CN211183951U

CN211183951U - Integrated multi-bandwidth compression android drive integrated circuit

Info

Publication number: CN211183951U
Application number: CN202020058272.8U
Authority: CN
Inventors: 邓祥义
Original assignee: Shenzhen Jinhaichuang Electronics Co ltd
Current assignee: Shenzhen Jinhaichuang Electronics Co ltd
Priority date: 2020-01-13
Filing date: 2020-01-13
Publication date: 2020-08-04
Anticipated expiration: 2030-01-13

Abstract

The integrated multi-bandwidth compression android drive integrated circuit comprises a controller, a first interface circuit, a second interface circuit, a memory card circuit, a memory circuit, a signal receiving circuit, a loudspeaker circuit, an earphone circuit, a backlight circuit, a camera circuit, an L ED circuit, a communication circuit, an acceleration sensor circuit, a third interface circuit and a fourth interface circuit, wherein the controller is respectively connected with the first interface circuit, the second interface circuit, the memory card circuit, the memory circuit, the signal receiving circuit, the loudspeaker circuit, the earphone circuit, the backlight circuit, the camera circuit, the L ED circuit, the communication circuit, the acceleration sensor circuit, the third interface circuit and the fourth interface circuit.

Description

Integrated multi-bandwidth compression android drive integrated circuit

Technical Field

The utility model belongs to the technical field of the mainboard, concretely relates to tall and erect drive integrative circuit of ann of integrated many bandwidth compression.

Background

With the development of economy, the functions of various electrical devices are gradually expanded, such as videos, network chatting and the like, and therefore corresponding circuit support is needed.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems, the utility model provides an integrated many bandwidth compression android drive integrative circuit, including controller, first interface circuit, second interface circuit, storage card circuit, memory circuit, signal reception circuit, speaker circuit, earphone circuit, backlight circuit, camera circuit, L ED circuit, communication circuit, acceleration sensor circuit, third interface circuit and fourth interface circuit, wherein, the controller respectively with first interface circuit the second interface circuit the storage card circuit the memory circuit the signal reception circuit the speaker circuit the earphone circuit the backlight circuit the camera circuit L ED circuit the communication circuit acceleration sensor circuit the third interface circuit with fourth interface circuit connects.

Preferably, the controller is an RK3399 chip.

Preferably, the first interface circuit is a USB interface circuit, and the USB interface circuit is connected to a USB.

Preferably, the second interface circuit is an HDMI interface circuit, and the HDMI interface circuit is connected to an audio and/or video device.

Preferably, the memory card circuit is a TF memory card circuit, and the TF memory card circuit is connected to a TF memory card.

Preferably, the memory circuit is an eMMC F L ASH circuit, and the eMMC F L ASH circuit includes an eMMCF L ASH memory.

Preferably, the signal receiving circuit is an infrared receiving circuit.

Preferably, the communication circuit includes 4G communication circuit, WIFI circuit and/or bluetooth circuit, 4G communication circuit includes 4G communication module, the WIFI circuit includes the WiFi module, the bluetooth circuit includes the bluetooth module.

Preferably, the third interface circuit is an L VDS interface circuit, and the L VDS interface circuit is connected with the liquid crystal display screen.

Preferably, the fourth interface circuit is a V-by-One interface circuit.

The application provides a pair of integrated many bandwidth compression android drive integrative circuit can realize multiple functions such as communication, information interaction, can be used for expanding the function of electrical apparatus.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic diagram of an integrated multi-bandwidth compression android deputy driving integrated circuit provided by the present invention;

fig. 2 is a schematic diagram of a first interface circuit of an integrated multi-bandwidth compression android integrated circuit;

fig. 3 is a schematic diagram of a second interface circuit of an integrated multi-bandwidth compression android integrated circuit;

fig. 4 is a schematic circuit diagram of a memory card integrated with a multi-bandwidth compression android decompression driver integrated circuit provided by the present invention;

fig. 5 is a schematic diagram of a memory circuit of an integrated multi-bandwidth compression android decompression driver integrated circuit provided by the present invention;

fig. 6 is a schematic diagram of a signal receiving circuit of an integrated multi-bandwidth compression android deputy driving integrated circuit provided by the present invention;

fig. 7 is a schematic diagram of a speaker circuit integrated with a multi-bandwidth compression android decompression drive integrated circuit provided by the present invention;

fig. 8 is a schematic diagram of an earphone circuit of an integrated multi-bandwidth compression android deputy driver integrated circuit provided by the present invention;

fig. 9 is a schematic diagram of a backlight circuit of an integrated multi-bandwidth compression android integrated circuit;

fig. 10 is a schematic circuit diagram of a camera integrated with a multi-bandwidth compression and android decompression drive integrated circuit provided by the present invention;

fig. 11 is an L ED circuit schematic diagram of an integrated multi-bandwidth compression android driver integrated circuit provided by the present invention;

fig. 12 is a schematic diagram of a communication circuit of an integrated multi-bandwidth compression android deputy driver integrated circuit provided by the present invention;

fig. 13 is a schematic circuit diagram of an acceleration sensor integrated with a multi-bandwidth compression and android decompression drive integrated circuit provided by the present invention;

fig. 14 is a schematic diagram of a third interface circuit of an integrated multi-bandwidth compression android integrated circuit;

fig. 15 is a fourth interface circuit schematic diagram of an integrated multi-bandwidth compression android deputy driving integrated circuit provided by the utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

As shown in fig. 1, in an embodiment of the present application, an integrated multi-bandwidth compression android drive integrated circuit provided by the present application includes a controller, a first interface circuit, a second interface circuit, a memory card circuit, a memory circuit, a signal receiving circuit, a speaker circuit, an earphone circuit, a backlight circuit, a camera circuit, an L ED circuit, a communication circuit, an acceleration sensor circuit, a third interface circuit, and a fourth interface circuit, where the controller is connected to the first interface circuit, the second interface circuit, the memory circuit, the signal receiving circuit, the speaker circuit, the earphone circuit, the backlight circuit, the camera circuit, the L ED circuit, the communication circuit, the acceleration sensor circuit, the third interface circuit, and the fourth interface circuit, respectively.

In the embodiment of the present application, the controller is an RK3399 chip.

Referring to fig. 2, in the embodiment of the present application, the first interface circuit is a USB interface circuit, and the USB interface circuit is connected to a USB.

As shown in fig. 3, in the embodiment of the present application, the second interface circuit is an HDMI interface circuit, and the HDMI interface circuit is connected to an audio and/or video device.

As shown in fig. 4, in the embodiment of the present application, the memory card circuit is a TF memory card circuit, and the TF memory card circuit is connected to a TF memory card.

As shown in fig. 5, in the embodiment of the present application, the memory circuit is an eMMC F L ASH circuit, and the eMMC F L ASH circuit includes an eMMC F L ASH memory.

Fig. 6 shows the signal receiving circuit provided in the embodiment of the present application, where the signal receiving circuit is an infrared receiving circuit.

Fig. 7 shows the speaker circuit provided in the embodiment of the present application.

Fig. 8 shows the earphone circuit provided in the embodiment of the present application.

Fig. 9 shows the backlight circuit provided in the embodiment of the present application.

Fig. 10 shows the camera circuit provided in the embodiment of the present application.

Fig. 11 shows the L ED circuit provided in the embodiment of the present application.

As shown in fig. 12, the communication circuit provided in this embodiment of the present application includes a 4G communication circuit, a WIFI circuit and/or a bluetooth circuit, the 4G communication circuit includes a 4G communication module, the WIFI circuit includes a WIFI module, and the bluetooth circuit includes a bluetooth module.

Fig. 13 shows the acceleration sensor circuit provided in the embodiment of the present application.

Referring to fig. 14, in the embodiment of the present application, the third interface circuit is an L VDS interface circuit, and the L VDS interface circuit is connected to the liquid crystal display.

Referring to fig. 15, in the embodiment of the present application, the fourth interface circuit is a V-by-One interface circuit.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. An integrated multi-bandwidth compression android drive integrated circuit is characterized by comprising a controller, a first interface circuit, a second interface circuit, a memory card circuit, a memory circuit, a signal receiving circuit, a speaker circuit, an earphone circuit, a backlight circuit, a camera circuit, L ED circuits, a communication circuit, an acceleration sensor circuit, a third interface circuit and a fourth interface circuit, wherein the controller is respectively connected with the first interface circuit, the second interface circuit, the memory card circuit, the memory circuit, the signal receiving circuit, the speaker circuit, the earphone circuit, the backlight circuit, the camera circuit, the L ED circuits, the communication circuit, the acceleration sensor circuit, the third interface circuit and the fourth interface circuit.

2. The integrated multi-bandwidth compression android driver integrated circuit of claim 1, wherein the controller is a RK3399 chip.

3. The integrated multi-bandwidth compression android driver integrated circuit of claim 1, wherein the first interface circuit is a USB interface circuit, the USB interface circuit being connected to a USB.

4. The integrated multi-bandwidth compression android driver integrated circuit of claim 1, wherein the second interface circuit is an HDMI interface circuit, the HDMI interface circuit being connected to an audio and/or video device.

5. The integrated multi-bandwidth compression android driver integrated circuit of claim 1, wherein the memory card circuit is a TF memory card circuit, the TF memory card circuit being connected to a TF memory card.

6. The integrated multi-bandwidth compression android driver integrated circuit of claim 1, wherein the memory circuit is an eMMC F L ASH circuit, the eMMC F L ASH circuit comprising an eMMC F L ASH memory.

7. The integrated multi-bandwidth compression android drive integrated circuit of claim 1, wherein the signal receiving circuit is an infrared receiving circuit.

8. The integrated multi-bandwidth compression android drive integrated circuit of claim 1, wherein the communication circuit comprises a 4G communication circuit, a WIFI circuit and/or a bluetooth circuit, the 4G communication circuit comprising a 4G communication module, the WIFI circuit comprising a WIFI module, the bluetooth circuit comprising a bluetooth module.

9. The integrated multi-bandwidth compression android driver integrated circuit of claim 1, wherein the third interface circuit is an L VDS interface circuit, and the L VDS interface circuit is connected to a liquid crystal display.

10. The integrated multi-bandwidth compression android driver integrated circuit of claim 1, wherein the fourth interface circuit is a V-by-One interface circuit.