CN211194625U - Plastic package mold capable of replacing product printing information - Google Patents

Plastic package mold capable of replacing product printing information Download PDF

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Publication number
CN211194625U
CN211194625U CN201922068596.XU CN201922068596U CN211194625U CN 211194625 U CN211194625 U CN 211194625U CN 201922068596 U CN201922068596 U CN 201922068596U CN 211194625 U CN211194625 U CN 211194625U
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China
Prior art keywords
model
module
connecting rod
week
logo
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Active
Application number
CN201922068596.XU
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Chinese (zh)
Inventor
刁卫斌
景昌忠
王毅
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Yangzhou Yangjie Electronic Co Ltd
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Yangzhou Yangjie Electronic Co Ltd
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Priority to CN201922068596.XU priority Critical patent/CN211194625U/en
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Abstract

The plastic package mould of removable product printing information. The utility model relates to a semiconductor frame plastic envelope especially relates to the improvement of the plastic envelope mould of removable product printing information. The plastic package mold capable of replacing product printing information is compact and reasonable in structure, simple and convenient to operate and capable of improving plastic package efficiency. When the utility model discloses carry out the plastic envelope to the semiconductor framework, the model module can be according to the model demand of required mark line oneself combination, and the model of this company adopts five-bit letter to make up usually, if special circumstances, when needing quadbit or tribit, adopts the model monomer that the top is the plane to make up; the combination mode is that the model monomers are sequentially connected in series on the first connecting rod through the trapezoidal through grooves in sequence; then directly putting the combined model module into a model cavity; the top surface of the model monomer and the top surface of the inner film core are in the same plane. The utility model has the characteristics of compact structure is reasonable, easy and simple to handle, improve plastic envelope efficiency etc.

Description

Plastic package mold capable of replacing product printing information
Technical Field
The utility model relates to a semiconductor frame plastic envelope especially relates to the improvement of the plastic envelope mould of removable product printing information.
Background
In the traditional semiconductor production process, the plastic packaging process is only used for singly packaging and protecting the wafer meeting the functional requirements by using plastic packaging adhesive, after the plastic packaging is finished, a laser marking machine or ink printing equipment is used for printing characters on the surface of the product, and marks such as corresponding models, week marks, logos and the like are marked for distinguishing the product models, production dates, production companies and the like. The above procedures need to be operated and processed by different devices, and manual circulation is needed, so that the production cost is improved, and the production efficiency is also reduced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to above problem, it is rational to provide compact structure, easy and simple to handle, improve the plastic envelope mould of removable product printing information of plastic envelope efficiency.
The technical scheme of the utility model is that: comprises a lower die body and a model module;
the lower die body comprises a peripheral frame body and an inner film core; the inner membrane core is fixedly arranged in the peripheral frame; the top surface of the peripheral frame body is positioned above the top surface of the inner membrane core;
the inner membrane core is provided with a model cavity matched with the model module;
the model module comprises a plurality of model monomers which are sequentially connected to the first connecting rod;
the cross section of the first connecting rod is trapezoidal;
the bottom of the model single body is provided with a trapezoidal through groove matched with the first connecting rod; and a first label sink groove is formed in the top of the model monomer.
The system also comprises a week recording module; the inner membrane core is provided with a week memory cavity matched with the week memory module;
the week note module comprises a plurality of week note monomers which are sequentially connected to the second connecting rod;
the section of the second connecting rod is trapezoidal;
the bottom of the week note monomer is provided with a trapezoidal through groove matched with the second connecting rod; and a second label sink groove is formed in the top of the week-keeping monomer.
The system also comprises a logo module; the inner film core is provided with a logo cavity matched with the logo module;
the section of the logo module is rectangular, the bottom of the logo module is a plane, and the top of the logo module is provided with a logo-shaped sinking groove III.
The utility model comprises a lower die body and a model module; the lower die body comprises a peripheral frame body and an inner film core; the inner membrane core is fixedly arranged in the peripheral frame body; the top surface of the peripheral frame body is positioned above the top surface of the inner membrane core; when the semiconductor frame is subjected to plastic package, the model modules can be combined according to the model requirements needing to be marked, the model of the company is usually formed by combining five-digit letters, and if special conditions need four or three digits, model monomers with flat tops are combined; the combination mode is that the model monomers are sequentially connected in series on the first connecting rod through the trapezoidal through grooves in sequence; then directly putting the combined model module into a model cavity; the top surface of the model monomer and the top surface of the inner film core are in the same plane. The logo, the model, the week mark (including letters and numbers) and other information of the product are independent modules which can be replaced and spliced; the body part of the die is modularized, the printing information is divided into a plurality of character modules, and when the product model needs to be replaced, the printing can be produced only by recombining the character modules into the required printing. The utility model has the characteristics of compact structure is reasonable, easy and simple to handle, improve plastic envelope efficiency etc.
Drawings
Figure 1 is a schematic structural view of the present invention,
FIG. 2 is a schematic view showing a structure of a connected state of a peripheral frame body and an inner membrane core,
figure 3 is a schematic view of the structure in direction a of figure 2,
FIG. 4 is a schematic structural view of a model monomer;
in the figure, 1 is a lower die body, 11 is a peripheral frame body, 12 is an inner film core, 2 is a model module, 21 is a model monomer, 211 is a first label sink groove, 3 is a model cavity, 4 is a week mark cavity, and 5 is a logo cavity.
Detailed Description
The utility model is shown in figures 1-4 and comprises a lower die body 1 and a model module 2;
the lower die body 1 comprises a peripheral frame body 11 and an inner film core 12; the inner membrane core 12 is fixedly arranged in the peripheral frame body 11; the top surface of the peripheral frame body 11 is positioned above the top surface of the inner membrane core 12; namely, a cavity for containing liquid glue is formed between the top surface of the inner membrane core 12 and the inner side wall of the peripheral frame body 11; liquid glue enters the containing cavity through a glue injection port between the upper die and the lower die; one surface of the upper die matched with the lower die body 1 is a plane;
the inner membrane core 12 is provided with a model cavity 3 matched with the model module 2;
the model module 2 comprises a plurality of model monomers 21 which are sequentially connected to the first connecting rod;
the cross section of the first connecting rod is trapezoidal;
the bottom of the model single body 21 is provided with a trapezoidal through groove matched with the first connecting rod; the top of the model single body 21 is provided with a first label sink groove 211.
When the semiconductor frame body is subjected to plastic package, the model modules 2 can be combined according to the model requirements needing to be marked, the model of the company is usually formed by combining five-digit letters, and if special conditions need four or three digits, the model single bodies 21 with the plane top are combined; the combination mode is that the model monomers 21 are sequentially connected in series on the first connecting rod through the trapezoidal through grooves in sequence; then directly putting the combined model module 2 into the model cavity 3; the top surface of the model single body 21 is in the same plane as the top surface of the inner film core 12.
The system also comprises a week recording module; the inner film core 12 is provided with a week memory cavity 4 matched with the week memory module;
the week note module comprises a plurality of week note monomers which are sequentially connected to the second connecting rod;
the section of the second connecting rod is trapezoidal;
the bottom of the week note monomer is provided with a trapezoidal through groove matched with the second connecting rod; and a second label sink groove is formed in the top of the week-keeping monomer. In the scheme, the week note is formed by combining 4 numbers, and the marking sinking groove II is a sinking groove with a corresponding number.
The system also comprises a logo module; the inner film core 12 is provided with a logo cavity 5 matched with the logo module;
the section of the logo module is rectangular, the bottom of the logo module is a plane, and the top of the logo module is provided with a logo-shaped sinking groove III.
The disclosure of the present application also includes the following points:
(1) the drawings of the embodiments disclosed herein only relate to the structures related to the embodiments disclosed herein, and other structures can refer to general designs;
(2) in case of conflict, the embodiments and features of the embodiments disclosed in this application can be combined with each other to arrive at new embodiments;
the above embodiments are only embodiments disclosed in the present disclosure, but the scope of the disclosure is not limited thereto, and the scope of the disclosure should be determined by the scope of the claims.

Claims (3)

1. The plastic package mold capable of replacing product printing information is characterized by comprising a lower mold body and a model module;
the lower die body comprises a peripheral frame body and an inner film core; the inner membrane core is fixedly arranged in the peripheral frame; the top surface of the peripheral frame body is positioned above the top surface of the inner membrane core;
the inner membrane core is provided with a model cavity matched with the model module;
the model module comprises a plurality of model monomers which are sequentially connected to the first connecting rod;
the cross section of the first connecting rod is trapezoidal;
the bottom of the model single body is provided with a trapezoidal through groove matched with the first connecting rod; and a first label sink groove is formed in the top of the model monomer.
2. The plastic package mold capable of replacing product printing information according to claim 1, further comprising a week-keeping module; the inner membrane core is provided with a week memory cavity matched with the week memory module;
the week note module comprises a plurality of week note monomers which are sequentially connected to the second connecting rod;
the section of the second connecting rod is trapezoidal;
the bottom of the week note monomer is provided with a trapezoidal through groove matched with the second connecting rod; and a second label sink groove is formed in the top of the week-keeping monomer.
3. The plastic package mold capable of replacing product lettering information as recited in claim 1, further comprising a logo module; the inner film core is provided with a logo cavity matched with the logo module;
the section of the logo module is rectangular, the bottom of the logo module is a plane, and the top of the logo module is provided with a logo-shaped sinking groove III.
CN201922068596.XU 2019-11-26 2019-11-26 Plastic package mold capable of replacing product printing information Active CN211194625U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922068596.XU CN211194625U (en) 2019-11-26 2019-11-26 Plastic package mold capable of replacing product printing information

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922068596.XU CN211194625U (en) 2019-11-26 2019-11-26 Plastic package mold capable of replacing product printing information

Publications (1)

Publication Number Publication Date
CN211194625U true CN211194625U (en) 2020-08-07

Family

ID=71880073

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922068596.XU Active CN211194625U (en) 2019-11-26 2019-11-26 Plastic package mold capable of replacing product printing information

Country Status (1)

Country Link
CN (1) CN211194625U (en)

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