CN211261238U - Semiconductor electric heating boiler with composite structure heating body - Google Patents
Semiconductor electric heating boiler with composite structure heating body Download PDFInfo
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- CN211261238U CN211261238U CN201922147014.7U CN201922147014U CN211261238U CN 211261238 U CN211261238 U CN 211261238U CN 201922147014 U CN201922147014 U CN 201922147014U CN 211261238 U CN211261238 U CN 211261238U
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- boiler
- heat insulating
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 112
- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 239000002131 composite material Substances 0.000 title claims abstract description 24
- 238000005485 electric heating Methods 0.000 title claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 53
- 230000001681 protective effect Effects 0.000 claims abstract description 37
- 239000011810 insulating material Substances 0.000 claims abstract description 24
- 239000012774 insulation material Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 9
- 229920003023 plastic Polymers 0.000 claims description 9
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 229920000742 Cotton Polymers 0.000 claims description 5
- 229920001651 Cyanoacrylate Polymers 0.000 claims description 3
- 239000004830 Super Glue Substances 0.000 claims description 3
- 239000011152 fibreglass Substances 0.000 claims description 2
- 239000006261 foam material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 2
- 238000012423 maintenance Methods 0.000 abstract description 2
- 238000005265 energy consumption Methods 0.000 description 3
- 238000005338 heat storage Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000001172 regenerating effect Effects 0.000 description 2
- 241001085205 Prenanthella exigua Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
Abstract
The utility model discloses a semiconductor electric heating boiler with a composite structure heating body, which comprises a heating system, a control system and a water supply system, wherein the heating system is respectively connected with the water supply system and the control system; the heating system is formed by combining a plurality of semiconductor heating elements, the surfaces of the semiconductor heating elements are sequentially coated with heat insulating materials and protective shells, so that the semiconductor heating elements and the heat insulating materials and the protective shells form a gapless composite structure body which is coated into a whole. Therefore, this is novel through protecting sheathing, can carry out the guard action to thermal insulation material, plays the secondary and blocks the effect that the heat scatters and disappears. In addition, the semiconductor heating element, the heat insulating material and the protective shell form a complete composite structure body, and the installation, the overhaul and the disassembly are greatly facilitated. The problems that the traditional heating element is directly fixed on a heat insulation material by the throat hoop, so that the heat insulation effect is poor, and the installation and the maintenance are easy to damage are solved.
Description
Technical Field
The utility model relates to a heating boiler, a semiconductor electric heating boiler with composite construction heating member specifically says so.
Background
At present, in cold areas, there are various heating modes, such as central heating, gas heating, air-conditioning heating, and the like. However, the above heating system has a disadvantage that water is generally heated by a system of burning coal in a large boiler room, for example, central heating. The mode can bring a series of problems of environmental pollution, natural resource waste and the like in winter. Meanwhile, the residents cannot freely adjust the required heat, which causes the individuals to bear unnecessary economic burden. Under the environment, semiconductor electric heating boilers have been produced, and are favored by people due to the advantages of high efficiency, energy conservation, environmental protection and the like. Most heating systems of semiconductor heating furnaces in the market adopt a heating element structure and are simple, namely, only a layer of heat insulation material is wrapped outside an inner container of the heating element, and the heating element is tightened and fixed by a hose clamp. The heating element structure has certain disadvantages that the heat insulating material is greatly deformed due to the soft characteristic of the heat insulating material after being tightened and fixed by the hose clamp, so that the contact between the inner side of the heat insulating material and the surface of a heating body is not uniform, the heat insulating material of the closely contacted part of the heat insulating material is melted due to the high temperature on the surface of the heating element, the ideal heat insulating effect cannot be achieved, and the integral aesthetic degree of the heating element is seriously influenced. In addition, the heat insulating material has low strength and is easy to damage, and the function of completely protecting the heating inner container cannot be realized.
Disclosure of Invention
In view of the above problem, the utility model provides a semiconductor electric heating boiler with composite construction heating member. The novel boiler has the characteristics of higher heating efficiency, lower energy consumption and the like.
The technical solution of the utility model is that: a semiconductor electric heating boiler with a heating body of a composite structure comprises a heating system, a control system and a water supply system, wherein the heating system is respectively connected with the water supply system and the control system; the heating system is formed by combining a plurality of semiconductor heating elements, the surfaces of the semiconductor heating elements are sequentially coated with heat insulating materials and protective shells, so that the semiconductor heating elements and the heat insulating materials and the protective shells form a gapless composite structure body which is coated into a whole.
In the novel, protecting sheathing is the cylinder, or the cylinder both ends are equipped with the end cover, or two semicircle combinations.
Further, the protective casing of the cylindrical body has the same length as the heat insulating material, and both ends of the protective casing and the heat insulating material are in an unclosed state.
Furthermore, two ends of the protective shell of the cylinder are connected with the end covers in an adhesion mode, and the centers of the end covers are provided with through holes.
Furthermore, the protective shells of the two semicircular assemblies form a half pipe, and fastening hose clamps are arranged on the protective shells of the two semicircular assemblies at intervals.
Furthermore, a super glue bonding layer is arranged between the protective shells of the two semicircular assemblies and the heat insulation material.
In the novel, protective housing is made for PVC plastic material or glass steel material.
Further, the heat insulation material is rubber plastic cotton or a foaming material.
The semiconductor heating element referred to above employs a PTC heating element.
The utility model has the advantages that: by arranging the heat insulating material and the protective shell on the surface of the semiconductor heating element in sequence, not only can the heat insulating material be protected in multiple aspects, but also the secondary heat loss prevention effect can be achieved. In addition, the novel design enables the semiconductor heating element, the heat insulation material and the protective shell to form a complete composite structure body, and greatly facilitates installation, maintenance and disassembly.
Drawings
FIG. 1 is a system diagram of the present invention;
FIG. 2 is a schematic view of the heating element composite structure of FIG. 1;
fig. 3 and 4 show different embodiments of fig. 2.
Fig. 5 is another system embodiment of fig. 1.
Detailed Description
The present invention will be further described with reference to the following examples.
EXAMPLE one (direct supply boiler)
Referring to fig. 1 and 2, the semiconductor electric heating boiler with a heating body of a composite structure belongs to a straight-through boiler. The semiconductor electric heating boiler comprises a heating system 3, a control system 2, a water supply system 16 and a radiator 13, wherein the heating system 3 is respectively connected with the water supply system 16 and the control system 2. The heating boiler of the embodiment comprises a boiler shell 1, wherein a heating system 3 and a control system 2 are installed in the boiler shell 1, the heating system 3 is formed by connecting a plurality of semiconductor heating elements 4 in parallel with a water outlet pipeline 15 and a water return pipeline 14 in a water supply system 16, and each semiconductor heating element 4 is connected with the control system 2 through a heating element circuit 5. The control system 2 is connected with a thermocouple 6 through a thermocouple circuit 7, and the thermocouple 6 is arranged at the front end of a water outlet valve 8 on a water outlet pipeline 15 and used for monitoring the temperature of outlet water. And the control system 2 is connected with a water pump 11 arranged on a water return pipeline 14 through a water pump circuit lead 10. A water return valve 9 and a water replenishing tank 12 are respectively arranged on the water return pipelines 14 positioned at the front end and the rear end of the water pump 11. The water outlet pipe 15 and the water return pipe 14 are provided with radiators 13. The heating system is formed by combining a plurality of semiconductor heating elements 4. In the present embodiment, the surface of the semiconductor heating element 4 is sequentially coated with the heat insulating material 16 and the protective case 17, and the semiconductor heating element 4 and the heat insulating material 16, and the heat insulating material 16 and the protective case 17 are integrally coated without a gap therebetween. The protective casing 17 of the cylindrical body has the same length as the heat insulator 16, and both ends of the protective casing 17 are not closed by the heat insulator 16. The protective housing 17 of this embodiment is made of PVC plastic material (see fig. 2).
The operation principle of the boiler is as follows:
from the replenishing tank 12, the water enters the main pipe 14 and is then driven by the water pump 11 connected in the return pipe 14 through the return valve 9 into the heating system 3. The heating system is formed by combining a plurality of semiconductor heating elements 4 which are connected in parallel with a water outlet pipeline 15 and a water return pipeline 14, and when water entering the heating system 3 passes through the semiconductor heating elements 4 which are connected in parallel, the water can be heated instantly, so that the temperature of the water reaches the set temperature. The heated water is collected again in the return pipe 14 and flows out of the heating system 3 through the outlet valve 8 to the inside of the radiator 13. The temperature of the outlet water is monitored by a thermocouple 6 at the front end of a water outlet valve 8. During the whole operation process, the control system 2 in the boiler is respectively connected with the semiconductor heating element 4, the thermocouple 6 and the water pump 11 through circuit connecting wires. The parallel connection 5 with each semiconductor heating element is used for respectively managing the current passing through each semiconductor heating element 4, controlling the output power thereof and finally heating the water to the set temperature. The thermocouple 6 and the control system 2 are connected with a thermocouple circuit lead 7, then the water temperature can be monitored, the feedback effect is achieved in real time, and the control system 2 can readjust the output power of each semiconductor heating element through signal feedback of the thermocouple 6, so that the effective heating effect is achieved. The control system starts the water pump 11 or stops running through the water pump circuit conductor 10. The control system 2 employs a known technique, and therefore, detailed description thereof is omitted. The heating system 3, the control system 2 and part of the water pipeline are covered by the protective shell 1 to form the main body part of the semiconductor heating boiler.
Fig. 3 shows another embodiment of a protective housing different from that of fig. 2. The difference is that end covers 18 are arranged at two ends of a cylindrical protective shell 17, the two ends of the cylindrical protective shell 17 are connected with the end covers 18 in an adhesion mode, and a through hole is formed in the center of each end cover 18. The usage and functional features are the same as those of fig. 2.
Fig. 4 shows a further different embodiment from that of fig. 2. It is changed correspondingly on the basis of fig. 1. Namely, a half pipe is formed by two split combined protective shells 17 which are symmetrical in the axial direction (length direction), and fastening throat hoops 19 are arranged on the protective shells 17 of the two semicircular combined bodies at intervals. A super glue bonding layer 20 is arranged between the protective shells 17 and the heat insulation materials 16 of the two semicircular assemblies.
In the above, the protective casing 17 may be made of glass fiber reinforced plastic material, besides PVC plastic material.
In the above, the heat insulating material 16 is rubber plastic cotton or a foam material.
Embodiment two (regenerative boiler)
The regenerative boiler system shown in fig. 5 includes the same heating system, control system, water supply system and radiator as those of fig. 1. Except that a heat storage water tank 21 is installed on the water outlet line 15 and the water return line 14, and a water pump 11 is installed on the water outlet line 14. A radiator 13 is attached to the water outlet line 15 and the water return line 14. The two ends of the heat storage water tank 21 are respectively connected with the boiler and the radiator to form two closed loops, the boiler is firstly used for heating water in the heat storage water tank, when the water reaches a set target temperature, the loop at the other end is opened, and then the hot water enters the radiating system to finally achieve the purpose of temperature rise. The functional function is the same as in fig. 1.
In order to fully illustrate the effects of the present invention, after the semiconductor heating elements of the composite structure are combined into a heating system, various aspects of the boiler are improved, which include:
1. the heating efficiency of the boiler is improved, and the energy consumption is reduced. Comparing the heating element with composite structure based on the formula of stable heat conduction of multi-layer cylindrical wall2(1-1) calculation shows that if the composite structure heating element is used, the heat secondary loss can be reduced by 1% compared with the original simple structure, so that the heating efficiency is improved, the heating time is shortened, and the energy consumption is reduced.
Wherein Q is the heat lost outwards by the heating liner, Q1To utilize the heat lost in heating the element with a simple structure, Q2To take advantage of the heat loss of the composite structure heating element; heating element length, set to 360mm in this calculation; t is t1Heating the inner container to reach the surface temperature of 300 ℃ after the inner container reaches a stable state; temperature t of outer layer of integral structure of heating elementi+1Ambient temperature 20 ℃; λ is the thermal conductivity of the respective coating material, λ being1The thermal conductivity of the rubber-plastic cotton is 0.022W/mK, lambda2The thermal conductivity of the PVC half pipe is 0.19W/mK.3r is the surface radius of each material, r1Heating the surface of the inner container to approximate radius of 25mm, r2The surface radius of the rubber-plastic cotton is 45mm, r3The surface radius of the PVC half pipe is 47 mm. The percentage of heat loss reduction can therefore be expressed as
2. The integral aesthetic property of the heating system in the boiler is improved. The flexible heat insulating material wrapped outside the traditional simple structure heating element is usually dark color, is not matched with the color (white or metal color) of the pipeline of the water supply system and gives unclean feeling to people. The external part of the composite structure heating element corresponding to the heating element is a bright white PVC half pipe, and the color of the external part of the heating element can be consistent with that of the internal part of the boiler. In addition, due to the regular shape of the half pipe, the phenomenon that the heat insulation material of the heating element with a simple structure is seriously deformed due to the contraction of the throat hoop can be avoided, and the overall appreciation of the boiler is improved.
3. The inner container of each heating element and the heat insulation material in the heating system are protected. The half pipe is prepared from high molecular polymers, and is widely applied to the industrial production fields of product packaging, protection and the like. Because the heating element has higher strength, the heat insulation material can be effectively prevented from being scratched by a sharp object in the process of assembling the heating element, and a series of problems that the surface of the heating inner container is damaged and the heat insulation effect is reduced due to the damage of the heat insulation material are solved. In addition, because the interior of the half pipe is a regular cylindrical curved surface, the heat insulation material in the heating element can be uniformly extruded, so that all parts of the heat insulation material in contact with the heating inner container are uniformly heated, and the heat damage of partial areas caused by nonuniform heating of the heat insulation material is avoided.
Claims (8)
1. A semiconductor electric heating boiler with a heating body of a composite structure comprises a heating system, a control system and a water supply system, wherein the heating system is respectively connected with the water supply system and the control system; the heating system is characterized in that the heating system is formed by combining a plurality of semiconductor heating elements, the surfaces of the semiconductor heating elements are sequentially coated with heat insulation materials and protective shells, so that the semiconductor heating elements and the heat insulation materials, and the heat insulation materials and the protective shells form a gapless composite structure body which is coated into a whole.
2. A boiler as claimed in claim 1, wherein said protective casing is a cylinder, or two ends of the cylinder are equipped with end caps, or two semicircular assemblies.
3. The electric heating boiler for semiconductor having heating body of composite structure as set forth in claim 2, wherein said cylindrical protective casing and heat insulating material have the same length, and both ends of the protective casing and heat insulating material are in non-closed state.
4. A boiler as claimed in claim 2, wherein said protective casing of the cylindrical body is adhesively connected at both ends to the end caps provided with a through hole at the center.
5. The electric heating boiler of semiconductor with heating body of composite structure as claimed in claim 2, wherein the protective casing of said two semicircular assemblies forms a half pipe, and fastening throat hoops are provided at intervals on the protective casing of the two semicircular assemblies.
6. The electric heating boiler of semiconductor with heating body of composite structure as claimed in claim 2, wherein a super glue adhesion layer is provided between the protective casing and the heat insulating material of the two semicircular assemblies.
7. A semiconductor electric heating boiler with a composite structure heating body as claimed in claim 1, wherein the protective casing is made of PVC plastic material or glass fiber reinforced plastic material.
8. The semiconductor electric heating boiler having the composite structure heating body as claimed in claim 1, wherein the heat insulating material is rubber plastic cotton or a foam material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922147014.7U CN211261238U (en) | 2019-12-04 | 2019-12-04 | Semiconductor electric heating boiler with composite structure heating body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922147014.7U CN211261238U (en) | 2019-12-04 | 2019-12-04 | Semiconductor electric heating boiler with composite structure heating body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211261238U true CN211261238U (en) | 2020-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922147014.7U Expired - Fee Related CN211261238U (en) | 2019-12-04 | 2019-12-04 | Semiconductor electric heating boiler with composite structure heating body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211261238U (en) |
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2019
- 2019-12-04 CN CN201922147014.7U patent/CN211261238U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
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Granted publication date: 20200814 |