 9, motor fixed platform, 10, the inside bottom surface of slicer, 11, ground.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the present invention.
Fig. 2 is the utility model discloses with the cooperation picture of diamond wire slicer, the utility model discloses a raceway platform 1 that is used for motor 8 mounting platform of silicon wafer processing according to the inside motor fixed platform 9 of equipment, with the difference in height at the outer on-the-spot horizon of equipment, designs the unequal high supporting leg of an adjustable height, and second support column 402 is the low supporting leg, puts in the inside bottom surface of equipment, and first support column 401 is the high supporting leg, puts in the outside ground 11 of equipment. In addition, the whole mounting platform plane is made to be horizontal to the internal motor fixing platform 9 of the equipment by adjusting the adjusting mechanism below the supporting column 4, the internal motor fixing platform 9 is tightly leaned, then the motor 8 is placed on the raceway platform 1, and the motor 8 is horizontally pushed to the internal motor fixing platform 9 of the equipment. And finally, positioning and mounting the motor 8.
Fig. 1 is a schematic structural diagram of the present invention, which includes a supporting mechanism, rollers 3 and an adjusting mechanism, the supporting mechanism includes a raceway platform 1 and supporting columns 4 connected to the raceway platform 1, the raceway platform 1 is a rectangular plate, the raceway platform 1 is disposed along a horizontal direction, a plurality of mounting rails 2 are further reserved on the raceway platform 1, the mounting rails 2 are semi-cylindrical grooves, the mounting rails 2 are further parallel to each other, the rollers 3 are disposed in the mounting rails 2, the rollers 3 can roll in the mounting rails 2, the rollers 3 are cylindrical, the raceway platform 1 is further connected to the plurality of supporting columns 4, the number of the supporting columns 4 can be set to be more than 4, and here, the number of the supporting columns is set to be 4; one end of each supporting column 4 is connected with the bottom surface of the mounting platform, a mounting groove 5 is reserved at the other end of each supporting column 4, the supporting columns 4 are connected with an adjusting mechanism through the mounting grooves 5 respectively, the supporting columns 4 are further subdivided into first supporting columns 401 and second supporting columns 402, the first supporting columns 401 are arranged on the ground 11 outside the equipment through the adjusting mechanism, the second supporting columns 402 are arranged at the bottom inside the equipment through the adjusting mechanism, the number of the first supporting columns 401 and the number of the second supporting columns 402 are 2, and connecting lines between the first supporting columns 401 and connecting lines between the second supporting columns 402 are parallel to the mounting track 2; the adjusting mechanism comprises a thread groove 6 and an anchor bolt 7 matched with the thread groove 6, the thread groove 6 is fixed in the mounting groove 5, the anchor bolt 7 is further connected to the thread groove 6 through a thread end of the anchor bolt 7, and the anchor bolt 7 is a flat-head bolt.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention, and the present invention is not intended to be limited to the embodiments shown herein.
Claims (6)
1. The utility model provides a motor mounting platform for silicon wafer processing which characterized in that: the roller type rolling device comprises a supporting mechanism, a roller and an adjusting mechanism, wherein the supporting mechanism comprises a raceway platform and supporting columns connected with the raceway platform, the raceway platform is arranged along the horizontal direction, a plurality of mounting rails are reserved on the raceway platform and are parallel to each other, the roller is arranged in the mounting rails, the roller is cylindrical, and the raceway platform is further connected with the supporting columns; one end of each support column is connected with the bottom surface of the mounting platform, a mounting groove is reserved at the other end of each support column, and the plurality of support columns are connected to the adjusting mechanism through the mounting grooves respectively; adjusting mechanism include the thread groove and with thread groove assorted rag bolt, the thread groove is fixed in the inside of mounting groove, rag bolt still through rag bolt's threaded end connect in the thread groove.
2. The motor mounting platform for silicon wafer processing as claimed in claim 1, wherein: the raceway platform is a rectangular plate.
3. The motor mounting platform for silicon wafer processing as claimed in claim 1, wherein: the mounting rail is a semi-cylindrical groove.
4. The motor mounting platform for silicon wafer processing as claimed in claim 1, wherein: the support columns are arranged to be more than 4.
5. The motor mounting platform for silicon wafer processing as claimed in claim 4, wherein: the support column still includes first support column and second support column, first support column passes through adjustment mechanism and sets up in the outside ground of equipment, the second support column passes through adjustment mechanism and sets up at the inside end of equipment, first support column with the second support column all sets up to 2, and the line between the first support column and the line between the second support column all parallels with the mounting rail.
6. The motor mounting platform for silicon wafer processing as claimed in claim 1, wherein: the foundation bolt is a flat-head bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921505838.0U CN211279242U (en) | 2019-09-11 | 2019-09-11 | Motor mounting platform for processing silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921505838.0U CN211279242U (en) | 2019-09-11 | 2019-09-11 | Motor mounting platform for processing silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211279242U true CN211279242U (en) | 2020-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921505838.0U Active CN211279242U (en) | 2019-09-11 | 2019-09-11 | Motor mounting platform for processing silicon wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN211279242U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114953219A (en) * | 2022-05-24 | 2022-08-30 | 常州英诺激光科技有限公司 | Method for manufacturing square single crystal optical fiber, and composite crystal |
-
2019
- 2019-09-11 CN CN201921505838.0U patent/CN211279242U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114953219A (en) * | 2022-05-24 | 2022-08-30 | 常州英诺激光科技有限公司 | Method for manufacturing square single crystal optical fiber, and composite crystal |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 471000 No. 99 Binhe North Road, Luoyang hi tech Industrial Development Zone, Henan Patentee after: Mesk Electronic Materials Co., Ltd Address before: 471000 No. 99 Binhe North Road, Luoyang hi tech Industrial Development Zone, Henan Patentee before: MCL ELECTRONIC MATERIALS Ltd. |