CN211190829U - Circuit module positioning and assembling device - Google Patents
Circuit module positioning and assembling device Download PDFInfo
- Publication number
- CN211190829U CN211190829U CN201921868171.0U CN201921868171U CN211190829U CN 211190829 U CN211190829 U CN 211190829U CN 201921868171 U CN201921868171 U CN 201921868171U CN 211190829 U CN211190829 U CN 211190829U
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- supporting seat
- positioning
- cover plate
- circuit board
- electronic components
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Abstract
The utility model discloses a circuit module positioning assembly device for circuit board and electronic components's location equipment, circuit module positioning assembly device includes buffer block, first supporting seat, second supporting seat, location strip and apron, the top of buffer block is provided with a plurality of adaptation grooves that are used for holding electronic components, first supporting seat with the second supporting seat is located respectively the top surface both ends of buffer block, first supporting seat with form the accommodation space that is used for positioning circuit board between the second supporting seat, apron detachably set up in first supporting seat with the top of second supporting seat, set up a plurality of hole sites that expose that are used for the point to glue on the apron. This technical scheme is used for solving current electronic components and circuit board assembly location and is inaccurate and some problem of gluing position skew.
Description
Technical Field
The utility model belongs to the technical field of the components and parts equipment, concretely relates to circuit module positioning assembly device.
Background
The circuit module is the indispensable part among the present various electronic product, it is common to have power module and control module etc, its main form generally is to insert components and parts such as power in the pin hole on the circuit board through the form of pin, the fixed realization electricity of rethread welding is connected, the specification size of current electronic components is different, the great electronic components of some specifications is only difficult to reach the effect of stable installation through the welding, still need carry out the auxiliary fixation through the mode of gluing usually, the gluey operation of current electronic components and circuit board is basically gone on by the manual work, there is the problem of the inaccurate position of fixing a position and the position skew of gluing.
SUMMERY OF THE UTILITY MODEL
To the technical problem that above-mentioned exists, the utility model provides a circuit module positioning assembly device to solve the inaccurate problem of gluing the skew with the point of current electronic components and circuit board assembly location, this circuit module positioning assembly device can realize the accurate positioning of electronic components and circuit board, avoids gluing the skew simultaneously.
The utility model discloses a circuit module positioning and assembling device, which is used for positioning and assembling a circuit board and electronic components, and comprises a buffer block, a first supporting seat, a second supporting seat, a positioning strip and a cover plate, wherein the top of the buffer block is provided with a plurality of adaptive grooves for accommodating the electronic components, the first supporting seat and the second supporting seat are respectively positioned at two ends of the top surface of the buffer block, an accommodating space for positioning the circuit board is formed between the first supporting seat and the second supporting seat, the top of the first supporting seat is provided with a first guide groove which extends vertically, the top of the second supporting seat is provided with a second guide groove which extends vertically, one end of the positioning strip is inserted into the first guide groove, the other end of the positioning strip is inserted into the second guide groove, when the circuit board is placed between the first supporting seat and the second supporting seat, the positioning strips are pressed on the top surface of the circuit board, the cover plate is detachably arranged at the tops of the first supporting seat and the second supporting seat, when the cover plate is connected with the first supporting seat and the second supporting seat, the cover plate seals the top opening of the first guide groove and the top opening of the second guide groove, and a plurality of exposed hole sites for dispensing are formed in the cover plate.
Furthermore, the bottom of the adaptation groove is provided with an ejection block capable of moving up and down, and the bottom of the ejection block is connected with an air cylinder.
Furthermore, the cover plate and the first supporting seat are fixed with each other through a first bolt, and the cover plate and the second supporting seat are fixed with each other through a second bolt.
When the circuit module positioning and assembling device is used for assembling electronic components and circuit boards, the electronic components can be placed in the adaptive grooves of the buffer blocks in advance in an inverted mode, after the electronic components are positioned, the circuit boards are placed at the tops of the buffer blocks, position limiting is carried out on the circuit boards through the first supporting blocks and the second supporting blocks, the circuit boards and the electronic components are matched and fixed, the positioning strips are pressed downwards, the cover plates are covered, stable matching between the circuit boards and the electronic components is achieved, and glue dispensing can be carried out between the electronic components and the circuit boards through exposed hole positions on the cover plates after fixing is completed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit module positioning and assembling device.
Detailed Description
The utility model discloses a circuit module positioning and assembling device, this circuit module positioning and assembling device can realize the accurate positioning of electronic components and circuit board, avoid the point to glue the skew simultaneously.
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, only some embodiments, not all embodiments, of the present invention are described. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, the utility model discloses a circuit module positioning and assembling device for positioning and assembling a circuit board and an electronic component, the circuit module positioning and assembling device comprises a buffer block 6, a first support seat 5, a second support seat 8, a positioning strip 4 and a cover plate 1, the top of the buffer block 6 is provided with a plurality of adapting grooves 9 for accommodating the electronic component, the first support seat 5 and the second support seat 8 are respectively positioned at two ends of the top surface of the buffer block 6, an accommodating space for positioning the circuit board is formed between the first support seat 5 and the second support seat 8, the top of the first support seat 5 is provided with a first guide groove 3 which extends vertically, the top of the second support seat 8 is provided with a second guide groove 7 which extends vertically, one end of the positioning strip 4 is inserted into the first guide groove 3, the other end of the positioning strip 4 is inserted into the second guide groove 7, when the circuit board is placed between the first support seat 5 and the second support seat 8, the positioning strip 4 is pressed on the top surface of the circuit board, the cover plate 1 is detachably arranged at the tops of the first support seat 5 and the second support seat 8, when the cover plate 1 is connected with the first support seat 5 and the second support seat 8, the cover plate 1 seals the top opening of the first guide groove 3 and the top opening of the second guide groove 7, and the cover plate 1 is provided with a plurality of exposed hole sites 2 for dispensing.
An ejection block 10 capable of moving up and down is arranged at the bottom of the adapting groove 9, and an air cylinder (not shown) is connected to the bottom of the ejection block 10.
A first bolt (not shown) is arranged between the cover plate 1 and the first supporting seat 5 and is fixed with each other, and a second bolt is arranged between the cover plate 1 and the second supporting seat 8 and is fixed with each other.
When the circuit module positioning and assembling device is used for assembling electronic components and circuit boards, the electronic components can be placed in the adaptive grooves of the buffer blocks in advance in an inverted mode, after the electronic components are positioned, the circuit boards are placed at the tops of the buffer blocks, position limiting is carried out on the circuit boards through the first supporting blocks and the second supporting blocks, the circuit boards and the electronic components are matched and fixed, the positioning strips are pressed downwards, the cover plates are covered, stable matching between the circuit boards and the electronic components is achieved, and glue dispensing can be carried out between the electronic components and the circuit boards through exposed hole positions on the cover plates after fixing is completed.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (3)
1. A circuit module positioning and assembling device is used for positioning and assembling a circuit board and electronic components and is characterized by comprising a buffer block, a first supporting seat, a second supporting seat, a positioning strip and a cover plate, wherein a plurality of adaptive grooves for accommodating the electronic components are arranged at the top of the buffer block, the first supporting seat and the second supporting seat are respectively positioned at two ends of the top surface of the buffer block, an accommodating space for positioning the circuit board is formed between the first supporting seat and the second supporting seat, a first guide groove extending vertically is formed in the top of the first supporting seat, a second guide groove extending vertically is formed in the top of the second supporting seat, one end of the positioning strip is inserted into the first guide groove, the other end of the positioning strip is inserted into the second guide groove, when the circuit board is placed between the first supporting seat and the second supporting seat, the positioning strips are pressed on the top surface of the circuit board, the cover plate is detachably arranged at the tops of the first supporting seat and the second supporting seat, when the cover plate is connected with the first supporting seat and the second supporting seat, the cover plate seals the top opening of the first guide groove and the top opening of the second guide groove, and a plurality of exposed hole sites for dispensing are formed in the cover plate.
2. The circuit module positioning and assembling device of claim 1, wherein the bottom of the fitting groove is provided with an ejection block capable of moving up and down, and the bottom of the ejection block is connected with an air cylinder.
3. The circuit module positioning and assembling device of claim 1, wherein a first pin is disposed between said cover plate and said first supporting seat for mutual fixation, and a second pin is disposed between said cover plate and said second supporting seat for mutual fixation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921868171.0U CN211190829U (en) | 2019-11-01 | 2019-11-01 | Circuit module positioning and assembling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921868171.0U CN211190829U (en) | 2019-11-01 | 2019-11-01 | Circuit module positioning and assembling device |
Publications (1)
Publication Number | Publication Date |
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CN211190829U true CN211190829U (en) | 2020-08-07 |
Family
ID=71885037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921868171.0U Active CN211190829U (en) | 2019-11-01 | 2019-11-01 | Circuit module positioning and assembling device |
Country Status (1)
Country | Link |
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CN (1) | CN211190829U (en) |
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2019
- 2019-11-01 CN CN201921868171.0U patent/CN211190829U/en active Active
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