CN211221827U

CN211221827U - Injection mold for integrated circuit packaging structure

Info

Publication number: CN211221827U
Application number: CN201922109130.XU
Authority: CN
Inventors: 曹飞飞; 熊敏
Original assignee: Shenzhen Tengxin Precision Electronic Core Material Technology Co ltd
Current assignee: Shenzhen Tengxin Precision Electronic Core Material Technology Co ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-08-11
Anticipated expiration: 2029-11-29

Abstract

The utility model relates to the technical field of injection molds, in particular to an injection mold for an integrated circuit packaging structure, which comprises a mold frame, wherein the surface of the mold frame is provided with a material blocking block, the surface of the material blocking block is provided with a heat dissipation groove forming plate, a through hole is arranged on the bottom plate of the mold frame, a rubber sealing sheet is arranged on the inner wall of the through hole, the bottom of the rubber sealing sheet is provided with a piece for placing the slide, and the side wall of the piece for placing the slide is fixed on the inner wall of the through hole; the beneficial effects are that: the utility model provides a set up the through-hole on injection mold's for integrated circuit packaging structure bottom plate, the through-hole is inside to add and to establish the rubber mounting, and the rubber mounting is carried the slide glass and is pegged graft the push rod in carrying the interior ring of slide and support jointly, avoids the material of moulding plastics to extrude the rubber mounting undercut, and after injection moulding, upwards crowded lifting plate moves the push rod and upwards promotes the rubber mounting and protruding, and the product release after the shaping is pour groove one end distance, is convenient for take out the shaping product from the mould.

Description

Injection mold for integrated circuit packaging structure

Technical Field

The utility model relates to an injection mold correlation technique field specifically is an injection mold for integrated circuit packaging structure.

Background

One of the functions of the integrated circuit package is to protect the chip from damage due to contact with an external object, and a heat dissipation hole is formed in the surface of the conventional package structure to dissipate heat of the chip;

in the prior art, a box body for packaging an integrated circuit is inconvenient to take out after injection molding in a mold; the heat dissipation groove on the surface of the integrated circuit package needs to be processed through complex procedures such as hole opening and inner hole polishing, so that the production efficiency of the integrated circuit package box body is not convenient to improve; therefore, the utility model provides an injection mold for integrated circuit packaging structure is used for solving above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an injection mold for integrated circuit packaging structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an injection mold for integrated circuit packaging structure, includes the mould frame, the surface of mould frame is provided with and keeps off the material piece, the surface that keeps off the material piece is provided with the radiating groove profiled sheeting, has seted up the through-hole on the bottom plate of mould frame, be provided with the rubber mounting on the inner wall of through-hole, the bottom of rubber mounting is provided with takes the slide glass, the lateral wall of taking the slide glass is fixed on the inner wall of through-hole, and the bottom surface of rubber mounting is provided with the push rod, the push rod bottom is connected with the lifter plate, the lifter plate is in the inside of guide way, and the guide way is seted up on the bottom surface of mould frame, and the outside cover of push rod is equipped with compression spring, compression spring fixes between lifter plate and guide way, and the opening part of guide way.

Preferably, the through holes are of a circular cylinder structure, the through holes are provided with two groups, the two groups of through holes are distributed in a central symmetry mode about the bottom plate of the die frame, the top surface of the rubber sealing piece is provided with a high-temperature-resistant coating, the bottom surface of the rubber sealing piece is provided with a wear-resistant coating, and the carrying piece is of a circular plate-shaped structure.

Preferably, the lifting plate is of a square ring plate structure, the guide groove is of an annular cylinder structure, balls are embedded into the inner ring surface of the lifting plate and the outer ring surface of the lifting plate, and the balls are in contact with the inner wall of the guide groove.

Preferably, the limiting ring plates are of square annular structures, the two limiting ring plates are arranged, the direction of the bottom plates of the two limiting ring plates is opposite, and the two limiting ring plates are fixed on the bottom surface of the die frame through screws to limit the lifting plate together.

Preferably, the support is "protruding" font cylinder structure, and the fixed orifices has been seted up on the surface of support, constitutes the pouring basin between the inner wall of mould frame and the lateral wall of mould frame, and the radiating groove profiled sheeting is square platelike structure, and the radiating groove profiled sheeting is provided with a plurality ofly, and a plurality of radiating groove profiled sheeting are arranged along the long limit of top surface of keeping off the material piece and are distributed.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model provides an integrated circuit packaging structure is with seting up the through-hole on injection mold's the bottom plate, the through-hole is inside to add and to establish the rubber mounting, the rubber mounting is supported by carrying the slide and the push rod of pegging graft in carrying the interior ring of piece jointly, avoid the injection molding material to extrude the subsides downwards the rubber mounting, after injection moulding, push up and push away the lifter plate and move the push rod and promote the rubber mounting to protruding upwards, push out the product after the shaping and pour groove one end distance, be convenient for take out the shaping product from the mould;

2. the utility model provides an injection mold for integrated circuit packaging structure adds at the fender material piece top surface and establishes the radiating groove profiled sheeting, and after the pouring basin is inside to be full of the forming material, the top surface and the liquid level coplane of radiating groove profiled sheeting, constitute the hole in radiating groove profiled sheeting department after so shaping, save to hole processing procedures such as shaping box body trompil, polishing.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is an enlarged schematic view of a structure in fig. 1.

In the figure: the device comprises a die frame 1, a material blocking block 2, a heat dissipation groove forming plate 3, a through hole 4, a rubber sealing sheet 5, a carrying sheet 6, a push rod 7, a lifting plate 8, a ball 81, a compression spring 9, a limiting ring plate 10, a support 11 and a guide groove 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 2, the present invention provides a technical solution: an injection mold for an integrated circuit packaging structure comprises a mold frame 1, wherein a material blocking block 2 is bonded on the surface of the mold frame 1, a heat dissipation groove forming plate 3 is bonded on the surface of the material blocking block 2, a pouring groove is formed between the inner wall of the mold frame 1 and the side wall of the mold frame 1, the heat dissipation groove forming plate 3 is of a square plate-shaped structure, a plurality of heat dissipation groove forming plates 3 are arranged, the heat dissipation groove forming plates 3 are distributed along the long edge of the top surface of the material blocking block 2, pouring fluid is filled into the pouring groove formed between the inner wall of the mold frame 1 and the side wall of the material blocking block 2, the liquid level of the pouring fluid is coplanar with the top surface of the heat dissipation groove forming plate 3, holes are conveniently formed in the heat dissipation groove forming plate 3 of a formed product, and the processes of punching and polishing are omitted for the formed product;

the bottom plate of the die frame 1 is provided with through holes 4, rubber seal pieces 5 are bonded on the inner walls of the through holes 4, the through holes 4 are in a circular cylinder structure, the through holes 4 are provided with two groups, the two groups of through holes 4 are symmetrically distributed about the center of the bottom plate of the die frame 1, the top surfaces of the rubber seal pieces 5 are provided with high-temperature resistant coatings, the bottom surfaces of the rubber seal pieces 5 are provided with wear-resistant coatings, the carrying pieces 6 are in a circular plate structure, the bottom of each rubber seal piece 5 is provided with a carrying piece 6, the side wall of each carrying piece 6 is bonded on the inner wall of each through hole 4, the bottom surfaces of the rubber seal pieces 5 are bonded with push rods 7, the carrying pieces 6 and the push rods 7 inserted into the carrying pieces 6 support the rubber seal pieces 5 together in the standing forming process, the rubber seal pieces 5 are prevented from being pressed downwards and sunken by pouring fluid, and the lifting plates 8 connected to the bottom ends of the rubber;

the bottom end of the push rod 7 is bonded with a lifting plate 8, the lifting plate 8 is positioned inside a guide groove 12, the guide groove 12 is arranged on the bottom surface of the die frame 1, the guide groove 12 is communicated with the through hole 4, the lifting plate 8 is of a square ring plate structure, the guide groove 12 is of an annular cylinder structure, balls are embedded and installed on the inner ring surface of the lifting plate 8 and the outer ring surface of the lifting plate 8, the balls are in contact with the inner wall of the guide groove 12, the outer side of the push rod 7 is sleeved with a compression spring 9, the compression spring 9 is fixed between the lifting plate 8 and the guide groove 12, a limit ring plate 10 is inserted into an opening of the guide groove 12, the limit ring plates 10 are of a square ring structure, two limit ring plates 10 are arranged, the direction of the bottom plates of the two limit ring plates 10 is opposite, the two limit ring plates 10 are fixed on the bottom surface of the die frame 1 through screws to limit the lifting, support 11 is "protruding" font cylinder structure, the fixed orifices has been seted up on the surface of support 11, treat the inside product shaping back of pouring basin, the finger pushes up lifter plate 8 and upwards slides along guide way 12, ball 81 reduces the wearing and tearing between the surface of lifter plate 8 and the guide way 12 inner wall, lifter plate 8 shifts up the back and drives push rod 7 and upwards crowds and push away rubber mounting 5, the product after will forming is released pouring basin one end distance, be convenient for take out the product after the shaping from the pouring basin, and simultaneously, compression spring 9 is by 8 extrusion shrink of lifter plate, loosen lifter plate 8 back, compression spring 9 promotes lifter plate 8 and kick-backs down, lifter plate 8 overlap joint is on the surface of spacing crown plate 10, avoid lifter plate 8 to break away from in guide way 12.

The working principle is as follows: in actual work, the filling expansion pipe is inserted into a fixed hole on the surface of the support 11, the support 11 is fixed on a supporting surface, the pouring fluid is filled into a pouring groove formed between the inner wall of the mold frame 1 and the side wall of the material blocking block 2, so that the liquid level of the pouring fluid is coplanar with the top surface of the heat dissipation groove forming plate 3, a hole is conveniently formed in the heat dissipation groove forming plate 3 of the formed product, the processes of punching and polishing the formed product are saved, the carrying sheet 6 and the push rod 7 inserted in the carrying sheet 6 support the rubber sealing sheet 5 together in the standing forming process, the rubber sealing sheet 5 is prevented from being depressed by the pouring fluid, the lifting plate 8 connected with the bottom end of the rubber sealing sheet 5 is lapped on the limiting ring plate 10 at the moment, therefore, the rubber sealing sheet 5 cannot move downwards, and after the product in the pouring groove is formed, the lifting plate 8 is pushed upwards along the guide groove 12 by fingers, ball 81 reduces the wearing and tearing between 8's of lifter plate's surface and the guide way 12 inner wall, lifter plate 8 shifts up the back and drives push rod 7 and push away rubber mounting 5 to the top, the product after will forming is released pouring basin one end distance, be convenient for take out the product after the shaping from the pouring basin, and simultaneously, compression spring 9 is by 8 extrusion shrink of lifter plate, loosen the lifter plate 8 back, compression spring 9 promotes 8 rebound of lifter plate downwards, 8 overlap joints of lifter plate are on the surface of spacing ring board 10, avoid lifter plate 8 to break away from in 12.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an integrated circuit is injection mold for packaging structure, includes mould frame (1), its characterized in that: the surface of the mold frame (1) is provided with a material blocking block (2), the surface of the material blocking block (2) is provided with a heat dissipation groove forming plate (3), a bottom plate of the mold frame (1) is provided with a through hole (4), the inner wall of the through hole (4) is provided with a rubber sealing sheet (5), the bottom of the rubber sealing sheet (5) is provided with a carrying sheet (6), the side wall of the carrying sheet (6) is fixed on the inner wall of the through hole (4), the bottom surface of the rubber sealing sheet (5) is provided with a push rod (7), the bottom end of the push rod (7) is connected with a lifting plate (8), the lifting plate (8) is positioned inside the guide groove (12), the guide groove (12) is arranged on the bottom surface of the mold frame (1), the outer side of the push rod (7) is sleeved with a compression spring (9), the compression spring (9) is fixed between the lifting plate (8), a limiting ring plate (10) is arranged at the opening of the guide groove (12), and a support (11) is arranged on the bottom surface of the die frame (1).

2. The injection mold of claim 1, wherein: through-hole (4) are circular cylinder structure, and through-hole (4) are provided with two sets ofly, and two sets of through-hole (4) are provided with high temperature resistant coating about the bottom plate central symmetry distribution of mould frame (1), the top surface of rubber mounting (5), and the bottom surface of rubber mounting (5) is provided with wear-resistant coating, carries on piece (6) and is the annular platelike structure of circle.

3. The injection mold of claim 1, wherein: the lifting plate (8) is of a square ring plate structure, the guide groove (12) is of an annular cylinder structure, balls are embedded into the inner ring surface of the lifting plate (8) and the outer ring surface of the lifting plate (8), and the balls are in contact with the inner wall of the guide groove (12).

4. The injection mold of claim 1, wherein: the limiting ring plates (10) are of square annular structures, the two limiting ring plates (10) are arranged, the direction of the bottom plates of the two limiting ring plates (10) is opposite, and the two limiting ring plates (10) are fixed on the bottom surface of the die frame (1) through screws to limit the lifting plate (8) together.

5. The injection mold of claim 1, wherein: support (11) are "protruding" font cylinder structure, and the fixed orifices has been seted up on the surface of support (11), constitutes the pouring basin between the inner wall of mould frame (1) and the lateral wall of mould frame (1), and radiating groove profiled sheeting (3) are square platelike structure, and radiating groove profiled sheeting (3) are provided with a plurality ofly, and a plurality of radiating groove profiled sheeting (3) are arranged along the long limit of top surface of striker block (2) and are distributed.