CN211194756U

CN211194756U - Packaging mold convenient to adjust

Info

Publication number: CN211194756U
Application number: CN201921974565.4U
Authority: CN
Inventors: 周健
Original assignee: Tianshui Tianjia Electronics Co ltd
Current assignee: Tianshui Tianjia Electronics Co ltd
Priority date: 2019-11-14
Filing date: 2019-11-14
Publication date: 2020-08-07
Anticipated expiration: 2029-11-14

Abstract

The utility model belongs to the packaging mold field specifically is a packaging mold who conveniently adjusts. Including fixed die body, lower adjustment die body, go up the adjustment die body, fixed die body is upper and lower both ends open-ended barrel, and both ends are equipped with the external screw thread about the fixed die body, adjust the die body down and be upper end open-ended drum, be equipped with the internal thread on its inner wall, be equipped with down the boss on its inside bottom, it is lower extreme open-ended drum to go up the adjustment die body, is equipped with the internal thread on its inner wall, and its inside top has last boss, go up the upper and lower both ends of adjusting the die body and adjusting the die body difference threaded connection at fixed die body down. The utility model discloses a simple structure, the convenient regulation can reduce manufacturing cost, can improve production efficiency, convenient to popularize and use.

Description

Packaging mold convenient to adjust

Technical Field

The utility model relates to an encapsulation mould field, concretely relates to convenient encapsulation mould who adjusts.

Background

Injection molding is one of the indispensable processes in the semiconductor packaging process. During injection molding, the semiconductor component to be subjected to plastic packaging is placed in the injection molding groove, the corresponding upper die and the lower die are matched, and then sufficient stress can be applied to continuously compact the semiconductor packaging component to be subjected to plastic packaging and plastic until the balance between the stress and the elastic component is achieved and maintained, so that the required plastic packaging thickness and the ideal plastic packaging effect of the semiconductor packaging component are obtained. However, the injection groove of the conventional package mold for the lower mold has only a single initial depth. Since the stress applied by injection molding is fixed, the thickness of the semiconductor package obtained by using the package mold is also single. Obviously, for different thickness requirements of the semiconductor package, a new package mold is required to be manufactured again for completely different specifications. Thus, the production cost is increased and the production efficiency is decreased, so that the packaging mold needs to be further improved to improve the competitiveness of manufacturers.

SUMMERY OF THE UTILITY MODEL

The utility model aims at the above problem that exists among the prior art, provide a can satisfy the convenient encapsulation mould of adjusting of different packaging part thickness.

In order to realize the purpose, the utility model discloses specifically adopt following technical scheme:

the utility model provides a convenient packaging mold who adjusts, includes fixed die body 1, lower regulation die body 2, goes up regulation die body 3, its characterized in that: the fixed die body 1 is a cylinder body with openings at the upper end and the lower end, the upper end and the lower end of the fixed die body 1 are provided with external threads, the lower adjusting die body 2 is a cylinder with an opening at the upper end, the inner wall of the cylinder is provided with internal threads, the inner bottom of the cylinder is provided with a lower boss 21, the upper adjusting die body 3 is a cylinder with an opening at the lower end, the inner wall of the cylinder is provided with internal threads, the inner top of the cylinder is provided with an upper boss 31, and the upper adjusting die body 3 and the lower adjusting die body 2 are respectively in threaded.

A plurality of horizontal placing tables 4 are arranged on the inner wall of the middle part of the fixed die body 1 at intervals.

The placing table 4 is an arc-shaped plate.

And the top of the upper adjusting die body 3 is provided with a through glue injection port 5.

The diameters of the lower boss 21 and the upper boss 31 are equal to the inner diameter of the fixed die body 1.

The wall of the lower boss 21 and the wall of the upper boss 31 are vertically provided with a plurality of exhaust grooves 6, and the side wall of the bottom of the lower adjusting die body 2 and the side wall of the top of the upper adjusting die body 3 are provided with exhaust holes 7.

The lower boss 21 is flush with the lower adjusting die body 2, and the upper boss 31 is flush with the upper adjusting die body 3.

And the outer wall of the middle part of the fixed die body 1 is provided with scale marks.

Compared with the prior art, the beneficial effects of the utility model reside in that: simple structure, convenient regulation only needs to rotate threaded connection and adjusts the die body with adjusting down at the last regulation die body at fixed die body upper and lower both ends, alright adjust the plastic envelope thickness of packaging part, and the packaging part of different thickness can be made to a mould, but reduction in production cost can improve production efficiency.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic cross-sectional view of the present invention.

Fig. 3 is a schematic structural view of the fixed mold body of the present invention.

Fig. 4 is a schematic structural diagram of the lower adjusting die body of the present invention.

Fig. 5 is a schematic structural diagram of the upper adjusting mold body of the present invention.

Shown in the figure: fixing the mold body 1; a lower adjusting die body 2; a lower boss 21; an upper adjusting die body 3; an upper boss 31; a placing table 4; a glue injection port 5; an exhaust duct 6; and an exhaust hole 7.

Detailed Description

The structure and the advantageous effects of the present invention will be further described with reference to the accompanying drawings and the embodiments.

Examples

The utility model provides a convenient encapsulating die who adjusts, as fig. 1 to 5, includes fixed die body 1, lower adjustment die body 2, goes up adjustment die body 3, fixed die body 1 is upper and lower both ends open-ended barrel, and both ends are equipped with the external screw thread about fixed die body 1, lower adjustment die body 2 is upper end open-ended drum, is equipped with the internal thread on its inner wall, is equipped with down boss 21 on its inner bottom, it is lower extreme open-ended drum to go up adjustment die body 3, is equipped with the internal thread on its inner wall, and its interior top has last boss 31, go up adjustment die body 3 and lower adjustment die body 2 difference threaded connection at the upper and lower both ends of fixed die body 1.

The placing table 4 is an arc-shaped plate.

The wall of the lower boss 21 and the wall of the upper boss 31 are vertically provided with a plurality of exhaust grooves 6, and the side wall of the bottom of the lower adjusting die body 2 and the side wall of the top of the upper adjusting die body 3 are provided with exhaust holes 7 corresponding to the exhaust grooves 6 in position. Therefore, the exhaust groove is communicated with the exhaust hole, so that the gas in the die body can be conveniently and smoothly exhausted out of the die body.

And the outer wall of the middle part of the fixed die body 1 is provided with scale marks. The positions of the lower adjusting die body and the upper adjusting die body are convenient to adjust.

The utility model discloses an application principle does: firstly, adjusting a lower adjusting die body according to the plastic package thickness at the lower part of a package part, namely, rotating the lower adjusting die body to enable the lower adjusting die body to move up and down on a fixed die body, forming a lower die cavity by a lower boss and the fixed die body together, then placing a packaged object on a placing table, screwing an upper adjusting die body at the upper end of the fixed die body, adjusting the position of the upper adjusting die body according to the plastic package thickness at the upper part of the package part, forming an upper die cavity by an upper boss and the fixed die body together, and finally injecting a colloid from a glue injection. And in the glue injection process, gas is finally exhausted from the exhaust hole through the exhaust groove.

The above description is only a preferred example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a convenient packaging mold who adjusts, includes fixed die body (1), adjusts die body (2) down, goes up and adjusts die body (3), its characterized in that: fixed die body (1) is upper and lower both ends open-ended barrel, and both ends are equipped with the external screw thread about fixed die body (1), adjust die body (2) down for upper end open-ended drum, be equipped with the internal thread on its inner wall, be equipped with down boss (21) on its interior bottom, it is lower extreme open-ended drum to go up to adjust die body (3), is equipped with the internal thread on its inner wall, and its interior top has last boss (31), go up and adjust die body (3) and adjust die body (2) respectively threaded connection at the upper and lower both ends of fixed die body (1) down.

2. The adjustable packaging mold of claim 1, wherein: and a plurality of horizontal placing tables (4) are arranged on the inner wall of the middle part of the fixed die body (1) at intervals.

3. The adjustable packaging mold of claim 2, wherein: the placing table (4) is an arc-shaped plate.

4. The adjustable packaging mold of claim 1, wherein: and a through glue injection port (5) is arranged at the top of the upper adjusting die body (3).

5. The adjustable packaging mold of claim 1, wherein: the diameters of the lower boss (21) and the upper boss (31) are equal to the inner diameter of the fixed die body (1).

6. The adjustable packaging mold of claim 1, wherein: the wall of the lower boss (21) and the wall of the upper boss (31) are vertically provided with a plurality of exhaust grooves (6), and the bottom side wall of the lower adjusting die body (2) and the top side wall of the upper adjusting die body (3) are provided with exhaust holes (7).

7. The adjustable packaging mold of claim 1, wherein: the lower boss (21) is flush with the lower adjusting die body (2), and the upper boss (31) is flush with the upper adjusting die body (3).

8. The adjustable packaging mold of claim 1, wherein: and the outer wall of the middle part of the fixed die body (1) is provided with scale marks.