CN211278001U - Disassembly and assembly tool for grinding disc of silicon wafer grinding machine - Google Patents
Disassembly and assembly tool for grinding disc of silicon wafer grinding machine Download PDFInfo
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- CN211278001U CN211278001U CN201921881877.0U CN201921881877U CN211278001U CN 211278001 U CN211278001 U CN 211278001U CN 201921881877 U CN201921881877 U CN 201921881877U CN 211278001 U CN211278001 U CN 211278001U
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Abstract
The utility model provides a dismantlement installation frock of silicon chip grinding machine mill, relates to semiconductor material technical field, including evenly distributed in 4 cuboid hoisting plate and 4 fixed plates with the fixed L type of hoisting plate cooperation all around on mill surface, 2 locking screw holes have been seted up on the surface of every cuboid hoisting plate, and hookup screw hole has been seted up to the side of cuboid hoisting plate, set up on the fixed plate one with hookup screw hole cooperation fixed hookup hole. The utility model discloses beneficial effect: the utility model has the advantages of simple structure and reasonable design, processing technology is simple, with low costs, convenient operation, safe and reliable, utilize the structure and the function of abrasive disc machine itself and the utility model discloses combine the dismantlement installation function that realizes the mill to overcome the problem of dismouting difficulty, sparingly change the mill time widely, reduced manufacturing cost, improved the equipment productivity.
Description
Technical Field
The utility model belongs to the technical field of semiconductor material, concretely relates to silicon chip grinds dismantlement installation frock of machine mill.
Background
And the silicon wafer enters a silicon wafer grinding processing procedure after the outline chamfering, and the silicon wafer grinding machine grinds the silicon wafer under the pressure rotation of the upper grinding disc and the lower grinding disc. After long-time use, the upper millstone and the lower millstone are worn and need to be replaced after being thinned. The manual replacement is difficult, the operation time is long, the weight and the size of the upper grinding disc and the lower grinding disc are large, and potential safety hazards exist during operation. At present, semiconductor material processing manufacturers in China all use silicon wafer grinding machines and all use multiple devices.
The grinding device has the following disadvantages that the upper grinding disc and the lower grinding disc are arranged in the using process:
1. the wearing article has short service life and is frequently replaced;
2. the upper and lower millstones are large and heavy, and the disassembly and the assembly are unsafe.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a dismantlement installation frock of silicon chip grinding machine mill is provided, it is frequent to solve mill about the current grinding device, the troublesome unsafe scheduling problem of dismouting.
The utility model discloses a solve the technical scheme that above-mentioned technical problem adopted and be: the utility model provides a dismantlement installation frock of silicon chip grinding machine mill, includes evenly distributed in the hoist and mount board of 4 cuboid all around on mill surface and 4 fixed plates with the fixed L type of hoist and mount board cooperation, 2 locking screw holes have been seted up on the surface of every cuboid hoist and mount board, and hookup screw hole has been seted up to the side of cuboid hoist and mount board, set up on the fixed plate one with hookup screw hole cooperation fixed hookup hole, during fixed, the horizontal segment card of L type fixed plate is in the mill bottom surface, hookup bolt passes hookup hole on the fixed plate and hookup screw hole on the hoist and mount board in proper order and screws up the realization fixed.
Hoisting plate and fixed plate are stainless steel.
The connecting hole is a long strip with adjustable fixed position.
The utility model has the advantages that: the utility model has the advantages of simple structure and reasonable design, processing technology is simple, with low costs, convenient operation, safe and reliable, utilize the structure and the function of abrasive disc machine itself and the utility model discloses combine the dismantlement installation function that realizes the mill to overcome the problem of dismouting difficulty, sparingly change the mill time widely, reduced manufacturing cost, improved the equipment productivity.
Drawings
Fig. 1 is the structure schematic diagram of the basket of the present invention.
The labels in the figure are: 1. the device comprises a hoisting plate, 2 locking screws, 3 locking screw holes, 4 connecting screw holes, 5 fixing plates, 6 connecting holes, 7 connecting bolts.
Detailed Description
The following detailed description and the accompanying drawings are included to provide a further understanding of the invention.
As shown in the figure, a dismantlement installation frock of silicon chip grinding machine mill, including evenly distributed in mill surface 4 cuboid hoisting plate 1 and 4 with 1 fixed L type of cooperation of hoisting plate 5, 2 locking screw holes 3 have been seted up on every cuboid hoisting plate 1's surface, and hookup screw hole 4 has been seted up to cuboid hoisting plate 1's side, set up one on the fixed plate 5 and hookup hole 6 fixed with 4 cooperations of hookup screw hole, when fixed, L type fixed plate 5's horizontal segment card is in the mill bottom surface, and hookup bolt 7 passes hookup hole 6 on the fixed plate 5 and hookup screw hole 4 on the hoisting plate 1 in proper order and screws up the realization fixed.
Further, the hoisting plate 1 and the fixing plate 5 are both made of stainless steel.
Furthermore, the connecting hole 6 is a long strip shape capable of adjusting the fixing position of the fixing plate 5, and is suitable for mounting and dismounting the grinding disc with different thicknesses or under different conditions.
The utility model discloses installation and working method:
when the grinding disc is disassembled or assembled, the upper fixed disc of the grinding disc machine is lifted to be away from the grinding disc, 4 cuboid hoisting plates 1 are uniformly distributed on the circumferential surface of the grinding disc, then the upper fixed disc of the grinding disc machine falls down, locking screws 2 sequentially penetrate through the upper fixed disc and locking screw holes 3 in the hoisting plates 1 so as to lock and fix the hoisting plates 1 and the upper fixed disc of the grinding disc machine, 4L-shaped fixing plates 5 are respectively fixed on the side surfaces of the hoisting plates 1, when the fixing is performed, the connecting holes 6 correspond to the connecting screw holes 4, the horizontal section of each L-shaped fixing plate 5 is clamped below the lower surface of the grinding disc, then the connecting bolts 7 sequentially penetrate through the connecting holes 6 and the connecting screw holes 4 and tighten the connecting bolts 7 so as to realize the fixing, at the moment, the position of the grinding disc can be moved by the grinding disc machine, and the grinding disc can be placed at a proper position. The connecting holes 6 are long-strip-shaped, and the fixing position of the L-shaped fixing plate 5 can be adjusted according to the thickness or position of the grinding disc, so that the L-shaped fixing plate 5 can be always clamped on the lower bottom surface of the grinding disc, and the safety of moving the grinding disc is improved.
Claims (3)
1. The utility model provides a dismantlement installation frock of silicon chip grinding machine mill, its characterized in that: hoisting plate (1) and 4 of 4 cuboid and hoisting plate (1) cooperation fixed L type including evenly distributed all around on the mill surface fixed plate (5), 2 locking screw hole (3) have been seted up on the surface of every cuboid hoisting plate (1), and hookup screw hole (4) have been seted up to the side of cuboid hoisting plate (1), set up on fixed plate (5) one with hookup screw hole (4) cooperation fixed hookup hole (6), during fixed, the horizontal segment card of L type fixed plate (5) is in the mill bottom surface, hookup bolt (7) pass hookup hole (6) on fixed plate (5) and hookup screw hole (4) on hoisting plate (1) in proper order and screw up and realize fixedly.
2. The tool for disassembling and assembling the grinding disc of the silicon wafer grinding machine according to claim 1, characterized in that: the hoisting plate (1) and the fixing plate (5) are both made of stainless steel.
3. The tool for disassembling and assembling the grinding disc of the silicon wafer grinding machine according to claim 1, characterized in that: the connecting hole (6) is long strip with adjustable fixed position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921881877.0U CN211278001U (en) | 2019-11-04 | 2019-11-04 | Disassembly and assembly tool for grinding disc of silicon wafer grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921881877.0U CN211278001U (en) | 2019-11-04 | 2019-11-04 | Disassembly and assembly tool for grinding disc of silicon wafer grinding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211278001U true CN211278001U (en) | 2020-08-18 |
Family
ID=72011379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921881877.0U Active CN211278001U (en) | 2019-11-04 | 2019-11-04 | Disassembly and assembly tool for grinding disc of silicon wafer grinding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211278001U (en) |
-
2019
- 2019-11-04 CN CN201921881877.0U patent/CN211278001U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 471000 No. 99 Binhe North Road, Luoyang hi tech Industrial Development Zone, Henan Patentee after: Mesk Electronic Materials Co., Ltd Address before: 471000 No. 99 Binhe North Road, Luoyang hi tech Industrial Development Zone, Henan Patentee before: MCL ELECTRONIC MATERIALS Ltd. |