CN211233978U - Diamond aftertreatment cooling device - Google Patents
Diamond aftertreatment cooling device Download PDFInfo
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- CN211233978U CN211233978U CN201921705432.7U CN201921705432U CN211233978U CN 211233978 U CN211233978 U CN 211233978U CN 201921705432 U CN201921705432 U CN 201921705432U CN 211233978 U CN211233978 U CN 211233978U
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Abstract
The utility model relates to the technical field of diamond processing equipment, in particular to a diamond post-processing cooling device, which comprises a machine table and a fan arranged on the machine table, wherein the upper part of the machine table is provided with a placing table which is used for placing diamonds and has heat conducting property; an S-shaped liquid guide channel is formed in the placing table; the lower wall of the placing table is provided with a liquid inlet hole communicated with one end of the liquid guide channel, and the lower wall of the placing table is also provided with a liquid outlet hole communicated with the other end of the liquid guide channel; and the machine table is also provided with a liquid supply system for circularly supplying cooling liquid to the liquid guide channel, wherein the liquid outlet end of the liquid supply system is communicated with the liquid inlet hole, and the liquid return end is communicated with the liquid outlet hole. The utility model discloses combine fan and cooling liquid cooling two kinds of modes to cool off the diamond, the cooling effect is obvious.
Description
Technical Field
The utility model relates to a diamond processing equipment technical field especially relates to a diamond aftertreatment cooling device.
Background
Because of its good physical properties, diamond is applied in industries such as diamond drill bits, diamond cutter discs and the like, and in order to meet the needs, the modern industry adopts a synthetic method to prepare diamond, and mainly uses static ultrahigh pressure and high temperature technology to generate diamond through the reaction of carbonaceous raw materials such as graphite and the like and certain metals (alloys).
The surface of the diamond is at a high temperature after the diamond is synthesized and taken out in a synthesis furnace, so the diamond cannot be directly collected and released, and the upper surface of the diamond is generally cooled by blowing air by using a fan so as to accelerate the cooling speed of the diamond; although this air cooling method can provide a cooling effect, the cooling efficiency still needs to be improved.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a diamond aftertreatment cooling device.
In order to solve the technical problem, the technical scheme of the utility model is that:
a diamond post-treatment cooling device comprises a machine table and a fan arranged on the machine table, wherein a placing table used for placing diamonds and having heat conduction performance is arranged at the upper part of the machine table; an S-shaped liquid guide channel is formed in the placing table; the lower wall of the placing table is provided with a liquid inlet hole communicated with one end of the liquid guide channel, and the lower wall of the placing table is also provided with a liquid outlet hole communicated with the other end of the liquid guide channel; and the machine table is also provided with a liquid supply system for circularly supplying cooling liquid to the liquid guide channel, wherein the liquid outlet end of the liquid supply system is communicated with the liquid inlet hole, and the liquid return end is communicated with the liquid outlet hole.
Through the setting, the fan can carry out the forced air cooling to the upper surface of diamond, simultaneously the feed liquor system can circulate reciprocal to inject into the coolant liquid in the liquid guide passageway, so the coolant liquid just can make the platform of placing be in the low temperature state, so the heat of diamond lower surface just can be better transmit place the bench to, in order to reach the refrigerated effect for diamond lower surface cooling, from this can know, the fan is to diamond granule upper surface cooling, microthermal place the platform can be for the lower surface cooling of diamond, thereby can improve the cooling effect greatly. And the liquid guide channel is set to be S-shaped, so that the contact area of the cooling liquid in the placing table and the placing table can be increased, the cooling effect of the cooling liquid on the placing table is further improved, and the cooling effect of the diamond is indirectly improved.
The utility model discloses further set up to: the liquid supply system comprises a liquid storage tank and a water pump, wherein the liquid storage tank is arranged in the machine table and used for storing cooling liquid, the water pump is fixedly arranged on the outer side wall of the liquid storage tank, and the liquid inlet end of the water pump extends into the inner bottom of the liquid storage tank; the liquid outlet end of the water pump is communicated with the liquid inlet hole through a connecting pipe; and the upper part of the liquid storage tank is provided with a liquid return pipe communicated with the liquid outlet hole.
Through the setting, the water pump can constantly extract the coolant liquid in the liquid reserve tank and pour into the drain passageway in, take away by the coolant liquid and place the absorptive heat of platform, finally get back to the liquid reserve tank again by returning the liquid pipe in, so circulation is reciprocal, and one comes cyclic utilization the waste that the coolant liquid can not cause the coolant liquid, and two comes, can improve the cooling effect in the coolant liquid circulation inflow drain passageway.
The utility model discloses further set up to: the bottom of the liquid storage box is fixedly connected with a plurality of semiconductor refrigeration pieces, wherein the refrigeration surfaces of the semiconductor refrigeration pieces are in contact with the bottom wall of the liquid storage box.
Through the setting, when the coolant liquid flows back into the liquid reserve tank from the drain passageway in, it can carry a part of heat, and work for a long time like this can make the coolant liquid temperature in the liquid reserve tank higher to be difficult to play fine cooling effect, the event sets up the coolant liquid of semiconductor refrigeration piece in to the liquid reserve tank and cools down, so that the coolant liquid can keep lower temperature throughout.
The utility model is further provided with a groove arranged on the bottom wall of the liquid storage tank; the semiconductor refrigerating piece is fixedly arranged in the groove, and the refrigerating surface of the semiconductor refrigerating piece is attached to the wall of the groove; the upper surface of the bottom wall of the machine table is fixedly connected with two sleepers; the liquid storage tank is fixedly arranged on the sleeper.
Through the arrangement, the groove is formed in the bottom wall of the liquid storage tank, so that the semiconductor refrigeration piece is installed, the thickness of the bottom wall of the liquid storage tank can be reduced, and the cooling effect of the semiconductor refrigeration piece on cooling liquid in the liquid storage tank is improved. Set up the sleeper and place liquid reserve tank aim at, form a space that supplies the semiconductor refrigeration piece radiating between the bottom that makes the liquid reserve tank and the board diapire.
The utility model discloses further set up to: the upper wall of the placing table is provided with a placing groove for placing diamonds.
Through the arrangement, the placing groove is arranged to prevent the diamond particles from falling off from the placing table.
The utility model discloses further set up to: and the bottom of the machine table is provided with rollers.
Through the arrangement, the roller is arranged, so that the whole device can be conveniently moved.
To sum up, compare prior art, the utility model has the advantages of:
the utility model discloses a fan cools down the diamond upper surface, can cool down the lower surface of diamond through the platform of placing of coolant liquid refrigerated to the cooling effect has been improved greatly. And the liquid guide channel is set to be S-shaped, so that the contact area of the cooling liquid in the placing table and the placing table can be increased, the cooling effect of the cooling liquid on the placing table is further improved, and the cooling effect of the diamond is indirectly improved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the placement table;
FIG. 3 is a rear view of the placement table;
FIG. 4 is a schematic view of a liquid supply system;
fig. 5 is a schematic view of the internal structure of the reservoir.
Reference numerals: 1. a machine platform; 11. mounting a plate; 12. a fan; 13. a roller; 2. a placing table; 21. a drainage channel; 22. a liquid inlet hole; 23. a liquid outlet hole; 24. a placement groove; 3. a liquid supply system; 31. a liquid storage tank; 311. a groove; 32. a water pump; 33. a connecting pipe; 34. a liquid return pipe; 35. a semiconductor refrigeration sheet; 4. and (7) sleeper.
Detailed Description
The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings, so that the technical solution of the present invention can be more easily understood and grasped.
Example (b): referring to fig. 1, the present embodiment provides a diamond post-treatment cooling device, which includes a machine table 1 with an opening on the front and the upper part, and a roller 13 is disposed on the lower part of the machine table 1 to facilitate moving the whole machine table 1.
A placing table 2 for placing diamonds is arranged at the upper part of the machine table 1, and a placing groove 24 for placing diamonds is arranged on the upper wall of the placing table 2 to prevent diamond particles from falling; the mount 2 should be made of a material having a good thermal conductivity, and for example, the mount 2 may be made of an aluminum material, which is not particularly limited.
The machine table 1 is provided with a fan 12, specifically, an installation plate 11 inclined to the placing table 2 side is fixedly connected to the upper end of the back side of the machine table 1, and a plurality of fans 12 blowing air toward the placing table 2 are installed on the installation plate 11, for example, 3 fans 12 may be adopted.
Referring to fig. 2, the placing table 2 of the present embodiment is provided with an S-shaped liquid guiding channel 21 inside; referring to fig. 3, a liquid inlet hole 22 communicated with one end of the liquid guiding channel 21 is formed in the lower wall of the placing table 2, and a liquid outlet hole 23 communicated with the other end of the liquid guiding channel 21 is further formed in the lower wall of the placing table 2. Thus, the cooling liquid flows into the liquid guide channel 21 from the liquid inlet hole 22 and then flows out from the liquid guide channel 21 from the liquid outlet hole 23.
The machine table 1 is further provided with a liquid supply system 3 for circularly supplying cooling liquid into the liquid guide channel 21, wherein the liquid outlet end of the liquid supply system 3 is communicated with the liquid inlet hole 22, and the liquid return end is communicated with the liquid outlet hole 23.
Specifically, as shown in fig. 5, the liquid supply system 3 includes a liquid storage tank 31 installed in the machine platform 1 for storing the cooling liquid, and a water pump 32 fixedly installed on an outer side wall of the liquid storage tank 31, wherein a liquid inlet end of the water pump 32 extends into an inner bottom of the liquid storage tank 31; the liquid outlet end of the water pump 32 is communicated with the liquid inlet hole 22 through a connecting pipe 33; the upper part of the liquid storage tank 31 is provided with a liquid return pipe 34 communicated with the liquid outlet hole 23. So in water pump 32 passes through feed liquor hole 22 suction drain passage 21 with the coolant liquid in the liquid reserve tank 31 through connecting pipe 33, in the coolant liquid backward flow that is followed in the liquid reserve tank 31 in the drain passage 21 by liquid return pipe 34 again, so circulation is reciprocal, and the coolant liquid is at drain passage 21 internal circulation flow, alright constantly cool off place platform 2 and make place platform 2 be in the temperature that reduces to the cooling diamond.
As shown in fig. 4, the bottom of the liquid storage tank 31 is fixedly connected with a plurality of semiconductor refrigeration sheets 35, wherein the refrigeration surface of the semiconductor refrigeration sheets 35 is in contact with the bottom wall of the liquid storage tank 31; because in the time of in the coolant liquid advances the liquid reserve tank 31 from leading liquid passageway 21 internal reflux, it can carry partly heat, work for so long time can make the coolant liquid temperature in the liquid reserve tank 31 higher to be difficult to play fine cooling effect, the event sets up the coolant liquid of semiconductor refrigeration piece 35 in to the liquid reserve tank 31 and cools down, so that the coolant liquid can keep lower temperature all the time.
Specifically, when the liquid storage tank 31 is installed, a groove 311 is formed in the bottom wall of the liquid storage tank; the semiconductor refrigeration piece 35 is fixedly arranged in the groove 311, and the refrigeration surface of the semiconductor refrigeration piece 35 is attached to the groove wall of the groove 311; the upper surface of the bottom wall of the machine table 1 is fixedly connected with two sleepers 4; the reservoir 31 is fixedly mounted on the sleeper 4. Because the semiconductor refrigeration piece 35 can produce more heat when in operation, so in order to facilitate the heat dissipation thereof, the sleeper 4 is arranged to install the liquid storage box 31, so that a space for the heat dissipation of the semiconductor refrigeration piece 35 can exist at the bottom of the liquid storage box 31.
The during operation, the diamond particle tiling of waiting cold district is in the standing groove 24 of placing platform 2, open fan 12, open semiconductor refrigeration piece 35 and water pump 32 simultaneously, so water pump 32 is with the coolant liquid in the liquid reserve tank 31 through the suction of feed liquor hole 22 in connecting pipe 33 in leading liquid passageway 21, the coolant liquid backward flow that is in leading liquid passageway 21 again by returning liquid pipe 34 advances the liquid reserve tank 31 in, so circulation is reciprocal, the coolant liquid is at leading liquid passageway 21 internal recycle flow, alright place platform 2 messenger and place platform 2 in the temperature that reduces with continuous cooling, with the cooling diamond.
Above only the typical example of the utility model discloses, in addition, the utility model discloses can also have other multiple concrete implementation manners, all adopt the technical scheme that equivalent replacement or equivalent transform formed, all fall in the utility model discloses the scope of claiming.
Claims (6)
1. The utility model provides a diamond aftertreatment cooling device, includes board (1) and locates fan (12) on board (1), its characterized in that: a placing table (2) which is used for placing the diamond and has heat conduction performance is arranged at the upper part of the machine table (1); an S-shaped liquid guide channel (21) is formed in the placing table (2); a liquid inlet hole (22) communicated with one end of the liquid guide channel (21) is formed in the lower wall of the placing table (2), and a liquid outlet hole (23) communicated with the other end of the liquid guide channel (21) is formed in the lower wall of the placing table (2); the machine table (1) is also provided with a liquid supply system (3) for circularly supplying cooling liquid to the liquid guide channel (21), wherein the liquid outlet end of the liquid supply system (3) is communicated with the liquid inlet hole (22), and the liquid return end is communicated with the liquid outlet hole (23).
2. A diamond post-treatment cooling device according to claim 1, wherein: the liquid supply system (3) comprises a liquid storage tank (31) which is arranged in the machine table (1) and used for storing cooling liquid, and a water pump (32) which is fixedly arranged on the outer side wall of the liquid storage tank (31), wherein the liquid inlet end of the water pump (32) extends into the inner bottom of the liquid storage tank (31); the liquid outlet end of the water pump (32) is communicated with the liquid inlet hole (22) through a connecting pipe (33); the upper part of the liquid storage tank (31) is provided with a liquid return pipe (34) communicated with the liquid outlet hole (23).
3. A diamond post-treatment cooling device according to claim 2, wherein: the bottom of the liquid storage box (31) is fixedly connected with a plurality of semiconductor refrigeration pieces (35), wherein the refrigeration surfaces of the semiconductor refrigeration pieces (35) are in contact with the bottom wall of the liquid storage box (31).
4. A diamond post-treatment cooling device according to claim 3, wherein: a groove (311) is formed in the bottom wall of the liquid storage tank (31); the semiconductor refrigeration piece (35) is fixedly arranged in the groove (311), and the refrigeration surface of the semiconductor refrigeration piece (35) is attached to the wall of the groove (311); the upper surface of the bottom wall of the machine table (1) is fixedly connected with two sleepers (4); the liquid storage tank (31) is fixedly arranged on the sleeper (4).
5. A diamond post-treatment cooling device according to claim 1, wherein: the upper wall of the placing table (2) is provided with a placing groove (24) for placing diamonds.
6. A diamond post-treatment cooling device according to claim 1, wherein: the bottom of the machine table (1) is provided with rollers (13).
Priority Applications (1)
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CN201921705432.7U CN211233978U (en) | 2019-10-12 | 2019-10-12 | Diamond aftertreatment cooling device |
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CN201921705432.7U CN211233978U (en) | 2019-10-12 | 2019-10-12 | Diamond aftertreatment cooling device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114670281A (en) * | 2022-03-24 | 2022-06-28 | 重庆三峡学院 | Workpiece cooling device for FRP (fiber reinforced plastic) processing |
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2019
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114670281A (en) * | 2022-03-24 | 2022-06-28 | 重庆三峡学院 | Workpiece cooling device for FRP (fiber reinforced plastic) processing |
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