CN211226998U - PE film capable of being thermally adhered with paper at high temperature - Google Patents
PE film capable of being thermally adhered with paper at high temperature Download PDFInfo
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- CN211226998U CN211226998U CN201922025628.8U CN201922025628U CN211226998U CN 211226998 U CN211226998 U CN 211226998U CN 201922025628 U CN201922025628 U CN 201922025628U CN 211226998 U CN211226998 U CN 211226998U
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Abstract
The utility model discloses a PE film of high temperature and paper heat bonding, including the film body, the film body is equipped with dampproof course, heat-resistant layer, first glue solution layer, permeable formation, second glue solution layer and electrostatic absorption layer from the top down in proper order, the heat-resistant layer thickness is 3um-6um, evenly distributed's through hole has all been seted up on permeable formation and the electrostatic absorption layer, first glue solution layer thickness is 0.5um-0.8 um. The utility model discloses in, the PE film, including the film body, the film body is equipped with dampproof course, heat-resistant layer, first glue solution layer, permeable formation, second glue solution layer and static adsorbed layer from the top down in proper order, through static adsorbed layer and paper prepositioning, then the bulk heating back, and the intraformational glue solution of first glue solution layer and second glue solution melts and passes through hole and paper contact, realizes the connection with the paper.
Description
Technical Field
The utility model relates to a PE film technical field especially relates to a PE film that high temperature and paper heat bond.
Background
PE film, polyethylene film, refers to a film produced from PE film. The PE film has moisture resistance and low moisture permeability, and is often used for bonding to an object requiring moisture resistance.
The pe film is connected with the paper in a paper connecting mode, namely a thermoplastic type and an adhesive type, wherein the thermoplastic type is formed by winding a pe film on the outer part of the paper and then heating to realize hot plastic packaging; the bonding type is that the pe film and the paper are directly bonded by using bonding liquid; the thermoplastic type connecting mode is inconvenient to operate and easy to cause large local thermal deformation; the glue solution is bonded, so that the positioning is difficult or inaccurate.
Therefore, the utility model provides a PE film that high temperature and paper heat bond.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: in order to solve the problems of inconvenient operation and large deformation after connection in the prior art of connecting the PE film and the paper, the PE film which is thermally adhered with the paper at high temperature is provided.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a PE film of high temperature and paper heat bonding, includes the film body, the film body is equipped with dampproof course, heat-resistant layer, first glue solution layer, permeable formation, second glue solution layer and electrostatic absorption layer from the top down in proper order, the heat-resistant layer thickness is 3um-6um, evenly distributed's through hole has all been seted up on permeable formation and the electrostatic absorption layer, first glue solution layer thickness is 0.5um-0.8 um.
As a further description of the above technical solution:
the density of the heat-resistant layer is 0.94-0.965 g/cm 3.
As a further description of the above technical solution:
the thicknesses of the heat-resistant layer, the first glue layer, the permeable layer, the second glue layer and the electrostatic adsorption layer are gradually decreased.
As a further description of the above technical solution:
the through holes on the permeating layer and the electrostatic adsorption layer are distributed in a staggered mode.
As a further description of the above technical solution:
the first glue solution layer and the second glue solution layer are made of hot-melt EVA resin glue.
As a further description of the above technical solution:
and the first glue solution layer and the second glue solution layer are also added with tackifiers.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses in, the PE film, including the film body, the film body is equipped with dampproof course, heat-resistant layer, first glue solution layer, permeable formation, second glue solution layer and static adsorbed layer from the top down in proper order, through static adsorbed layer and paper prepositioning, then the bulk heating back, and the intraformational glue solution of first glue solution layer and second glue solution melts and passes through hole and paper contact, realizes the connection with the paper.
2. The utility model discloses in, the heat-resisting layer thickness is 3um-6um, when the japanese paper heat glues, can avoid pe membrane thermal deformation, and first glue solution layer thickness is 0.5um-0.8um, and the glue solution capacity that provides through the through hole after the melting can cover whole paper, and the heating bonding back thermal deformation is little, and the glue solution is filled evenly.
Drawings
Fig. 1 shows according to the utility model discloses pe membrane cross-sectional view's that provides structural schematic.
Illustration of the drawings:
1. a moisture barrier; 2. a heat-resistant layer; 3. a first glue layer; 4. a permeable layer; 5. a second glue layer; 6. an electrostatic adsorption layer; 7. a through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a PE film capable of being thermally adhered with paper at high temperature comprises a film body, wherein a moisture-proof layer 1, a heat-resistant layer 2, a first glue solution layer 3, a permeable layer 4, a second glue solution layer 5 and an electrostatic adsorption layer 6 are sequentially arranged on the film body from top to bottom, the first glue solution layer 3 and the second glue solution layer 5 are hot-melt EVA resin glue, the EVA resin glue has thermosetting property, is solidified at normal temperature and is melted after being heated, the thickness of the heat-resistant layer 2 is 3-6 um, and when the PE film is thermally adhered with paper, can avoid the thermal deformation of the pe film, the penetration layer 4 and the electrostatic adsorption layer 6 are both provided with through holes 7 which are uniformly distributed, the first glue solution layer 3 and the second glue solution layer 5 are bonded with paper through the through holes 7 after hot melting, before hot melting, through electrostatic absorption layer 6 and paper adsorption location, make things convenient for bonding after the hot melt, first glue solution layer 3 thickness is 0.5um-0.8um, and the glue solution capacity that provides through hole 7 after the melting can cover whole paper.
Specifically, as shown in fig. 1, the density of the heat-resistant layer 2 is 0.94 to 0.965 g/cm3, which improves the heat-resistant strength and prevents thermal deformation.
Specifically, as shown in fig. 1, the thicknesses of the thermal layer 2, the first glue solution layer 3, the permeable layer 4, the second glue solution layer 5 and the electrostatic adsorption layer 6 are sequentially decreased, and the thickness of the pe film can be reduced integrally by the distribution mode.
Specifically, as shown in fig. 1, the through holes 7 on the permeation layer 4 and the electrostatic adsorption layer 6 are distributed in a staggered manner, so that the first glue solution layer 3 is prevented from being extruded under pressure, and the function of protecting the first glue solution layer 3 is achieved.
Specifically, as shown in fig. 1, the first glue solution layer 3 and the second glue solution layer 5 are further added with a tackifier, so that the strength of the pe film and the paper bonding can be improved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a PE film of high temperature and paper heat bonding, includes the film body, its characterized in that, the film body is equipped with dampproof course (1), heat-resistant layer (2), first glue liquid layer (3), permeable formation (4), second glue liquid layer (5) and electrostatic adsorption layer (6) from the top down in proper order, heat-resistant layer (2) thickness is 3um-6um, evenly distributed's through hole (7) have all been seted up on permeable formation (4) and electrostatic adsorption layer (6), first glue liquid layer (3) thickness is 0.5um-0.8 um.
2. A PE film which is thermally bondable to paper at a high temperature according to claim 1, wherein the density of the heat-resistant layer (2) is 0.94-0.965 g/cm 3.
3. The PE film capable of being thermally bonded with paper at a high temperature according to claim 2, wherein the heat-resistant layer (2), the first glue solution layer (3), the permeable layer (4), the second glue solution layer (5) and the electrostatic adsorption layer (6) have successively decreasing thicknesses.
4. A PE film hot-bonded to paper at high temperature according to claim 1, characterized in that the through holes (7) on the permeable layer (4) and the electrostatic adsorbing layer (6) are distributed in a staggered manner.
5. A PE film with high temperature and thermal bonding with paper according to claim 1, characterized in that the first glue solution layer (3) and the second glue solution layer (5) are hot melt EVA resin glue.
6. A PE film with high temperature and thermal bonding with paper according to claim 5, characterized in that the first glue layer (3) and the second glue layer (5) are added with tackifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922025628.8U CN211226998U (en) | 2019-11-21 | 2019-11-21 | PE film capable of being thermally adhered with paper at high temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922025628.8U CN211226998U (en) | 2019-11-21 | 2019-11-21 | PE film capable of being thermally adhered with paper at high temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211226998U true CN211226998U (en) | 2020-08-11 |
Family
ID=71932714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922025628.8U Active CN211226998U (en) | 2019-11-21 | 2019-11-21 | PE film capable of being thermally adhered with paper at high temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211226998U (en) |
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2019
- 2019-11-21 CN CN201922025628.8U patent/CN211226998U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A PE film with high temperature and paper thermal adhesion Effective date of registration: 20230614 Granted publication date: 20200811 Pledgee: Zhejiang Lanxi Rural Commercial Bank Co.,Ltd. Pledgor: Zhejiang Hengle packaging materials Co.,Ltd. Registration number: Y2023980043860 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |