CN211207263U - Heat radiation structure of computer mainboard - Google Patents
Heat radiation structure of computer mainboard Download PDFInfo
- Publication number
- CN211207263U CN211207263U CN201921051956.9U CN201921051956U CN211207263U CN 211207263 U CN211207263 U CN 211207263U CN 201921051956 U CN201921051956 U CN 201921051956U CN 211207263 U CN211207263 U CN 211207263U
- Authority
- CN
- China
- Prior art keywords
- mainboard
- sliding guide
- lead screw
- gear
- transmission lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model is suitable for a computer mainboard heat dissipation technical field provides a heat radiation structure of computer mainboard, including mainboard, axial fan, sliding guide and transmission lead screw, be provided with the electron chip on the mainboard, the electron chip is located between transmission lead screw and the sliding guide, and transmission lead screw and sliding guide are connected with the plastic support, one side sliding connection of plastic support in sliding guide, the opposite side threaded connection of plastic support in the transmission lead screw, axial fan fixed connection in the plastic support, be provided with fan control interface on the mainboard, axial fan pass through power cord and control line connect in fan control interface, axial fan is provided with temperature sensor, the fixed driving motor who is connected with the transmission lead screw that is provided with of mainboard. The utility model provides a pair of heat radiation structure of computer mainboard, it can effectively dispel the heat to a plurality of electronic chip, and computer mainboard's whole radiating effect is good.
Description
Technical Field
The utility model belongs to the technical field of the computer mainboard heat dissipation, especially, relate to a heat radiation structure of computer mainboard.
Background
In the present computer mainboard, a fan is fixed on a heat dissipation seat and cannot move, and some areas cannot be effectively and quickly dissipated, so that local overheating is easily caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome above-mentioned prior art not enough, provide a heat radiation structure of computer mainboard, its whole radiating effect is good.
The utility model discloses a realize like this: a heat dissipation structure of a computer mainboard comprises a mainboard, an axial fan, a sliding guide rail and a transmission lead screw, wherein a plurality of electronic chips which are adjacently arranged at intervals are arranged on the mainboard, the transmission lead screw and the sliding guide rail are arranged at a parallel interval and are connected to the mainboard through a supporting seat, the electronic chips are positioned between the transmission lead screw and the sliding guide rail, the transmission lead screw and the sliding guide rail are connected with a plastic bracket, one side of the plastic bracket is connected to the sliding guide rail in a sliding way, the other side of the plastic bracket is connected to the transmission lead screw in a threaded way, the axial fan is fixedly connected to the plastic bracket, a fan control interface is arranged on the mainboard, the axial fan is connected to the fan control interface through a power cord and a control cord, one side of the axial fan, which faces towards, temperature sensor pass through the signal line connect in the mainboard, the length of power cord, control line and signal line equals and all is greater than sliding guide's length, the mainboard is fixed to be provided with driving motor, driving motor pass through gear train or driving belt with the transmission lead screw is connected.
Specifically, the power line, the control line and the signal line are sleeved in the same silica gel hose.
Specifically, driving motor's pivot is connected with first gear, the one end fixedly connected with second gear of transmission lead screw, first gear, second gear are the spur gear and intermeshing.
Specifically, the axial fan is provided with a sliding hole sleeved on the sliding guide rail.
Specifically, bearings are arranged between the transmission screw rod and the supporting seat and between the sliding guide rail and the supporting seat.
The utility model provides a heat radiation structure of computer mainboard, its axial fan that can slide around through setting up, only an axial fan alright effectively dispel the heat to a plurality of electronic chip in the region of rectangular shape, the whole radiating effect of computer mainboard is good.
Drawings
Fig. 1 is a schematic perspective view illustrating a heat dissipation structure of a computer motherboard according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
As shown in fig. 1, an embodiment of the present invention provides a heat dissipation structure for a computer motherboard, which includes a motherboard 1, an axial fan 2, a sliding guide 3 and a transmission screw rod 4, wherein the sliding guide 3 can be in a round bar shape or a square bar shape. Be provided with the electronic chip 5 that a plurality of adjacent intervals set up on mainboard 1, electronic chip 5 welds in mainboard 1. The electronic chip 5 may include a south bridge chip, a north bridge chip, a power control chip, an audio chip, a network card chip and a bluetooth chip spaced along a straight line (axial direction of the sliding guide rail 3 and the transmission screw 4). The transmission screw rod 4 and the sliding guide rail 3 are arranged at a parallel interval and connected with the mainboard 1 through the supporting seat 6, and the bottom of the supporting seat 6 can be fixed on the mainboard 1 through screws. The drive screw 4 and the slide guide 3 are at a distance from the surface of the main plate 1. And the electronic chip 5 is located between the transmission screw rod 4 and the sliding guide rail 3, the transmission screw rod 4 and the sliding guide rail 3 are connected with a plastic support 7, one side of the plastic support 7 is slidably connected with the sliding guide rail 3, the other side of the plastic support 7 is in threaded connection with the transmission screw rod 4, the axial flow fan 2 is fixedly connected with the plastic support 7 through a screw or a buckle, and the plastic support 7 can be in a cross shape or a hollow shape and the like. The axial flow fan 2 is located above the electronic chip 5. The main board is provided with a fan control interface 8, the axial flow fan 2 is connected to the fan control interface 8 through a power line and a control line, one surface of the axial flow fan 2 facing the electronic chip 5 is provided with a temperature sensor (not shown in the figure), the temperature sensor is connected to the main board through a signal line, and the lengths of the power line, the control line and the signal line are equal and are all greater than the length of the sliding guide rail 3. The main board 1 is fixedly provided with a driving motor 9, and an output shaft of the driving motor 9 is connected with the transmission screw rod 4 through a gear set or a transmission belt. The driving motor 9 can drive the transmission screw rod 4 to rotate, so that the plastic support 7 and the axial flow fan 2 can slide along the sliding guide rail 3, the plastic support 7 and the axial flow fan 2 can slide back and forth along the sliding guide rail 3 through the positive rotation and the reverse rotation of the driving motor 9, and different chips are cooled, the temperature sensor can be an infrared temperature sensor, the driving motor 9 can be controlled to be opened and closed according to the temperature of the corresponding chip, namely when the temperature detected by the temperature sensor is greater than a set value (for example, greater than 50 ℃), the driving motor 9 is controlled to stop until the temperature detected by the temperature sensor is less than the set value, the driving motor 9 is controlled to rotate, and the axial flow fan 2 is moved to the position of another electronic chip 5. The driving motor 9 may be a servo motor, which may have a position detection module, etc. When the plastic support 7 and the axial flow fan 2 slide to the end of the sliding guide rail 3, the plastic support 7 and the axial flow fan 2 are blocked by the supporting seat 6 and cannot slide, the torque of the servo motor is increased, the servo motor can automatically reverse, and the plastic support 7 and the axial flow fan 2 can reciprocate along the sliding guide rail 3.
Specifically, the power line, the control line and the signal line are sleeved in the same silica gel hose 10, so that the reliability is high.
Specifically, the axial fan 2 is provided with a sliding hole sleeved on the sliding guide rail 3.
Specifically, bearings can be arranged between the transmission screw rod 4 and the support seat 6 and between the sliding guide rail 3 and the support seat 6, so that the rotation resistance is small.
Specifically, the rotating shaft of the driving motor 9 is connected with a first gear 11, one end of the transmission screw rod 4 is fixedly connected with a second gear 12, and the first gear 11 and the second gear 12 are straight gears and are meshed with each other. The first gear 11 may be smaller in diameter than the second gear 12 to achieve speed reduction.
The utility model provides a heat radiation structure of computer mainboard, it can gliding axial fan 2 through setting up, can effectively dispel the heat to the regional electronic chip 5 of rectangular shape, and computer mainboard's whole radiating effect is good.
Claims (5)
1. A heat radiation structure of a computer mainboard is characterized in that: the electronic chip temperature control device comprises a mainboard, an axial flow fan, a sliding guide rail and a transmission lead screw, wherein a plurality of electronic chips which are arranged at intervals are arranged on the mainboard, the transmission lead screw and the sliding guide rail are arranged at intervals in parallel and are connected to the mainboard through a supporting seat, the electronic chips are arranged between the transmission lead screw and the sliding guide rail, the transmission lead screw and the sliding guide rail are connected with a plastic support, one side of the plastic support is connected to the sliding guide rail in a sliding way, the other side of the plastic support is in threaded connection with the transmission lead screw, the axial flow fan is fixedly connected to the plastic support and is arranged above the electronic chips, a fan control interface is arranged on the mainboard, the axial flow fan is connected to the fan control interface through a power line and a control line, and one side of the axial flow fan, temperature sensor pass through the signal line connect in the mainboard, the length of power cord, control line and signal line equals and all is greater than sliding guide's length, the mainboard is fixed to be provided with driving motor, driving motor pass through gear train or driving belt with the transmission lead screw is connected.
2. The heat dissipating structure of a computer motherboard of claim 1, wherein: the power line, the control line and the signal line are sleeved in the same silica gel hose.
3. The heat dissipating structure of a computer motherboard of claim 1, wherein: the utility model discloses a gear transmission device, including driving motor, drive screw, first gear, second gear, driving motor's pivot is connected with first gear, the one end fixedly connected with second gear of transmission lead screw, first gear, second gear are the straight-teeth gear and intermeshing.
4. The heat dissipating structure of a computer motherboard of claim 1, wherein: the axial flow fan is provided with a sliding hole sleeved on the sliding guide rail.
5. The heat dissipating structure of a computer motherboard of claim 1, wherein: and bearings are arranged between the transmission screw rod and the supporting seat and between the sliding guide rail and the supporting seat.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921051956.9U CN211207263U (en) | 2019-07-05 | 2019-07-05 | Heat radiation structure of computer mainboard |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921051956.9U CN211207263U (en) | 2019-07-05 | 2019-07-05 | Heat radiation structure of computer mainboard |
Publications (1)
Publication Number | Publication Date |
---|---|
CN211207263U true CN211207263U (en) | 2020-08-07 |
Family
ID=71852435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921051956.9U Expired - Fee Related CN211207263U (en) | 2019-07-05 | 2019-07-05 | Heat radiation structure of computer mainboard |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN211207263U (en) |
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2019
- 2019-07-05 CN CN201921051956.9U patent/CN211207263U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200807 Termination date: 20210705 |