CN211182515U - Radiation unit and base station antenna - Google Patents
Radiation unit and base station antenna Download PDFInfo
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- CN211182515U CN211182515U CN202020018867.0U CN202020018867U CN211182515U CN 211182515 U CN211182515 U CN 211182515U CN 202020018867 U CN202020018867 U CN 202020018867U CN 211182515 U CN211182515 U CN 211182515U
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Abstract
The utility model relates to a mobile communication technology field discloses a radiating element and base station antenna, wherein radiating element includes medium substrate and metal circuit, medium substrate structure as an organic whole, the medium substrate includes the roof, supporting part and loading part link to each other with the lower surface of roof respectively, metal circuit includes radiating part and feed part, the upper surface of roof is located in the electroplating of radiating part, radiating part passes the roof and extends to the surface of loading part, the surface of locating the supporting part is electroplated to the feed part. The utility model provides a radiation unit and base station antenna, based on the medium substrate of integrated into one piece, with radiation part and feed part all set up on the medium substrate, this radiation unit realizes the oscillator function as single part, can simplify the oscillator structure, simple to operate, the uniformity is better; and the loading part is arranged, the radiation part can realize loading, and the miniaturization of the radiation unit is favorably realized.
Description
Technical Field
The utility model relates to a mobile communication technology field especially relates to a radiating element and base station antenna.
Background
As a new generation wireless mobile communication network with higher data transmission rate, larger network capacity and smaller time delay, a 5G (fifth generation mobile communication system) changes an Antenna into an integrated active Antenna aau (active Antenna unit) by integrating a large-scale Antenna array and an RRU, which puts requirements on miniaturization, light weight, low profile and easy assembly on a core component radiation unit of the 5G Antenna.
The traditional radiating unit mainly comprises a metal die-casting radiating unit, a PCB radiating unit and a microstrip radiating unit, wherein the metal die-casting radiating unit is heavy in weight and high in section, the PCB radiating unit and the traditional microstrip radiating unit are composed of a plurality of parts, the assembling and welding process is complex, and the batch consistency is poor. The traditional radiating unit has larger size, does not meet the development requirement of miniaturization and has poorer batch consistency.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a radiating element and base station antenna for solve or partially solve traditional radiating element size great, unsatisfied miniaturized development requirement's problem.
An embodiment of the utility model provides a radiating element, including medium substrate and metal circuit, medium substrate structure as an organic whole, the medium substrate includes roof, supporting part and loading part, the supporting part with the loading part respectively with the lower surface of roof links to each other, metal circuit includes radiating part and feed part, radiating part electroplates and locates the upper surface of roof, radiating part passes the roof extends to the surface of loading part, feed part electroplates and locates the supporting part's surface.
On the basis of the scheme, the supporting part comprises a first supporting plate and a second supporting plate which are vertically crossed, and the first supporting plate and the second supporting plate are respectively vertically connected with the top plate; the radiation part comprises two first radiation surfaces arranged along the first support plate and two second radiation surfaces arranged along the second support plate, and the intersection positions of the two first radiation surfaces and the two second radiation surfaces correspond to the intersection positions of the first support plate and the second support plate.
On the basis of the scheme, the metal circuit further comprises a balun part, the balun part comprises two first balun surfaces which are arranged on the first side surface of the first supporting plate and located on two sides of the second supporting plate, and two second balun surfaces which are arranged on the first side surface of the second supporting plate and located on two sides of the first supporting plate, the two first balun surfaces are correspondingly connected with the two first radiation surfaces, and the two second balun surfaces are correspondingly connected with the two second radiation surfaces.
On the basis of the scheme, the dielectric substrate further comprises a grounding column arranged at the bottom of the intersection position of the first supporting plate and the second supporting plate, and the bottoms of the two first balun surfaces and the two second balun surfaces extend to the surface of the grounding column.
On the basis of the above scheme, the feeding portion includes a first feeding surface provided on the second side surface of the first support plate, and a second feeding surface provided on the second side surface of the second support plate; the medium base material further comprises a plug pin arranged at one end of the bottom of the first supporting plate and one end of the bottom of the second supporting plate respectively, and the first feeding surface and the second feeding surface correspondingly extend to the surface of the plug pin.
On the basis of the scheme, the position where the second supporting plate and the first feeding surface are intersected and the position where the first supporting plate and the second feeding surface are intersected are respectively provided with an opening.
On the basis of the scheme, the top plate is provided with first through holes at positions corresponding to the two first radiation surfaces and the two second radiation surfaces respectively, the first through holes corresponding to the two first radiation surfaces are located on one side of the first supporting plate, and the first through holes corresponding to the two second radiation surfaces are located on one side of the second supporting plate.
On the basis of the scheme, the loading part comprises loading columns which are arranged corresponding to the corner parts of the radiation part, second through holes are formed in the top plate corresponding to the loading columns, and the second through holes are formed in one side of the loading columns.
On the basis of the scheme, the first radiation surface and the second radiation surface are respectively of a polygonal structure; and the top plate is provided with a third through hole at other parts except the part corresponding to the radiation part.
The embodiment of the utility model provides a base station antenna, including above-mentioned radiating element.
The embodiment of the utility model provides a radiation unit and base station antenna, based on the medium substrate of integrated into one piece, with radiation portion and feed portion all set up on the medium substrate, this radiation unit realizes the oscillator function as single part, can simplify the oscillator structure, simple to operate, the uniformity is better, metal circuit electroplates and sets up the precision higher, index uniformity is good; and the loading part is arranged, the radiation part can realize loading, and the miniaturization of the radiation unit is favorably realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an overall schematic view of a radiation unit according to an embodiment of the present invention;
fig. 2 is a schematic top surface view of a top plate according to an embodiment of the present invention;
FIG. 3 is a schematic view of the arrangement of the supporting portion and the loading portion in the embodiment of the present invention;
fig. 4 is a schematic bottom view of a radiation unit according to an embodiment of the present invention;
fig. 5 is a schematic diagram of the arrangement of the balun part in the embodiment of the present invention;
fig. 6 is a schematic diagram of the arrangement of the feeding portion and the balun portion in the embodiment of the present invention;
fig. 7 is a schematic diagram of the arrangement of the feeding portion in the embodiment of the present invention.
Description of reference numerals:
wherein, 1, a medium substrate; 2. a metal circuit; 11. a top plate; 12. a loading part; 13. a support portion; 14. a welding portion; 21. a radiating portion; 22. a balun moiety; 23. a power feeding portion; 24. a ground portion; 111. a first through hole; 112. a second through hole; 113. a third through hole; 121. loading the column; 131. a first support plate; 132. a second support plate; 133. opening a hole; 141. a ground post; 142. a plug pin; 211. a first radiating surface; 212. a second radiating surface; 221. a first balun face; 222. a second balun face; 231. a first feeding surface; 232. a second feeding surface.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The embodiment of the utility model provides a radiating element, refer to fig. 1, this radiating element includes medium substrate 1 and metal circuit 2, medium substrate 1 structure as an organic whole, medium substrate 1 includes roof 11, supporting part 13 and loading part 12 link to each other with the lower surface of roof 11 respectively, metal circuit 2 includes radiating part 21 and feed portion 23, radiating part 21 electroplates the upper surface of locating roof 11, radiating part 21 passes the surface that roof 11 extends to loading part 12, feed portion 23 electroplates the surface of locating supporting part 13.
The dielectric substrate 1 is arranged to be an integral structure, and specifically, the dielectric substrate 1 can be integrally injection molded. The method can be conveniently manufactured in a large scale, and the consistency of the medium base material 1 is improved. The support portion 13 serves to support the top plate 11 and facilitate the arrangement of the power feeding portion 23. The radiation portion 21 extends to the surface of the loading portion 12, that is, the surface of the loading portion 12 is also provided with a radiation circuit, and the radiation circuit on the surface of the loading portion 12 is integrally connected with the radiation portion 21 on the upper surface of the top plate 11.
According to the radiation unit provided by the embodiment, based on the integrally formed dielectric substrate 1, the radiation part 21 and the feed part 23 are both arranged on the dielectric substrate 1, the radiation unit serves as a single part to realize the oscillator function, the oscillator structure can be simplified, the installation is convenient, the consistency is good, the electroplating setting precision of the metal circuit 2 is high, and the index consistency is good; and the loading part 12 is arranged, the radiation part 21 can realize loading, and the miniaturization of the radiation unit is favorably realized.
On the basis of the above embodiment, further, referring to fig. 2 and 3, the support portion 13 includes the first support plate 131 and the second support plate 132 which intersect vertically, and the first support plate 131 and the second support plate 132 are connected to the top plate 11 vertically, respectively. The first support plate 131 and the second support plate 132 are crossed to stably support the top plate 11.
The radiation part 21 includes two first radiation surfaces 211 disposed along the first support plate 131 and two second radiation surfaces 212 disposed along the second support plate 132, and the intersection of the two first radiation surfaces 211 and the two second radiation surfaces 212 corresponds to the intersection of the first support plate 131 and the second support plate 132. I.e., the central portion of the supporting portion 13 corresponds to the central portion of the radiating portion 21.
On the basis of the above embodiment, further referring to fig. 4, the metal circuit 2 further includes a balun portion 22, the balun portion 22 includes two first balun surfaces 221 disposed on the first side surface of the first support plate 131 and located on two sides of the second support plate 132, and two second balun surfaces 222 disposed on the first side surface of the second support plate 132 and located on two sides of the first support plate 131, the two first balun surfaces 221 are correspondingly connected to the two first radiation surfaces 211, and the two second balun surfaces 222 are correspondingly connected to the two second radiation surfaces 212.
Since the first support plate 131 and the second support plate 132 are disposed to intersect, the first side of the first support plate 131 is divided into two parts by the second support plate 132, i.e., one part of the first side of the first support plate 131 is located at one side of the second support plate 132, and the other part is located at the other side of the second support plate 132. First balun surfaces 221 are provided at both portions of the first side surface of the first support plate 131. The two first balun surfaces 221 are correspondingly located below the two first radiating surfaces 211. And the two first balun surfaces 221 are connected with the two first radiating surfaces 211 in a one-to-one correspondence.
Similarly, the first side of the second support plate 132 is divided into two parts by the first support plate 131, i.e., one part of the first side of the second support plate 132 is located at one side of the first support plate 131, and the other part is located at the other side of the first support plate 131. Second balun surfaces 222 are provided at two portions of the first side surface of the second support plate 132, respectively. The two second balun surfaces 222 are correspondingly located below the two second radiating surfaces 212. And the two second balun surfaces 222 are connected with the two second radiating surfaces 212 in a one-to-one correspondence.
On the basis of the above embodiment, further referring to fig. 5, the dielectric substrate 1 further includes a grounding pillar 141 disposed at the bottom of the intersection of the first support plate 131 and the second support plate 132, and the bottoms of the two first balun surfaces 221 and the two second balun surfaces 222 extend to the surface of the grounding pillar 141. Further, a ground portion 24 is formed on the surface of the ground post 141.
On the basis of the above-described embodiment, further, referring to fig. 6 and 7, the feeding portion 23 includes the first feeding face 231 provided on the second side face of the first support plate 131, and the second feeding face 232 provided on the second side face of the second support plate 132; the dielectric substrate 1 further includes a plug pin 142 disposed at one end of the bottom of the first supporting plate 131 and one end of the bottom of the second supporting plate 132, and the first feeding surface 231 and the second feeding surface 232 extend to the surface of the plug pin 142. The first feeding surface 231 extends to the surface of the plug 142 at the bottom of the first support plate 131, and the second feeding surface 232 extends to the surface of the plug 142 at the bottom of the second support plate 132.
That is, two patch pins 142 are provided at the bottom of the support portion 13, and one of the two patch pins 142 is located at the bottom of the first support plate 131 and the other is located at the bottom of the second support plate 132. The two patch pins 142 together with the ground post 141 form the soldered portion 14 of the dielectric substrate 1. The radiating element provided by the embodiment adopts a two-point feeding and three-point mounting mode, and the power distribution layout of the four-point feeding is simpler in structure and more convenient to mount.
On the basis of the above embodiment, further, referring to fig. 7, the intersection of the second supporting plate 132 and the first feeding surface 231 and the intersection of the first supporting plate 131 and the second feeding surface 232 are respectively provided with the opening 133. The first feeding plane 231 may cross the second support plate 132 on the second side of the first support plate 131. An opening 133 is provided at a crossing portion of the second support plate 132 and the first feeding face 231 such that the first feeding face 231 passes through the opening 133 without contact between the first feeding face 231 and the second support plate 132.
The second feeding plane 232 may cross the first support plate 131 on the second side of the second support plate 132. The opening 133 is disposed at the intersection of the first support plate 131 and the second feeding surface 232, so that the second feeding surface 232 passes through the opening 133 and there is no contact between the second feeding surface 232 and the first support plate 131.
Further, the first feeding surface 231 and the second feeding surface 232 may be a winding structure, and the widths of the first feeding surface 231 and the second feeding surface 232 are flexibly set according to actual needs.
On the basis of the above-described embodiment, further, referring to fig. 1 and 2, the top plate 11 is provided with the first through holes 111 at positions corresponding to the two first radiation surfaces 211 and the two second radiation surfaces 212, respectively, and the first through holes 111 corresponding to the two first radiation surfaces 211 are located at one side of the first support plate 131, and the first through holes 111 corresponding to the two second radiation surfaces 212 are located at one side of the second support plate 132.
The two first radiating surfaces 211 respectively extend through the top plate 11 through the first through holes 111 to the first side surface of the first support plate 131 to form two first balun surfaces 221. The two second radiating surfaces 212 also extend through the top plate 11 through the first through holes 111 to the first side surface of the second supporting plate 132 to form two second balun surfaces 222.
On the basis of the above embodiment, further, the loading portion 12 includes the loading posts 121 disposed corresponding to the corner portions of the radiation portion 21, and the top plate 11 is provided with the second through holes 112 corresponding to the loading posts 121, and the second through holes 112 are located at one side of the loading posts 121. The top end of the loading column 121 is connected to the lower surface of the top plate 11. The radiation portion 21 extends through the top plate 11 to the surface of the loading column 121 through the second through hole 112.
The loading columns 121 are arranged at the positions corresponding to the corner parts of the radiation part 21, so that the loading of the outer ring of the radiation circuit is realized. The specific number of the loading columns 121 can be flexibly set according to the actual situation, and is not limited. Specifically, when the radiation portion 21 includes two first radiation surfaces 211 and two second radiation surfaces 212, four loading columns 121 may be correspondingly disposed, and the four loading columns 121 are correspondingly located at four corners of the four radiation surfaces.
On the basis of the above embodiment, further, referring to fig. 2, the first radiation surface 211 and the second radiation surface 212 are respectively in a polygonal structure; the top plate 11 is provided with a third through hole 113 at a position other than the position corresponding to the radiation section 21. The third through hole 113 reduces the weight of the top plate 11, which is advantageous for weight reduction of the radiation unit.
On the basis of the foregoing embodiments, further, the present embodiment provides a base station antenna, including the radiation unit described in any of the foregoing embodiments.
On the basis of the above embodiments, further, the embodiment provides a miniaturized low-profile ultra-wideband molding interconnection radiating element, which can be applied to a 5G large-scale array antenna, has the advantages of light weight, low profile, wide working frequency band, simple structure and convenience in installation, is very suitable for large-scale manufacturing and automatic production, and has a broad application prospect in large-scale array antennas.
The present embodiment provides a miniaturized low-profile ultra-wideband mold interconnection radiating element, as shown in fig. 1, specifically including a dielectric substrate 1 and a metal circuit 2. The medium base material 1 is integrally injection-molded and comprises a top plate 11, a loading part 12, a supporting part 13 and a welding part 14 from top to bottom, wherein the supporting part 13 is connected with the top plate 11 and the welding part 14; the metal circuit 2 includes a radiation portion 21, a balun portion 22, a power feeding portion 23, and a ground portion 24. The metal circuit 2 is arranged on the upper surface of the top plate 11 of the dielectric substrate 1 to form a radiation circuit, and partially extends to the inner surface of the supporting part of the dielectric substrate 1 and finally reaches the bottom welding part to form a microstrip feeding part 23.
Referring to fig. 2, the dielectric substrate 1 is integrally injection molded from a high temperature resistant engineering plastic, and has a dielectric constant in the range of 2.2 to 10.2. The top plate 11 of the medium substrate 1 is a cube, so that the area of the top plate 11 can be saved, and a rectangular hole, namely the third through hole 113 is formed in the center, so that the material consumption is reduced, and the weight of the integrated medium substrate 1 is reduced. The loading part 12 of the dielectric substrate 1 is a rectangular loading column 121 below the four corners of the top plate 11.
Referring to fig. 3, the support portion 13 of the dielectric substrate 1, which includes two rectangular parallelepipeds intersecting each other at an axis of ± 45 °, i.e., a first support plate 131 and a second support plate 132, is a part of the integrally formed radiation unit for connecting the top plate 11 of the dielectric substrate 1 and the matrix substrate welding portion 14 to form a closed structure to reinforce the structural strength of the integrated dielectric substrate 1.
Referring to fig. 2, the four corners of the top plate 11 of the dielectric substrate 1 are respectively provided with a rectangular parallelepiped hole, i.e. the second through hole 112, which forms a smooth transition structure with the loading portion 12 of the dielectric substrate 1, so that there is no shielding in a plan view, and it is convenient to partially extend the radiation circuit disposed on the top plate 11 of the dielectric substrate 1 downward to the surface of the loading portion 12.
Four quadrants at the center of the top plate 11 of the medium substrate 1 are respectively provided with a spade-shaped groove, namely a first through hole 111, and form a smooth transition structure with the supporting part 13 of the medium substrate 1, so that the radiation circuit arranged on the top plate 11 of the medium substrate 1 can be conveniently partially extended downwards to the inner surface of the supporting part without shielding when being overlooked; the radiating unit is a part of the integrally formed radiating unit and is positioned on the upper layer of the integrally formed radiating unit, so that the size of the radiating unit is reduced, and the miniaturization is realized.
Referring to fig. 3 and 4, the soldering portion 14 of the dielectric substrate 1 is composed of two cylindrical plug pins 142 and a grounding pin 141, and is a part of the integrated radiating element, and is located at the bottom layer of the integrated radiating element. The two patch pins 142 are respectively located on the ± 45 ° axes on the same side, that is, on the two support plates, and are used for electrically connecting to the power distribution network port to realize signal excitation; meanwhile, the center of the grounding cylinder is provided with a balun which is formed with the supporting part 13 of the dielectric substrate 1 and is used for inhibiting the generation of the peripheral surface current.
The radiation part 21 of the metal circuit 2 is arranged on the top plate 11 of the dielectric substrate 1, is four scalene hexagons, is centrosymmetric, is used as the radiation part 21, is a part of an integrally formed radiation unit, is positioned on the upper layer of the top plate 11 of the dielectric substrate 1, realizes miniaturization, and realizes low profile due to the thickness of the radiation part 21, namely the height from the PCB dielectric substrate 1 is less than 0.05 lambda (working wavelength). Then, one part of the radiation part 21 passes through the upper surface of the top plate 11 of the dielectric substrate 1 and extends to the loading part 12 of the dielectric substrate 1, and the other part extends to the inner surface of the support part along the feed hole, namely the first through hole 111, and serves as a balun part 22; finally, the grounding part 24 is formed by reaching the bottom welding part and being attached to the grounding cylinder; the feeder circuit extends from the dielectric substrate 1 support portion 13 down to the patch pins 142.
The balun part 22 of the metal circuit 2 extends downwards towards the surface of the supporting part 13 of the dielectric substrate 1 along the connecting part of the top plate 11 of the dielectric substrate 1 and the supporting part 13 of the dielectric substrate 1; the feeding portions 23 of the metal circuits 2 extend downward from the supporting portion 13 of the dielectric substrate 1 to the plug pins 142, respectively; the balun portion 22 of the metal circuit 2 extends to the grounding cylinder forming a grounding portion 24 of the metal circuit 2. Through the arrangement of the balun part 22 of the radiation circuit, the cross polarization ratio index of the microstrip radiation unit is improved. Through the design, the integrally formed dielectric half-wave microstrip radiating unit is finally realized.
The metal circuit 2 extends to the surface of the loading part 12 of the dielectric substrate 1, so that the radiation unit is miniaturized; the part of the inner surface of the support part of the medium substrate 1 is extended, so that the cross polarization index of the radiation unit is greatly improved; by adopting the two-point feeding and three-point mounting mode, the power distribution layout is simpler compared with the 4-point feeding in structure, and the mounting is more convenient.
The radiating unit provided by the embodiment is an integrated oscillator based on molding interconnection, the radiating and feeding circuits are arranged on a molding part, the molding part is small in material density and light in weight, and a plastic electroplating circuit is high in precision and good in index consistency, so that the radiating unit is used as a single part to realize the oscillator function, the oscillator structure can be simplified, the installation is convenient, and the consistency is good; the outer ring of the radiation circuit is loaded, and the radiation unit is miniaturized based on the parameters and the loading of a high dielectric medium; the feed balun is in a sawtooth shape, the feed circuit is wound and bent, and the equivalent circuit is expanded to realize a lower section of the oscillator; the power distribution layout relative to the 4-point feed in structure is simpler and the installation is more convenient by adopting a two-point feed and three-point installation mode; the radiation principle of the radiation unit is a half-wave dipole principle, the ultra-wide band of 2.5-3.8GHz can be realized, and 2 application frequency bands in 5G are met. Therefore, the radiating element meets the application requirements of a large-scale array antenna, and the provided molded interconnection radiating element has the characteristics of light weight, low profile, simple structure, wide working frequency band and suitability for large-scale manufacturing and automatic production.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A radiation unit is characterized by comprising a medium substrate and a metal circuit, wherein the medium substrate is of an integral structure and comprises a top plate, a supporting part and a loading part, the supporting part and the loading part are respectively connected with the lower surface of the top plate, the metal circuit comprises a radiation part and a feed part, the radiation part is electroplated on the upper surface of the top plate, the radiation part penetrates through the top plate and extends to the surface of the loading part, and the feed part is electroplated on the surface of the supporting part.
2. The radiant unit of claim 1 wherein the support section comprises first and second vertically intersecting support plates, each of the first and second support plates being vertically attached to the top plate;
the radiation part comprises two first radiation surfaces arranged along the first support plate and two second radiation surfaces arranged along the second support plate, and the intersection positions of the two first radiation surfaces and the two second radiation surfaces correspond to the intersection positions of the first support plate and the second support plate.
3. The radiating element of claim 2, wherein the metal circuit further comprises a balun portion, and the balun portion comprises two first balun surfaces disposed on the first side surface of the first support plate and located on two sides of the second support plate, and two second balun surfaces disposed on the first side surface of the second support plate and located on two sides of the first support plate, the two first balun surfaces being correspondingly connected to the two first radiating surfaces, and the two second balun surfaces being correspondingly connected to the two second radiating surfaces.
4. The radiating element of claim 3, wherein the dielectric substrate further comprises a grounding pillar disposed at a bottom of an intersection of the first support plate and the second support plate, and bottoms of the two first balun surfaces and the two second balun surfaces extend to a surface of the grounding pillar.
5. The radiating element of claim 2, wherein the feeding portion comprises a first feeding surface provided on the second side of the first support plate and a second feeding surface provided on the second side of the second support plate;
the medium base material further comprises a plug pin arranged at one end of the bottom of the first supporting plate and one end of the bottom of the second supporting plate respectively, and the first feeding surface and the second feeding surface correspondingly extend to the surface of the plug pin.
6. The radiating element of claim 5, wherein the intersection of the second support plate and the first feeding surface and the intersection of the first support plate and the second feeding surface are respectively provided with an opening.
7. The radiating element according to claim 2, wherein the top plate is provided with first through holes at positions corresponding to the two first radiating surfaces and the two second radiating surfaces, respectively, and the first through holes corresponding to the two first radiating surfaces are located at one side of the first supporting plate and the first through holes corresponding to the two second radiating surfaces are located at one side of the second supporting plate.
8. The radiating element of claim 2, wherein the loading portion comprises loading posts corresponding to corner portions of the radiating portion, and the top plate is provided with second through holes corresponding to the loading posts, the second through holes being located at one side of the loading posts.
9. The radiating element of claim 2, wherein the first radiating surface and the second radiating surface are each a polygonal structure; and the top plate is provided with a third through hole at other parts except the part corresponding to the radiation part.
10. A base station antenna comprising a radiating element according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020018867.0U CN211182515U (en) | 2020-01-06 | 2020-01-06 | Radiation unit and base station antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020018867.0U CN211182515U (en) | 2020-01-06 | 2020-01-06 | Radiation unit and base station antenna |
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| CN211182515U true CN211182515U (en) | 2020-08-04 |
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| CN202020018867.0U Active CN211182515U (en) | 2020-01-06 | 2020-01-06 | Radiation unit and base station antenna |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736428A (en) * | 2020-12-24 | 2021-04-30 | 京信通信技术(广州)有限公司 | Radiation unit and antenna |
| CN113708063A (en) * | 2021-08-27 | 2021-11-26 | 合肥移瑞通信技术有限公司 | Antenna radiator, terminal antenna and terminal equipment |
| CN115241659A (en) * | 2022-06-27 | 2022-10-25 | 河南大学 | High-isolation broadband tri-polarization MIMO antenna |
-
2020
- 2020-01-06 CN CN202020018867.0U patent/CN211182515U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112736428A (en) * | 2020-12-24 | 2021-04-30 | 京信通信技术(广州)有限公司 | Radiation unit and antenna |
| CN113708063A (en) * | 2021-08-27 | 2021-11-26 | 合肥移瑞通信技术有限公司 | Antenna radiator, terminal antenna and terminal equipment |
| CN115241659A (en) * | 2022-06-27 | 2022-10-25 | 河南大学 | High-isolation broadband tri-polarization MIMO antenna |
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