CN211237856U

CN211237856U - Varistor module

Info

Publication number: CN211237856U
Application number: CN202020140266.7U
Authority: CN
Inventors: 许荣辉
Original assignee: Powertech Industrial Co Ltd
Current assignee: Powertech Industrial Co Ltd
Priority date: 2020-01-21
Filing date: 2020-01-21
Publication date: 2020-08-11
Anticipated expiration: 2030-01-21

Abstract

The utility model discloses a piezoresistor module. The piezoresistor module comprises a base, a shell, a piezoresistor main body, a metal elastic sheet and a welding material. The piezoresistor main body comprises two ceramic chips, a first limiting pin and a second limiting pin. The two ceramic chips form a chip main body, and the chip main body is provided with a first side edge and a second side edge which are adjacent to each other; the first limiting pin extends outwards from the first side edge to the base; the second limiting pin extends outwards from the second side edge to the base; the metal elastic sheet is arranged on the base and is not less than 1 mm away from the second limit pin, one end of the metal elastic sheet is in lap joint with the second limit pin through a welding material, and the melting point temperature of the welding material is 100-200 ℃. Therefore, the temperature can be prevented from being too high, and the safety is improved.

Description

Varistor module

Technical Field

The utility model relates to a piezo-resistor module especially relates to a piezo-resistor module with temperature protect function.

Background

The surge protection assembly can be used for protecting an electric appliance from being damaged due to instantaneous surge in life, but the existing surge protection assembly is often accompanied with the problem of fire when damaged, so other protection assemblies are needed to avoid the problem of fire of the surge protection assembly, the number of relative parts is more and more complex, the structure is more and the existing surge protection assembly is welded on a circuit board by a traditional electric wire, if the surge protection assembly is abnormal, high temperature can be generated, so the circuit board can be fired due to high temperature except the possibility of fire of the surge protection assembly, and the safety is poor.

The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed a novel and effective method for improving the above-mentioned drawbacks.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that, not enough to prior art provides a piezo-resistor module, when can avoiding the sudden wave protection subassembly to take place the abnormal conditions effectively, leads to taking place the conflagration shortcoming because of high temperature.

The embodiment of the utility model discloses piezo-resistor module, a serial communication port, piezo-resistor module includes: a base with a limit structure; the base and the shell are combined to form a closed space, and the limiting structure is positioned in the closed space; a varistor body, comprising: the two ceramic chips are positioned in the closed space, two side faces of each ceramic chip are respectively provided with an electrode layer, the two ceramic chips are mutually attached to form a chip main body, and the chip main body is provided with a first side edge and a second side edge which are adjacent to each other; the first limiting pin extends outwards from the first side edge of the chip main body to the base; the second limiting pin extends outwards from the second side edge of the chip main body to the limiting structure; the second limiting pin is provided with a bending section and an inserting section connected with the bending section, and a reference surface is formed between the bending section and the inserting section of the second limiting pin; the first metal elastic sheet is arranged on the base, one end of the first metal elastic sheet penetrates out of the closed space, and the other end of the first metal elastic sheet is connected with the bending section of the second limiting pin; the first metal elastic sheet is provided with a first extending section and a first lapping section connected with the first extending section, and the distance between the first extending section and the reference surface is not less than 1 mm; the first lap joint section is lapped by the first extension section towards the bending section of the second limiting pin and is fixed through the first welding material of the piezoresistor module; when the first metal elastic sheet is heated to a temperature higher than the melting point of the first welding material, the first lap joint section of the first metal elastic sheet is separated from the bending section of the second limiting pin; wherein the melting point temperature of the first solder material is 100 to 200 ℃.

Preferably, the varistor module further includes a second metal spring and a second welding material, the second metal spring is disposed on the base, one end of the second metal spring penetrates through the enclosed space, and the other end of the second metal spring is connected to a contact side surface of the chip main body; the second metal elastic sheet is provided with a second extending section and a second lapping section connected with the second extending section, the distance between the second extending section and the contact side surface of the chip main body is not less than 1 millimeter, the second lapping section is lapped from the second extending section to the contact side surface of the chip main body and is fixed through the second welding material, and the melting point temperature of the second welding material is 100-200 ℃; when the second metal elastic sheet is heated to a temperature exceeding the melting point of the second welding material, the second lap joint section of the second metal elastic sheet is separated from the contact side face of the chip main body.

Preferably, the first and second solder materials are tin-bismuth alloys.

Preferably, the first metal elastic piece and the second metal elastic piece are formed on the base in an embedding and ejecting mode.

Preferably, of the two ceramic chips, two of the electrode layers most distant from each other are defined as an outer electrode layer, and each of the other electrode layers is defined as an inner electrode layer; the second limit pins are extended outwards from the joint of the two ceramic chips and are electrically connected with the inner electrode layers of the two ceramic chips.

Preferably, the voltage-sensitive voltage module further includes a connection piece, the connection piece is U-shaped and has two contact sections, a cross section connecting the two contact sections, and an insulating layer disposed on the cross section, the two contact sections are connected to the two electrode layers disposed on two side surfaces of the chip main body, the cross section is disposed on the first side of the chip main body, and the insulating layer is disposed between the cross section and the first side.

Preferably, the connecting piece further has a penetrating section, the penetrating section extends from one of the contact sections, and the penetrating section penetrates out of the closed space.

Preferably, the chip main body is coated with an insulating material.

Preferably, at least one of the base and the housing is a ceramic material.

Preferably, the medium in the closed space is air.

To sum up, the varistor module disclosed in the embodiment of the present invention, through the design that the first metal elastic piece and the second limit pin (the reference surface) are spaced from each other by not less than 1 mm, and the first metal elastic piece is fixed to the second limit pin through the first welding material, when the first metal elastic piece generates 100 to 200 degrees celsius, the first welding material melts due to high temperature, so that the first metal elastic piece is no longer lapped with the second limit pin; therefore, fire accidents caused by high temperature can be avoided.

For a further understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are only intended to illustrate the present invention, and not to limit the scope of the present invention.

Drawings

Fig. 1 is an exploded schematic view of a varistor module according to a first embodiment of the present invention.

Fig. 2 is a partially exploded schematic view (a) of a varistor module according to a first embodiment of the present invention.

Fig. 3 is a partially exploded schematic view (ii) of a varistor module according to a first embodiment of the present invention.

Fig. 4 is a schematic side view of a varistor module according to a first embodiment of the present invention.

Fig. 5 is a schematic view of a state of the first metal dome of the first embodiment of the present invention when separated from the second limit pin.

Fig. 6 is a cross-sectional view of the cross-section line VI-VI of fig. 1.

Fig. 7 is an enlarged schematic view of region VII of fig. 6.

Fig. 8 is an exploded view of a varistor module according to a second embodiment of the present invention.

Fig. 9 is a partially exploded view of a varistor module according to a second embodiment of the present invention.

Fig. 10 is a schematic side plan view of a varistor module according to a second embodiment of the present invention.

Fig. 11 is an enlarged schematic view of the region XI of fig. 10.

Fig. 12 is a schematic diagram illustrating a state when the first metal dome is separated from the second limit pin and the second metal dome is separated from the electrode layer (contact side surface) according to the second embodiment of the present invention.

Detailed Description

The following is a description of the embodiments of the present invention disclosed in the "varistor module 100" with specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present invention. The utility model discloses the concrete embodiment of accessible other differences is implemented or is used, and each item detail in this specification also can be based on different viewpoints and application, does not deviate from the utility model discloses a carry out various modifications and changes under the design. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

[ first embodiment ]

Referring to fig. 1 to 7, which are first embodiments of the present invention, the present embodiment discloses a varistor module 100, which can prevent the surge protection assembly from generating high temperature due to abnormal occurrence, and further effectively improve safety. That is, any varistor module without preventing the high temperature from being continuously generated is difficult to compare with the varistor module 100 in the present embodiment. The following describes the structure of each component of the varistor module 100, and describes the connection relationship between the components of the varistor module 100.

As shown in fig. 1 to 3, the varistor module 100 includes a base 1, a casing 2 combined with the base 1, a varistor main body 3 disposed between the base 1 and the casing 2, a first metal spring 4 disposed on the base 1 and between the base 1 and the casing 2, a first welding material 7 for fixing the first metal spring 4, and a connecting piece 5 disposed on the base 1.

The base 1 has a limiting structure 11, and the limiting structure 11 may be cylindrical in this embodiment and is formed by integrally extending the base 1, but is not limited to the embodiment. For example, the position limiting structure 11 may be a rectangular cylinder and is a separate component disposed on the base 1.

The base 1 and the housing 2 may be made of a ceramic material or a material having a glass fiber component in this embodiment, but are not limited to the embodiment. The housing 2 is a hollow structure, and an opening 21 is formed at one end of the housing (i.e. the lower end of the housing 2 in fig. 1), the housing 2 is covered on the base 1, so that the housing 2 and the base 1 are combined to form a closed space SP, and the medium in the closed space SP is air, but is not limited to the air carried in this embodiment. For example, the medium in the closed space SP may be an insulating resin.

The pressure-sensitive resistor body 3 is located in the enclosed space SP, and the pressure-sensitive resistor body 3 includes two ceramic chips 31, a first limit pin 32 connected between the two ceramic chips 31, and a second limit pin 33 connected between the two ceramic chips 31.

It should be noted that the number of the ceramic chips 31 of the pressure-sensitive resistor main body 3 can be adjusted according to the needs of the designer, but is at least two. For example, in other embodiments not shown in the present invention, the number of the ceramic chips of the varistor module 100 may be four, five, or six. For convenience of describing the present embodiment, the number of the ceramic chips of the pressure-sensitive resistor main body 3 will be described below by taking three as an example, that is, the number of the ceramic chips shown in fig. 1 to 7 is three, but not limited to that carried by the present embodiment.

As shown in fig. 2 and fig. 3, the three ceramic chips 31 are located in the enclosed space SP, two side surfaces of each ceramic chip 31 are respectively provided with an electrode layer, and the three ceramic chips 31 are mutually attached to form a chip main body M. Specifically, each of the ceramic chips 31 is a rectangular sheet-like structure in the present embodiment; that is to say, the chip body M has a rectangular structure and has four sides, and the four sides respectively define a first side S1, a second side S2 adjacent to the first side S1, a third side S3 opposite to the first side S1, and a fourth side S4 opposite to the second side S2, but the invention is not limited to the embodiment. For example, in other embodiments not shown in the present invention, three ceramic chips 31 may also be circular sheet-shaped structures, and each ceramic chip 31 is divided into four same sectors, and the arc length of each sector is defined as an equal distance edge. That is, each of the sectors has an included angle of 90 degrees, and two adjacent equidistant edges are the first side S1 and the second side S2, and the other equidistant edges are the third side S3 and the fourth side S4.

In addition, the electrode layer of each ceramic chip 31 is distributed in the central area of the side surface of the corresponding ceramic chip 31 in this embodiment; among the three ceramic chips 31, two of the electrode layers most distant from each other are defined as an outer electrode layer 311a, and the other electrode layers are defined as an inner electrode layer 311 b. Further, the chip body M is further covered with an insulating material 312 (shown in fig. 6 and 7). Specifically, the insulating material 312 may be an insulating resin in this embodiment, and the insulating material 312 is coated on the outer edge of each chip body M (i.e. the portion of each ceramic chip 31 not having the electrode layer) and a portion of the electrode layer, but is not limited to the embodiment; for example, the insulating material 312 may only cover the outer edges of three ceramic chips 31; accordingly, the occurrence of sparking between the adjacent ceramic chips 31 is prevented.

As shown in fig. 2 and 3, the first limiting pin 32 extends outward from the first side S1 of the chip body M to the base 1. In detail, the first limiting pin 32 is made of a conductive material, in the embodiment, one end of the first limiting pin 32 is located between any two adjacent ceramic chips 31 and electrically coupled to the corresponding inner electrode layer 311b, and the other end of the first limiting pin passes through the first side S1 (i.e., below the chip body M in fig. 3) and penetrates out of the base 1 to be exposed out of the enclosed space SP, but not limited to the embodiment. For example, in other embodiments not shown in the present invention, the first limiting pin 32 may also be electrically coupled to the outer electrode layer 311a of any one of the ceramic chips 31, and extend from the first side S1 of the chip body M toward the base 1 to be exposed outside the enclosed space SP.

The second limiting pin 33 extends outwards from the second side edge S2 of the chip body M to the limiting structure 11. In detail, the second limiting pin 33 is made of a conductive material, in this embodiment, the second limiting pin 33 has a bending section 331 and an inserting section 332 connected to the bending section 331, the bending section 331 is located between any two adjacent ceramic chips 31 and located at the second side S2 of the chip main body M, the bending section 331 is electrically coupled to the inner electrode layers 311b of the two ceramic chips 31, and the inserting section 332 is disposed in the limiting structure 11. Further, the bending section 331 and the inserting section 332 of the second limiting pin 33 form a reference plane P1 (as shown in fig. 4 and 5).

The first metal elastic sheet 4 is disposed on the base 1, one end of the first metal elastic sheet 4 penetrates through the enclosed space SP, and the other end of the first metal elastic sheet is connected to the bending section 331 of the second limiting pin 33. Specifically, the first metal dome 4 is a metal sheet member with elastic restoring force in this embodiment, and is formed on the base 1 by insert molding, but is not limited to the embodiment. For example, the first metal dome 4 may also be directly disposed on the surface of the base 1. The first metal dome 4 has a first extending section 41 and a first overlapping section 42 connected to the first extending section 41, the first extending section 41 and the reference plane P1 are spaced apart from each other by a first distance D1 (shown in fig. 5), and the first distance D1 is 1 millimeter (mm); that is, the first metal dome 4 and the second limiting pin 33 are disposed at an interval; the first overlapping section 42 is overlapped by the first extending section 41 toward the bending section 331 of the second limiting pin 33 and fixed by a first welding material 7 (i.e., the state shown in fig. 4), and when the first welding material 7 reaches the melting point temperature, the first metal dome 4 is separated from the second limiting pin 33 (i.e., the state shown in fig. 5). In another aspect, the distance between the first metal dome 4 and the second limit pin 33 is a distance that can prevent flashover, that is, any varistor module without flashover prevention is difficult to compare with the varistor module 100 of this embodiment.

In detail, the melting point temperature of the first soldering material 7 is 100 to 200 degrees celsius, and in the embodiment, is a sn — bi alloy, but is not limited to the embodiment. For example, the first solder material 7 can be selected to have the same melting point (e.g., tin-zinc alloy) according to the design of the designer. Further, when the first metal elastic sheet 4 is heated to a temperature exceeding the melting point of the first welding material 7 (i.e. 100 to 200 degrees celsius), the first welding material 7 melts when reaching the melting point, so that the first overlapping section 42 of the first metal elastic sheet 4 and the bending section 331 of the second limit pin 33 are not fixed, and the first metal elastic sheet 4 is forced to be separated from the second limit pin 33 and not connected to the second limit pin 33 by the elastic restoring force of the first metal elastic sheet 4.

As shown in fig. 2 and fig. 6, the connecting sheet 5 is disposed on the base 1, the connecting sheet 5 is U-shaped and has two contact sections 51, a cross section 52 connecting the two contact sections 51, and an insulating layer 53 disposed on the cross section 52, the two contact sections 51 are connected to the two electrode layers disposed on the two side surfaces of the chip main body M, the cross section 52 is disposed on the first side S1 of the chip main body M, the insulating layer 53 is disposed between the cross section 52 and the first side S1, and the insulating layer 53 may be made of insulating resin in this embodiment, but is not limited to the embodiment. Further, the connecting piece 5 is further formed with a penetrating section 54, the penetrating section 54 is formed by extending one of the contact sections 51, and the penetrating section 54 passes through the base 1 and out of the enclosed space SP.

[ second embodiment ]

As shown in fig. 8 to 12, which are second embodiments of the present invention, the present embodiment is similar to the first embodiment, and the same points of the two embodiments are not repeated, but the difference of the present embodiment compared to the first embodiment mainly lies in:

as shown in fig. 8 to 10, the varistor module 100' further includes a second metal spring 6 and a second welding material 8 (as shown in fig. 10). The second metal dome 6 is disposed on the base 1, one end of the second metal dome 6 passes through the base 1 and penetrates out of the enclosed space SP, and the other end is connected to a contact side P2 (shown in fig. 12) of the chip body M, where the contact side P2 is one of the outer electrode layers 311 a.

Specifically, as shown in fig. 12, the second metal dome 6 is a metal sheet member with elastic restoring force in the present embodiment, and is formed on the base 1 by insert molding, but is not limited to the embodiment. For example, the second metal dome 6 may also be directly disposed on the surface of the base 1. The second metal dome 6 has a second extending portion 61 and a second overlapping portion 62 connecting the second extending portion 61, the second extending portion 61 and the contact side surface P2 of the chip body M are spaced apart from each other by a second distance D2, and the second distance D2 is 1 millimeter (mm); that is, the first metal dome 4 and the contact side surface P2 are disposed at an interval. The second overlapping section 62 is overlapped by the second extending section 61 toward the contact side P2 of the chip main body M and fixed by the second welding material 8, and the melting temperature of the second welding material 8 is 100 to 200 degrees celsius; when the second metal dome 6 is heated to a temperature exceeding the melting point of the second solder material 8, the second overlapping section 62 of the second metal dome 6 is separated from the contact side P2 (the outer electrode layer 311a) of the chip body M. In other words, the distance between the second metal dome 6 and the contact side surface P2 is a distance that can prevent spark-over, that is, any varistor module without spark-over prevention is difficult to compare with the varistor module 100' in this embodiment.

In detail, the melting point temperature of the second soldering material 8 is 100 to 200 degrees celsius, and in the embodiment, is a sn — bi alloy, but is not limited to the embodiment. For example, the second solder material 8 can be selected to have the same melting point (e.g., tin-zinc alloy) in response to designer design considerations. Further, when the second metal dome 6 is heated to a temperature exceeding the melting point of the second welding material 8 (i.e. 100 to 200 degrees celsius), the second welding material 8 melts due to reaching the melting point, so that the second overlapping section 62 of the second metal dome 6 and the contact side surface P2 (the outer electrode layer 311a) are no longer fixed, and the second metal dome 6 is subjected to the elastic restoring force of itself, so as to be separated from the contact side surface P2 and no longer connected.

[ technical effects of the embodiments of the present invention ]

To sum up, in the varistor module 100 according to the embodiment of the present invention, the first metal dome 4 and the second limit pin 33 (the reference plane P1) are spaced from each other by not less than 1 mm, and the first metal dome 4 is fixed to the second limit pin 33 by the first welding material 7, so that when the first metal dome 4 generates 100 to 200 ℃ (the voltage is about more than 300 volts), the first welding material 7 melts due to high temperature, and the first metal dome 4 is not overlapped with the second limit pin 33; therefore, fire accidents caused by high temperature can be avoided.

The above mentioned embodiments are only preferred and feasible embodiments of the present invention, and are not intended to limit the scope of the present invention, and all equivalent changes and modifications made according to the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A varistor module, comprising:

a base with a limit structure;

the base and the shell are combined to form a closed space, and the limiting structure is positioned in the closed space;

a varistor body, comprising:

the two ceramic chips are positioned in the closed space, two side faces of each ceramic chip are respectively provided with an electrode layer, the two ceramic chips are mutually attached to form a chip main body, and the chip main body is provided with a first side edge and a second side edge which are adjacent to each other;

the first limiting pin extends outwards from the first side edge of the chip main body to the base; and

the second limiting pin extends outwards from the second side edge of the chip main body to the limiting structure; the second limiting pin is provided with a bending section and an inserting section connected with the bending section, and a reference surface is formed between the bending section and the inserting section of the second limiting pin; and

the first metal elastic sheet is arranged on the base, one end of the first metal elastic sheet penetrates out of the closed space, and the other end of the first metal elastic sheet is connected with the bending section of the second limiting pin; the first metal elastic sheet is provided with a first extending section and a first lapping section connected with the first extending section, and the distance between the first extending section and the reference surface is not less than 1 mm; the first lap joint section is lapped by the first extension section towards the bending section of the second limiting pin and is fixed through the first welding material of the piezoresistor module;

when the first metal elastic sheet is heated to a temperature higher than the melting point of the first welding material, the first lap joint section of the first metal elastic sheet is separated from the bending section of the second limiting pin; wherein the melting point temperature of the first solder material is 100 to 200 degrees celsius.

2. The varistor module of claim 1, further comprising a second metal spring and a second solder material, wherein the second metal spring is disposed on the base, one end of the second metal spring protrudes through the enclosed space, and the other end of the second metal spring is connected to a contact side of the chip main body; the second metal elastic sheet is provided with a second extending section and a second lapping section connected with the second extending section, the distance between the second extending section and the contact side surface of the chip main body is not less than 1 millimeter, the second lapping section is lapped from the second extending section to the contact side surface of the chip main body and is fixed through the second welding material, and the melting point temperature of the second welding material is 100-200 ℃; when the second metal elastic sheet is heated to exceed the melting point temperature of the second welding material, the second lap joint section of the second metal elastic sheet is separated from the contact side face of the chip main body.

3. The varistor module of claim 2, wherein said first and second solder materials are tin-bismuth alloys.

4. The varistor module of claim 2, wherein said first metal dome and said second metal dome are formed on said base in an insert-and-eject manner.

5. The module according to claim 1, wherein of the two ceramic chips, two of the electrode layers most distant from each other are defined as an outer electrode layer, and each of the other electrode layers is defined as an inner electrode layer; the second limit pins are extended outwards from the joint of the two ceramic chips and are electrically connected with the inner electrode layers of the two ceramic chips.

6. The varistor module of claim 1, further comprising a connecting tab having a U-shape and having two contact sections, a cross section connecting said two contact sections, and an insulating layer disposed on said cross section, wherein said two contact sections connect said two electrode layers on opposite sides of said chip body, said cross section is disposed on said first side of said chip body, and said insulating layer is disposed between said cross section and said first side.

7. A varistor module according to claim 6, wherein said connecting tab further comprises a piercing section extending from one of said contact sections and said piercing section extends out of said enclosed space.

8. The module of claim 1 wherein the chip body is coated with an insulating material.

9. The varistor module of claim 1, wherein at least one of said base and said housing is a ceramic material.

10. The varistor module of claim 1, wherein the medium in said enclosed space is air.